Small package Flash IC (Integrated Circuit) marking structure

Abstract

The utility model discloses a small package Flash IC (Integrated Circuit) marking structure, which comprises a chip body, an identification structure for identification is formed on the chip body, and the identification structure is positioned on a partial area of the surface of the chip body. The marking structure has the effects that the mark with the identification is formed on the chip body of the small package, the subsequent identification of the chip body is facilitated, and the condition of goods mixing is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of IC chips, in particular to a small package Flash IC marking structure. Background Art

[0002] The purpose of dotting integrated circuit chips is generally to mark them. There are generally two types of markings for integrated circuit chips. The direct-insert IC is marked with a semicircular notch, and the chip IC is marked with a small dot. There are also notches and small dots. When dotting integrated circuit chips, a dotting fixture is usually required to mainly assist and assist in controlling the position of the integrated circuit chip. In recent years, in the after-sales repair market, small-package Flash ICs (0.7x 1.2mm) have gradually occupied the traditional large-package Flash ICs (2x3mm), because the small-package Flash IC is closer to a capacitor and resistor component in appearance, making the after-sales repair screen look closer to the original screen and more acceptable to customers.

[0003] The small package Flash IC in the prior art is small in size. After the software is burned by the burning device, it is impossible to mark the burned Flash IC by the traditional dotting method, which is inconvenient for identification and easily leads to the situation of mixing goods. Utility Model Content

[0004] The utility model aims to overcome the deficiencies in the prior art and provide a small package Flash IC marking structure.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A small package Flash IC marking structure comprises: a chip body, on which a marking structure for marking is formed, and the marking structure is located on a partial area of ​​the surface of the chip body.

[0007] In one embodiment, a marking area is provided on the chip body, and the marking structure is formed on the marking area.

[0008] In one embodiment, the identification structure is a reflective film layer, and the reflective film layer is formed on the surface of the chip body.

[0009] In one embodiment, the reflective film layer is formed on the logo area by silk screen printing, spin coating or evaporation.

[0010] In one embodiment, the reflective film layer is reflective and will reflect when exposed to light.

[0011] In one embodiment, the thickness of the reflective film layer is 0.1 mm-0.3 mm.

[0012] In one embodiment, the reflective film layer is formed on the surface of the chip body before the chip body is burned.

[0013] In one embodiment, a pattern layer with a texture is disposed on the reflective film layer, and the pattern layer is formed on the surface of the reflective film layer by laser after the chip body is burned.

[0014] In one embodiment, the pattern layer is a plurality of dots.

[0015] In one embodiment, the pattern layer is a cross mark.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The utility model provides a small package Flash IC marking structure by setting a marking structure. Before the chip body is burned, a reflective film layer is formed on the marking area of ​​the chip body. After burning, a laser machine in the burning equipment forms a pattern layer on the surface of the reflective film layer. The pattern layer serves as a mark of the small package chip body after burning, so that the small package chip body has identification, which is convenient for subsequent identification of the chip body and prevents the occurrence of mixed goods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 A structural schematic diagram of Example 1 of a small package Flash IC marking structure provided by the utility model;

[0020] Figure 2 This is a structural schematic diagram of Example 2 of a small-package Flash IC marking structure provided by the utility model.

[0021] Description of the drawings: 10. Chip body; 11. Marking area; 20. Reflective film layer; 21. Pattern layer. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0023] Embodiment 1:

[0024] A small package Flash IC marking structure, refer to Figure 1, including a chip body 10, on which a marking structure for marking is formed. The marking structure is located on a partial area of ​​the surface of the chip body 10, and a marking area 11 is provided on the chip body 10, on which the marking structure is formed. The position and size of the marking area 11 can be determined according to actual needs.

[0025] Reference Figure 1 The identification structure is a reflective film layer 20, which is disposed on the surface of the chip body 10. The reflective film layer 20 is formed on the identification area 11 by screen printing, spin coating or evaporation. The reflective film layer 20 is reflective, and under illumination, light will be reflected through the reflective film layer 20 to the human eye, thereby playing a certain identification role.

[0026] Further, refer to Figure 1 The thickness of the reflective film layer 20 is 0.1 mm-0.3 mm.

[0027] Reference Figure 1 A pattern layer 21 with a texture is disposed on the reflective film layer 20, and the reflective film layer 20 is disposed on the surface of the chip body 10 before the chip body 10 is burned. Since a laser machine is integrated in the burning device for burning, after the chip body 10 is burned, the surface of the reflective film layer 20 is lasered by the laser machine, thereby forming a pattern layer 21 with a texture on the surface of the reflective film layer 20.

[0028] Reference Figure 1 The pattern layer 21 is a dot, and there are multiple dots, which are evenly distributed on the pattern layer 21. The surface of the reflective film layer 20 is irradiated with a laser to form the pattern layer 21, and the pattern layer 21 is used as a mark after the small package chip body 10 is burned, so that the small package chip body 10 has identification, which is convenient for subsequent identification of the chip body 10 and prevents the occurrence of mixed goods.

[0029] Embodiment 2:

[0030] The difference between this embodiment and the first embodiment is that the pattern layer 21 is different.

[0031] Reference Figure 2 The pattern layer 21 is a cross mark, which is formed on the reflective film layer 20 by laser, so as to facilitate observation and identification.

[0032] In this embodiment, the pattern layer 21 may also be other indicative patterns, such as a triangle, etc., to facilitate identification and distinction.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A small package Flash IC marking structure, characterized in that: include: A chip body (10), wherein an identification structure for identification is formed on the chip body (10), and the identification structure is located on a partial area of ​​the surface of the chip body (10).

2. A small package Flash IC marking structure according to claim 1, characterized in that: The chip body (10) is provided with a marking area (11), and the marking structure is formed on the marking area (11).

3. A small package Flash IC marking structure according to claim 2, characterized in that: The identification structure is a reflective film layer (20), and the reflective film layer (20) is formed on the surface of the chip body (10).

4. A small package Flash IC marking structure according to claim 3, characterized in that: The reflective film layer (20) is formed on the marking area (11) by means of silk-screen printing, spin coating or evaporation.

5. A small package Flash IC marking structure according to claim 4, characterized in that: The reflective film layer (20) is reflective and will reflect when irradiated by light.

6. A small package Flash IC marking structure according to claim 5, characterized in that: The thickness of the reflective film layer (20) is 0.1 mm-0.3 mm.

7. A small package Flash IC marking structure according to claim 6, characterized in that: The reflective film layer (20) is formed on the surface of the chip body (10) before the chip body (10) is burned.

8. A small package Flash IC marking structure according to claim 7, characterized in that: A pattern layer (21) with a texture is arranged on the reflective film layer (20); the pattern layer (21) is formed on the surface of the reflective film layer (20) by laser after the chip body (10) is burned.

9. A small package Flash IC marking structure according to claim 8, characterized in that: The pattern layer (21) is a plurality of dots.

10. A small package Flash IC marking structure according to claim 9, characterized in that: The pattern layer (21) is a cross mark.

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