High-qualified-rate optical solder wire and optical detection equipment thereof

By designing a solder wire detection device with a fixing rod and placement components, the problem of unstable manual operation of existing detectors is solved, and the detection efficiency and pass rate are improved.

CN222448860UActive Publication Date: 2025-02-11SHENZHEN DITENG TIN CO LTD
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Patent Information

Application Number
CN202420956847.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-06
Publication Date
2025-02-11
Estimated Expiration
2034-05-06

AI Technical Summary

Technical Problem

When the existing solder wire detector performs a large number of solder wires, manual operation is unstable, resulting in insufficiency of detection.

Method used

An optical solder wire detection device including a base, a fixing rod, a mounting frame and a placement assembly is designed. The detector body is fixed through the fixing rod and a mounting frame, and the placement assembly is used to position and fix the solder wire, simplifying the operation process.

Benefits of technology

By fixing the detector body and positioning the solder wire, the equipment significantly improves the detection efficiency, reduces the possibility of operation errors, and improves the pass rate of solder wire detection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an optical solder wire with high qualified rate and optical detection equipment thereof, which comprises a base, one side of the surface of the base is connected with a fixing rod, the top end of the fixing rod is connected with a mounting rack, and a detector main body is arranged in the mounting rack; the placement assembly is arranged on the surface of the fixing rod and located above the base, the left side and the right side of each of the two sides of the surface of the detector body are connected with limiting blocks, the placement assembly comprises a movable sleeve, and one side of the movable sleeve is connected with a placement plate. According to the high-qualified-rate optical solder wire and the optical detection equipment thereof, the detector main body can be fixed when the base with the fixing rod and the mounting frame are used in cooperation with the placement assembly, only the solder wire needs to be placed when the solder wire is detected, and therefore the effect of being convenient and fast to operate can be achieved.
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Description

Technical Field

[0001] The utility model relates to the field of solder wires, in particular to an optical solder wire with a high pass rate and optical detection equipment thereof. Background Art

[0002] Solder wire, Chinese name: solder wire, solder line, tin wire, tin wire, solder wire is composed of two parts: tin alloy and additives. The alloy components are divided into tin-lead and lead-free additives, which are evenly poured into the middle part of the tin alloy.

[0003] Currently, solder wires are optically sampled and tested after production. During the optical sampling test, the metal content in the solder wire is checked to see if it meets the standard. However, current detectors are used for convenience. However, when testing a large number of solder wires, manual operation of the detector may result in unstable operation.

[0004] Therefore, it is necessary to provide an optical solder wire with a high pass rate and an optical detection device thereof to solve the above technical problems. Utility Model Content

[0005] The utility model provides an optical inspection device for optical solder wires with a high pass rate, which solves the problem that the existing inspection instruments are used for convenience, but when a large number of solder wires are inspected, the inspection instrument is unstable when being manually taken and operated.

[0006] In order to solve the above technical problems, the utility model provides an optical inspection device for optical solder wires with a high pass rate, comprising:

[0007] A base, one side of the base surface is connected to a fixing rod, the top of the fixing rod is connected to a mounting frame, and the detector body is arranged inside the mounting frame;

[0008] A placement component is arranged on the surface of the fixing rod and is located above the base.

[0009] Preferably, both left and right sides of the surface of the detector body are connected to limit blocks.

[0010] Preferably, the placement assembly comprises a movable sleeve, and one side of the movable sleeve is connected to a placement plate.

[0011] Preferably, a fixing bolt is arranged inside the movable sleeve, and a plurality of fixing holes matching with the fixing bolt are sequentially opened on the surface of the fixing rod from top to bottom.

[0012] Preferably, a positioning component is provided on the surface of the placement plate, and the positioning component includes a groove, a threaded rod is provided inside the groove, threaded sleeves are threadedly connected on both sides of the surface of the threaded rod, and positioning blocks are connected to the surfaces of the two threaded sleeves.

[0013] Preferably, one end of the threaded rod is connected to a rotating handle.

[0014] An optical solder wire with a high pass rate, the solder wire is processed and inspected by using any optical inspection device for optical solder wires with a high pass rate, comprising: a solder wire body, a soldering layer is arranged inside the solder wire body, a tin layer is arranged on the surface of the soldering layer, an anti-oxidation layer is arranged on the surface of the tin layer, and a plurality of grooves are opened on the surface of the anti-oxidation layer.

[0015] Compared with the related art, the optical inspection device for optical solder wire with high pass rate provided by the utility model has the following beneficial effects:

[0016] The utility model provides an optical inspection device for optical solder wires with a high pass rate. A base with a fixing rod and a mounting frame are used in conjunction with a placement component to fix a main body of the inspection device, so that when inspecting the solder wire, only the solder wire needs to be placed, thereby facilitating operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic structural diagram of a first embodiment of an optical inspection device for optical solder wires with a high pass rate provided by the utility model;

[0018] Figure 2 for Figure 1 An enlarged schematic diagram of part A is shown;

[0019] Figure 3 A schematic structural diagram of a second embodiment of an optical solder wire optical inspection device with a high pass rate provided by the utility model;

[0020] Figure 4 for Figure 3 An enlarged schematic diagram of part B is shown;

[0021] Figure 5 The present invention is a schematic structural diagram of a third embodiment of an optical inspection device for optical solder wires with a high pass rate provided by the present invention.

[0022] Numbers in the figure: 1. Solder wire body, 2. Soldering layer, 3. Tin layer, 4. Anti-oxidation layer, 5. Groove, 6. Base, 7. Fixing rod, 8. Mounting bracket, 9. Detector body, 10. Limit block, 11. Placement component, 111. Movable sleeve, 112. Placement plate, 113. Fixing bolt, 114. Fixing hole, 12. Positioning component, 121. Groove, 122. Threaded rod, 123. Threaded sleeve, 124. Positioning block, 125. Turning handle. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0024] First embodiment

[0025] Please refer to Figure 1 and Figure 2 ,in, Figure 1 A schematic structural diagram of a first embodiment of an optical solder wire with a high pass rate and an optical detection device thereof provided by the utility model; Figure 2 for Figure 1 An optical solder wire with a high pass rate and an optical inspection device thereof include:

[0026] A base 6, one side of the surface of the base 6 is connected to a fixing rod 7, the top of the fixing rod 7 is connected to a mounting frame 8, and a detector body 9 is arranged inside the mounting frame 8;

[0027] A placement component 11 is disposed on the surface of the fixing rod 7 and located above the base 6 .

[0028] The left and right sides of both sides of the surface of the detector body 9 are connected to limit blocks 10.

[0029] The placement assembly 11 includes a movable sleeve 111 , and a placement plate 112 is connected to one side of the movable sleeve 111 .

[0030] The use of the limit block 10 can play a positioning role when the detector body 9 is installed inside the mounting frame 8. An opening is opened on one side of the mounting frame 8 to facilitate the installation of the handle of the detector body 9. The movable sleeve 111 is sleeved on the surface of the fixed rod 7.

[0031] A fixing bolt 113 is disposed inside the movable sleeve 111 , and a plurality of fixing holes 114 matching the fixing bolt 113 are sequentially opened on the surface of the fixing rod 7 from top to bottom.

[0032] The working principle of an optical solder wire with a high pass rate and its optical detection equipment provided by the utility model is as follows:

[0033] When in use, first place the detector body 9 inside the mounting frame 8. After placing the detector body 9, pull the placement plate 112 to drive the movable sleeve 111 to move on the surface of the fixed rod 7. When the placement plate 112 moves to a suitable position, use the fixing bolt 113 to pass through the movable sleeve 111 and connect it to the fixing hole 114 on the surface of the fixed rod 7.

[0034] Compared with the related art, the optical solder wire with high pass rate and the optical detection equipment thereof provided by the utility model have the following beneficial effects:

[0035] The utility model provides an optical solder wire with a high pass rate and an optical detection device thereof. A base 6 with a fixing rod 7 and a mounting frame 8 are used in conjunction with a placement component 11 to fix a detector body 9, so that when the solder wire is detected, only the solder wire needs to be placed, thereby facilitating operation.

[0036] Second embodiment

[0037] Please refer to Figure 3 and Figure 4 Based on the optical solder wire with high pass rate and its optical detection device provided by the first embodiment of the present application, the second embodiment of the present application proposes another optical solder wire with high pass rate and its optical detection device. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0038] Specifically, the difference of the optical solder wire with high pass rate and its optical detection equipment provided by the second embodiment of the present application is that, in an optical solder wire with high pass rate and its optical detection equipment, a positioning component 12 is provided on the surface of the placement plate 112, and the positioning component 12 includes a groove 121, and a threaded rod 122 is provided inside the groove 121, and threaded sleeves 123 are threadedly connected on both sides of the surface of the threaded rod 122, and positioning blocks 124 are connected to the surfaces of the two threaded sleeves 123.

[0039] The groove 121 is opened on the surface of the placement plate 122, one end of the threaded rod 122 is rotatably connected to one side of the inner wall of the groove 121 through a rotating shaft, and one end of the threaded rod 122 is connected to the rotating handle 125 through a connecting block.

[0040] One end of the threaded rod 122 is connected to a rotating handle 125 .

[0041] The working principle of an optical solder wire with a high pass rate and its optical detection equipment provided by the utility model is as follows:

[0042] During use, when positioning the solder wire on the surface of the placement plate 112, the threaded rod 122 is driven to rotate by rotating the handle 125. When the threaded rod 122 rotates, it drives the threaded sleeves 123 on both sides of the surface to move. When the threaded sleeves 123 move, it drives the positioning blocks 124 on the surface to move. When the positioning blocks 124 move to contact the solder wire, stop rotating the handle 125.

[0043] Compared with the related art, the optical solder wire with high pass rate and the optical detection equipment thereof provided by the utility model have the following beneficial effects:

[0044] The utility model provides an optical solder wire with a high pass rate and an optical detection device thereof. A positioning component 12 is arranged on the surface of a placement plate 112 to play a fixing role when detecting the solder wire, and can quickly and accurately position the solder wire when detecting the solder wire.

[0045] Third embodiment

[0046] Please refer to Figure 5 Based on the optical solder wire with high pass rate and its optical detection device provided in the first embodiment of the present application, the third embodiment of the present application proposes another optical solder wire with high pass rate and its optical detection device. The third embodiment is only a preferred mode of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0047] Specifically, the third embodiment of the present application provides an optical solder wire with a high pass rate and an optical inspection device thereof, which is different in that it is an optical solder wire with a high pass rate, and the solder wire is processed and inspected using an optical solder wire optical inspection device with a high pass rate, and includes: a solder wire body 1, a solder wire body 1 having a soldering layer 2 disposed inside, a tin layer 3 disposed on the surface of the soldering layer 2, an anti-oxidation layer 4 disposed on the surface of the tin layer 3, and a plurality of grooves 5 disposed on the surface of the anti-oxidation layer 4.

[0048] The material of the tin layer 3 is mainly metallic tin. The tin layer 3 covers the soldering layer 2 . The tin layer 12 completely covers the soldering layer 2 . There is no gap between the soldering layer 2 and the tin layer 3 .

[0049] The antioxidant coating is mainly composed of antioxidant powder, which is a combination of non-metallic mineral materials. The antioxidant coating is evenly coated on the surface of the tin layer, which can not only prevent the tin layer from being oxidized by the air during storage, but also form crystals on the solder surface when in contact with the molten solder during welding, isolating the tin liquid from contact with oxygen in the air, preventing the tin liquid from oxidation, and at the same time decomposing and reducing the tin slag to reduce the generation of tin slag.

[0050] Compared with the related art, the optical solder wire with high pass rate and the optical detection equipment thereof provided by the utility model have the following beneficial effects:

[0051] The utility model provides an optical solder wire with high qualification rate and an optical detection device thereof. A soldering layer 2, a tin layer 3, an anti-oxidation layer 4 and a plurality of grooves 5 are arranged inside a solder wire body 1, so as to play a role in heat dissipation when the solder wire body 1 is used.

[0052] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An optical inspection device for optical solder wires with a high pass rate, characterized in that: include: A base, one side of the base surface is connected to a fixing rod, the top of the fixing rod is connected to a mounting frame, and the detector body is arranged inside the mounting frame; A placement component is arranged on the surface of the fixing rod and is located above the base.

2. The optical inspection device for optical solder wires with high pass rate according to claim 1, characterized in that: The left and right sides of both sides of the surface of the detector body are connected with limiting blocks.

3. The optical inspection device for optical solder wires with high pass rate according to claim 1, characterized in that: The placement component comprises a movable sleeve, and one side of the movable sleeve is connected with a placement plate.

4. The optical inspection device for optical solder wires with high pass rate according to claim 3, characterized in that: A fixing bolt is arranged inside the movable sleeve, and a plurality of fixing holes matching with the fixing bolt are sequentially opened on the surface of the fixing rod from top to bottom.

5. The optical inspection device for optical solder wires with high pass rate according to claim 3, characterized in that: A positioning component is arranged on the surface of the placement plate, and the positioning component includes a groove, a threaded rod is arranged inside the groove, threaded sleeves are threadedly connected to both sides of the surface of the threaded rod, and positioning blocks are connected to the surfaces of the two threaded sleeves.

6. The optical inspection device for optical solder wires with high pass rate according to claim 5, characterized in that: One end of the threaded rod is connected with a rotating handle.

7. An optical solder wire with a high pass rate, the solder wire is processed and inspected by using the optical inspection device for optical solder wire with a high pass rate according to any one of claims 1 to 6, characterized in that: include: A solder wire body is provided with a flux layer inside the solder wire body, a tin layer is provided on the surface of the flux layer, an anti-oxidation layer is provided on the surface of the tin layer, and a plurality of grooves are provided on the surface of the anti-oxidation layer.