Needle type liquid cooling radiator
By designing a needle-type liquid-cooled radiator, the use of densely distributed fine diameter main needle and thermal grease layer, the problem of insufficient heat exchange area and efficiency of existing liquid-cooled radiators is solved, achieving more efficient heat dissipation effect and lower scrap rate.
Patent Information
- Application Number
- CN202421180036.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The existing liquid-cooled radiators have shortcomings in terms of heat exchange area and cooling efficiency, and cannot meet the needs of objects to be cooled with high heat generation.
A needle-type liquid-cooled radiator is designed, including a first substrate, a main needle and a second substrate. The diameter of the main needle is small and densely distributed. The coolant is heat-exchanged through the main needle in the groove and passes through thermally conductive silicon. The lipid layer and the needle further improve the heat exchange efficiency.
It improves heat dissipation efficiency, increases heat exchange area, and can dissipate heat more efficiently for cooling objects. The main needle design makes it easy to replace and reduces the scrap rate.
Smart Images

Figure CN222440588U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of liquid cooling radiators, in particular to a needle-type liquid cooling radiator. Background Art
[0002] The objects to be cooled (chips, power devices / modules) will generate a lot of heat during operation, and the objects to be cooled can be cooled and dissipated by liquid cooling radiators.
[0003] For objects with high heat generation to be cooled, existing liquid cooling radiators include pin fins, which are usually manufactured by cold forging and extrusion. The pin fins have low density, low heat exchange area, and low cooling efficiency, and do not meet the requirements. Utility Model Content
[0004] In view of the above problems in the prior art, the purpose of the present invention is to provide a pin-type liquid-cooled radiator having a larger heat exchange area and capable of improving heat exchange efficiency.
[0005] In order to solve the above problems, the utility model provides a pin-type liquid cooling radiator, the pin-type liquid cooling radiator comprising:
[0006] A first substrate, the first substrate comprising a first surface and a second surface opposite to each other, the second surface being used for mounting an object to be cooled;
[0007] A plurality of main needles, the top ends of the plurality of main needles being inserted into the first surface of the first substrate;
[0008] The second substrate is connected to the first substrate, the second substrate is formed with a groove capable of accommodating cooling liquid, the groove is formed with a liquid inlet hole and a liquid outlet hole capable of allowing cooling liquid to enter and exit, and the groove accommodates all the main needles.
[0009] Furthermore, a plurality of pits are formed on the first surface of the first substrate, and the plurality of main needles are inserted into the pits in a one-to-one correspondence.
[0010] Furthermore, the cross-sectional area of the pit gradually decreases from its mouth to its bottom, and the shape of the top end of the main needle is adapted to the shape of the pit so that the top end of the main needle is in close contact with the side wall and the bottom of the pit.
[0011] Furthermore, the pin-type liquid cooling radiator comprises:
[0012] A thermally conductive silicone grease layer is disposed between the top end of the main needle and the first substrate.
[0013] Furthermore, the pin-type liquid cooling radiator also includes:
[0014] A plurality of groups of branch needles, wherein the plurality of groups of branch needles correspond one-to-one to the plurality of main needles, and a group of the branch needles comprises the plurality of branch needles arranged at intervals along the length direction of the main needles.
[0015] Furthermore, a group of the branch needles further includes a plurality of the branch needles arranged at intervals in the circumferential direction around the main needle.
[0016] Furthermore, in the two groups of branch needles located on two adjacent main needles, ends of at least some of the branch needles in the length direction are in contact with each other.
[0017] Furthermore, the main needle is formed into a cylinder, and its diameter is 0.3 mm to 2 mm.
[0018] Furthermore, the pin-type liquid cooling radiator also includes:
[0019] A solder layer is disposed between the bottom end of the main needle and the second substrate.
[0020] Furthermore, the first substrate is made of copper, and the main needle is made of aluminum.
[0021] Due to the above technical solution, the utility model has the following beneficial effects:
[0022] According to the needle-type liquid cooling radiator of the utility model, the second surface of the first substrate can be used to install the object to be cooled, and the first surface of the first substrate is inserted with multiple rows and columns of main needles, and the diameter of the main needles is small, so that the main needles can be densely distributed, and the coolant can flow from the liquid inlet hole into the groove of the second substrate, so that the groove is filled with coolant, and the coolant exchanges heat with the densely distributed main needles in the groove, thereby improving the heat dissipation efficiency, and the main needles exchange heat with the object to be cooled through the first substrate, thereby efficiently dissipating the heat of the object to be cooled. The main needles can be easily replaced, which can reduce the scrap rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solution of the utility model, the following is a brief introduction to the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 It is a structural diagram of a pin-type liquid cooling radiator according to an embodiment of the utility model;
[0025] Figure 2 is a structural diagram of a first substrate according to an embodiment of the utility model;
[0026] Figure 3is a structural diagram of a first substrate and a main needle according to an embodiment of the utility model;
[0027] Figure 4 is a structural diagram of a first substrate, a main needle and a solder layer according to an embodiment of the utility model;
[0028] Figure 5 It is a structural diagram of a main needle and a branch needle according to an embodiment of the utility model;
[0029] Figure 6 It is a structural diagram of a main needle and a branch needle according to another embodiment of the utility model.
[0030] Reference numerals:
[0031] 100, first substrate; 110, pit; 200, second substrate; 210, liquid inlet hole; 220, liquid outlet hole; 310, main needle; 320, branch needle; 400, solder layer. DETAILED DESCRIPTION
[0032] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0034] The following is a structural diagram of a pin-type liquid cooling radiator according to an embodiment of the present utility model.
[0035] like Figures 1 to 6 As shown, the liquid cooling radiator of the embodiment of the present invention includes: a first substrate 100 , a plurality of main pins 310 and a second substrate 200 .
[0036] First, the first substrate 100 and the plurality of main pins 310 are described. The first substrate 100 includes a first surface and a second surface opposite to each other, and the second surface is used to mount an object to be cooled. The top ends of the plurality of main pins 310 are inserted into the first surface of the first substrate 100.
[0037] like Figure 1 and Figure 3 As shown, the first surface of the first substrate 100 is distributed with multiple rows and columns of main needles 310, and the main needles 310 can be thinner (smaller in diameter), and the diameter of conventional needle fins can be reduced by several times, so that a larger heat exchange area can be provided with the coolant. The second surface of the first substrate 100 can be connected to an object to be cooled to dissipate heat from the object to be cooled.
[0038] Moreover, the main needle 310 is inserted into the first substrate 100, rather than being integrally formed with the first substrate 100. If part of the main needle 310 is deformed or damaged, the corresponding main needle 310 can be replaced and inserted into the first substrate 100 again. In the cold forging method (the needle wing and the first substrate 100 are integrally formed), if part of the needle wing is damaged, the entire needle needs to be scrapped. This can improve the product yield and reduce the scrap rate.
[0039] Next, the second substrate 200 is described. The second substrate 200 is connected to the first substrate 100 and has a groove for accommodating the cooling liquid. The groove has a liquid inlet 210 and a liquid outlet 220 for allowing the cooling liquid to enter and exit. The groove accommodates all the main needles 310 .
[0040] The coolant can flow from the liquid inlet hole 210 into the groove of the second substrate 200, so that the groove is filled with the coolant. The coolant exchanges heat with the main needle 310 in the groove. The main needle 310 exchanges heat with the object to be cooled through the first substrate 100, thereby cooling the object to be cooled and ensuring stable operation of the object to be cooled.
[0041] In the above needle-type liquid cooling radiator, the second surface of the first substrate 100 can be mounted with an object to be cooled, and the first surface of the first substrate 100 is inserted with multiple rows and columns of main needles 310, and the diameter of the main needles 310 is small, so that the main needles 310 can be densely distributed, and the coolant can flow from the liquid inlet 210 into the groove of the second substrate 200, so that the groove is filled with coolant, and the coolant exchanges heat with the densely distributed main needles 310 in the groove, thereby improving the heat dissipation efficiency, and the main needles 310 exchange heat with the object to be cooled through the first substrate 100, so as to efficiently dissipate heat from the object to be cooled. Moreover, the main needles can be easily replaced to reduce the scrap rate.
[0042] In some embodiments of the present invention, a plurality of pits 110 are formed on the first surface of the first substrate 100 , and a plurality of main needles 310 are inserted into the pits 110 in a one-to-one correspondence.
[0043] like Figure 2As shown, the first surface of the first substrate 100 is formed with multiple rows and columns of pits 110, which can facilitate the fixing of the main needle 310 and increase the contact area between the main needle 310 and the first substrate 100, reduce contact thermal resistance, and improve heat exchange efficiency.
[0044] Furthermore, the cross-sectional area of the pit 110 gradually decreases from its mouth to its bottom, and the shape of the top end of the main needle 310 is adapted to the shape of the pit, so that the top end of the main needle 310 is closely attached to the side wall and bottom of the pit 110 .
[0045] like Figure 6 As shown, the top of the main needle 310 is conical, and accordingly, the shape of the concave hole 110 can be funnel-shaped, and the conical top of the main needle 310 is close to the bottom and side wall of the funnel-shaped concave hole. This design can facilitate the alignment of the main needle 310 and the concave hole 110, so that the main needle 310 can be smoothly inserted into the concave hole 110.
[0046] It should be noted that the above are only optional examples, and the shape of the top of the main needle 310 can also be a column, and correspondingly, the shape of the pit 110 is a columnar groove, which should all be understood to be within the scope of the present utility model.
[0047] Furthermore, the pin-type liquid cooling radiator includes a thermally conductive silicone grease layer, which is disposed between the top of the main pin 310 and the first substrate 100 .
[0048] Thermal grease can be applied to the top of the main needle 310 and then inserted into the pit 110, or a small amount of thermal grease can be injected into the bottom of the pit 110 and the main needle 310 can be inserted into the pit 110, so that the thermal grease layer is arranged between the top of the main needle 310 and the first substrate 100. By injecting thermal grease into the tiny gap between the main needle 310 and the pit 110, the contact thermal resistance between the main needle 310 and the first substrate 100 can be reduced, thereby increasing the heat exchange efficiency.
[0049] In some embodiments of the present invention, the pin-type liquid cooling radiator further includes a plurality of groups of branch pins 320. The plurality of groups of branch pins 320 correspond to the plurality of main pins 310 one by one, and a group of branch pins 320 includes a plurality of branch pins 320 spaced apart and arranged along the length direction of the main pins 310.
[0050] like Figure 5 As shown, a group of branch pins 320 includes a plurality of branch pins 320 spaced apart and arranged along the length direction. The branch pins 320 can further increase the heat exchange area of the pin-type liquid cooling radiator and improve the heat exchange efficiency.
[0051] Furthermore, the group of branch needles 320 further includes a plurality of branch needles 320 arranged at intervals in the circumferential direction around the main needle 310 .
[0052] like Figure 5As shown, a group of branch needles 320 also includes four branch needles 320 arranged at intervals in the circumferential direction around the main needle 310. It should be noted that the above is only an optional example, and a group of branch needles 320 may also include two branch needles 320, six branch needles 320, etc., which should be understood within the scope of the present invention. In this way, the number of branch needles can be increased, thereby further increasing the heat exchange area and improving the heat exchange efficiency.
[0053] Furthermore, in the two groups of branch needles 320 located on two adjacent main needles 310 , the ends of at least some of the branch needles 320 in the length direction are in contact with each other.
[0054] The part of the branch needles 320 located between two adjacent main needles 310 abuts against each other, which can prevent the main needles 310 from being excessively tilted and deformed, and increase the structural stability of the main needles 310 .
[0055] In some embodiments of the present invention, the main needle 310 is formed as a cylinder, and its diameter is 0.3 mm to 2 mm.
[0056] The diameter of the cylindrical main needle 310 can be 0.3 mm, 0.6 mm, 1 mm, 1.5 mm, 2 mm, etc. These diameters are relatively small and meet the strength requirements, and can better meet the premise of having a large heat exchange area and having relatively high strength.
[0057] In some embodiments of the present invention, the pin-type liquid cooling radiator further includes a solder layer 400. The solder layer 400 is disposed between the bottom end of the main pin 310 and the second substrate 200.
[0058] like Figure 4 As shown, a solder layer 400 (solder plate) is arranged on the bottom end of the main needle 310, and then the assembled first substrate 100, the main needle 310 and the solder layer 400 are connected to the second substrate 200, and then inserted into a solder furnace for processing, so as to achieve a stable connection between the main needle 310 and the second substrate 200 and reduce the contact thermal resistance between the main needle 310 and the second substrate 200.
[0059] In some embodiments of the present invention, the first substrate 100 is a copper part, and the main needle 310 is an aluminum part.
[0060] The hardness of aluminum is higher than that of copper. The main needle 310 made of aluminum can be easily inserted into the first substrate 100 made of copper. The main needle 310 has a higher strength. Even if the pit 110 is not formed on the first substrate 100, the main needle 310 can be inserted into the first substrate 100. Since the main needle 310 is inserted into the first substrate 100 (rather than integrally formed), the first substrate 100 and the main needle 310 can be made of different materials. The thermal conductivity of the first substrate 100 made of copper is higher than that of the main needle 310 made of aluminum. Compared with the main needle 310 and the first substrate 100 made entirely of copper, it can save costs and has a higher heat exchange efficiency. Moreover, the first substrate 100 made of copper can achieve better welding with the object to be cooled than the first substrate 100 made of aluminum.
[0061] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A pin-type liquid cooling radiator, characterized in that: The pin-type liquid cooling radiator comprises: A first substrate, the first substrate comprising a first surface and a second surface opposite to each other, the second surface being used for mounting an object to be cooled; A plurality of main needles, the top ends of the plurality of main needles being inserted into the first surface of the first substrate; A second substrate is connected to the first substrate, the second substrate is formed with a groove capable of accommodating cooling liquid, the groove is formed with a liquid inlet hole and a liquid outlet hole capable of allowing cooling liquid to enter and exit, and the groove accommodates all the main needles.
2. The pin-type liquid cooling radiator according to claim 1, characterized in that: A plurality of pits are formed on the first surface of the first substrate, and the plurality of main needles are inserted into the pits in a one-to-one correspondence.
3. The pin-type liquid cooling radiator according to claim 2, characterized in that: The cross-sectional area of the pit gradually decreases from its mouth to its bottom, and the shape of the top end of the main needle is adapted to the shape of the pit so that the top end of the main needle is in close contact with the side wall and the bottom of the pit.
4. The pin-type liquid cooling radiator according to claim 3, characterized in that: The pin-type liquid cooling radiator comprises: A thermally conductive silicone grease layer is disposed between the top end of the main needle and the first substrate.
5. The pin-type liquid cooling radiator according to claim 1, characterized in that: The pin-type liquid cooling radiator also includes: A plurality of groups of branch needles, wherein the plurality of groups of branch needles correspond one-to-one to the plurality of main needles, and a group of the branch needles comprises the plurality of branch needles arranged at intervals along the length direction of the main needles.
6. The pin-type liquid cooling radiator according to claim 5, characterized in that: The group of branch needles further includes a plurality of branch needles arranged at intervals around the circumference of the main needle.
7. The pin-type liquid cooling radiator according to claim 5, characterized in that: In the two groups of branch needles located on two adjacent main needles, ends of at least some of the branch needles in the length direction are in contact with each other.
8. The pin-type liquid cooling radiator according to claim 1, characterized in that: The main needle is formed into a cylinder, and its diameter is 0.3 mm to 2 mm.
9. The pin-type liquid cooling radiator according to claim 1, characterized in that: The pin-type liquid cooling radiator also includes: A solder layer is disposed between the bottom end of the main needle and the second substrate.
10. The pin-type liquid cooling radiator according to claim 1, characterized in that: The first substrate is made of copper, and the main needle is made of aluminum.