Heating platform device suitable for underfilling
By designing a detachable heating platform device, the problem of cumbersome disassembly of existing heating platforms when switching package types and the heating wires are easily damaged, achieving rapid switching and disassembly of the heating platform, reducing maintenance costs and customization cycles.
Patent Information
- Application Number
- CN202420188709.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-01-26
AI Technical Summary
When switching packaging types, the existing heating platforms need to remove the entire platform and the heating wire power supply. The process is cumbersome and easy to damage the heating wire, resulting in the scrapping of the platform, and the cost is high and the customization cycle is long.
A detachable heating platform device is designed, including a bottom support platform, a lifting mechanism bracket and a fixed heating base platform. The fixed heating base platform is moved up and down through the cylinder support, so as to achieve rapid switching and disassembly of the heating platform to avoid damage to heating. Silk.
It realizes rapid switching and disassembly of the heating platform, reduces damage to the heating wire, reduces equipment maintenance costs and customization cycles, and improves the efficiency of the packaging process.
Smart Images
Figure CN222440530U_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a heating platform device suitable for bottom filling. Background Art
[0002] At present, in the bottom filling process of semiconductor packaging process, the bottom filling method is mainly achieved through "non-contact jet" dispensing; non-contact jet dispensing technology is the best method for bottom filling of chip scale package (CSP), ball grid array (BGA) and package on package (PoP) on circuit board, and the jet system can automatically manage the key process flow related to bottom filling. In the process, the substrate needs to be transferred to the heating area first, the heating platform rises and vacuum absorbs the substrate to preheat the substrate, and then the jet system fills the glue between the chip and the substrate.
[0003] The existing heating platform is an integral whole, and the heating wire is pre-buried in the heating platform. When switching the packaging type, the entire heating platform and the heating wire power supply need to be completely dismantled and replaced, which is very inconvenient. At the same time, the existing heating platform has a high cost and a long customization cycle. During the dismantling process, the heating wire is also easily damaged, causing the platform to be scrapped. Therefore, there is an urgent need for a heating platform device that is easy to dismantle the entire heating platform and the heating wire power supply. Summary of the invention
[0004] Purpose of the invention: The purpose of the present invention is to address the deficiencies in the prior art and provide a heating platform device suitable for bottom filling, which can not only quickly switch the heating platform suitable for the packaging type, but also reduce the damage to the platform heating wire caused by switching the packaging type.
[0005] Technical solution: The present invention discloses a heating platform device suitable for bottom filling, comprising a bottom support platform, with lifting mechanism brackets symmetrically installed on both sides of the bottom support platform, a heating device arranged above the lifting mechanism bracket, the heating device consisting of a heating platform located above and a fixed heating base platform located below, the heating platform being detachably connected to the fixed heating base platform, a group of heating wires being evenly distributed inside the fixed heating base platform, and both ends of the heating wires extending out of the fixed heating base platform and connected to an external power source through wire heads;
[0006] A cylinder is fixed under the fixed heating base platform, which lifts the fixed heating base platform up and down, and the lifting mechanism bracket plays a supporting role. When the packaging type needs to be switched, the heating platform is separated from the fixed heating base platform and the corresponding heating platform is replaced.
[0007] Furthermore, the lifting mechanism bracket includes a fixed block and a lead screw fixed to the bottom support platform, a plurality of sliders are fixed to the lead screw, a moving part is fixed to the slider, and a fixed heating base platform is fixed to the top of the moving part;
[0008] When the cylinder lifts the fixed heating base platform up and down, the lifting mechanism bracket as a supporting mechanism also moves up and down with the cylinder, and the moving parts move up and down to drive the slider to move up and down on the screw; a crossbeam is set between the two fixed blocks, and the cylinder is fixed on the crossbeam.
[0009] Furthermore, the heating platform is a rectangular parallelepiped. When the package type is FCCSP, the general size of the cross section is 245*110 mm; when the package type is BGA, the cross section size is 155*310 mm.
[0010] Furthermore, the heating platform is fixedly connected to the fixed heating base platform by screws, which is convenient for disassembly.
[0011] Furthermore, the heating wire is connected to the electric wire, and the electric wire is fixedly supported by an electric wire bracket to stably support the electric wire.
[0012] Furthermore, a group of vacuum holes are arranged inside the heating platform to facilitate the adsorption of the substrate when the heating platform is working.
[0013] Furthermore, the fixed heating base platform also includes a temperature sensor, which can monitor the temperature of the fixed base platform in real time.
[0014] Furthermore, a support frame is connected to the top of the cylinder, and the top of the support frame supports and fixes the heating base platform through a support plate.
[0015] Beneficial effects: Compared with the prior art, the advantages of the present invention are:
[0016] (1) The present invention heats the lower fixed base platform and conducts heat to the upper heating platform to form an integrated whole. When disassembling, only the upper quick-detachable heating platform needs to be disassembled, which is convenient and quick.
[0017] (2) Since the present invention divides the heating device into two parts, heating platforms of different sizes can be made for quick switching without dismantling the entire heating device;
[0018] (3) In the present invention, the heating wire is installed inside the fixed base platform located at the bottom, so when the heating platform is disassembled, the heating wire will not be damaged, causing the platform to be scrapped. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION
[0020] The technical solution of the present invention is described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the embodiments.
[0021] like Figure 1 A heating platform device suitable for bottom filling is shown, comprising a bottom support platform 1, with lifting mechanism brackets 2 symmetrically installed on both sides of the bottom support platform 1, the lifting mechanism bracket 2 comprising a fixed block 2-1 and a lead screw 2-2 fixed to the bottom support platform 1, a plurality of sliders 2-3 fixed on the lead screw 2-2, a moving part 2-4 fixed on the slider 2-3, and a fixed heating base platform 3-2 fixed on the top of the moving part 2-4;
[0022] When the cylinder 6 lifts the fixed heating base platform 3-2 to move up and down, the lifting mechanism bracket 2 as a supporting mechanism also moves up and down with the cylinder 6, and the moving part 2-4 moves up and down to drive the slider 2-3 to move up and down on the screw 2-2; a crossbeam 2-5 is arranged between the two fixed blocks 2-1, and the cylinder 6 is fixed on the crossbeam 2-5; the top of the cylinder 6 is connected to the support frame 8, and the top of the support frame 8 supports the fixed heating base platform 3-2 through the support plate 9.
[0023] A heating device 3 is arranged above the lifting mechanism bracket 2, and the heating device 3 consists of a heating platform 3-1 located above and a fixed heating base platform 3-2 located below. The heating platform 3-1 is fixedly connected to the fixed heating base platform 3-2 by screws, and a group of vacuum holes are arranged inside the heating platform 3-1; a group of heating wires 4 and temperature sensors 10 are evenly distributed inside the fixed heating base platform 3-2, and both ends of the heating wire 4 extend out of the fixed heating base platform 3-2 and are connected to an external power supply through a wire head 5; the heating wire 4 is connected to the wire, and the wire is fixedly supported by a wire bracket 7; the heating platform is a rectangular parallelepiped with a cross-sectional size of 245*110mm.
[0024] A cylinder 6 is fixed below the fixed heating base platform 3-2, and the cylinder 6 lifts the fixed heating base platform 3-2 to move up and down. The lifting mechanism bracket 2 plays a supporting role. When it is necessary to switch the packaging type, the heating platform 3-1 is separated from the fixed heating base platform 3-2 and the corresponding heating platform is replaced. The bottom support platform 1 is used in conjunction with the track device. When the product flows to the top of the heating platform through the track, the present invention rises to heat the product.
[0025] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and details may be made without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims
1. A heating platform device suitable for bottom filling, comprising a bottom support platform (1), a lifting mechanism bracket (2) symmetrically mounted on both sides of the bottom support platform (1), a heating device (3) disposed above the lifting mechanism bracket (2), characterized in that: The heating device (3) is composed of a heating platform (3-1) located at the top and a fixed heating base platform (3-2) located at the bottom. The heating platform (3-1) is detachably connected to the fixed heating base platform (3-2). A group of heating wires (4) are evenly distributed inside the fixed heating base platform (3-2). Both ends of the heating wires (4) extend out of the fixed heating base platform (3-2) and are connected to an external power source through wire heads (5). A cylinder (6) is fixed below the fixed heating base platform (3-2), and the cylinder (6) lifts the fixed heating base platform (3-2) to move up and down. The lifting mechanism bracket (2) plays a supporting role. When it is necessary to switch the packaging type, the heating platform (3-1) is separated from the fixed heating base platform (3-2) and the corresponding heating platform is replaced.
2. A heating platform device suitable for bottom filling according to claim 1, characterized in that: The lifting mechanism bracket (2) comprises a fixed block (2-1) and a lead screw (2-2) fixed to the bottom support platform (1); a plurality of sliders (2-3) are fixed to the lead screw (2-2); a moving component (2-4) is fixed to the slider (2-3); and the fixed heating base platform (3-2) is fixed to the top of the moving component (2-4).
3. A heating platform device suitable for bottom filling according to claim 1, characterized in that: The heating platform is a rectangular parallelepiped.
4. A heating platform device suitable for bottom filling according to claim 1, characterized in that: The heating platform (3-1) is fixedly connected to the fixed heating base platform (3-2) via screws.
5. A heating platform device suitable for bottom filling according to any one of claims 1 to 4, characterized in that: The heating wire (4) is connected to an electric wire, and the electric wire is fixedly supported by an electric wire bracket (7).
6. A heating platform device suitable for bottom filling according to any one of claims 1 to 4, characterized in that: A group of vacuum holes are arranged inside the heating platform (3-1).
7. A heating platform device suitable for bottom filling according to any one of claims 1 to 4, characterized in that: The fixed heating base platform (3-2) also includes a temperature sensor (10).
8. The heating platform device suitable for bottom filling according to claim 2, characterized in that: The top of the cylinder (6) is connected to a support frame (8), and the top of the support frame (8) supports the fixed heating base platform (3-2) via a support plate (9).