Atomizer and electronic atomization device
By designing a flat plate-shaped atomizer, using the stacking structure of the base, heating parts, liquid guides and cover plates, the problem of large thickness of the traditional atomizer is solved, and the thinner design of the atomizer is realized. Installation diversity.
Patent Information
- Application Number
- CN202323365317.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2033-12-11
AI Technical Summary
The thickness of traditional atomizers is relatively large, which limits their application in electronic atomization devices.
A atomizer is designed, which includes a base, a heating element, a liquid guide and a cover plate. Through the stacked structure of these components, the entire atomizer is flat in shape and reduces thickness.
The thinner design of the atomizer is realized, the thickness is reduced, the installation diversity of the device is improved, and the atomization effect is maintained.
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Figure CN222443180U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic atomization, and in particular to an atomizer and an electronic atomization device including the atomizer. Background Art
[0002] The atomizer can be used to atomize the liquid atomization matrix to form an aerosol that can be inhaled by the user, so that the atomizer has a wide development prospect. However, for a traditional atomizer, the atomizer is usually a tubular structure, which makes the atomizer and the entire electronic atomization device thick. Summary of the invention
[0003] A technical problem solved by the present application is how to reduce the thickness of the atomizer.
[0004] An atomizer, comprising:
[0005] A base, the base comprising a substrate, the substrate being provided with air guide holes;
[0006] A heating element, wherein the heating element is stacked on the substrate, and at least a portion of the heating element is arranged corresponding to the air guide hole;
[0007] a liquid guiding member, the liquid guiding member being stacked on a surface of the heating element facing away from the substrate; and
[0008] A cover plate, the cover plate is stacked on a surface of the liquid guiding member facing away from the heating member, and a liquid guiding hole for supplying liquid to the liquid guiding member is provided on the cover plate;
[0009] Wherein, the cover plate is connected to the base, and the cover plate and the substrate are spaced apart.
[0010] In one embodiment, the heat generating component includes a heat generating portion, a supporting portion and a pin portion, wherein the supporting portion connects the heat generating portion and the pin portion; the heat generating portion is at least partially located within the range of the air guide hole, the supporting portion is stacked on the substrate, and the pin portion is at least partially located outside the substrate.
[0011] In one embodiment, the number of the pin portions is at least two, and at least two of the pin portions are located on the same side of the support portion, or at least two of the pins are located on different sides of the support portion.
[0012] In one embodiment, a gap is formed between part of the pin portion and the support portion.
[0013] In one embodiment, the base also includes a limiting member connected to the substrate, and the limiting member is arranged on the surface of the substrate connected to the heating element; the limiting member and the substrate are arranged to form a accommodating space; the heating element and the liquid guiding member are accommodated in the accommodating space; the cover plate is detachably connected to the limiting member.
[0014] In one embodiment, the cover plate includes a covering portion and a plurality of connecting portions connected to the covering portion, wherein the covering portion is stacked on the liquid guiding member; the plurality of connecting portions are arranged at the edge of the covering portion, and the limiting member is provided with matching portions corresponding to the plurality of connecting portions, and the connecting portions are clamped in the corresponding matching portions so that the connecting portions and the matching portions can be detachably connected.
[0015] In one of the embodiments, the cover plate further includes a reinforcing rib, which is protruding along the thickness direction of the cover portion and is disposed on a surface of the cover portion facing the liquid guiding member, and the reinforcing rib is in contact with the liquid guiding member.
[0016] In one of the embodiments, the base further includes a positioning column, which is arranged on the surface of the substrate facing the cover plate, and a positioning hole corresponding to the positioning column is opened on the heating element, and the positioning column cooperates with the positioning hole.
[0017] In one embodiment, the base includes a first base and a second base layer, the first base layer is made of metal or alloy material, the second base layer is made of silicone material, the second base layer is stacked on the first base layer, the heating element is stacked on the second base layer, and the thickness of the second base layer is less than the thickness of the first base layer.
[0018] An electronic atomization device comprises the atomizer described in any one of the above, wherein the electronic atomization device is provided with an air intake channel, and the extension direction of the air intake channel is perpendicular to or parallel to the plane where the heating element is located.
[0019] A technical effect of an embodiment of the present application is: since the heating element base, the heating element, the liquid guiding element and the cover plate are stacked on each other, the entire atomizer is roughly a flat structure, and the atomizer can be abstracted as a plane. Compared with the traditional tubular atomizer, the thickness of the atomizer is reduced, so that a thin design of the atomizer can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a schematic diagram of the three-dimensional structure of an atomizer provided in an embodiment.
[0021] FIG. 2 is a schematic diagram of the exploded structure of the atomizer shown in FIG. 1 .
[0022] FIG. 3 is a schematic diagram of a partial exploded structure of the atomizer shown in FIG. 1 .
[0023] FIG. 4 is a schematic diagram of the three-dimensional structure of the cover plate in the atomizer shown in FIG. 1 .
[0024] FIG. 5 is a schematic diagram of the three-dimensional structure of an atomizer provided in another embodiment.
[0025] FIG6 is a schematic diagram of the planar structure of an atomizer provided by an embodiment when it is installed horizontally.
[0026] FIG. 7 is a schematic diagram of the planar structure of an atomizer provided by an embodiment when it is installed vertically.
[0027] Figure numerals: atomizer 10, base 100, first base layer 101, second base layer 102, substrate 110, air guide hole 111, limit member 120, clamping hole 121, positioning column 130, heating element 200, heating portion 210, mesh 211, supporting portion 220, pin portion 230, spacing gap 240, positioning hole 250, cover plate 300, sealing portion 310, liquid guide hole 311, connecting portion 320, reinforcing rib 330, liquid guide member 400, air intake channel 20. DETAILED DESCRIPTION
[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0029] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0031] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0032] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0034] Referring to Fig. 1, Fig. 2 and Fig. 3, an atomizer 10 provided in one embodiment of the present application includes a base 100, a heating element 200, a liquid guide 400 and a cover plate 300. The heating element 200 is stacked on the base 100, the liquid guide 400 is stacked on the surface of the heating element 200 away from the base 100, and the cover plate 300 is connected to the base 100 and stacked on the surface of the liquid guide 400 away from the heating element 200. In view of the fact that the cover plate 300 is connected to the base 100 and the cover plate 300 is spaced apart from the base 100, the heating element 200 and the liquid guide 400 are sandwiched between the cover plate 300 and the base 100.
[0035] Referring to FIG. 1 , FIG. 2 and FIG. 3 , in some embodiments, the base 100 adopts a layered arrangement mode, that is, the base 100 may include two layers of different materials, which may be respectively recorded as a first base layer 101 and a second base layer 102, and the second base layer 102 is stacked on the first base layer 101. The hardness of the first base layer 101 may be higher than the hardness of the second base layer 102, so that the first base layer 101 and the entire base 100 have reasonable structural strength. The first base layer 101 may be made of metal or alloy material, for example, the first base layer 101 may be made of stainless steel material, and the second base layer 102 may be made of silicone material, so that the second base layer 102 has good flexibility. The heating element 200 is stacked on the second base layer 102. The thickness of the second base layer 102 is small, so that the thickness of the second base layer 102 can be much smaller than the thickness of the first base layer 101, so that the thickness of the entire base 100 can be reasonably reduced.
[0036] Referring to Fig. 1, Fig. 2 and Fig. 3, in some embodiments, the base 100 includes a substrate 110 and a stopper 120, the substrate 110 may be roughly in the shape of a cuboid, the heating element 200 is stacked on the substrate 110, the substrate 110 has a surface disposed toward the heating element 200 in the thickness direction, the surface is connected to the heating element 200, the stopper 120 is protrudingly disposed on the surface along the thickness direction of the substrate 110, and the number of the stopper 120 is multiple, so that the multiple stoppers 120 are located on the same side of the thickness direction of the substrate 110. The multiple stoppers 120 are arranged at intervals along the circumference of the substrate 110. The stopper 120 and the substrate 110 together enclose a housing space, and the heating element 200 and the liquid guide 400 are accommodated in the housing space. The stopper 120 may be provided with a matching portion, which is used to form a clamping match with the cover plate 300, so as to realize a detachable connection relationship between the cover plate 300 and the stopper 120. For example, the matching portion may be a clamping hole 121, which is used to cooperate with the cover plate 300, so as to form a detachable connection relationship between the cover plate 300 and the base 100. The clamping hole 121 maintains a certain distance from the substrate 110. For example, the stopper 120 may be a telescopic structure. When the stopper 120 is extended and retracted, the distance between the clamping hole 121 and the substrate 110 is adjustable, and the distance between the cover plate 300 and the substrate 110 can be adjusted, thereby adjusting the clamping force of the cover plate 300 on the liquid guide member 400 and the heating member 200. Obviously, the adhesion force between the heat conductor and the heating member 200 can also be adjusted. In other embodiments, the mating portion may be a convex strip, which is inserted into the hole structure of the cover plate 300, and the detachable connection relationship between the cover plate 300 and the stopper 120 can also be achieved.
[0037] Referring to FIG. 1 , FIG. 2 and FIG. 3 , in some embodiments, an air guide hole 111 is provided on the substrate 110, and the air guide hole 111 runs through the entire substrate 110 along the thickness direction of the substrate 110, so the air guide hole 111 is a through hole. The base 100 also includes a positioning column 130, and the positioning column 130 is protrudingly arranged on the substrate 110. The substrate 110 has a surface arranged toward the heating element 200, and the positioning column 130 is protrudingly arranged on the surface along the thickness direction of the substrate 110. The heating element 200 is provided with a positioning hole 250. When the heating element 200 is superimposed on the substrate 110, the positioning column 130 cooperates with the positioning hole 250, so that the heating element 200 can play a good limiting role, thereby improving the installation efficiency and installation accuracy of the heating element 200.
[0038] Referring to FIG. 1 , FIG. 2 and FIG. 3 , in some embodiments, the heating element 200 is a planar structure, and the heating element 200 includes a heating portion 210, a supporting portion 220 and a pin portion 230. There is one heating portion 210, two supporting portions 220, and two pin portions 230, wherein one supporting portion 220 is connected between one pin portion 230 and one end of the heating portion 210, and another supporting portion 220 is connected between another pin portion 230 and the other end of the heating portion 210. A plurality of mesh holes 211 are provided on the heating portion 210, and the shape of the mesh holes 211 can be circular, rhombus or regular polygon, etc. The heating portion 210 corresponds to the air guide hole 111, so that the heating portion 210 is at least partially located within the coverage range of the air guide hole 111, which can also be understood as the orthographic projection of the air guide hole 111 along the thickness direction of the substrate 110 can cover at least part of the heating portion 210. The support portion 220 may not be provided with the mesh 211. The support portion 220 is stacked on the substrate 110. The support portion 220 is at least partially located outside the coverage of the air guide hole 111. It can also be understood that the support portion 220 is at least partially located outside the coverage of the orthographic projection of the air guide hole 111 along the thickness direction of the substrate 110. The pin portion 230 is at least partially located outside the base 100. The pin portion 230 is used to be electrically connected to the power supply element, that is, the power supply element supplies power to the entire heating element 200 through the pin.
[0039] Referring to FIG. 1 , FIG. 2 and FIG. 3 , in some embodiments, a spacing gap 240 is formed between part of the pin portion 230 and the support portion 220 . By providing the spacing gap 240 , the pin portion 230 can be bent relative to the support portion 220 along the spacing gap 240 , so that it is convenient to abut against the ejector pin of the power supply element during assembly. The pin portion 230 can be located on the same side or on the opposite side of the support portion 220 . Referring to FIG. 3 , for example, the pin portion 230 can be located on opposite sides of the length direction of the heating portion 210 , so that the pin portion 230 extends from opposite sides of the length direction of the substrate 110 , and finally the pin portion 230 is located on the opposite side of the support portion 220 . Referring to FIG. 5 , for another example, the pin portion 230 can be located on the same side of the width direction of the heating portion 210 , so that the pin portion 230 extends from the same side of the width direction of the substrate 110 , and finally the pin portion 230 is located on the same side of the support portion 220 . In this way, the heating element 200 can adapt to different installation situations, ensuring that a reliable electrical connection is formed between the heating element 200 and the power supply element.
[0040] In some embodiments, the liquid guide 400 can conduct and buffer the atomized matrix of the liquid. Since the liquid guide 400 is stacked on the heating element 200, when the heating element 200 generates heat, the atomized matrix buffered on the liquid guide 400 can absorb the heat and atomize to form an aerosol, which can be inhaled by the user. The aerosol will overflow from the air guide hole 111 of the base 100.
[0041] Referring to FIG. 2, FIG. 3 and FIG. 4, in some embodiments, the cover plate 300 includes a cover portion 310 and a connection portion 320, and a liquid guide hole 311 is provided on the cover portion 310, and the liquid guide hole 311 is a through hole, so that the liquid guide hole 311 runs through the entire cover portion 310 along the thickness direction of the cover portion 310. When the cover portion 310 is stacked on the liquid guide member 400, the atomized matrix of the liquid can enter the liquid guide member 400 through the liquid guide hole 311. The connection portion 320 is protrudingly arranged at the edge of the cover portion 310, so that the connection portion 320 is protrudingly arranged at the edge in a direction that is angled with the thickness direction of the cover portion 310, for example, the connection portion 320 is protrudingly arranged at the edge of the cover portion 310 in a thickness direction perpendicular to the thickness of the cover portion 310. The number of the connection portions 320 is equal to the number of the upper limit members 120 of the base 100, so that the connection portions 320 and the limit members 120 form a one-to-one correspondence. The connecting portion 320 can be inserted into the locking hole 121 on the limiting member 120 and matched with the locking hole 121 , so that the cover plate 300 forms a detachable connection relationship with the base 100 through the connecting portion 320 .
[0042] Referring to FIG. 2 , FIG. 3 and FIG. 4 , in some embodiments, the cover plate 300 may further include reinforcing ribs 330 , and the number of the reinforcing ribs 330 may be two or more. The reinforcing ribs 330 are protruding along the thickness direction of the cover portion 310 on the surface of the cover portion 310 facing the liquid guide member 400 , so that the reinforcing ribs 330 protrude a certain height relative to the surface. When the cover plate 300 is connected to the base 100 , the reinforcing ribs 330 will abut against the liquid guide member 400 , and through the reinforcing ribs 330 , the reinforcing ribs 330 are closer to the substrate 110 relative to the cover portion 310 , so that the reinforcing ribs 330 generate a greater pressure against the liquid guide member 400 relative to the cover portion 310 , thereby increasing the pressure against the liquid guide member 400 by the entire cover plate 300 , and also generating sufficient adhesion between the liquid guide member 400 and the heating element 200 .
[0043] When the atomizer 10 is working, since the cover plate 300 stacked on the liquid guide member 400 is provided with a liquid guide hole 311, the liquid atomized matrix will flow into the liquid guide member 400 through the liquid guide hole 311, and the liquid guide member 400 will play a role in transmitting and caching the atomized matrix. When the heating element 200 is heated, since the heating element 200 and the liquid guide member 400 are stacked on each other, the atomized matrix in the liquid guide member 400 will absorb the heat of the heating element 200 and atomize to form an aerosol. During the process of the user inhaling the aerosol, the aerosol overflowing from the liquid guide member 400 will be output from the air guide hole 111 in the base 100, so that the aerosol is absorbed by the user.
[0044] In view of the planar structure of the heating element 200, the base 100, the heating element 200, the liquid guide member 400 and the cover plate 300 are stacked on each other along the thickness direction of the heating element 200, so that the entire atomizer 10 is roughly a flat structure, and the atomizer 10 can be abstracted as a plane. Compared with the traditional tubular atomizer 10, the atomizer 10 in the above embodiment has a relatively small thickness, so that the thin design of the atomizer 10 can be achieved.
[0045] The present application also provides an electronic atomization device, which includes the above-mentioned atomizer 10. The electronic atomization device has an inhalation channel 20, through which the aerosol is discharged, and the user can absorb the aerosol at the end of the inhalation channel 20. The inhalation channel 20 extends along a first direction, for example, the first direction can be a vertical direction. Referring to FIG3, during the installation process of the atomizer 10, the atomizer 10 can be installed horizontally. At this time, the plane where the heating element 200 is located extends along a second direction, and the second direction is a horizontal direction. Obviously, the first direction and the second direction are perpendicular to each other. Therefore, when the atomizer 10 is installed horizontally, the extension direction of the inhalation channel 20 is perpendicular to the plane where the heating element 200 is located, and the aerosol overflowing from the liquid guide 400 can enter the inhalation channel 20 through a roughly linear motion trajectory.
[0046] Referring to FIG. 5 , the atomizer 10 can also be installed vertically. In this case, the plane where the heating element 200 is located extends along the first direction, that is, the plane where the heating element 200 is located extends along the vertical direction, and the extension direction of the air inhalation channel 20 is parallel to the plane where the heating element 200 is located. Therefore, when the atomizer 10 is installed vertically, the extension direction of the air inhalation channel 20 is parallel to the plane where the heating element 200 is located, and the aerosol overflowing from the liquid guide 400 can first move along the plane perpendicular to the heating element 200, that is, move along the second direction, and then deflect 90°, so that the aerosol moves along the first direction to smoothly enter the air inhalation channel 20.
[0047] Therefore, by making the atomizer 10 abstracted as a plane, on the one hand, the thickness of the atomizer 10 can be reasonably reduced, and the thin design of the atomizer 10 can be achieved; on the other hand, compared with the traditional tubular atomizer 10 that can only be installed vertically, the atomizer 10 in the above embodiment can be installed horizontally and vertically, thereby achieving the diversity of the installation of the atomizer 10.
[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0049] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. An atomizer, characterized in that: include: A base, the base comprising a substrate, the substrate being provided with air guide holes; A heating element, wherein the heating element is stacked on the substrate, and at least a portion of the heating element is arranged corresponding to the air guide hole; A liquid guiding member, the liquid guiding member is stacked on a surface of the heating element away from the substrate; and A cover plate, the cover plate is stacked on a surface of the liquid guiding member facing away from the heating member, and a liquid guiding hole for supplying liquid to the liquid guiding member is provided on the cover plate; Wherein, the cover plate is connected to the base, and the cover plate and the substrate are spaced apart.
2. The atomizer according to claim 1, characterized in that The heat generating element comprises a heat generating portion, a supporting portion and a pin portion, wherein the supporting portion connects the heat generating portion and the pin portion; the heat generating portion is at least partially located within the range of the air guide hole, the supporting portion is stacked on the substrate, and the pin portion is at least partially located outside the substrate.
3. The atomizer according to claim 2, characterized in that The number of the pin portions is at least two, and at least two of the pin portions are located on the same side of the support portion, or at least two of the pins are located on different sides of the support portion.
4. The atomizer according to claim 2, characterized in that A spacing gap is formed between part of the pin portion and the supporting portion.
5. The atomizer according to claim 1, characterized in that The base also includes a limiting member connected to the substrate, wherein the limiting member is arranged on the surface of the substrate connected to the heating element; the limiting member and the substrate are arranged to form a receiving space; the heating element and the liquid guiding member are accommodated in the receiving space; the cover plate is detachably connected to the limiting member.
6. The atomizer according to claim 5, characterized in that The cover plate includes a sealing portion and a plurality of connecting portions connected to the sealing portion, wherein the sealing portion is stacked on the liquid guiding member; the plurality of connecting portions are arranged at the edge of the sealing portion, and the limiting member is provided with matching portions corresponding to the plurality of connecting portions, and the connecting portions are clamped in the corresponding matching portions so that the connecting portions and the matching portions can be detachably connected.
7. The atomizer according to claim 6, characterized in that The cover plate further includes a reinforcing rib, which is protruding along the thickness direction of the cover portion and disposed on a surface of the cover portion facing the liquid guide member, and the reinforcing rib abuts against the liquid guide member.
8. The atomizer according to claim 5, characterized in that The base further includes a positioning column, which is arranged on the surface of the substrate facing the cover plate. A positioning hole corresponding to the positioning column is opened on the heating element, and the positioning column cooperates with the positioning hole.
9. The atomizer according to claim 1, characterized in that The base includes a first base layer and a second base layer, the first base layer is made of metal or alloy material, the second base layer is made of silicone material, the second base layer is stacked on the first base layer, the heating element is stacked on the second base layer, and the thickness of the second base layer is less than the thickness of the first base layer.
10. An electronic atomization device, characterized in that: The electronic atomizer comprises the atomizer according to any one of claims 1 to 9, wherein the electronic atomizer device is provided with an air intake channel, and the extension direction of the air intake channel is perpendicular to or parallel to the plane where the heating element is located.