Cleaning equipment

Abstract

The utility model relates to cleaning equipment. The cleaning equipment comprises a rack, a feeding and discharging module, a positioning module, a carrying module and a plurality of cleaning modules. The positioning module is used for positioning the product; each cleaning module is detachably arranged, and each cleaning module is used for cleaning products; the carrying module is used for grabbing and releasing the products so as to drive the products to flow among the feeding and discharging module, the positioning module and any cleaning module. A wafer is loaded to the loading and unloading module, then the carrying module grabs the wafer at the loading and unloading module and carries the wafer to the positioning module for positioning, then the carrying module carries the wafer positioned at the positioning module to any cleaning module for cleaning, and after cleaning is completed, the carrying module carries the wafer to the loading and unloading module for unloading. As the cleaning modules and the rack are detachably arranged, when one cleaning module breaks down, the cleaning module can be detached for independent maintenance, the cleaning equipment does not need to be shut down for maintenance, and the wafer cleaning efficiency and the production efficiency are prevented from being affected.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer cleaning, and specifically relates to a cleaning device. Background Art

[0002] Cleaning refers to the use of physical or chemical methods to remove surface impurities or self-oxides before oxidation, photolithography, epitaxy, diffusion and other processes in the semiconductor process to obtain a surface that meets the cleanliness requirements. At present, the cleaning of semiconductor wafers is mainly divided into manual cleaning and cleaning machine cleaning. When using a cleaning machine for cleaning, the wafer is placed on a cleaning disk, and the solution is sprayed onto the surface of the wafer. The cleaning disk drives the wafer to rotate for cleaning. The centrifugal force generated by the rotation allows the solution to pass through the surface of the wafer and be thrown out to achieve the cleaning effect.

[0003] Existing cleaning machines are equipped with multiple cleaning modules to clean multiple wafers at the same time, that is, each cleaning module has a cleaning plate and other structures to improve cleaning efficiency. However, the existing cleaning machines are designed as a whole machine. When one of the cleaning modules fails, the whole machine needs to be shut down for maintenance, which affects wafer cleaning and production efficiency. Utility Model Content

[0004] The technical problem to be solved by the present application is that the existing cleaning machine adopts an integrated design, and a failure in one cleaning module requires the entire machine to be shut down for repair, which affects the wafer cleaning and production efficiency. A cleaning device is provided that does not require the entire machine to be shut down for repair when a single cleaning module fails.

[0005] The technical solution proposed in this application is:

[0006] A cleaning device, comprising:

[0007] frame;

[0008] A loading and unloading module is arranged on the frame;

[0009] A positioning module, arranged on the frame, for positioning the product;

[0010] A plurality of cleaning modules are arranged at intervals on the frame, and each of the cleaning modules is detachably arranged, and each of the cleaning modules is used to clean the product;

[0011] The transport module is arranged on the frame and is used to grab and release the product to drive the product to flow between the loading and unloading modules, the positioning module and any one of the cleaning modules.

[0012] Furthermore, the positioning module includes a positioning frame and a positioning component, the positioning frame is connected to the frame, and the positioning component is arranged on the positioning frame and is used to position the product.

[0013] Furthermore, the positioning assembly includes a positioning drive member and a plurality of positioning members. The positioning drive member is arranged on the positioning frame and is connected to the plurality of positioning members to drive the plurality of positioning members to approach and move away from each other. The plurality of positioning members can carry the product together, and the product can be positioned when the plurality of positioning members approach each other.

[0014] Furthermore, the positioning assembly also includes a positioning seat and a transmission structure, the positioning seat is arranged on the positioning frame, the positioning drive member, the transmission structure and the multiple positioning members are all arranged on the positioning seat, and each of the positioning members can move reciprocatingly, and the transmission structure is connected between the positioning drive member and the multiple positioning members.

[0015] Furthermore, each of the cleaning modules includes a cleaning rack and a cleaning component, the cleaning rack is detachably connected to the frame, the cleaning component is detachably arranged on the cleaning rack, and the cleaning component is used to clean the product.

[0016] Furthermore, the cleaning component includes a rotating structure and a liquid spraying structure, both of which can be detachably arranged on the cleaning frame, and the rotating structure can carry and rotate the product, and the liquid spraying structure can spray cleaning liquid onto the product on the rotating structure.

[0017] Furthermore, the rotating structure includes a mounting seat, a bearing seat, and a plurality of support columns. The mounting seat is detachably arranged on the cleaning rack, the bearing seat is rotatably arranged on the mounting seat, and the plurality of support columns are spaced apart on the bearing seat to jointly carry and fix the product.

[0018] Furthermore, the bearing seat has a bearing surface, the bearing surface is provided with a cleaning groove, the liquid spraying end of the liquid spraying structure extends into the cleaning groove, and the plurality of support columns are provided on the bearing surface and arranged around the cleaning groove.

[0019] Furthermore, the rotating structure further comprises a rotating shaft, the rotating shaft is rotatably disposed on the mounting seat, the bearing seat is connected to the rotating shaft, and one end of the rotating shaft extends into the cleaning tank;

[0020] The rotating shaft is hollow, and the liquid spraying end of the liquid spraying structure passes through the rotating shaft and extends into the cleaning tank.

[0021] Furthermore, the liquid spray structure includes a cleaning part, which is arranged on the cleaning frame and has a cleaning space and a drainage hole. The rotating structure is connected to the cleaning part and at least partially extends into the cleaning space to carry the product in the cleaning space. The drainage hole is connected to the cleaning space.

[0022] With the above-mentioned cleaning equipment, the wafer is loaded into the loading and unloading module, and then the transport module grabs the wafer at the loading and unloading module and transports the wafer to the positioning module for positioning. Then the transport module transports the wafer positioned at the positioning module to any cleaning module for cleaning. After the cleaning is completed, the transport module transports the wafer to the loading and unloading module for unloading. Since the cleaning module and the frame are detachably arranged, when one of the cleaning modules fails, it can be removed and repaired separately, without the need to shut down the cleaning equipment for maintenance, thereby avoiding affecting the wafer cleaning efficiency and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.

[0024] Figure 1 A schematic diagram of the structure of a cleaning device provided in one embodiment of the present application;

[0025] Figure 2 for Figure 1 The structural schematic diagram of the positioning module in the cleaning equipment shown;

[0026] Figure 3 for Figure 1 A schematic diagram of the structure of a cleaning module in the cleaning device shown;

[0027] Figure 4 for Figure 3 The schematic diagram of the cleaning module shown is a structural diagram from another angle after the wafer is removed;

[0028] Figure 5 for Figure 4 An enlarged schematic diagram of the structure at point A in the cleaning module is shown.

[0029] Description of labels:

[0030] 100, cleaning equipment; 200, wafer; 110, rack; 120, loading and unloading module; 130, positioning module; 140, transport module; 150, cleaning module; 131, positioning frame; 132, positioning assembly; 133, positioning drive member; 134, positioning member; 151, cleaning frame; 152, cleaning assembly; 153, rotating structure; 154, liquid spraying structure; 155, bearing seat; 156, supporting column; 157, rotating shaft; 1551, bearing surface; 1552, cleaning tank; 1561, supporting part; 1562, limiting part; 158, cleaning part; 1581, cleaning space; 1582, drainage hole; 1583, liquid spraying hole; 159, liquid spraying pipe. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] like Figure 1 As shown, an embodiment of the present application provides a cleaning device 100 , including a frame 110 , a loading and unloading module 120 , a positioning module 130 , a transport module 140 and a plurality of cleaning modules 150 .

[0034] The loading and unloading module 120 , the positioning module 130 , the transporting module 140 and the plurality of cleaning modules 150 are all disposed on the frame 110 , and each cleaning module 150 is detachably disposed.

[0035] The loading and unloading module 120 is used for loading or unloading products, the positioning module 130 is used for positioning products, each cleaning module 150 is used for cleaning products, and the transport module 140 is used to grab and release products to drive the products to flow between the loading and unloading module 120, the positioning module 130 and any one of the cleaning modules 150.

[0036] It should be noted that, in this embodiment, the product is a wafer 200. In other embodiments, the product may also be other. This application takes the wafer 200 as an example for description.

[0037] With the above-mentioned cleaning equipment, the wafer 200 is loaded to the loading and unloading module 120, and then the transport module 140 grabs the wafer 200 at the loading and unloading module 120, and transports the wafer 200 to the positioning module 130 for positioning, and then the transport module 140 transports the wafer 200 positioned at the positioning module 130 to any cleaning module 150 for cleaning, and after the cleaning is completed, the transport module 140 transports the wafer 200 to the loading and unloading module 120 for unloading. Since the cleaning module 150 and the rack 110 are detachably arranged, when one of the cleaning modules 150 fails, it can be removed and repaired separately, without stopping the cleaning equipment for maintenance, thereby avoiding affecting the cleaning efficiency and production efficiency of the wafer 200.

[0038] Combination Figure 1 It can be confirmed that the transport module 140 is a robot that cooperates with a gripper to transport the wafer 200. In addition, the transport module 140 is arranged in the middle of the rack 110, and the loading and unloading module 120, the positioning module 130 and multiple cleaning modules 150 are arranged around the transport module 140 to facilitate the transport module 140 to transport the wafer 200.

[0039] In one embodiment, the loading and unloading module 120 includes a bracket and a base, the bracket is connected to the frame 110, and the base is arranged on the bracket for carrying the wafer 200. In addition, it should be noted that a positioning structure is also provided on the base to perform preliminary positioning of the wafer 200, and then a second positioning is performed by the positioning module 130 to ensure the accuracy of the wafer 200 grasped by the transport module 140, thereby ensuring that the transport module 140 accurately places the wafer 200 on the cleaning module 150.

[0040] See also Figure 2 In one embodiment, the positioning module 130 includes a positioning frame 131 and a positioning assembly 132. The positioning frame 131 is connected to the frame 110. The positioning assembly 132 is disposed on the positioning frame 131 and is used to position the wafer 200. It should be noted that the positioning frame 131 can also be detachably connected to the frame 110, so that when the positioning module 130 fails, it can be directly replaced, which is convenient for maintenance, shortens the maintenance time, and improves the cleaning efficiency.

[0041] In one embodiment, the positioning assembly 132 includes a positioning driver 133 and a plurality of positioning members 134. The positioning driver 133 is disposed on the positioning frame 131 and connected to the plurality of positioning members 134 to drive the plurality of positioning members 134 to move closer to and away from each other. The plurality of positioning members 134 can carry the wafer 200 together, and the plurality of positioning members 134 can position the wafer 200 when they are closer to each other.

[0042] Optionally, the positioning driver 133 is a finger cylinder, and the number of the positioning members 134 is three. Specifically, the structure of the positioning assembly 132 is similar to a three-jaw chuck, and the positioning member 134 is similar to a claw. The three positioning members 134 are evenly spaced and arranged on a circular path with the center of the positioning driver 133 as the center of the circle, and the three positioning members 134 can move radially back and forth in the circle to move closer to and away from each other. In other embodiments, the positioning driver 133 can also be a driving mechanism such as a plurality of cylinders or electric cylinders that correspondingly drive the plurality of positioning members 134 to move closer to and away from each other, and it is sufficient to drive the plurality of positioning members 134 to move closer to and away from each other to perform center positioning on the wafer 200, and there is no limitation here.

[0043] In one embodiment, each cleaning module 150 includes a cleaning rack 151 and a cleaning assembly 152. The cleaning rack 151 is detachably connected to the frame 110, and the cleaning assembly 152 is detachably arranged on the cleaning rack 151 to further facilitate maintenance, shorten maintenance time, and improve cleaning efficiency. The cleaning assembly 152 is used to clean the wafer 200.

[0044] For further information, see Figure 3 and Figure 4 The cleaning assembly 152 includes a rotating structure 153 and a liquid spraying structure 154. Both the rotating structure 153 and the liquid spraying structure can be detachably arranged on the cleaning rack 151 to further facilitate maintenance, shorten maintenance time, and improve cleaning efficiency. The rotating structure 153 can carry and rotate the wafer 200, and the liquid spraying structure 154 can spray cleaning liquid onto the wafer 200 on the rotating structure 153. In this way, the transport module 140 transports the wafer 200 to the rotating structure 153, and the rotating structure 153 rotates the wafer 200. During the rotation, the liquid spraying structure 154 sprays the cleaning liquid onto the wafer 200. The cleaning liquid is allowed to pass through the surface of the wafer 200 and be thrown out by the centrifugal force generated by the rotation, thereby achieving a cleaning effect.

[0045] In one embodiment, the rotating structure 153 includes a mounting seat, a supporting seat 155, and a plurality of supporting columns 156. The mounting seat is detachably disposed on the cleaning rack 151, the supporting seat 155 is rotatably disposed on the mounting seat, and the plurality of supporting columns 156 are spaced apart on the supporting seat 155 to jointly support and fix the chip 200 to prevent the chip 200 from shaking or even falling off during rotation.

[0046] Furthermore, the rotating structure 153 further includes a rotating shaft 157, which is rotatably disposed on the mounting seat and connected to the bearing seat 155, so that the bearing seat 155 can rotate relative to the mounting seat. Specifically, the rotating shaft 157 is rotatably disposed on the mounting seat via a bearing.

[0047] In one embodiment, the support seat 155 has a support surface 1551, the support surface 1551 is provided with a cleaning groove 1552, and a plurality of support columns 156 are disposed on the support surface 1551 and arranged around the cleaning groove 1552. In this way, after the wafer 200 is placed on the plurality of support columns 156, the wafer 200 can cover the cleaning groove 1552. The liquid spraying end of the liquid spraying structure 154 extends into the cleaning groove 1552, and the cleaning liquid is sprayed on the wafer 200 on the support column 156 to clean the bottom of the wafer 200.

[0048] It is understandable that the wafer 200 is supported on a plurality of support pillars 156, and the plurality of support pillars 156 are arranged at intervals, so that during the rotation of the wafer 200, the cleaning liquid sprayed to the bottom of the wafer 200 by the liquid spraying structure 154 can be separated from the wafer 200 under the action of centrifugal force. Figure 4 In the illustrated embodiment, the bearing surface 1551 is a circular plane, a plurality of support columns 156 are arranged at intervals along the circumference of the bearing surface 1551 at the edge of the bearing surface 1551, the cleaning groove 1552 is located in the middle position of the bearing surface 1551, and the spray end of the spray structure 154 is located in the middle position of the cleaning groove 1552.

[0049] Please also see Figure 5 In one embodiment, each support column 156 includes a support portion 1561 and a limiting portion 1562, the support portion 1561 is connected to the support seat 155, and the limiting portion 1562 is connected to one end of the support portion 1561 away from the support seat 155. The end of the support portion 1561 away from the support seat 155 is used to support the wafer 200, and the limiting portion 1562 can limit the wafer 200 supported by the support portion 1561, so as to fix the wafer 200. Specifically, the limiting portion 1562 and the support portion 1561 are coaxially arranged, the diameter of the limiting portion 1562 is smaller than the diameter of the support portion 1561, and the connection position of the limiting portion 1562 and the support portion 1561 is connected through an inclined surface. In this way, the wafer 200 can be supported and limited at the inclined surface.

[0050] In one embodiment, the shaft 157 is hollow, and one end of the shaft 157 extends into the cleaning tank 1552. The liquid spraying end of the liquid spraying structure 154 passes through the shaft 157 and extends into the cleaning tank 1552, thereby spraying the cleaning liquid to the bottom of the wafer 200.

[0051] In one embodiment, the liquid spraying structure 154 includes a cleaning member 158, which is disposed on the cleaning frame 151 and has a cleaning space 1581 and a liquid discharge hole 1582. The rotating structure 153 is connected to the cleaning member 158 and at least partially extends into the cleaning space 1581 to carry the wafer 200 in the cleaning space 1581. The liquid discharge hole 1582 is connected to the cleaning space 1581. In this way, the rotating structure 153 drives the wafer 200 to rotate in the cleaning space 1581. During the rotation, the wafer 200 is cleaned by the cleaning liquid, and the cleaning liquid is discharged through the liquid discharge hole 1582.

[0052] It should be noted that the cleaning member 158 can be detachably connected to the cleaning frame 151. In addition, the rotating structure 153 and the cleaning member 158 are sealed to ensure that the cleaning liquid is discharged from the drain hole 1582 to avoid leakage of the cleaning liquid.

[0053] Furthermore, the liquid spraying structure 154 further includes a liquid supplying member and a liquid spraying pipe 159, the liquid supplying member is connected to the liquid spraying pipe 159, and one end of the liquid spraying pipe 159 away from the liquid supplying member is directed toward the wafer 200, so as to spray the cleaning liquid on the wafer 200. In addition, the liquid spraying pipe 159 may include a plurality of liquid spraying pipes, and the liquid spraying end of at least one liquid spraying pipe 159 passes through the rotating shaft 157 and extends into the cleaning tank 1552, so as to spray the cleaning liquid on the bottom of the wafer 200.

[0054] In one embodiment, the cleaning member 158 is further provided with a liquid spray channel and a plurality of liquid spray holes 1583 connected to the liquid spray channel. The liquid supply member is connected to the liquid spray channel. The plurality of liquid spray holes 1583 are located on the inner wall of the cleaning space 1581. The cleaning liquid is sprayed on the chip 200 in the cleaning space 1581.

[0055] In actual applications, the cleaning piece 158 is cylindrical, and the cleaning space 1581 is also roughly cylindrical. The support seat 155 in the rotating structure 153 is located at the bottom of the cleaning space 1581 and in the middle position of the cleaning space 1581. A plurality of spray holes 1583 are evenly spaced along the circumference of the cleaning piece 158, and the drainage hole 1582 is located on the bottom wall of the cleaning space 1581.

[0056] In order to facilitate understanding of the technical solution of this application, Figure 1 The working process of the cleaning device in the above embodiment is described as follows:

[0057] The staff places the wafer 200 to be cleaned at the loading and unloading module 120, and the loading and unloading module 120 performs preliminary positioning on the wafer 200. The transport module 140 grabs the wafer 200 at the loading and unloading module 120, and then transports the wafer 200 to the positioning module 130. At this time, the multiple positioning members 134 are in a distant state to facilitate the placement of the wafer 200. Next, the positioning drive member 133 drives the multiple positioning members 134 to approach each other until the wafer 200 is clamped, thereby achieving secondary positioning of the wafer 200. Then the transport module 140 grabs the wafer 200 that has been secondary positioned, and the positioning drive member 133 drives the multiple positioning members 134 to move away from each other to release the wafer 200.

[0058] The transport module 140 transports the wafer 200 to one of the vacant cleaning modules 150 and places the wafer 200 on a plurality of support pillars 156. Then the rotating shaft 157 drives the support seat 155 to rotate, thereby driving the wafer 200 to rotate. During the rotation of the wafer 200, the spray pipe 159 in the cleaning tank 1552 sprays the cleaning liquid toward the bottom of the wafer 200, and the spray hole 1583 on the cleaning member 158 can spray the cleaning liquid toward the top of the wafer 200, so as to clean both surfaces of the wafer 200. After the cleaning is completed, the transport module 140 grabs the wafer 200 and places it at the loading and unloading module 120, and the staff unloads the material.

[0059] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A cleaning device, characterized in that: include: frame; A loading and unloading module is arranged on the frame; A positioning module, arranged on the frame, for positioning the product; A plurality of cleaning modules are arranged at intervals on the frame, and each of the cleaning modules is detachably arranged, and each of the cleaning modules is used to clean the product; The transport module is arranged on the frame and is used to grab and release the product to drive the product to flow between the loading and unloading modules, the positioning module and any one of the cleaning modules.

2. The cleaning device according to claim 1, characterized in that: The positioning module comprises a positioning frame and a positioning assembly. The positioning frame is connected to the frame. The positioning assembly is arranged on the positioning frame and is used for positioning the product.

3. The cleaning device according to claim 2, characterized in that: The positioning assembly includes a positioning drive member and a plurality of positioning members. The positioning drive member is arranged on the positioning frame and connected to the plurality of positioning members to drive the plurality of positioning members to approach and move away from each other. The plurality of positioning members can carry the product together, and the product can be positioned when the plurality of positioning members approach each other.

4. The cleaning device according to claim 3, characterized in that: The positioning assembly also includes a positioning seat and a transmission structure. The positioning seat is arranged on the positioning frame. The positioning drive member, the transmission structure and multiple positioning members are all arranged on the positioning seat, and each of the positioning members can move back and forth. The transmission structure is connected between the positioning drive member and the multiple positioning members.

5. The cleaning device according to claim 1, characterized in that: Each of the cleaning modules comprises a cleaning rack and a cleaning component. The cleaning rack is detachably connected to the frame. The cleaning component is detachably arranged on the cleaning rack. The cleaning component is used to clean the product.

6. The cleaning device according to claim 5, characterized in that: The cleaning component includes a rotating structure and a liquid spraying structure, both of which can be detachably arranged on the cleaning frame, and the rotating structure can carry and rotate the product, and the liquid spraying structure can spray cleaning liquid onto the product on the rotating structure.

7. The cleaning device according to claim 6, characterized in that: The rotating structure includes a mounting seat, a bearing seat, and a plurality of supporting columns. The mounting seat is detachably arranged on the cleaning rack, the bearing seat is rotatably arranged on the mounting seat, and the plurality of supporting columns are spaced apart on the bearing seat to jointly carry and fix the product.

8. The cleaning device according to claim 7, characterized in that: The bearing seat has a bearing surface, the bearing surface is provided with a cleaning groove, the liquid spraying end of the liquid spraying structure extends into the cleaning groove, and a plurality of support columns are arranged on the bearing surface and around the cleaning groove.

9. The cleaning device according to claim 8, characterized in that: The rotating structure further includes a rotating shaft, which is rotatably disposed on the mounting seat, the bearing seat is connected to the rotating shaft, and one end of the rotating shaft extends into the cleaning tank; The rotating shaft is hollow, and the liquid spraying end of the liquid spraying structure passes through the rotating shaft and extends into the cleaning tank.

10. The cleaning device according to claim 6, characterized in that: The liquid spraying structure includes a cleaning part, which is arranged on the cleaning frame and has a cleaning space and a drainage hole. The rotating structure is connected to the cleaning part and at least partially extends into the cleaning space to carry the product in the cleaning space. The drainage hole is connected to the cleaning space.

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