Printed circuit board (PCB) structure for improving installation of non-metallized installation hole

Abstract

The utility model discloses a PCB structure for improving installation of a non-metallized mounting hole, which comprises a PCB and the non-metallized mounting hole arranged on the PCB, and the non-metallized mounting hole penetrates through the surface layer and the bottom layer of the PCB. The surface layer and the bottom layer of the PCB are respectively provided with a circle of solder mask area on the periphery of the non-metallization mounting hole, and a plurality of steel mesh areas distributed at intervals are arranged in the solder mask areas. According to the utility model, resistance welding opening and steel mesh opening processing are carried out on the periphery of the non-metallized mounting hole on the surface layer and the bottom layer of the PCB, after the PCB is processed and formed, solder paste is brushed on the periphery of the non-metallized mounting hole, and when the PCB is fixed in cooperation with screws, the situation that the screws damage green oil and a base material of the PCB is avoided, and the service life of the PCB is prolonged. And meanwhile, the situation that the copper sheet on the periphery of the non-metallized mounting hole is warped and even falls off can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and in particular to a PCB structure for improving the installation of non-metallized mounting holes. Background Art

[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important part of the physical support and signal transmission of electronic products. It not only bears the physical support function of electronic components, but also is responsible for the efficient transmission of signals. Its importance is self-evident. In the manufacturing and installation process of PCB boards, the design and application of mounting holes are particularly important, especially some non-metallized mounting holes, which occupy an indispensable position in the design of PCB boards due to their unique performance.

[0003] The main function of non-metallized mounting holes is to fix the PCB board and ensure its stability on the case or housing. However, in the actual installation process, since screws and washers are needed for fixing, the direct contact between these components and the PCB board may bring a series of problems.

[0004] First, the friction between the screws and washers and the PCB during the fixing process may cause damage to the PCB. When too much force is applied, it may not only damage the green oil layer on the surface of the PCB, but also damage the substrate of the PCB, seriously affecting its service life and performance. In addition, the copper sheet around the mounting hole is prone to warping or even falling off when subjected to excessive pressure, which will have an adverse effect on the overall structural stability of the PCB.

[0005] On the other hand, if the force is too small, the screws may not be tightened, causing them to loosen and fall off, which in turn affects the fixing effect of the PCB board. This may not only reduce the overall performance of the electronic product, but also cause safety hazards.

[0006] Therefore, in order to solve the problems existing in the PCB installation process, the PCB needs to be optimized. Utility Model Content

[0007] In order to overcome the problem in the prior art that the non-metallized mounting holes of the PCB board may damage the board green paint and substrate when the PCB board is fixed with screws and gaskets, and cause the copper sheet around the mounting holes to warp or even fall off, the utility model provides a PCB structure for improving the installation of non-metallized mounting holes.

[0008] The technical solution of the utility model is as follows:

[0009] A PCB structure for improving the installation of non-metallized mounting holes comprises a PCB board and a non-metallized mounting hole arranged on the PCB board, wherein the non-metallized mounting hole penetrates a surface layer and a bottom layer of the PCB board, and a circle of solder resist area is arranged on the surface layer and the bottom layer of the PCB board around the non-metallized mounting hole, and a plurality of spaced steel mesh areas are arranged in the solder resist area.

[0010] As a preferred solution of the utility model, a avoidance area is provided in the solder resist area corresponding to each of the steel mesh areas, and the area of ​​each of the avoidance areas is larger than the area of ​​the corresponding steel mesh area.

[0011] As a preferred solution of the present invention, the steel mesh area is in the shape of an elongated strip.

[0012] As a preferred solution of the present invention, the width of the steel mesh area is 0.4 mm.

[0013] As a preferred solution of the present invention, the width of the avoidance area is 0.5 mm.

[0014] As a preferred solution of the present invention, the center distance between two adjacent steel mesh areas is 1 mm.

[0015] As a preferred solution of the present invention, the diameter of the non-metallized mounting hole is 3.6 mm.

[0016] As a preferred solution of the present invention, the distance from the solder resist area to the hole wall of the non-metallized mounting hole is greater than 0.5 mm.

[0017] As a preferred solution of the present invention, a plurality of the steel mesh areas form a solder paste brushing area.

[0018] As a preferred solution of the utility model, the size of the solder paste brushing area is consistent with the size of the screw.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] The utility model provides a PCB structure for improving the installation of non-metallic mounting holes. By performing solder mask and steel mesh processing on a circle around the non-metallic mounting holes on the surface layer and the bottom layer of the PCB board, after the PCB board is processed and formed, solder paste is brushed on the periphery of the non-metallic mounting holes, so that when the non-metallic mounting holes are used to fix the PCB board with screws, the screws will only contact the solder paste around the non-metallic mounting holes. Even in the process of tightening the screws with force, the screws will first contact the solder paste instead of the green oil and substrate of the PCB board. Therefore, the green oil and substrate of the PCB board will not be damaged by the screws, and the copper skin around the non-metallic mounting holes will be reduced. The situation of copper skin warping or even copper skin falling off can also be reduced. At the same time, in the subsequent transportation and use of the PCB board, since there will be a large friction between the screws and the solder paste, it is not easy for the screws to loosen. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the partial structure of the surface layer of the PCB board in one embodiment of the utility model;

[0023] Figure 2 It is a schematic diagram of the local structure of the bottom layer of the PCB board in one embodiment of the utility model.

[0024] In the figure,

[0025] 1. PCB board; 2. Non-metallized mounting holes; 3. Solder mask area; 31. Avoidance area; 4. Steel mesh area. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the utility model and are not used to limit the utility model.

[0027] It should be noted that the terms "install", "set", "connect", "fix" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. The meaning of "plurality" is two or more, unless otherwise clearly defined.

[0028] The main function of the non-metallized mounting holes on the PCB is to fix the PCB and ensure its stability on the case or housing. However, in the actual installation process, since screws and gaskets are needed for fixing, the direct contact between these components and the PCB may bring a series of problems. First, the friction between the screws and gaskets and the PCB during the fixing process may cause damage to the PCB. When too much force is applied, it may not only damage the green oil layer on the surface of the PCB, but also damage the substrate of the PCB, seriously affecting its service life and performance. In addition, the copper sheet around the mounting hole is prone to warping or even falling off when subjected to excessive pressure, which will have an adverse effect on the overall structural stability of the PCB. On the other hand, if the force is too small, the screws may not be tightened, causing the screws to loosen and fall off, which in turn affects the fixing effect of the PCB. This may not only reduce the overall performance of electronic products, but also cause safety hazards.

[0029] In order to solve the above problems, an embodiment of the utility model provides a PCB structure for improving the installation of non-metallized mounting holes.

[0030] See also Figure 1 , Figure 2The PCB structure for improving the installation of non-metallic mounting holes comprises a PCB board 1 and a non-metallic mounting hole 2 arranged on the PCB board 1, the non-metallic mounting hole 2 penetrates the surface layer and the bottom layer of the PCB board 1, and the surface layer and the bottom layer of the PCB board 1 are both provided with a circle of solder resist area 3 around the non-metallic mounting hole 2, and a plurality of steel mesh areas 4 are provided in the solder resist area 3, and the plurality of steel mesh areas 4 form a solder paste brushing area. The utility model performs solder resist and steel mesh processing on a circle around the non-metallic mounting hole on the surface layer and the bottom layer of the PCB board 1, and in processing, solder paste will be brushed after the steel mesh is opened, so that the solder paste is brushed on the periphery of the non-metallic mounting hole 2. The solder paste plays a role in increasing friction and fixing, so that when the non-metallic mounting hole 2 cooperates with the screw to fix the PCB board 1, the screw will only contact the solder paste around the non-metallic mounting hole 2, and even in the process of tightening the screw, the first thing the screw will contact will be the solder paste, rather than the green oil and substrate of the PCB board 1. Therefore, the utility model will not cause the screws to damage the green oil and base material of the PCB board 1, and can also reduce the copper skin around the non-metallized mounting hole 2 from warping or even shedding. In addition, because of the solder paste, there will be a large friction between the screw and the solder paste after the screw is tightened. During the subsequent transportation and use of the PCB board 1, the screw is not prone to loosening due to the friction. In addition, the spaced steel mesh areas 4 help reduce the waste of solder paste. By accurately controlling the layout and size of the steel mesh areas 4, it can be ensured that after the circuit board is processed and formed, the solder paste is only applied to the required position, avoiding unnecessary waste, which not only helps to reduce production costs, but also helps to improve production efficiency.

[0031] See also Figure 1 , Figure 2 In one embodiment, each of the solder mask areas 3 is provided with a avoidance area 31 corresponding to each of the steel mesh areas 4, and the area of ​​each avoidance area 31 is larger than the area of ​​the corresponding steel mesh area 4. The setting of the avoidance area 31 helps to ensure that the solder paste can be evenly distributed around the non-metallized mounting hole 2. Due to the existence of the avoidance area 31, the steel mesh area 4 will not be hindered when brushing the solder paste, so that the solder paste can be smoothly and evenly applied to the predetermined position.

[0032] See also Figure 1 , Figure 2 In some specific embodiments, the steel mesh area 4 is in the shape of a long strip, and the setting of the long strip steel mesh area 4 helps to more accurately control the application position and amount of the solder paste; because the shape of the steel mesh area 4 is regular and continuous, the solder paste can be more evenly distributed around the non-metallized mounting hole 2 when passing through the steel mesh area 4, which helps to ensure that each mounting hole can obtain an appropriate amount of solder paste, thereby improving the accuracy and reliability of welding.

[0033] In some specific embodiments, the width of the steel mesh area 4 is 0.4 mm, and the width of the avoidance area 31 is 0.5 mm, which is slightly larger than the width of the steel mesh area 4, which provides additional space for applying the solder paste. During the process of applying the solder paste, the avoidance area 31 can prevent the solder paste from excessively accumulating on the edge of the steel mesh area 4, ensuring that the solder paste can be applied to the PCB board 1 more smoothly and evenly.

[0034] In some specific embodiments, the center distance between two adjacent steel mesh areas 4 is 1 mm. This distance setting not only ensures the independence between the steel mesh areas 4, but also enables them to be closely arranged, thereby achieving continuous application of solder paste; appropriate distance setting helps prevent the solder paste from mixing or overflowing between different steel mesh areas 4, thereby maintaining the clarity and accuracy of the application area.

[0035] In some specific embodiments, the diameter of the non-metalized mounting hole 2 is 3.6 mm. Of course, in other embodiments, the diameter of the non-metalized mounting hole 2 can be freely adjusted according to the size of the PCB board 1, and the utility model does not limit this.

[0036] In one embodiment, the distance between the solder resist area 3 and the hole wall of the non-metallized mounting hole 2 is greater than 0.5 mm. Maintaining an appropriate distance between the solder resist area 3 and the hole wall of the non-metallized mounting hole 2 can effectively prevent solder paste or green oil from flowing into the hole due to improper operation during processing. If solder paste or green oil enters the inside of the non-metallized mounting hole 2, it may affect the fixation of the PCB board 1. Therefore, by maintaining a certain distance, it can be ensured that the inside of the non-metallized mounting hole 2 remains clean and unobstructed.

[0037] In one embodiment, the size of the solder paste brushing area is consistent with the size of the screw selected to fix the PCB board 1. The matching of the solder paste brushing area and the screw size can ensure that the screw can accurately contact the solder paste when fixing the PCB board 1. Since the solder paste has the function of increasing friction and fixing, this design can ensure that the screw is not easy to slip or shift during the tightening process, thereby improving the stability and reliability of the fixing of the PCB board 1.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0039] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A PCB structure for improving the installation of non-metallic mounting holes, comprising a PCB board and a non-metallic mounting hole arranged on the PCB board, wherein the non-metallic mounting hole penetrates the surface layer and the bottom layer of the PCB board, and is characterized in that: The surface layer and the bottom layer of the PCB board are both provided with a circle of solder resist area around the non-metallized mounting hole, and a plurality of spaced steel mesh areas are provided in the solder resist area.

2. The PCB structure for improving installation of non-metallized mounting holes according to claim 1, characterized in that: The solder resist area is provided with an avoidance area corresponding to each of the steel mesh areas, and the area of ​​each of the avoidance areas is larger than the area of ​​the corresponding steel mesh area.

3. The PCB structure for improving installation of non-metallized mounting holes according to claim 2, characterized in that: The steel mesh area is in the shape of an elongated strip.

4. The PCB structure for improving installation of non-metallized mounting holes according to claim 3, characterized in that: The width of the steel mesh area is 0.4 mm.

5. The PCB structure for improving installation of non-metallized mounting holes according to claim 4, characterized in that: The width of the avoidance area is 0.5 mm.

6. The PCB structure for improving installation of non-metallized mounting holes according to claim 1, characterized in that: The center distance between two adjacent steel mesh areas is 1 mm.

7. The PCB structure for improving installation of non-metallized mounting holes according to claim 1, characterized in that: The diameter of the non-metallic mounting hole is 3.6 mm.

8. The PCB structure for improving installation of non-metallized mounting holes according to claim 1, characterized in that: The distance from the solder resist area to the hole wall of the non-metallized mounting hole is greater than 0.5 mm.

9. The PCB structure for improving installation of non-metallized mounting holes according to claim 1, characterized in that: The plurality of steel mesh areas form a solder paste brushing area.

10. The PCB structure for improving installation of non-metallized mounting holes according to claim 9, characterized in that: The size of the solder paste brushing area is consistent with the size of the screw.

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