Inverter

Abstract

The inverter comprises a shell, a PCB, an upper cover and a power module, an electromagnetic shielding cover fixed on the upper surface of the power module is arranged in the shell, the upper cover is installed on the electromagnetic shielding cover and forms an isolation cavity with the electromagnetic shielding cover in an enclosing mode, and the PCB is arranged in the isolation cavity; the electromagnetic shielding cover comprises a substrate, one side of the substrate is provided with a plurality of first protruding parts for bearing the PCBs, and second protruding parts protruding towards the same side of the substrate with the first protruding parts are arranged between the adjacent first protruding parts. A group of long edges of the substrate are bent to form retaining walls, the first protruding parts and the second protruding parts are arranged along one of the retaining walls, and each second protruding part is partially located on the retaining wall. According to the inverter of the utility model, the cooperation of the electromagnetic shielding cover and the upper cover is realized, and the formed isolation cavity shields the PCB, so that the electromagnetic field generated by the power module of the inverter is prevented from interfering the control of the PCB; the second protruding part reinforces the weak part, so that the relatively thin substrate keeps relatively high strength, and the thickness and the weight of the substrate are reduced.

Description

Technical Field

[0001] The utility model relates to the field of electric control components, in particular to an inverter. Background Art

[0002] In existing power circuit products, in order to shield electromagnetic radiation and prevent the control function of the PCB from being interfered with, a metal bracket is usually set between the PCB and the power module to achieve electromagnetic shielding. However, the metal bracket cannot be insulated, and sufficient electrical clearance needs to be left in the design, making the overall volume of the bracket larger; in addition, the metal bracket in the prior art is usually thicker and heavier, and its electromagnetic shielding effect is also average.

[0003] In view of the above defects, the present invention proposes a new inverter. Utility Model Content

[0004] The purpose of the utility model is to provide an inverter that not only maintains good electromagnetic shielding capability and structural strength, but also reduces the thickness and weight of the electromagnetic shielding cover. The utility model solves the above technical problems through the following technical solutions:

[0005] The utility model provides an inverter, comprising a housing, a PCB board, an upper cover and a power module, wherein an electromagnetic shielding cover fixed to the upper surface of the power module is arranged in the housing, the upper cover is mounted on the electromagnetic shielding cover and enclosed with the electromagnetic shielding cover to form an isolation cavity, and the PCB board is arranged in the isolation cavity;

[0006] The electromagnetic shielding cover comprises a substrate, a plurality of first protrusions for carrying the PCB are provided on one side of the substrate, second protrusions are provided between adjacent first protrusions and protrude toward the same side of the substrate as the first protrusions, the second protrusions have a depth smaller than the first protrusions and a width and a length larger than the first protrusions;

[0007] A group of long sides of the substrate are bent to form a retaining wall. The first protrusions and the second protrusions are arranged along one of the retaining walls. Each of the second protrusions is partially located on the retaining wall.

[0008] In the present technical solution, the retaining wall is inserted into the reserved gap of the upper cover, so that the electromagnetic shielding cover and the upper cover are matched, and the formed isolation cavity shields the PCB board, thereby preventing the electromagnetic field generated by the power module of the inverter from interfering with the PCB board control; the second protrusion on the substrate plays a reinforcing role in the weak position, so that the thinner substrate maintains a higher strength, thereby reducing the thickness and weight of the substrate.

[0009] Preferably, both sides of the substrate are provided with insulating coatings.

[0010] In the prior art, since the surface of the power module is provided with exposed copper parts, in order to ensure absolute insulation, a certain distance has to be maintained between the shielding cover and the power module. In the present technical solution, the provision of an insulating coating eliminates the need to consider electrical clearance during design, so that the electromagnetic shielding cover can be as close to the power module as possible, thereby enhancing the electromagnetic shielding effect and making the entire design more compact.

[0011] Preferably, a plurality of signal holes are provided on the substrate, and the signal holes are arranged along the retaining wall opposite to the first protrusion and the second protrusion, and the insulating coating is provided on the side wall of each of the signal holes.

[0012] In this technical solution, the signal hole is used to allow the signal needle to pass through and connect to the PCB board for control. An insulating coating is provided on the side wall of the signal hole so that there is no need to consider electrical clearance during design, which greatly improves space utilization. At the same time, the hole size is minimized to enhance electromagnetic shielding capability.

[0013] Preferably, a plurality of fourth protrusions are provided in the middle of the substrate and protrude toward the same side of the substrate as the first protrusions, and the top of the first protrusion is at the same height as the top of the fourth protrusion.

[0014] In the technical solution, the fourth protrusion supports the PCB board together with the first protrusion, and a through hole can be provided on the fourth protrusion, and the PCB board and the electromagnetic shielding cover are fixed to the shell together by screws passing through the through hole.

[0015] Preferably, the first protrusion is a circular boss, the top of the first protrusion is a plane and has a fixing hole, and the PCB board is fixed to the top of the first protrusion by means of screws passing through the fixing hole.

[0016] In the technical solution, the contact area between the PCB board and the first protrusion is relatively large and is fixed by screws, so that the PCB board is fixed more firmly.

[0017] Preferably, a riveting hole is provided on the base plate, the first protrusion is a threaded insert fixed in the riveting hole, and a threaded fit is formed between the PCB board and the threaded insert.

[0018] In this technical solution, the PCB board is stably fixed by screws, and the substrate is relatively simple to process and has high dimensional accuracy.

[0019] Preferably, a plurality of mounting holes are respectively provided along a group of short sides of the substrate.

[0020] In the technical solution, the substrate is mounted on the housing through the mounting hole, so that the electromagnetic shielding cover is stably fixed.

[0021] Preferably, a third protrusion is provided on the top of the retaining wall.

[0022] In the technical solution, the third protrusion extends into the gap reserved in the upper cover to achieve the matching between the electromagnetic shielding cover and the upper cover.

[0023] Preferably, the third protrusion is an arc-shaped structure formed by bending.

[0024] In the technical solution, the arc-shaped third protrusion plays a guiding role to prevent the third protrusion and the upper cover from generating metal debris due to friction and causing a short circuit on the PCB board.

[0025] Preferably, the third protrusion is a spring sheet.

[0026] In this technical solution, the spring and the upper cover fit tightly together, the gap is small, the shielding effect is better, and higher frequency electromagnetic waves can be shielded.

[0027] On the basis of conforming to the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present utility model.

[0028] The positive and progressive effects of the utility model are:

[0029] In the inverter of the utility model, the retaining wall on the electromagnetic shielding cover is inserted into the reserved gap of the upper cover, so that the electromagnetic shielding cover and the upper cover are matched, and the formed isolation cavity shields the PCB board, so as to prevent the electromagnetic field generated by the power module of the inverter from interfering with the control of the PCB board; the second protrusion on the substrate plays a reinforcing role in the weak position, so that the thinner substrate maintains a higher strength, thereby reducing the thickness and weight of the substrate; insulating coatings are provided on both sides of the substrate, so that there is no need to consider the electrical gap during design, and the electromagnetic shielding cover can be as close to the power module as possible, thereby enhancing the electromagnetic shielding effect and making the entire design more compact.

[0030] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the detailed description and drawings here are only used to illustrate the present application and do not impose any limitations on the scope of the claims of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other features and advantages of the present application will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0032] Figure 1 It is a three-dimensional schematic diagram of the electromagnetic shielding cover of the inverter according to the first embodiment of the utility model.

[0033] Figure 2 It is a partial cross-sectional schematic diagram of the inverter of Example 1 of the utility model.

[0034] Reference numerals

[0035] 1 substrate

[0036] 2 First protrusion

[0037] 3 Second protrusion

[0038] 4 Retaining Wall

[0039] 5 signal hole

[0040] 6 Mounting holes

[0041] 7 The third protrusion

[0042] 8 Fourth protrusion

[0043] 100 Shell

[0044] 200 PCB board

[0045] 300 Upper cover

[0046] 400 Power Module

[0047] 500 Isolation Chamber DETAILED DESCRIPTION

[0048] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present application. The present application can also be implemented or applied through other different specific implementation methods, and the details in the present application can also be modified or changed in various ways according to different viewpoints and application systems without departing from the spirit of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0049] The following is a detailed description of the embodiments of the present application with reference to the accompanying drawings so that those skilled in the art can easily implement the present application. The present application can be embodied in a variety of different forms and is not limited to the embodiments described herein.

[0050] In the representations of the present application, the representations with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the represented specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples, unless they contradict each other.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0052] In order to clearly describe the present application, components irrelevant to the description are omitted, and the same reference symbols are given to the same or similar components throughout the specification.

[0053] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.

[0054] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.

[0055] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0056] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present application. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0057] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which this application belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the relevant technical literature and the contents of the current disclosure, and unless defined, shall not be overly interpreted as ideal or very formal meanings.

[0058] Example 1

[0059] like Figure 1 and Figure 2 As shown, the inverter in this embodiment includes a shell 100, a PCB board 200, an upper cover 300 and a power module 400. An electromagnetic shielding cover fixed to the upper surface of the power module 400 is provided in the shell 100, the upper cover 300 is installed on the electromagnetic shielding cover and enclosed with the electromagnetic shielding cover to form an isolation cavity 500, and the PCB board is arranged in the isolation cavity 500; the electromagnetic shielding cover includes a substrate 1, one side of the substrate 1 is provided with a plurality of first protrusions 2 for carrying the PCB board 200, and second protrusions 3 protruding to the same side of the substrate 1 as the first protrusions 2 are provided between adjacent first protrusions 2, the depth of the second protrusion 3 is smaller than the first protrusion 2, and the width and length are both larger than the first protrusion 2; a group of long sides of the substrate 1 are bent to form a retaining wall 4, the first protrusions 2 and the second protrusions 3 are arranged along one of the retaining walls 4, and each second protrusion 3 is partially located on the retaining wall 4. The retaining wall 4 is inserted into the upper cover 300 to reserve a gap, so that the electromagnetic shielding cover and the upper cover 300 are matched, and the formed isolation cavity 500 shields the PCB board 200, so as to prevent the electromagnetic field generated by the power module 400 of the inverter from interfering with the control of the PCB board 200; the second protrusion 3 on the substrate 1 plays a reinforcing role in the weak part, so that the thinner substrate 1 maintains a higher strength, thereby reducing the thickness and weight of the substrate 1. The substrate 1 is a steel sheet metal part made by multiple stamping processes, and its electromagnetic shielding effect is better than the aluminum die casting in the prior art and is easy to process.

[0060] In other embodiments, other materials or processes may be used to obtain the substrate 1 as required.

[0061] In this embodiment, both sides of the substrate 1 are provided with an insulating coating. The insulating coating is a high-voltage insulating coating. The closer the electromagnetic shielding cover is to the power module 400, the better the shielding effect. However, in the prior art, since the surface of the power module 400 is provided with exposed copper parts, in order to ensure absolute insulation, a certain distance must be maintained between the shielding cover and the power module 400. The provision of the insulating coating eliminates the need to consider electrical clearance during design, so that the electromagnetic shielding cover can be as close to the power module 400 as possible, thereby enhancing the electromagnetic shielding effect and making the entire design more compact.

[0062] A plurality of signal holes 5 are provided on the substrate 1, and the signal holes 5 are arranged along the retaining wall 4 opposite to the first protrusion 2 and the second protrusion 3, and an insulating coating is provided on the side wall of each signal hole 5. The signal hole 5 is used to allow the signal needle to pass through and connect to the PCB board 200 for control. The insulating coating is provided on the side wall of the signal hole 5 so that the electrical clearance does not need to be considered during the design, and the space utilization rate is greatly improved. At the same time, the opening size is minimized to enhance the electromagnetic shielding capability.

[0063] A plurality of fourth protrusions 8 are provided in the middle of the substrate 1, protruding to the same side of the substrate 1 as the first protrusions 2, and the top of the first protrusion 2 is at the same height as the top of the fourth protrusion 8. The fourth protrusion 8 supports the PCB board 200 together with the first protrusion 2, and a through hole is provided on the fourth protrusion 8, and the PCB board 200 and the electromagnetic shielding cover are fixed to the housing 100 together by screws passing through the through holes.

[0064] The first protrusion 2 is a circular boss, the top of the first protrusion 2 is a plane with a fixing hole, and the PCB board 200 is fixed to the top of the first protrusion 2 by screws passing through the fixing hole. The contact area between the PCB board 200 and the first protrusion 2 is large, and the PCB board 200 is fixed by screws, so that the fixation of the PCB board 200 is more stable.

[0065] A plurality of mounting holes 6 are respectively provided along a group of short sides of the substrate 1. The substrate 1 is mounted on the housing 100 through the mounting holes 6, so that the electromagnetic shielding cover is stably fixed.

[0066] A third protrusion 7 is provided on the top of the retaining wall 4. The third protrusion 7 extends into the gap reserved in the upper cover 300 to achieve the matching between the electromagnetic shielding cover and the upper cover 300.

[0067] The third protrusion 7 is an arc-shaped structure formed by bending. The arc-shaped third protrusion 7 plays a guiding role to prevent the third protrusion 7 and the upper cover 300 from generating metal debris due to friction, thereby preventing the PCB board 200 from short-circuiting.

[0068] The second protrusion 3 is rectangular, and the fourth protrusion 8 is a circular boss. In other embodiments, the second protrusion 3 and the fourth protrusion 8 can also be set to other shapes as needed.

[0069] The inverter in this embodiment is simulated using software. When the inverter is working, the electromagnetic field generated by the power module 400 enters the isolation cavity 500 only in a small amount at the four corners and edges of the isolation cavity 500. The magnetic field strength at the location of the PCB board 200 is generally lower than 0.7A / m, and the electric field strength is generally lower than 2V / m, which is significantly lower than the surrounding areas.

[0070] Example 2

[0071] The difference between this embodiment and embodiment 1 is that:

[0072] The base plate 1 is provided with a riveting hole, the first protrusion 2 is a threaded insert fixed in the riveting hole, and the PCB board 200 and the threaded insert are fixed by a threaded fit. The PCB board 200 is stably fixed by screws, and the base plate 1 is relatively easy to process and has high dimensional accuracy.

[0073] Example 3

[0074] The difference between this embodiment and embodiment 1 is that:

[0075] The third protrusion 7 is a spring sheet, which is tightly matched with the upper cover 300, with a smaller gap, and has a better shielding effect, and can shield electromagnetic waves with higher frequencies.

[0076] In other embodiments, the third protrusion 7 may not be provided as required; after the top of the retaining wall 4 is inserted into the preset gap of the upper cover 300, the gap between the retaining wall 4 and the upper cover 300 is filled with conductive foam.

[0077] In summary, the purpose of the utility model is to provide an inverter which not only maintains good electromagnetic shielding capability and structural strength, but also reduces the thickness and weight of the electromagnetic shielding cover.

[0078] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An inverter, characterized in that: The invention comprises a housing (100), a PCB board (200), an upper cover (300) and a power module (400); an electromagnetic shielding cover fixed to the upper surface of the power module (400) is provided in the housing (100); the upper cover (300) is mounted on the electromagnetic shielding cover and enclosed with the electromagnetic shielding cover to form an isolation cavity (500); and the PCB board (200) is arranged in the isolation cavity (500); The electromagnetic shielding cover comprises a substrate (1), a plurality of first protrusions (2) for carrying the PCB board (200) are provided on one side of the substrate (1), second protrusions (3) are provided between adjacent first protrusions (2) and protrude toward the same side of the substrate (1) as the first protrusions (2), the second protrusions (3) having a depth smaller than that of the first protrusions (2) and a width and length larger than those of the first protrusions (2); A group of long sides of the base plate (1) are bent to form a retaining wall (4); the first protrusion (2) and the second protrusion (3) are arranged along one of the retaining walls (4); and each of the second protrusions (3) is partially located on the retaining wall (4).

2. The inverter according to claim 1, characterized in that: Both sides of the substrate (1) are provided with insulating coatings.

3. The inverter according to claim 2, characterized in that: The substrate (1) is provided with a plurality of signal holes (5), the signal holes (5) are arranged along the retaining wall (4) opposite to the first protrusion (2) and the second protrusion (3), and the insulating coating is provided on the side wall of each signal hole (5).

4. The inverter according to claim 1, characterized in that: A plurality of fourth protrusions (8) are provided in the middle of the substrate (1) and protrude towards the same side of the substrate (1) as the first protrusions (2), and the top of the first protrusion (2) and the top of the fourth protrusion (8) are at the same height.

5. The inverter according to claim 1, characterized in that: The first protrusion (2) is a circular boss; the top of the first protrusion (2) is a plane and has a fixing hole; the PCB board (200) is fixed to the top of the first protrusion (2) by means of screws passing through the fixing hole.

6. The inverter according to claim 1, characterized in that: The base plate (1) is provided with a riveting hole, the first protrusion (2) is a threaded insert fixed in the riveting hole, and a threaded fit is formed between the PCB board (200) and the threaded insert.

7. The inverter according to claim 1, characterized in that: A plurality of mounting holes (6) are respectively arranged along a group of short sides of the base plate (1).

8. The inverter according to claim 1, characterized in that: A third protrusion (7) is provided on the top of the retaining wall (4).

9. The inverter according to claim 8, characterized in that: The third protrusion (7) is an arc-shaped structure formed by bending.

10. The inverter according to claim 8, characterized in that: The third protrusion (7) is a spring sheet.

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