Chip capacitor sintering device

Abstract

The utility model relates to the technical field of chip capacitors, in particular to a chip capacitor sintering device, which comprises a sintering tank, two ends of the sintering tank are fixedly connected with connecting covers, one end of each connecting cover is fixedly connected with a sealing sleeve seat, one end of each sealing sleeve seat is fixedly connected with a cooling side frame, and the other end of each connecting cover is fixedly connected with a cooling side frame. And a plurality of layers of sintering material placing frames are evenly arranged in the cooling side frame, the bottom end of the sintering tank is fixedly connected with a ventilation base, and the two ends of the ventilation base are fixedly connected with air guide valves. Through the sintering tank, the connecting cover, the sealing sleeve seat, the cooling side frame, the sintering material placing frame, the limiting seat, the positioning sealing seat, the electric heating pipe and the soaking ring seat, the equipment can perform more efficient and continuous chip capacitor sintering operation; a worker firstly puts multiple layers of chip capacitors needing to be sintered into the clamping grooves of the sintering material placing frame, and then the positioning sealing seats in the limiting seats can be directly pushed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitors, in particular to a chip capacitor sintering device. Background Art

[0002] Chip capacitors, whose full name is multilayer ceramic capacitors, are a type of capacitor material. They are one of the most widely used components on circuit boards. They are rectangular in shape and come in yellow, cyan, blue-gray, etc. Translucent light yellow ones are the most common. The basic parameters of chip capacitors include capacitance, operating voltage, leakage current value, error, etc.

[0003] For example, the patent document with the announcement number CN 206835399 U discloses a wear-resistant coating high-efficiency induction heating device, including a shell and a variable frequency motor, a cylindrical heating layer is arranged in the shell, an induction coil is arranged along the length direction of the outer periphery of the heating layer, a heat insulation layer is arranged between the induction coil and the inner wall of the shell, and adapters are respectively connected to the heating layer at both ends, and transmission teeth are arranged at intervals along the circumferential direction at one end of the adapter connected to the heating layer, a rotating shaft is connected to the middle of the adapter, and flanges are respectively connected to the ends of the shell, and the adapter is rotatably connected in the end, and the output shaft of the variable frequency motor is connected to the rotating shaft of an adapter through a coupling, and a feed port and a discharge port are respectively opened on the two ends, and one end of the induction coil is fixedly connected to the end through a connecting column. The utility model has a simple structure, stable operation, convenient and efficient operation, can make full use of heat, has a good heating effect, and has high production efficiency.

[0004] However, in actual use, due to the limitation of its own structure, this structure can usually only load and unload the chip capacitors one batch at a time. But during the unloading process, it is often necessary to wait for the chip capacitors to cool down, resulting in the overall low efficiency of the equipment for the chip capacitors. At the same time, the equipment cannot realize efficient cooling and loading and unloading operations on the chip capacitors, and cannot meet daily use needs. Therefore, it is urgent to design a chip capacitor sintering device to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a chip capacitor sintering device to solve the problem that the existing structure proposed in the above background technology can only load and unload the chip capacitors one by one in actual use due to the limitation of its own structure. However, it is often necessary to wait for the chip capacitors to be cooled during the unloading process, resulting in the overall low efficiency of the device for the chip capacitors. At the same time, the device cannot realize efficient cooling and loading and unloading operations on the chip capacitors and cannot meet the daily use needs.

[0006] To achieve the above object, the utility model provides the following technical solutions: a chip capacitor sintering device, comprising a sintering pot, two ends of the sintering pot are fixedly connected with connection covers, one end of the connection cover is fixedly connected with a sealing sleeve seat, one end of the sealing sleeve seat is fixedly connected with a cooling side frame, and multiple layers of sintering material racks are evenly arranged inside the cooling side frame;

[0007] A ventilation base, the bottom end of the sintering pot is fixedly connected with the ventilation base, both ends of the ventilation base are fixedly connected with air guide valves, and both ends of the air guide valve are fixedly connected with air uniforming seats.

[0008] Preferably, a ventilation duct is provided on the inner bottom wall of the wind uniforming seat, and wind distribution plates are evenly provided inside the wind uniforming seat.

[0009] Preferably, an air gathering groove is provided inside the ventilation base, and a dustproof net is provided on the back of the ventilation base.

[0010] Preferably, both ends of the ventilation base are fixedly connected with fan racks, and a heat dissipation fan is arranged inside the fan rack.

[0011] Preferably, one end of the cooling side frame is fixedly connected to a limiting seat, and a positioning sealing seat is arranged inside the limiting seat.

[0012] Preferably, electric heating tubes are evenly arranged inside the sintering pot, and a heat-averaging ring seat is arranged on the inner wall of the sintering pot.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The chip capacitor sintering device can make the equipment perform more efficient and continuous chip capacitor sintering operation through the sintering tank, connecting cover, sealing sleeve seat, cooling side frame, sintering material rack, limit seat, positioning sealing seat, electric heating pipe and equalizing ring seat. In the actual use process, the staff first puts the chip capacitors to be sintered into the card slot of the sintering material rack in multiple layers, and then directly pushes the positioning sealing seat inside the limit seat, so that the sintering material rack carries the chip capacitor directly into the sintering tank for sintering operation. At this time, under the action of the electric heating pipe and the equalizing ring seat inside the sintering tank, it is ensured that the chip capacitor can be sintered more evenly. Then the staff can load the chip capacitor through the sintering material rack inside the cooling side frame at the other end, and then repeatedly pull the two sets of sintering material racks to pull back and forth inside the sintering tank to load and unload materials, so that the cooling time of the chip capacitor after sintering can be reduced, and the inside of the sintering tank can also carry out continuous and stable chip capacitor sintering work, which reflects the practicality of the equipment design.

[0015] The chip capacitor sintering device further improves the overall use effect of the equipment by means of the sintering tank, ventilation base, air guide valve, wind uniformity seat, ventilation pipe, air distribution plate, wind gathering slot, dust screen, fan rack and heat dissipation fan. In daily use, the staff can alternately start the heat dissipation fans inside the fan racks at both ends of the ventilation base, so that they can respectively inhale the heat dissipation airflow from the dust screen, and perform adaptive ventilation and heat dissipation operations according to the pulling and pulling of the sintering material racks inside the cooling side racks at both ends of the sintering tank. At the same time, through the ventilation pipe and air distribution plate inside the wind uniformity seat, all the chip capacitors inside the sintering material racks inside the cooling side racks can obtain uniform, stable and rapid heat dissipation and cooling operations, which reflects the comprehensiveness of the equipment design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0017] Figure 2 It is an overall schematic diagram of the sintering tank structure of the utility model;

[0018] Figure 3 It is an overall schematic diagram of the ventilation base structure of the utility model;

[0019] Figure 4 It is an overall schematic diagram of the wind uniforming seat structure of the utility model.

[0020] In the figure: 1. sintering pot; 2. connecting cover; 3. sealing sleeve seat; 4. cooling side frame; 5. sintering material rack; 6. ventilation base; 7. air guide valve; 8. air uniformity seat; 9. ventilation pipe; 10. air distribution plate; 11. air gathering slot; 12. dustproof net; 13. fan frame; 14. cooling fan; 15. limit seat; 16. positioning sealing seat; 17. electric heating pipe; 18. uniform heat ring seat. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 , an embodiment provided by the utility model:

[0023] A chip capacitor sintering device comprises a sintering pot 1, two ends of the sintering pot 1 are fixedly connected with a connection cover 2, one end of the connection cover 2 is fixedly connected with a sealing sleeve seat 3, one end of the sealing sleeve seat 3 is fixedly connected with a cooling side frame 4, the interior of the cooling side frame 4 is evenly provided with a multi-layer sintering material rack 5, one end of the cooling side frame 4 is fixedly connected with a limiting seat 15, a positioning sealing seat 16 is arranged inside the limiting seat 15, the interior of the sintering pot 1 is evenly provided with electric heating pipes 17, and the inner wall of the sintering pot 1 is provided with a heat equalizing ring seat 18, so that the sintering material rack 5 carries the chip capacitor directly into the interior of the sintering pot 1 for sintering operation, and at this time, under the action of the electric heating pipe 17 and the heat equalizing ring seat 18 inside the sintering pot 1, it is ensured that the chip capacitor can obtain a more uniform sintering operation.

[0024] A ventilation base 6 is fixedly connected to the bottom end of the sintering pot 1, and air guide valves 7 are fixedly connected to both ends of the ventilation base 6. Wind uniformity seats 8 are fixedly connected to both ends of the air guide valve 7. A ventilation pipe 9 is provided on the inner bottom wall of the wind uniformity seat 8. Wind distribution plates 10 are evenly provided inside the wind uniformity seat 8. An air gathering groove 11 is provided inside the ventilation base 6. A dustproof net 12 is provided on the back of the ventilation base 6. Fan racks 13 are fixedly connected to both ends of the ventilation base 6. A cooling fan 14 is provided inside the fan rack 13. The cooling fans 14 inside the fan racks 13 at both ends of the ventilation base 6 are alternately started to inhale the cooling airflow from the dustproof net 12 respectively, and the sintering material racks 5 inside the cooling side racks 4 at both ends of the sintering pot 1 are pulled and pulled to perform adaptive ventilation and cooling operations.

[0025] Working principle: When in use, the user first places the chip capacitors that need to be sintered into the card slots of the sintering rack 5 in multiple layers, and then directly pushes the positioning sealing seat 16 inside the limit seat 15, so that the sintering rack 5 carries the chip capacitors directly into the sintering tank 1 for sintering. At this time, under the action of the electric heating tube 17 and the heat-averaging ring seat 18 inside the sintering tank 1, it is ensured that the chip capacitors can be sintered more evenly. Then the staff can load the chip capacitors through the sintering rack 5 inside the cooling side frame 4 at the other end, and then repeatedly pull the two groups of sintering racks 5 to pull them back and forth inside the sintering tank 1 for loading and unloading operations, thereby And the cooling time of the chip capacitor after sintering can be prolonged, and the inside of the sintering tank 1 can also carry out continuous and stable chip capacitor sintering work. In daily use, the staff can alternately start the cooling fan 14 inside the fan frame 13 at both ends of the ventilation base 6, so that it can respectively inhale the cooling airflow from the dustproof net 12, and according to the pulling of the sintering material rack 5 inside the cooling side frame 4 at both ends of the sintering tank 1, adaptive ventilation and heat dissipation operations are carried out. At the same time, through the ventilation pipe 9 and the air distribution plate 10 inside the wind uniforming seat 8, all the chip capacitors inside the sintering material rack 5 inside the cooling side frame 4 can obtain uniform, stable and rapid heat dissipation and cooling operations. The above is the entire working principle of the utility model.

[0026] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A chip capacitor sintering device, comprising a sintering tank (1), characterized in that: The two ends of the sintering pot (1) are fixedly connected with a connecting cover (2), one end of the connecting cover (2) is fixedly connected with a sealing sleeve seat (3), one end of the sealing sleeve seat (3) is fixedly connected with a cooling side frame (4), and the interior of the cooling side frame (4) is evenly provided with multiple layers of sintering material racks (5); A ventilation base (6), the bottom end of the sintering pot (1) is fixedly connected to the ventilation base (6), both ends of the ventilation base (6) are fixedly connected to air guide valves (7), and both ends of the air guide valve (7) are fixedly connected to air uniformity seats (8).

2. A chip capacitor sintering device according to claim 1, characterized in that: The inner bottom wall of the air uniforming seat (8) is provided with a ventilation pipe (9), and the interior of the air uniforming seat (8) is evenly provided with air distribution plates (10).

3. The chip capacitor sintering device according to claim 1, characterized in that: An air gathering groove (11) is provided inside the ventilation base (6), and a dustproof net (12) is provided on the back of the ventilation base (6).

4. The chip capacitor sintering device according to claim 1, characterized in that: The two ends of the ventilation base (6) are fixedly connected to a fan frame (13), and a heat dissipation fan (14) is arranged inside the fan frame (13).

5. The chip capacitor sintering device according to claim 1, characterized in that: One end of the cooling side frame (4) is fixedly connected to a limiting seat (15), and a positioning sealing seat (16) is provided inside the limiting seat (15).

6. The chip capacitor sintering device according to claim 1, characterized in that: The interior of the sintering pot (1) is evenly provided with electric heating pipes (17), and the inner wall of the sintering pot (1) is provided with a heat-averaging ring seat (18).

Images