Drying device of semiconductor wafer box

Abstract

The utility model relates to the technical field of semiconductor wafer box cleaning, in particular to a semiconductor wafer box drying device which comprises a drying box, a driving mechanism, a clamping mechanism and a strip-shaped spray pipe. A driving mechanism is connected to the upper portion of the drying box, a clamping mechanism is arranged in the drying box, a strip-shaped spraying pipe is connected to the inner wall of the drying box, a driving motor is started to drive a support to rotate and drive a movable gear to rotate, meanwhile, the movable gear rotates along a fixed gear, and a semiconductor wafer box above the movable gear rotates; a supporting column is inserted into a movable gear, then a semiconductor wafer box is placed on a grid plate, a rubber rod is moved according to the size of the semiconductor wafer box, a rubber ring in a sleeve is driven to rotate along a circular ring, the semiconductor wafer box is squeezed, and the semiconductor wafer box is dried through the heating pipe and the nitrogen after being heated in the drying box, so that drying is facilitated. Therefore, the device is suitable for semiconductor wafer cassettes with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer box cleaning, in particular to a drying device for a semiconductor wafer box. Background Art

[0002] In semiconductor production, wafer boxes are mainly used to place and transport wafers. In order to prevent wafer boxes from contaminating wafers, the wafer boxes need to be cleaned and dried by cleaning and drying devices before use. The drying devices of existing semiconductor wafer boxes still have certain defects when used, such as;

[0003] Existing drying devices for semiconductor wafer boxes usually place the semiconductor wafer box on a fixed frame and then blow heated N2 or compressed gas (CDA) into it to dry it. The semiconductor wafer box is fixed inside and does not move, which easily causes one side to be dried while the other side is wet. In addition, when it is necessary to dry semiconductor wafer boxes of other sizes, the bracket usually needs to be replaced, which is inconvenient to use. Summary of the invention

[0004] The utility model aims to provide a drying device for a semiconductor wafer box to solve the problem that the drying device for a semiconductor wafer box currently on the market has a poor drying effect and cannot adapt to semiconductor wafer boxes of different sizes.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: A drying device for a semiconductor wafer box, comprising: a drying box, a driving mechanism, a clamping mechanism and a strip-shaped spray pipe;

[0006] A driving mechanism is connected to the top of the drying box, a clamping mechanism is arranged inside the drying box, a strip-shaped spray pipe is connected to the inner wall of the drying box, and the drying box serves as a storage base;

[0007] An air supply pipe is connected above the strip nozzle, an annular nozzle is connected to one side of the air supply pipe, the annular nozzle is connected to the upper inner wall of the drying box, and a hot air blower is connected above the annular nozzle, the hot air blower passes through the inner wall of the drying box and is connected to a solenoid valve, the solenoid valve is arranged above the drying box, a heating pipe is connected to the inner wall of the drying box, the driving mechanism includes: a driving motor, a bracket, a connecting rod, a bearing, a vertical rod, a connecting plate, a movable gear and a fixed gear, the upper surface of the drying box is connected to a driving motor, and the output end of the driving motor passes through the inner wall of the drying box and is connected to a bracket.

[0008] Preferably, a connecting rod is fixedly connected to one side of the bracket, a bearing is connected to one side of the connecting rod, a vertical rod is fixedly passed through the bearing, and the vertical rod is fixedly connected to the inner wall of the drying box.

[0009] Preferably, a connecting plate is provided above the connecting rod, and a movable gear is rotatably connected to the upper surface of the connecting plate.

[0010] Preferably, one side of the movable gear is meshedly connected with a fixed gear, and the fixed gear is fixedly connected to the top of the vertical pole.

[0011] Preferably, the clamping mechanism comprises: a pillar, a circular ring, a grid plate, a rubber ring, a sleeve and a rubber rod. The drying box is provided with a pillar, the pillar is provided on the upper surface of the movable gear, and a circular ring is fixedly connected above the pillar.

[0012] Preferably, a grid plate is fixedly connected to the inner wall of the circular ring.

[0013] Preferably, a rubber ring is sleeved on the outer side of the circular ring, and a sleeve is sleeved and fixed on the outer side of the rubber ring.

[0014] Preferably, the outer peripheral surface of the sleeve is connected with a rubber rod, and the rubber rod is arranged above the movable gear.

[0015] Compared with the prior art, the utility model has the following beneficial effects: by starting the driving motor to drive the bracket to rotate, the movable gear itself is driven to rotate, and at the same time the movable gear rotates along the fixed gear, the semiconductor wafer box above the movable gear is rotated, and is dried by the heated nitrogen and heating tube in the drying box, thereby facilitating drying. By inserting the pillar on the movable gear, and then placing the semiconductor wafer box on the grid plate, the rubber rod is moved according to the size of the semiconductor wafer box, and the rubber ring in the sleeve is driven to rotate along the ring to squeeze the semiconductor wafer box, thereby adapting to semiconductor wafer boxes of different sizes. The specific contents are as follows:

[0016] 1. Start the driving motor to drive the bracket to rotate, drive the connecting rod to push the bearing to rotate, and at the same time, the movable gear rotates along the fixed gear above the connecting plate, rotating the semiconductor wafer box above the movable gear to dry evenly, thereby facilitating drying;

[0017] 2. By inserting the pillar into the movable gear and then placing the semiconductor wafer box on the grid plate, the residual moisture flows away from the grid plate, and the rubber ring in the sleeve is driven to rotate along the ring by moving the rubber rod. The semiconductor wafer box is squeezed with multiple sets of rubber rods to limit the position, thereby adapting to semiconductor wafer boxes of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the connecting plate of the utility model;

[0019] Figure 2 This is a schematic diagram of the bracket of the utility model;

[0020] Figure 3 It is a schematic diagram of the grid plate of the utility model;

[0021] Figure 4 It is a schematic diagram of the main structure of the utility model.

[0022] In the figure: 1. drying box; 2. driving mechanism; 201. driving motor; 202. bracket; 203. connecting rod; 204. bearing; 205. vertical pole; 206. connecting plate; 207. movable gear; 208. fixed gear; 3. clamping mechanism; 301. pillar; 302. ring; 303. grid plate; 304. rubber ring; 305. sleeve; 306. rubber rod; 4. strip nozzle; 5. gas pipe; 6. ring nozzle; 7. hot air blower; 8. solenoid valve; 9. heating tube. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1 , Figure 2 and Figure 4 , the utility model provides a technical solution: a drying device for a semiconductor wafer box, comprising: a drying box 1, a driving mechanism 2, a clamping mechanism 3 and a strip nozzle 4;

[0025] A driving mechanism 2 is connected to the top of the drying box 1, a clamping mechanism 3 is arranged in the drying box 1, a strip nozzle 4 is connected to the inner wall of the drying box 1, and the drying box 1 serves as a storage base; an air supply pipe 5 is connected to the top of the strip nozzle 4, a ring nozzle 6 is connected to one side of the air supply pipe 5, the ring nozzle 6 is connected to the upper inner wall of the drying box 1, and a hot air blower 7 is connected to the top of the ring nozzle 6, the hot air blower 7 penetrates the inner wall of the drying box 1 and is connected to a solenoid valve 8, the solenoid valve 8 is arranged above the drying box 1, and a heating pipe 9 is connected to the inner wall of the drying box 1, the driving mechanism 2 includes: a driving motor 201, a bracket 202, a connecting rod 203, a bearing 204, a vertical rod 205, a connecting plate 206, a movable gear 207 and a fixed gear 208, the upper surface of the drying box 1 is connected to the driving motor 201, and the output end of the driving motor 201 penetrates the inner wall of the drying box 1 and is connected to the bracket 202.

[0026] A connecting rod 203 is fixedly connected to one side of the bracket 202, and a bearing 204 is connected to one side of the connecting rod 203. A vertical rod 205 is fixedly passed through the bearing 204, and the vertical rod 205 is fixedly connected to the inner wall of the drying box 1. A connecting plate 206 is arranged above the connecting rod 203, and a movable gear 207 is rotatably connected to the upper surface of the connecting plate 206. A fixed gear 208 is meshedly connected to one side of the movable gear 207, and the fixed gear 208 is fixedly connected to the top of the vertical rod 205.

[0027] During specific implementation, a plurality of water leakage holes are opened in the movable gear 207 to allow residual water to flow away, and the driving motor 201 is started to drive the bracket 202 to rotate, thereby driving the movable gear 207 to rotate itself and rotate along the fixed gear 208, thereby driving the semiconductor wafer box above the movable gear 207 to rotate, so that the semiconductor wafer box can be dried by the heated nitrogen and the heating tube 9.

[0028] See also Figure 1 and Figure 3 The clamping mechanism 3 includes: a pillar 301, a ring 302, a grid plate 303, a rubber ring 304, a sleeve 305 and a rubber rod 306. The drying box 1 is provided with a pillar 301, the pillar 301 is arranged on the upper surface of the movable gear 207, and the ring 302 is fixedly connected above the pillar 301, the grid plate 303 is fixedly connected to the inner wall of the ring 302, the rubber ring 304 is sleeved on the outer side of the ring 302, the sleeve 305 is sleeved and fixed on the outer side of the rubber ring 304, the outer peripheral surface of the sleeve 305 is connected to the rubber rod 306, and the rubber rod 306 is arranged above the movable gear 207.

[0029] In specific implementation, the support 301 is inserted into the water leakage hole in the movable gear 207, and then the semiconductor wafer box is placed on the grid plate 303. The residual water flows away from the grid plate 303. The rubber rod 306 is moved and squeezed according to the size of the semiconductor wafer box to adapt to semiconductor wafer boxes of different sizes.

[0030] To sum up: when using the drying device for the semiconductor wafer box, a simple understanding of the device is made. First, the solenoid valve 8 is connected to the nitrogen, the drying box 1 is opened, and the semiconductor wafer box is placed on the grid plate 303, the rubber rod 306 is moved to squeeze the semiconductor wafer box, and then the pillar 301 is placed on the movable gear 207, the drying box 1 is closed and the drive motor 201 is started, driving the semiconductor wafer box to rotate on the movable gear 207, and at the same time rotating along the fixed gear 208 in the drying box 1, the heating tube 9 is heated for drying, and at the same time the solenoid valve 8 is opened, the nitrogen is heated by the hot air blower 7, and sent into the annular nozzle 6, and enters the strip nozzle 4 from the gas supply pipe 5, and the heated nitrogen is sprayed from the annular nozzle 6 and the strip nozzle 4 to dry the semiconductor wafer box, and then discharged from the pipe on one side of the drying box 1. The content not described in detail in this description belongs to the prior art known to professional and technical personnel in this field.

[0031] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A drying device for a semiconductor wafer box, comprising: A drying box (1), a driving mechanism (2), a clamping mechanism (3) and a strip nozzle (4), characterized in that; A driving mechanism (2) is connected to the top of the drying box (1), a clamping mechanism (3) is provided inside the drying box (1), and a strip-shaped spray pipe (4) is connected to the inner wall of the drying box (1); An air delivery pipe (5) is connected to the top of the strip nozzle (4); one side of the air delivery pipe (5) is connected to an annular nozzle (6); the annular nozzle (6) is connected to the upper inner wall of the drying box (1); and a hot air blower (7) is connected to the top of the annular nozzle (6); the hot air blower (7) penetrates the inner wall of the drying box (1) and is connected to an electromagnetic valve (8); the electromagnetic valve (8) is arranged above the drying box (1); a heating pipe (9) is connected to the inner wall of the drying box (1); the driving mechanism (2) comprises: a driving motor (201), a bracket (202), a connecting rod (203), a bearing (204), a vertical rod (205), a connecting plate (206), a movable gear (207) and a fixed gear (208); the upper surface of the drying box (1) is connected to the driving motor (201); the output end of the driving motor (201) penetrates the inner wall of the drying box (1) and is connected to the bracket (202).

2. The drying device for a semiconductor wafer box according to claim 1, characterized in that: A connecting rod (203) is fixedly connected to one side of the bracket (202), a bearing (204) is connected to one side of the connecting rod (203), a vertical rod (205) is fixedly passed through the bearing (204), and the vertical rod (205) is fixedly connected to the inner wall of the drying box (1).

3. A drying device for a semiconductor wafer box according to claim 2, characterized in that: A connection plate (206) is provided above the connection rod (203), and a movable gear (207) is rotatably connected to the upper surface of the connection plate (206).

4. The drying device for a semiconductor wafer box according to claim 3, characterized in that: One side of the movable gear (207) is meshedly connected with a fixed gear (208), and the fixed gear (208) is fixedly connected to the top of the vertical pole (205).

5. The drying device for a semiconductor wafer box according to claim 1, characterized in that: The clamping mechanism (3) comprises: a support (301), a circular ring (302), a grid plate (303), a rubber ring (304), a sleeve (305) and a rubber rod (306). The support (301) is arranged in the drying box (1), the support (301) is arranged on the upper surface of the movable gear (207), and the circular ring (302) is fixedly connected above the support (301).

6. The drying device for a semiconductor wafer box according to claim 5, characterized in that: A grid plate (303) is fixedly connected to the inner wall of the circular ring (302).

7. The drying device for a semiconductor wafer box according to claim 5, characterized in that: A rubber ring (304) is sleeved on the outside of the circular ring (302), and a sleeve (305) is sleeved and fixed on the outside of the rubber ring (304).

8. The drying device for a semiconductor wafer box according to claim 7, characterized in that: The outer peripheral surface of the sleeve (305) is connected to a rubber rod (306), and the rubber rod (306) is arranged above the movable gear (207).

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