Cooling device of computer server

Abstract

The utility model discloses a cooling device of a computer server, which comprises a main body assembly, a cooling device and a cooling device, and the main body assembly comprises an exhaust pipe; the protection assembly comprises a water absorption sponge, a semi-ring plate, a fixing plate and a limiting column; wherein the number of the water absorption sponges is two, the inner surface of any one water absorption sponge is attached to the outer surface of the exhaust pipe, the semi-ring plates are attached to the outer surfaces of one ends of the water absorption sponges, the fixing plates are attached to the outer surfaces of the other ends of the water absorption sponges, and the limiting columns are connected to the interiors of the upper ends and the lower ends of the semi-ring plates and the interiors of the upper ends and the lower ends of the fixing plates in a penetrating mode. The problems that when an exhaust pipe outputs cold air, due to the fact that the temperature of the exhaust pipe located in a machine shell is high, water drops can be formed on the outer surface of the exhaust pipe, the water drops drop into the machine shell, the dropping water drops are not prone to being cleaned, and the service life of parts in the machine shell is affected by the water drops are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer heat dissipation equipment, in particular to a temperature reduction cooling device for a computer server. Background Art

[0002] The cooling device of the computer server is an immersion liquid cooling server, which is used to effectively dissipate heat to ensure stable operation of the server. For modern data centers, this cooling technology not only helps save energy costs, but also improves the performance and life of the server. It is especially suitable for high-density, high-power consumption server cluster environments.

[0003] After searching, the patent document with the announcement number CN220473960U discloses a computer server cooling device, which mainly relates to the technical field of computer heat dissipation equipment. A computer server cooling device comprises a casing, a semiconductor cooling fan is fixedly installed on one side of the casing, an exhaust pipe is fixedly installed at the air outlet of the semiconductor cooling fan, the exhaust pipe transversely penetrates the bottom of one side of the casing and is fixedly connected thereto, an exhaust pipe is fixedly installed on one side of the bottom surface of the inner wall of the casing, a fan is fixedly installed at the air outlet of the exhaust pipe, and an exhaust fan is fixedly installed on one side of the top surface of the casing. The beneficial effect of the utility model is that when the device is in use, cold air can be directly blown into the casing through the semiconductor cooling fan to achieve rapid cooling in the casing.

[0004] However, it still has the following disadvantages in actual use:

[0005] In the above patent document, when the exhaust pipe outputs cold air, under the alternation of hot and cold, due to the high temperature of the exhaust pipe inside the casing, water droplets will form on the outer surface of the exhaust pipe, and the water droplets will drip into the inside of the casing. Not only is it difficult to clean the dripping water droplets, but the water droplets also affect the service life of the internal parts of the casing. Utility Model Content

[0006] The utility model aims to provide a cooling device for a computer server to solve the problem raised in the above-mentioned background technology that when the exhaust pipe outputs cold air, under the alternation of hot and cold, due to the high temperature of the exhaust pipe inside the casing, water droplets are formed on the outer surface of the exhaust pipe, and the water droplets drip into the inside of the casing. It is not only difficult to clean the dripping water droplets, but also the water droplets affect the service life of the internal parts of the casing.

[0007] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0008] The utility model is a cooling device for a computer server, comprising:

[0009] a main body assembly, the main body assembly comprising an exhaust pipe;

[0010] A protection component, the protection component comprising a water-absorbing sponge, a semi-ring plate, a fixing plate and a limiting column;

[0011] Among them, there are two groups of water-absorbing sponges in total, and the inner surface of the water-absorbing sponges in any one group is fitted with the outer surface of the exhaust pipe, the semi-annular plate is fitted with the outer surface of one end of the water-absorbing sponge, and the fixed plate is fitted with the outer surface of the other end of the water-absorbing sponge, and the limiting column is connected through the upper and lower ends of the semi-annular plate and the fixed plate.

[0012] Furthermore, the surface of the other end of the limiting column is attached to the limiting plate, and a mounting groove is provided on the top of one end of the limiting column, and a movable column is rotatably connected inside the mounting groove.

[0013] Furthermore, the invention also includes a moisture-proof component;

[0014] The moisture-proof assembly includes a mounting frame, a partition and a movable frame;

[0015] The installation frame is located at the bottom of the exhaust pipe, the partition is fixed to the inner surface of the installation frame, and the movable frame is movably connected to the surface of one side of the installation frame.

[0016] Furthermore, handles are fixed on the top surfaces of both sides of the installation frame, and two groups of handles are provided.

[0017] Furthermore, a desiccant bag is placed inside the other side of the installation frame, and the desiccant bags are arranged in an array.

[0018] Furthermore, limiting grooves are provided on both sides of the partition and the installation frame, and limiting blocks are movably connected inside the limiting grooves. A breathable plate is fixed to the inner surface of the bottom end of the limiting block, and multiple groups of breathable holes are vertically provided inside the breathable plate.

[0019] Furthermore, a semiconductor cooling fan is fixed to the top surface of the exhaust pipe, a casing is fixed to the other side surface of the semiconductor cooling fan, an exhaust fan is fixed inside the top of the casing, and a base is fixed to the lower surface of the casing.

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] 1. The utility model provides a water-absorbing sponge. When the exhaust pipe is subjected to alternating hot and cold temperatures, water droplets on the surface of the exhaust pipe are absorbed by the water-absorbing sponge to prevent the water droplets from dripping into the inside of the casing. Not only does it need to be wiped and cleaned, but when cleaning the water, water droplets may accidentally splash onto the internal parts of the casing, affecting the normal use of the server. This solution makes the internal environment of the casing more reliable during the cooling process.

[0022] 2. Based on the first beneficial effect, when the moisture-proof component is used in conjunction with the moisture-proof component, when the absorbent sponge is removed, the absorbent sponge can be directly placed inside the installation frame to avoid the absorbent sponge dripping water droplets due to force during the removal process, and the casing needs to be wiped again. In addition, when used in conjunction with the desiccant bag, the water vapor in the air can be absorbed to prevent the internal environment of the casing from being too humid.

[0023] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0026] Figure 2 This is a diagram of the internal structure of the casing of the utility model;

[0027] Figure 3 This is a structural diagram of the protective component of the utility model;

[0028] Figure 4 This is a structural diagram of the moisture-proof component of the utility model.

[0029] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0030] 11. Casing; 12. Semiconductor cooling fan; 13. Exhaust fan; 14. Exhaust pipe; 15. Base;

[0031] 21. Absorbent sponge; 22. Semi-ring plate; 23. Fixed plate; 24. Limit plate; 25. Limit column; 26. Mounting groove; 27. Movable column;

[0032] 31. Installation frame; 32. Partition plate; 33. Movable frame; 34. Handle; 35. Limiting groove; 36. Breathable plate; 37. Limiting block; 38. Desiccant bag. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0035] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] See also Figure 1-Figure 3 As shown, this embodiment is a cooling device for a computer server, comprising:

[0037] A main body assembly, the main body assembly includes an exhaust pipe 14;

[0038] The exhaust pipe 14 is used to transport the cold air output by the semiconductor cooling fan 12 to the inside of the housing 11;

[0039] A protection component, the protection component includes a water-absorbing sponge 21, a semi-ring plate 22, a fixing plate 23 and a limiting column 25;

[0040] There are two groups of water-absorbing sponges 21, and the inner surface of any group of water-absorbing sponges 21 is attached to the outer surface of the exhaust pipe 14, the semi-ring plate 22 is attached to the outer surface of one end of the water-absorbing sponge 21, the fixed plate 23 is attached to the outer surface of the other end of the water-absorbing sponge 21, and the limit column 25 is connected to the upper and lower ends of the semi-ring plate 22 and the fixed plate 23;

[0041] The water-absorbing sponge 21 is used to absorb water droplets generated on the outer surface of the exhaust pipe 14. The water-absorbing sponge 21 is fixed by inserting the limiting column 25 into the semi-ring plate 22 and the fixing plate 23.

[0042] The other end surface of the limiting column 25 is attached to the limiting plate 24, and a mounting groove 26 is formed on the top of one end of the limiting column 25, and a movable column 27 is rotatably connected inside the mounting groove 26;

[0043] The limiting plate 24 is used to limit the limiting column 25 to the inside of the semi-ring plate 22 and the fixed plate 23, and the mounting groove 26 is used to receive and install the movable column 27. By changing the state of the movable column 27 in the mounting groove 26, the limiting column 25 is stably fixed to the inside of the semi-ring plate 22 and the fixed plate 23;

[0044] A semiconductor cooling fan 12 is fixed to the top surface of the exhaust pipe 14, a housing 11 is fixed to the other side surface of the semiconductor cooling fan 12, an exhaust fan 13 is fixed inside the top of the housing 11, and a base 15 is fixed to the bottom surface of the housing 11;

[0045] The semiconductor cooling fan 12 is used to generate cold air, the base 15 is used to fix the device to a desired position, and the exhaust fan 13 is used to remove the hot air inside the housing 11;

[0046] When the interior of the housing 11 is cooled;

[0047] The semiconductor cooling fan 12 produces cold air, and in cooperation with the exhaust pipe 14, the cold air is transported to the inside of the housing 11. When the cold air is transported to the bottom of the exhaust pipe 14, water droplets generated on the outer surface of the exhaust pipe 14 can be absorbed by the absorbent sponge 21.

[0048] When replacing the absorbent sponge 21;

[0049] Apply an outward lifting force to the movable column 27 so that the movable column 27 and the limiting column 25 are at the same horizontal line, apply a pushing force to the limiting column 25, and after the limiting column 25 is taken out from the semi-ring plate 22 and the fixed plate 23, the semi-ring plate 22 can be removed from the outer surface of the water-absorbing sponge 21, and then the old water-absorbing sponge 21 can be removed from the outer surface of the exhaust pipe 14. After that, the new water-absorbing sponge 21 is placed on the outer surface of the exhaust pipe 14, the semi-ring plate 22 is placed on the outer surface of the water-absorbing sponge 21, and the fixed plate 23 and the semi-ring plate 22 are placed at the same horizontal line, and then the limiting column 25 is inserted into the fixed plate 23 and the semi-ring plate 22, and a pressing force is applied to the limiting column 25 so that the limiting column 25 and the movable column 27 are in a vertical state;

[0050] This step makes the internal environment of the housing 11 more reliable during the cooling process.

[0051] See also Figure 2 and Figure 4 As shown, this embodiment is based on the above-mentioned embodiment 1 and further includes a moisture-proof component;

[0052] The moisture-proof assembly includes a mounting frame 31, a partition 32 and a movable frame 33;

[0053] The mounting frame 31 is located at the bottom of the exhaust pipe 14, the partition plate 32 is fixed to the inner surface of the mounting frame 31, and the movable frame 33 is movably connected to the surface of one side of the mounting frame 31;

[0054] The installation frame 31 is used to receive and install the partition 32, the partition 32 is used to isolate the inside of the installation frame 31, and the movable frame 33 is used to place the old water-absorbing sponge 21;

[0055] Handles 34 are fixed to the top surfaces of both sides of the installation frame 31, and there are two sets of handles 34;

[0056] The handle 34 facilitates taking the movable frame 33 out of the installation frame 31;

[0057] A desiccant bag 38 is placed inside the other side of the installation frame 31, and the desiccant bag 38 is provided in an array;

[0058] The desiccant bag 38 is used to absorb moisture in the air;

[0059] The partition plate 32 and the mounting frame 31 are provided with limiting grooves 35 on both sides, and the limiting grooves 35 are movably connected with limiting blocks 37. A ventilation plate 36 is fixed to the inner surface of the bottom end of the limiting block 37, and the ventilation plate 36 is vertically provided with a plurality of ventilation holes.

[0060] The limiting groove 35 is used to receive and install the limiting block 37, so as to fix the air permeable plate 36 on the top of the limiting groove 35, and the air permeable plate 36 is convenient for absorbing moisture in the air:

[0061] When replacing the water-absorbing sponge 21, the old water-absorbing sponge 21 is directly placed in the movable frame 33, and an upward force is applied to the handle 34 to make the movable frame 33 separate from the installation frame 31, so that the water-absorbing sponge 21 can be taken out from the housing 11;

[0062] When the semiconductor cooling fan 12 is working, the desiccant bag 38 can absorb moisture. When replacing the desiccant bag 38, an upward force is applied to the limit block 37, and the air permeable plate 36 is taken out from the inside of the installation frame 31. After the desiccant bag 38 is replaced, the limit block 37 is aligned with the limit groove 35, and a downward force is applied to the limit block 37, so that the air permeable plate 36 is fixed to the top of the installation frame 31.

[0063] This step can adsorb the water vapor in the air to prevent the internal environment of the housing 11 from being too humid.

[0064] In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be a connection between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, for technicians in this field, they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A cooling device for a computer server, characterized in that: include: A main body assembly, the main body assembly comprising an exhaust pipe (14); A protection component, the protection component comprising a water-absorbing sponge (21), a semi-ring plate (22), a fixing plate (23) and a limiting column (25); There are two groups of water-absorbing sponges (21), and the inner surface of any one group of water-absorbing sponges (21) is in contact with the outer surface of the exhaust pipe (14); the semi-annular plate (22) is in contact with the outer surface of one end of the water-absorbing sponge (21); the fixed plate (23) is in contact with the outer surface of the other end of the water-absorbing sponge (21); and the limiting column (25) is connected to the upper and lower ends of the semi-annular plate (22) and the fixed plate (23).

2. A cooling device for a computer server according to claim 1, characterized in that: The other end surface of the limiting column (25) is in contact with the limiting plate (24), and a mounting groove (26) is provided on the top of one end of the limiting column (25), and a movable column (27) is rotatably connected inside the mounting groove (26).

3. A cooling device for a computer server according to claim 1, characterized in that: Also included are moisture-proof components; The moisture-proof assembly comprises a mounting frame (31), a partition (32) and a movable frame (33); The installation frame (31) is located at the bottom of the exhaust pipe (14), the partition plate (32) is fixed to the inner surface of the installation frame (31), and the movable frame (33) is movably connected to a side surface of the installation frame (31).

4. A cooling device for a computer server according to claim 3, characterized in that: Handles (34) are fixed on the top surfaces of both sides of the installation frame (31), and two groups of handles (34) are provided.

5. The cooling device for a computer server according to claim 3, characterized in that: A desiccant bag (38) is placed inside the other side of the installation frame (31), and the desiccant bags (38) are arranged in an array.

6. The cooling device for a computer server according to claim 3, characterized in that: The partition plate (32) and the installation frame (31) are provided with limiting grooves (35) on both sides, the limiting grooves (35) are movably connected to limiting blocks (37), a ventilation plate (36) is fixed to the inner surface of the bottom end of the limiting block (37), and the ventilation plate (36) has multiple groups of ventilation holes vertically provided inside.

7. The cooling device for a computer server according to claim 1, characterized in that: A semiconductor cooling fan (12) is fixed to the top surface of the exhaust pipe (14), a housing (11) is fixed to the other side surface of the semiconductor cooling fan (12), an exhaust fan (13) is fixed inside the top of the housing (11), and a base (15) is fixed to the lower surface of the housing (11).

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