Heat conduction structure of circuit board

Abstract

The utility model discloses a heat conduction structure of a circuit board, which comprises a heat conduction plate and a heat dissipation plate which are arranged above the circuit board, a plurality of heat dissipation fins are arranged on the top surface of the heat dissipation plate, and a plurality of heat conduction top strips and a plurality of heat conduction bottom strips are respectively fixed on the upper surface and the lower surface of the heat conduction plate. The surface of the heat dissipation plate is provided with a first strip-shaped hole allowing the heat conduction top strip to be inserted therein. The surface of the circuit board is provided with a second strip-shaped hole allowing the heat conduction bottom strip to be inserted therein. According to the utility model, the circuit board heat conduction structure in the prior art is improved and optimized, and the heat conduction top strip, the heat conduction bottom strip, the positioning seat, the limiting structure and the like are designed, so that the heat conduction plate and the heat dissipation plate can be quickly mounted at the top of the circuit board, and the mounting convenience of the whole heat conduction structure is effectively improved; and meanwhile, the heat conduction plate and the heat dissipation plate can be conveniently detached from the top of the circuit board for maintenance subsequently, and the later maintenance convenience of the heat conduction structure is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a heat conduction structure of a circuit board. Background Art

[0002] Circuit board is also called circuit board, and can also be called printed circuit board or printed circuit board. Circuit board makes circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit board will generate a certain amount of heat during operation, so most circuit boards will be designed with heat conduction structure for heat dissipation. For example, the existing patent with publication number CN205648317U discloses "a circuit board heat dissipation structure for a switch, including a circuit board body; and also including a heat dissipation mechanism arranged on the circuit board body, and the heat dissipation mechanism includes a heat conduction plate and a heat conduction silicone plate made of heat conduction silicone". It can be seen that the application describes a common circuit board heat conduction heat dissipation structure;

[0003] In the actual use of the thermal conductive structure of the circuit board in the prior art, since the heat sink and the heat conductive plate are both fixed to the circuit board by screws, the whole thermal conductive structure is not easy to be disassembled and assembled, which reduces the convenience of early installation and the convenience of disassembly and assembly during later maintenance. Therefore, the utility model proposes a thermal conductive structure of the circuit board. Utility Model Content

[0004] The purpose of the utility model is to provide a heat conduction structure of a circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat conduction structure of a circuit board, comprising a heat conduction plate and a heat sink installed above the circuit board, the top surface of the heat sink is provided with a plurality of heat dissipation fins, the upper and lower surfaces of the heat conduction plate are respectively fixed with a plurality of heat conduction top strips and a plurality of heat conduction bottom strips, the surface of the heat sink is provided with a first strip hole for inserting the heat conduction top strip, the surface of the circuit board is provided with a second strip hole for inserting the heat conduction bottom strip, the top of the circuit board is symmetrically fixed with two positioning seats relative to the two sides of the heat conduction plate, and the top of the positioning seat penetrates to the top of the heat sink;

[0006] It also includes a limiting structure arranged on the circuit board, the limiting structure includes a cylindrical seat rotatably mounted on the top surface of the circuit board, a limiting pressure block is fixed on one side of the cylindrical seat, the limiting pressure block is pressed on the top edge of the heat sink, and a C-shaped block is slidably mounted on the other side of the cylindrical seat, a limiting card block is fixed on the bottom surface of the C-shaped block, and a limiting card slot corresponding to the limiting card block is provided on the top surface of the circuit board, the limiting card block is inserted into the limiting card slot, the limiting structure also includes a T-shaped slide groove provided on the surface of the cylindrical seat, a spring and a T-shaped slider are provided in the T-shaped slide groove, the T-shaped slider is slidably located in the T-shaped slide groove, and the spring is at the top of the T-shaped slider, and one end of the T-shaped slider extends to the surface of the cylindrical seat and is fixedly connected to the C-shaped slide block.

[0007] Preferably, a circular bottom groove is provided on the top surface of the T-shaped slider, the bottom end of the spring is inserted into the circular bottom groove, and a circular top groove is provided on the top inner wall of the T-shaped slide groove, the top end of the spring is inserted into the circular top groove.

[0008] Preferably, an auxiliary structure is further included, which is arranged between the positioning seat and the heat sink, and the auxiliary structure includes an L-shaped rubber pad fixed to the bottom surface of the heat sink, and the L-shaped rubber pad is located on one side of the positioning seat, and a positioning protrusion is provided on the surface of the L-shaped rubber pad, and a positioning slot is provided on the surface of the positioning seat for the positioning protrusion to be embedded, the L-shaped rubber pad and the positioning protrusion are an integrated structure, and the cross-section of the positioning protrusion is arc-shaped.

[0009] Compared with the prior art, the beneficial effect of the utility model is as follows: the utility model improves and optimizes the heat-conducting structure of the circuit board in the prior art, designs structures such as a heat-conducting top strip, a heat-conducting bottom strip, a positioning seat and a limiting structure, so that the heat-conducting plate and the heat-dissipating plate can be quickly installed on the top of the circuit board, effectively improving the installation convenience of the entire heat-conducting structure, and also facilitating the subsequent removal of the heat-conducting plate and the heat-dissipating plate from the top of the circuit board for maintenance, thereby improving the convenience of later maintenance of the heat-conducting structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a three-dimensional diagram of the utility model;

[0011] Figure 2 For this utility model Figure 1 A partial enlarged view of the middle A area;

[0012] Figure 3 It is a cross-sectional view of the utility model;

[0013] Figure 4 For this utility model Figure 3 A partial enlarged view of the middle B area;

[0014] Figure 5For this utility model Figure 3 A partial enlarged view of the middle C area;

[0015] In the figure: 1. heat conducting plate; 11. heat conducting top strip; 12. heat conducting bottom strip; 2. heat dissipation plate; 21. heat dissipation fin; 22. strip hole one; 23. L-shaped rubber pad; 24. positioning protrusion; 3. circuit board; 31. strip hole two; 4. positioning seat; 41. positioning slot; 5. limiting structure; 51. cylindrical seat; 52. limiting pressure block; 53. C-shaped shift block; 54. T-shaped slide groove; 55. spring; 56. T-shaped slider; 57. limiting block; 58. limiting slot. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example

[0017] See also Figures 1 to 4, which is the first embodiment of the utility model, and this embodiment provides a technical solution: the heat conduction structure of the circuit board includes a heat conduction plate 1 and a heat sink 2 installed above the circuit board 3, the top surface of the heat sink 2 is provided with a plurality of heat dissipation fins 21, and the upper and lower surfaces of the heat conduction plate 1 are respectively fixed with a plurality of heat conduction top strips 11 and a plurality of heat conduction bottom strips 12, the heat conduction plate 1, the heat conduction top strip 11, the heat conduction bottom strip 12, the heat sink 2 and the heat dissipation fins 21 are all made of copper material, and the surface of the heat sink 2 is provided with a strip hole 22 for inserting the heat conduction top strip 11, and the heat conduction top strip 11 will fit with the inner wall of the strip hole 22 after being inserted into the strip hole 22, thereby increasing the heat conduction efficiency between the heat conduction plate 1 and the heat sink 2, and the surface of the circuit board 3 is provided with a strip hole 21 for inserting the heat conduction bottom strip 12, and the heat conduction bottom strip 12 will also fit with the strip hole 21 after being inserted into the strip hole 21 The inner walls of the two 31 are fitted together to increase the thermal conductivity efficiency between the heat conducting plate 1 and the circuit board 3. The design of the heat conducting top strip 11 and the heat conducting bottom strip 12 can increase the contact area between the heat conducting plate 1 and the heat dissipation plate 2, and also increase the contact area between the heat conducting plate 1 and the circuit board 3, thereby improving the thermal conductivity efficiency of the overall thermal structure. The heat generated by the actual circuit board 3 during operation will be absorbed by the heat conducting bottom strip 12 and the heat conducting plate 1, and then the heat conducting plate 1 and the heat conducting top strip 11 will conduct the heat to the heat dissipation plate 2, and the heat dissipation plate 2 and the heat dissipation fins 21 will exchange the conducted heat with the air, thereby achieving the purpose of heat conduction and heat dissipation of the circuit board 3. Two positioning seats 4 are symmetrically fixed on the top of the circuit board 3 relative to the two sides of the heat conducting plate 1, and the top of the positioning seat 4 penetrates to the top of the heat dissipation plate 2, and the positioning seat 4 can limit the heat dissipation plate 2 in the horizontal direction;

[0018] The circuit board 3 also includes a limiting structure 5, which includes a cylindrical seat 51 rotatably mounted on the top surface of the circuit board 3. A limiting pressure block 52 is welded and fixed on one side of the cylindrical seat 51. The limiting pressure block 52 is pressed on the top edge of the heat sink 2, and can limit the heat sink 2 in the vertical direction to achieve stable installation of the heat sink 2 and the heat conducting plate 1. A C-shaped shift block 53 is slidably mounted on the other side of the cylindrical seat 51. A limiting card block 57 is welded and fixed on the bottom surface of the C-shaped shift block 53, and a limiting card slot 58 corresponding to the limiting card block 57 is opened on the top surface of the circuit board 3. The limiting card block 5 7 is inserted into the limiting card slot 58 to achieve the locking limit of the cylindrical seat 51, ensuring that the limiting pressure block 52 can be stably located on the top of the heat sink 2 during daily use, and the stable limit of the heat sink 2 is achieved. The limiting structure 5 also includes a T-shaped slide groove 54 opened on the surface of the cylindrical seat 51, and a spring 55 and a T-shaped slider 56 are arranged in the T-shaped slide groove 54. The T-shaped slider 56 is slidably located in the T-shaped slide groove 54, and the spring 55 is at the top of the T-shaped slider 56. One end of the T-shaped slider 56 extends to the surface of the cylindrical seat 51 and is fixedly connected to the C-shaped shift block 53. If the heat sink 2 and the heat conducting plate 1 are to be moved from the top of the circuit board 3 When the heat sink 2 and the heat conducting plate 1 are to be removed for maintenance, it is only necessary to lift the C-shaped shift block 53 first, so that the T-shaped slide block 56 moves upward to compress the spring 55, until the limit block 57 moves out of the limit slot 58, and then the cylindrical seat 51 can be rotated so that the limit pressing block 52 is no longer above the heat sink 2. At this time, the limit of the heat sink 2 and the heat conducting plate 1 can be released, and the heat sink 2 and the heat conducting plate 1 can be directly removed from the top of the circuit board 3 for maintenance. When the heat sink 2 and the heat conducting plate 1 are reinstalled later, the heat conducting plate 1 is first placed on the top of the circuit board 3, and the heat conducting bottom strip 12 is inserted into the strip-shaped hole 31, and then the heat sink 2 is covered on the heat conducting bottom strip 12. The top of the heat plate 1 is moved to the top of the heat plate 1, and the heat conductive top strip 11 is inserted into the strip hole 12, and the top of the positioning seat 4 is passed through the top of the heat sink 2. At this time, the C-shaped block 53 is lifted again and the cylindrical seat 51 is rotated until the limiting pressure block 52 is rotated to the top of the heat sink 2. At this time, the C-shaped block 53 is released, so that the spring 55 pushes the T-shaped slider 56 back, and the limiting card block 57 is inserted into the limiting card groove 58, so that the cylindrical seat 51 and the limiting pressure block 52 can be limited, so that the limiting pressure block 52 can stably block and limit the heat sink 2, thereby ensuring the installation stability of the heat sink 2 and the heat conductive plate 1.

[0019] Among them, a circular bottom groove is opened on the top surface of the T-shaped slider 56, and the bottom end of the spring 55 is inserted into the circular bottom groove. A circular top groove is opened on the top inner wall of the T-shaped slide groove 54, and the top end of the spring 55 is inserted into the circular top groove, so as to realize the stable installation of the spring 55. Example

[0020] See also Figures 1 to 5, which is the second embodiment of the utility model, is based on the previous embodiment, and the difference is that the auxiliary structure can be provided to play an auxiliary positioning role when the heat sink 2 is installed, thereby further improving the installation convenience of the heat sink 2 and the heat conducting plate 1.

[0021] Specifically, it also includes an auxiliary structure, which is arranged between the positioning seat 4 and the heat sink 2. The auxiliary structure includes an L-shaped rubber pad 23 glued and fixed to the bottom surface of the heat sink 2, and the L-shaped rubber pad 23 is located on one side of the positioning seat 4. The surface of the L-shaped rubber pad 23 is provided with a positioning protrusion 24, and the surface of the positioning seat 4 is provided with a positioning groove 41 for the positioning protrusion 24 to be embedded. When the heat sink 2 is installed, when the top end of the positioning seat 4 penetrates to the top of the heat sink 2, the positioning protrusion 24 will be squeezed into the positioning groove 41, thereby realizing auxiliary limiting of the heat sink 2 at this time, making it convenient for the operator to subsequently stably limit the heat sink 2 through the limiting structure 5, thereby further improving the installation convenience of the heat sink 2 and the heat conducting plate 1.

[0022] Among them, the L-shaped rubber pad 23 and the positioning protrusion 24 are an integrated structure, both of which are made of rubber material and will undergo elastic deformation when squeezed. The cross-section of the positioning protrusion 24 is arc-shaped, so that the positioning protrusion 24 is easy to undergo elastic deformation when squeezed.

[0023] Although the embodiments of the present invention have been shown and described (see the detailed description above for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat conduction structure for a circuit board, comprising a heat conduction plate (1) and a heat sink (2) mounted above a circuit board (3), wherein a top surface of the heat sink (2) is provided with a plurality of heat sink fins (21), characterized in that: A plurality of heat-conducting top strips (11) and a plurality of heat-conducting bottom strips (12) are fixed to the upper and lower surfaces of the heat-conducting plate (1), respectively; a strip-shaped hole (22) is provided on the surface of the heat-dissipating plate (2) for inserting the heat-conducting top strips (11); a strip-shaped hole (31) is provided on the surface of the circuit board (3) for inserting the heat-conducting bottom strips (12); two positioning seats (4) are symmetrically fixed to the top of the circuit board (3) relative to the two sides of the heat-conducting plate (1); the top of the positioning seat (4) penetrates through the top of the heat-dissipating plate (2); It also comprises a limiting structure (5) arranged on the circuit board (3), the limiting structure (5) comprising a cylindrical seat (51) rotatably mounted on the top surface of the circuit board (3), a limiting pressure block (52) being fixed on one side of the cylindrical seat (51), the limiting pressure block (52) being pressed on the top edge of the heat sink (2).

2. The heat conduction structure of the circuit board according to claim 1, characterized in that: A C-shaped shift block (53) is slidably mounted on the other side of the cylindrical seat (51); a limit card block (57) is fixed on the bottom surface of the C-shaped shift block (53); and a limit card slot (58) corresponding to the limit card block (57) is provided on the top surface of the circuit board (3); the limit card block (57) is inserted into the limit card slot (58).

3. The heat conduction structure of the circuit board according to claim 2, characterized in that: The limiting structure (5) further comprises a T-shaped slide groove (54) formed on the surface of the cylindrical seat (51), wherein a spring (55) and a T-shaped slider (56) are arranged in the T-shaped slide groove (54), wherein the T-shaped slider (56) is slidably located in the T-shaped slide groove (54), and the spring (55) is located at the top of the T-shaped slider (56), and one end of the T-shaped slider (56) extends to the surface of the cylindrical seat (51) and is fixedly connected to the C-shaped shift block (53).

4. The heat conduction structure of the circuit board according to claim 3, characterized in that: A circular bottom groove is formed on the top surface of the T-shaped sliding block (56), and the bottom end of the spring (55) is inserted into the circular bottom groove.

5. The heat conduction structure of the circuit board according to claim 3, characterized in that: A circular top groove is formed on the inner wall of the top end of the T-shaped slide groove (54), and the top end of the spring (55) is inserted into the circular top groove.

6. The heat-conducting structure of a circuit board according to claim 1, characterized in that: It also comprises an auxiliary structure, which is arranged between the positioning seat (4) and the heat dissipation plate (2).

7. The heat-conducting structure of the circuit board according to claim 6, characterized in that: The auxiliary structure comprises an L-shaped rubber pad (23) fixed to the bottom surface of the heat sink (2), and the L-shaped rubber pad (23) is located on one side of the positioning seat (4), a positioning protrusion (24) is provided on the surface of the L-shaped rubber pad (23), and a positioning slot (41) is provided on the surface of the positioning seat (4) for the positioning protrusion (24) to be embedded.

8. The heat-conducting structure of the circuit board according to claim 7, characterized in that: The L-shaped rubber pad (23) and the positioning protrusion (24) are an integrated structure, and the cross section of the positioning protrusion (24) is arc-shaped.

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