Wooden intelligent card using density board as supporting medium material

Abstract

The utility model discloses a wooden intelligent card using a density board as a supporting medium material. The wooden intelligent card comprises a chip assembly. The chip assembly comprises a density board supporting layer, a communication coil and a chip, a groove is formed in the density board supporting layer, the communication coil is arranged in the groove, the chip is arranged in the center of the interior of the groove, the chip is electrically connected with the communication coil, and the front end and the rear end of the density board supporting layer are connected with surface layers through bonding assemblies; the rear side surface of the chip is tightly attached to the front side surface of the density board supporting layer, the outer surface of the communication coil is tightly attached to the front side surface of the density board supporting layer, the bonding assemblies are hot melt adhesive film layers, the surface layer is a natural wood layer, and the edge of the surface layer is fixedly wrapped with a shell. Compared with a wooden intelligent card with other wooden materials as middle materials, the wooden intelligent card with the density board as the supporting middle material has the advantages that the surface is smoother, the overall hardness of the wooden card is high, and the wooden card is not easy to bend.

Description

Technical Field

[0001] The utility model relates to the technical field of wooden smart cards, in particular to a wooden smart card which uses a density board as a supporting material. Background Art

[0002] As a novel product, wooden smart card combines the beauty of traditional wood materials with the convenience of modern smart technology. MDF, as a man-made board, has high density and strength, which makes it an ideal choice for wooden smart card support. Compared with solid wood, MDF has better dimensional stability and anti-deformation ability, which can effectively ensure the flatness and durability of smart cards.

[0003] Some existing wooden smart cards use a single wood support to protect the chip layer;

[0004] Such traditional wooden smart cards have the following problems. For example, the use of a single wooden support method may affect the bending resistance of the wooden smart card, which may further affect the service life of the wooden smart card. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the existing defects and provide a wooden smart card using density board as the supporting middle material. Compared with wooden smart cards using other wooden materials as the middle material, the wooden smart card using density board as the supporting middle material has a smoother surface, and the overall hardness of the wooden card is high and not easy to bend, which can effectively solve the problems in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wooden smart card using density board as a supporting middle material, including a chip assembly;

[0007] Chip assembly: It includes a density board support layer, a communication coil and a chip. A groove is arranged inside the density board support layer, the communication coil is arranged inside the groove, the chip is arranged at the center position inside the groove, the chip is electrically connected to the communication coil, and the front and rear ends of the density board support layer are connected with a skin layer through an adhesive assembly. Compared with wooden smart cards using density board as the supporting middle material, wooden smart cards using other wooden materials as the middle material have a smoother surface, and the overall hardness of the wooden card is high and not easy to bend.

[0008] Furthermore, the rear surface of the chip is closely fitted with the front surface of the density board support layer, and the outer surface of the communication coil is closely fitted with the front surface of the density board support layer, so as to realize the close connection of the various components of the chip assembly.

[0009] Furthermore, the adhesive components are all hot-melt adhesive film layers, which effectively ensure the firmness of the connection between the chip component and the skin layer.

[0010] Furthermore, the surface layers are all natural wood layers to protect the chip components.

[0011] Furthermore, the edge of the epidermis layer is fixedly wrapped with a shell to protect the side surface of the chip component.

[0012] Furthermore, the density board support layers are all density fiberboards, which improves the support strength of the smart card itself.

[0013] Furthermore, the middle part of the epidermis layer opposite to the outer surface is provided with an information groove, which is convenient for printing and posting patterns.

[0014] Compared with the prior art, the beneficial effects of the utility model are: the wooden smart card using density board as the supporting material has the following advantages:

[0015] The personnel set the chip and communication coil in the groove inside the density board support layer, and glue and fix them according to the preset pasting position to form a chip component; then at the front and back ends of the chip component, stack the materials in order from the inside to the outside: bonding components and skin layers, and send the stacked materials into the hot melt bonding machine, set the temperature and time, so that the hot melt adhesive film of the bonding layer is melted to achieve a stable connection between each component, and then cold press bonding is performed; the semi-finished products after bonding are waterproofed and die-cut into cards. Compared with wooden smart cards with other wooden materials as the middle material, the wooden smart card with density board as the intermediate support material has a smoother surface, and the overall hardness of the wooden card is high and not easy to bend. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure inside the utility model;

[0018] Figure 3 It is a schematic cross-sectional structural diagram of the front side of the utility model;

[0019] Figure 4 It is a schematic diagram of the enlarged structure of point A of the utility model.

[0020] In the figure: 1 chip component, 11 density board support layer, 12 communication coil, 13 chip, 2 adhesive component, 3 skin layer, 4 shell. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 , This embodiment provides a technical solution: a wooden smart card using a density board as a supporting material, including a chip assembly 1;

[0023] Chip component 1: It includes a density board support layer 11, a communication coil 12 and a chip 13. The density board support layer 11 is provided with a groove inside, the communication coil 12 is arranged inside the groove, the chip 13 is arranged at the center position inside the groove, the chip 13 is electrically connected to the communication coil 12, the front and rear ends of the density board support layer 11 are connected with the epidermis 3 through the adhesive component 2, the rear surface of the chip 13 is tightly fitted with the front surface of the density board support layer 11, the outer surface of the communication coil 12 is tightly fitted with the front surface of the density board support layer 11, and the adhesive component 2 is a hot melt adhesive film layer. The hot melt adhesive film is a film product with or without release paper, which can be conveniently operated continuously or intermittently. It has good adhesion to many objects; it can be punched into precise shapes and sizes, suitable for purely manual or automated applications. The epidermis 3 are all natural wood layers, the thickness of the natural wood layers is 0.25mm, the edge of the epidermis 3 is fixedly wrapped with an outer shell 4, the inner side of the outer shell 4 is connected to the edge of the epidermis 3 by gluing, and the shape of the outer shell 4 is adapted to the shape of the epidermis 3 and the density board support layer 11, which can be a rectangular structure, a circular structure, a heart-shaped structure, etc. The density board support layer 11 is a density fiberboard, which is made of wood fiber or other plant fiber as raw materials, prepared by fiber, applied with synthetic resin, and pressed into a board under heating and pressurization conditions. The overall density of the density fiberboard is 650Kg / m 3 --800Kg / m 3 In between, the middle part of the epidermis layer 3 away from the outer surface is provided with an information slot, which is opened on the epidermis layer 3 and can be square, round or heart-shaped in shape, and can be used to post card information or other information.

[0024] The working principle of a wooden smart card using a density board as a supporting middle material provided by the utility model is as follows: a chip 13 and a communication coil 12 are arranged in a groove inside a density board supporting layer 11, and are bonded and fixed according to a preset bonding position to form a chip component 1; then, at the front and rear ends of the chip component 1, materials are stacked in sequence from the inside to the outside: a bonding component 2 and a skin layer 3, and the stacked materials are sent to a hot melt bonding machine, and the temperature and time are set so that the hot melt adhesive film of the bonding layer 2 is melted to achieve a stable connection of each component, and then cold pressing bonding is performed; the semi-finished product after bonding is waterproofed and die-cut into cards.

[0025] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wooden smart card using density board as a supporting material, characterized in that: comprising a chip assembly (1); A chip component (1): comprising a density board support layer (11), a communication coil (12) and a chip (13); a groove is provided inside the density board support layer (11); the communication coil (12) is arranged inside the groove; the chip (13) is arranged at a central position inside the groove; the chip (13) is electrically connected to the communication coil (12); and the front and rear ends of the density board support layer (11) are connected to a skin layer (3) via an adhesive component (2).

2. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The rear surface of the chip (13) is tightly fitted to the front surface of the density board support layer (11), and the outer surface of the communication coil (12) is tightly fitted to the front surface of the density board support layer (11).

3. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The bonding components (2) are all hot melt adhesive film layers.

4. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The epidermis (3) are all natural wood layers.

5. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The edge of the epidermis layer (3) is fixedly wrapped with an outer shell (4).

6. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The density board support layer (11) is density fiberboard.

7. A wooden smart card using density board as supporting material according to claim 1, characterized in that: The epidermis layer (3) is provided with an information groove in the middle part opposite to the outer surface.

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