Frame structure capable of improving overcurrent capability of product

Abstract

The utility model discloses a frame structure capable of increasing the overcurrent capability of a product, which comprises a plurality of packaging pins made of frame raw materials and a base island for bearing a chip, the plurality of packaging pins are arranged around the base island, and the packaging pins are connected with the base island according to the requirements of a nuclear power supply and a direct current power supply required by the chip. And combining the base island with the plurality of surrounding packaging pins to form a first bonding pad structure for bearing a nuclear power supply, and combining the plurality of surrounding packaging pins to form one or more second bonding pad structures for bearing a VCCC power supply of the chip or VO output of the chip. The LED packaging structure has the advantages that the enhanced bonding pad structure is adopted, the base islands and the packaging pins are combined, and the packaging pins with the same power supply are combined, so that the over-current capability of the power supply and the ground on the packaging is greatly improved, and the heat dissipation capability of the packaging is also enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a frame structure for increasing the flow capacity of products. Background Art

[0002] In the current chip plastic packaging framework, the base island and the package pins are relatively independent, and the package pins are completely independent from each other, which results in the inability of high-current chips to achieve strong overcurrent capability in plastic packaging. They can only rely on ceramic packaging and metal packaging, but the cost of ceramic packaging and metal packaging makes the packaging unacceptable. Utility Model Content

[0003] The utility model proposes a frame structure for increasing the flow capacity of products, and adopts the following technical solutions:

[0004] A frame structure for increasing the current carrying capacity of a product, comprising a plurality of package pins (1) made of a frame material and a base island (2) for carrying a chip, wherein the plurality of package pins (1) are arranged around the base island (2), and according to the requirements of a core power supply and a DC power supply required by the chip, the base island (2) and the surrounding plurality of package pins (1) are combined to form a first pad structure (3) for bearing the core power supply, and the surrounding plurality of package pins (1) are combined to form one or more second pad structures (4) for bearing the VCCC power supply of the chip or the VO output of the chip.

[0005] The utility model has a framework structure for increasing the product's overcurrent capacity, adopts an enhanced pad structure, merges the base island with the package pins, and merges the package pins of the same power supply, thereby greatly increasing the power supply and ground overcurrent capacity on the package, and also enhancing the package heat dissipation capacity.

[0006] In a preferred embodiment of the technical solution of the utility model, the base island (2) is welded together with a plurality of surrounding packaging pins (1) to form a first pad structure (3).

[0007] In a preferred embodiment of the technical solution of the utility model, a plurality of surrounding packaging pins (1) are welded together to form one or more second welding pad structures (4).

[0008] The beneficial effects of the utility model compared with the prior art are:

[0009] The frame structure of the utility model for increasing the product's current carrying capacity is suitable for a single-layer special frame structure and is only for chips with large current and ultra-large current characteristics. The main method is to merge and connect the pads of the traditional frame to form an ultra-large power supply and ground pad to solve the large current requirements of traditional wirebond products. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1This is a schematic diagram of a framework structure for increasing product flow capacity in this embodiment;

[0011] Figure 2 is a schematic diagram of Example 1;

[0012] Figure 3 This is a schematic diagram of Example 2. DETAILED DESCRIPTION

[0013] The technical solution of the utility model is described in detail below, but the protection scope of the utility model is not limited to the embodiment. Figure 1 -Attached Figure 3 The specific implementation manner is further described.

[0014] like Figure 1 As shown, this embodiment is a frame structure for increasing the product's current capacity, using a plurality of package pins 1 made of frame material and a base island 2 for carrying a chip, the plurality of package pins 1 are arranged around the base island 2, and according to the requirements of the core power supply and DC power supply required by the chip, the base island 2 and the surrounding plurality of package pins 1 are combined to form a first pad structure 3 for bearing the core power supply, and the surrounding plurality of package pins 1 are combined to form one or more second pad structures 4 for bearing the VCCC power supply of the chip or the VO output of the chip. Example 1

[0015] like Figure 2 As shown, when the core power supply VDD current of chip 5 exceeds 10A and the VCC power supply current exceeds 4A, a single package pin 1 is not sufficient to withstand the overcurrent requirement. It is necessary to merge the central base island 2 and the package pin 1 to increase the package pin 1 to withstand the core power supply current; at the same time, it can also avoid the phenomenon of excessive current in a pin causing burning when the chip is mounted on the PCB. Example 2

[0016] like Figure 3 As shown in the figure, when the chip output tube VO current exceeds 4A, the internal current of the chip is not evenly distributed, and a single package pin is not enough to withstand the overcurrent requirement. It is necessary to merge the four adjacent pins of the package to increase the pin overcurrent capacity; at the same time, it can also avoid the phenomenon of excessive current in a pin causing burning when mounted on the PCB.

[0017] The above embodiments are only for illustrating the technical idea of ​​the present utility model, and cannot be used to limit the protection scope of the present utility model. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present utility model shall fall within the protection scope of the present utility model.

Claims

1. A frame structure for increasing the current carrying capacity of a product, comprising a base island (2) for carrying a chip and a plurality of package pins (1) made of a frame material, characterized in that: A plurality of package pins (1) are arranged around a base island (2). According to the requirements of a core power supply and a DC power supply required by a chip, the base island (2) and the surrounding plurality of package pins (1) are combined to form a first pad structure (3) for bearing the core power supply, and the surrounding plurality of package pins (1) are combined to form one or more second pad structures (4) for bearing the VCCC power supply of the chip or the VO output of the chip.

2. A frame structure for increasing product flow capacity according to claim 1, characterized in that: The base island (2) is welded together with a plurality of surrounding package pins (1) to form a first pad structure (3).

3. A frame structure for increasing product flow capacity according to claim 1, characterized in that: A plurality of surrounding package pins (1) are welded together to form one or more second welding pad structures (4).

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