LED inorganic packaging structure

Abstract

The utility model provides an LED inorganic packaging structure, which relates to the technical field of LED packaging, and comprises a base, the top of the base is provided with a mounting groove, the inner wall of the mounting groove is provided with internal threads, the inner bottom of the mounting groove is fixedly connected with a limiting ring, and the inner surface of the mounting groove is provided with a connecting ring. According to the utility model, the inorganic glue is added into the slot formed between the mounting groove and the limiting ring, and then the lens is taken up and rotated, so that the connecting ring is in threaded connection with the internal thread, and the connecting ring is fixed in the mounting groove, and therefore, the lens can be fixed in the mounting groove under the action of the inorganic glue, the internal thread and the connecting ring. According to the LED packaging structure, good sealing between the LED chip installed in the center of the installation groove and the external environment can be guaranteed, dust, water and other impurities are prevented from entering the LED chip, the LED chip is kept clean and stable, and the second anti-overflow plate, the second anti-overflow groove, the first anti-overflow plate and the first anti-overflow groove are used in cooperation, so that the sealing performance of packaging and the cleanliness of the packaging process can be further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an inorganic LED packaging structure. Background Art

[0002] LED packaging refers to enclosing the chip in an independent space to provide adequate protection to prevent the chip from failing due to long-term exposure to the air or mechanical damage, so as to improve the stability of the chip. LED packaging is not only required to protect the wick, but also to be light-transmitting, have good light extraction efficiency and good heat dissipation, and be able to output electrical signals.

[0003] In the prior art, LED packaging mostly uses organic materials such as silicone and epoxy resin to seal and protect the chip. These materials have good transparency, but when the LED lamp is working, the ultraviolet light emitted will act on the surface of the organic material. After long-term use, the sealing material of the organic material will gradually age and break, affecting the sealing of the LED package and causing the device to fail. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that in the prior art, LED packaging mostly uses organic materials such as silicone and epoxy resin to seal and protect the chip. These materials have good transparency, but when the LED lamp is working, the ultraviolet light emitted will act on the surface of the organic material. After long-term use, the sealing material of the organic material will gradually age and break, affecting the sealing of the LED package and causing device failure. An inorganic LED packaging structure is proposed.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an LED inorganic packaging structure, comprising: a base, a mounting groove is provided on the top of the base, an inner thread is provided on the inner wall of the mounting groove, a limiting ring is fixedly connected to the inner bottom of the mounting groove, a connecting ring is provided on the inner surface of the mounting groove, a lens is fixedly connected to the top of the connecting ring, a first anti-overflow plate is fixedly connected to the outer surface of the connecting ring near the top, and a second anti-overflow plate is fixedly connected to the inner surface of the connecting ring near the top.

[0006] Preferably, a first anti-overflow groove is provided on the top of the base.

[0007] Preferably, the first anti-overflow groove is connected to the mounting groove, and the first anti-overflow plate is matched with the first anti-overflow groove.

[0008] Preferably, the first anti-overflow groove and the second anti-overflow groove are arranged horizontally, and the top of the first anti-overflow plate and the top of the base are arranged horizontally.

[0009] Preferably, a second anti-overflow groove is provided on the top of the limiting ring, and the second anti-overflow groove is matched with a second anti-overflow plate.

[0010] Preferably, the outer surface of the connecting ring is threadedly connected to the inner surface of the internal thread, and the LED chip is fixedly connected to the center position of the inner bottom of the mounting groove.

[0011] Preferably, first heat dissipation fins are fixedly connected to the outer surfaces of four sides of the base, and second heat dissipation fins are fixedly connected to the bottom of the base.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, inorganic glue is added to the slot formed between the mounting groove and the limiting ring, and then the lens is picked up and rotated to make the connecting ring threadedly connected with the internal thread, and the connecting ring is fixed in the mounting groove. Thus, under the action of the inorganic glue, the internal thread and the connecting ring, a good seal can be formed between the LED chip installed in the center of the mounting groove and the external environment to prevent dust, moisture and other impurities from entering, and keep the LED chip clean and stable. In addition, the second anti-overflow plate, the second anti-overflow groove, the first anti-overflow plate and the first anti-overflow groove are used in combination to further improve the sealing of the package and the cleanliness of the packaging process.

[0014] 2. In the present invention, a full range of heat dissipation system is formed by installing first heat dissipation fins on four sides of the base and second heat dissipation fins on the bottom of the base, thereby reducing the operating temperature of the LED chip, thereby extending its service life and stability of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of an inorganic LED packaging structure is proposed for the utility model;

[0016] Figure 2 A top view of an inorganic LED packaging structure is provided for the utility model;

[0017] Figure 3 A cross-sectional view of an inorganic LED packaging structure is provided for the utility model;

[0018] Figure 4 The utility model provides an expanded diagram of an LED inorganic packaging structure.

[0019] Legend: 1. Base; 2. First heat sink fin; 3. Second heat sink fin; 4. Lens; 5. First anti-overflow plate; 6. First anti-overflow groove; 8. LED chip; 9. Limiting ring; 10. Mounting groove; 11. Second anti-overflow plate; 12. Second anti-overflow groove; 13. Internal thread; 14. Connecting ring. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] Embodiment 1, as Figure 1-Figure 4 As shown, the utility model provides an inorganic LED packaging structure, including: a base 1, a mounting groove 10 is provided on the top of the base 1, an inner thread 13 is provided on the inner wall of the mounting groove 10, a limiting ring 9 is fixedly connected to the inner bottom of the mounting groove 10, a connecting ring 14 is provided on the inner surface of the mounting groove 10, a lens 4 is fixedly connected to the top of the connecting ring 14, and a first anti-overflow plate 5 is fixedly connected to the outer surface of the connecting ring 14 near the top. A second anti-overflow plate 11 is fixedly connected to the inner surface of the connecting ring 14 near the top, a first anti-overflow groove 6 is provided on the top of the base 1, the first anti-overflow groove 6 is connected to the mounting groove 10, the first anti-overflow plate 5 is matched with the first anti-overflow groove 6, the first anti-overflow groove 6 and the second anti-overflow groove 12 are horizontally arranged, the top of the first anti-overflow plate 5 is horizontally arranged with the top of the base 1, a second anti-overflow groove 12 is provided on the top of the limiting ring 9, the second anti-overflow groove 12 is matched with the second anti-overflow plate 11, the outer surface of the connecting ring 14 is threadedly connected to the inner surface of the internal thread 13, and an LED chip 8 is fixedly connected to the center of the inner bottom of the mounting groove 10.

[0023] The effect achieved by the entire embodiment 1 is that when the LED chip 8 needs to be inorganically packaged, inorganic glue is first added to the slot formed between the mounting groove 10 and the limiting ring 9. The inorganic glue can be boron nitride glue, which has high high temperature resistance and UV resistance. After the inorganic glue is added, the lens 4 is picked up, and the connecting ring 14 is aligned with the internal thread 13, and then the lens 4 is rotated to make the connecting ring 14 and the internal thread 13 threadedly connected, and the connecting ring 14 is fixed in the mounting groove 10, so that under the action of the inorganic glue, the internal thread 13 and the connecting ring 14, it can be ensured that the LED installed in the center of the mounting groove 10 A good seal is formed between the D chip 8 and the external environment to prevent dust, moisture and other impurities from entering, keeping the LED chip 8 clean and stable. When the connecting ring 14 is connected to the internal thread 13, the overflowed inorganic glue will be stored in the first anti-overflow groove 6 and the second anti-overflow groove 12, further improving the sealing of the LED chip 8 package. Then, the inorganic glue is waited for to solidify to complete the inorganic packaging of the LED chip 8. With the cooperation of the first anti-overflow plate 5 and the second anti-overflow plate 11, the inorganic glue is prevented from overflowing from the first anti-overflow groove 6 and the second anti-overflow groove 12 to the outside, thereby ensuring the cleanliness of the packaging process and the overall quality of the product.

[0024] Embodiment 2, as Figure 1-Figure 4 As shown, first heat dissipation fins 2 are fixedly connected to the outer surfaces of the four sides of the base 1 , and second heat dissipation fins 3 are fixedly connected to the bottom of the base 1 .

[0025] The effect achieved by the entire embodiment 2 is that the first heat dissipation fins 2 or the second heat dissipation fins 3 are installed on the four sides and the bottom of the base 1, and the heat dissipation fins can significantly increase the heat dissipation surface area, thereby improving the heat dissipation efficiency. The heat dissipation fins installed in all directions can more effectively dissipate heat to the surrounding environment, thereby ensuring the stable operation of the LED and extending its service life.

[0026] Working principle: When it is necessary to perform inorganic packaging on the LED chip 8, first add inorganic glue to the slot formed between the mounting groove 10 and the limiting ring 9. The inorganic glue can be boron nitride glue, which has high high temperature resistance and UV resistance. After the inorganic glue is added, pick up the lens 4, align the connecting ring 14 with the internal thread 13, and then rotate the lens 4 to thread the connecting ring 14 with the internal thread 13, and fix the connecting ring 14 in the mounting groove 10. Under the action of the inorganic glue, the internal thread 13 and the connecting ring 14, a good seal can be formed between the LED chip 8 installed in the center of the mounting groove 10 and the external environment to prevent dust, moisture and other impurities from entering, keep the LED chip 8 clean and stable, and when the connection When the ring 14 is connected to the internal thread 13, the overflowed inorganic glue will be stored in the first anti-overflow groove 6 and the second anti-overflow groove 12, further improving the sealing of the LED chip 8 package, and then waiting for the inorganic glue to solidify to complete the inorganic packaging of the LED chip 8. With the cooperation of the first anti-overflow plate 5 and the second anti-overflow plate 11, the inorganic glue is prevented from overflowing from the first anti-overflow groove 6 and the second anti-overflow groove 12 to the outside, thereby ensuring the cleanliness of the packaging process and the overall quality of the product. After the inorganic packaging of the LED chip 8 is completed, the first heat sink fins 2 or the second heat sink fins 3 are installed on the four sides and the bottom of the base 1. The all-round installed heat sink fins can more effectively dissipate heat to the surrounding environment, thereby ensuring the stable operation of the LED chip 8 and extending its service life.

[0027] The wiring diagram of the LED chip 8 in the present invention belongs to the common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use, so the control method and wiring arrangement of the LED chip 8 are not explained in detail.

[0028] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. An inorganic LED packaging structure, characterized in that: include: A base (1), wherein a mounting groove (10) is provided at the top of the base (1), an inner wall of the mounting groove (10) is provided with an internal thread (13), a limit ring (9) is fixedly connected to the inner bottom of the mounting groove (10), a connecting ring (14) is provided on the inner surface of the mounting groove (10), a lens (4) is fixedly connected to the top of the connecting ring (14), a first anti-overflow plate (5) is fixedly connected to the outer surface of the connecting ring (14) near the top, and a second anti-overflow plate (11) is fixedly connected to the inner surface of the connecting ring (14) near the top.

2. The LED inorganic packaging structure according to claim 1, characterized in that: A first anti-overflow groove (6) is provided on the top of the base (1).

3. The LED inorganic packaging structure according to claim 2, characterized in that: The first anti-overflow groove (6) is connected to the mounting groove (10), and the first anti-overflow plate (5) is matched with the first anti-overflow groove (6).

4. The LED inorganic packaging structure according to claim 3, characterized in that: The first anti-overflow groove (6) and the second anti-overflow groove (12) are arranged horizontally, and the top of the first anti-overflow plate (5) and the top of the base (1) are arranged horizontally.

5. The LED inorganic packaging structure according to claim 4, characterized in that: A second anti-overflow groove (12) is provided on the top of the limiting ring (9), and the second anti-overflow groove (12) and the second anti-overflow plate (11) are matched to each other.

6. The LED inorganic packaging structure according to claim 5, characterized in that: The outer surface of the connecting ring (14) is threadedly connected to the inner surface of the internal thread (13), and an LED chip (8) is fixedly connected to the center of the inner bottom of the mounting groove (10).

7. The LED inorganic packaging structure according to claim 6, characterized in that: The four outer surfaces of the base (1) are all fixedly connected with first heat dissipation fins (2), and the bottom of the base (1) is fixedly connected with second heat dissipation fins (3).

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