Temperature-adjustable water tank for water quenching of polycrystalline silicon

Abstract

A jacket plate is of a hollow structure, a plurality of partition plates are arranged in the jacket plate at intervals, a cooling water inlet and a cooling water outlet are formed in the two ends of a water channel respectively, the five jacket plates are spliced in a sealed mode to form a box body, and in every two jacket plates corresponding to any two opposite sides of the box body, a cooling water inlet and a cooling water outlet are formed in the water channel. One is provided with a replacement water inlet, the other is provided with a replacement water outlet, a plurality of liquid nitrogen pipelines are hermetically inserted into any two opposite sides of the box body, the liquid nitrogen storage tank is connected with the liquid nitrogen pipelines, an outlet of the ultrapure water storage tank is connected with the replacement water inlet, and the cooling water outlet and the replacement water outlet are both connected with an inlet of the cooling device. An outlet of the cooling device is connected with the cooling water inlet. According to the temperature of the ultrapure water in the box body, a cooling water temperature control mode is preferentially used, on the basis, a replacement water temperature control mode and a liquid nitrogen temperature control mode are added, the temperature control efficiency of the ultrapure water in the box body is high through three modes and three pipes, and related problems in the prior art can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of polysilicon water quenching, and in particular to a temperature-adjustable water tank for polysilicon water quenching. Background Art

[0002] Silicon is the most abundant element semiconductor in the earth's crust. It has superior properties and relatively mature process technology. It has become the main raw material for solid-state electronic devices. Silicon material is an important semiconductor material. The chemical element symbol is Si. Silicon used in the electronics industry should have high purity and excellent electrical and mechanical properties. Silicon is the semiconductor material with the largest output and the widest application. Its output and usage indicate the level of a country's electronics industry. Polycrystalline silicon is a form of single-element silicon. When molten single-element silicon solidifies under supercooling conditions, silicon atoms are arranged in the form of diamond lattices to form many crystal nuclei. If these crystal nuclei grow into grains with different crystal plane orientations, these grains will combine and crystallize into polycrystalline silicon.

[0003] Polysilicon needs to be crushed before use. Currently, polysilicon rods are usually crushed directly by a crusher, but this crushing method has a high powder rate, resulting in a high proportion of powder in the crushed material, and the selling price of the powder is low. Therefore, in the existing technology, most manufacturers generally water quench the polysilicon rods before crushing to make them naturally broken or easily broken, thereby facilitating the subsequent crushing operation.

[0004] The existing water quenching treatment of polysilicon directly uses a water tank, and the polysilicon rods heated at high temperature are placed in the water tank for rapid cooling for water quenching. In order to ensure the water quenching effect, the temperature of the polysilicon rods needs to be reduced from more than 500°C to about 80°C, which requires the temperature of the ultrapure water in the water tank to be maintained below 50°C, and the temperature of the ultrapure water in the water tank is controlled by a large amount of replacement water (ultrapure water), that is, the ultrapure water with a higher temperature in the water tank is discharged, and at the same time, ultrapure water with a lower temperature is introduced into the water tank to control the temperature of the ultrapure water in the water tank. However, the discharged ultrapure water is contaminated and cannot be reused. Such a water quenching process requires a large amount of ultrapure water, and water resources are scarce. The waste is quite serious, and the efficiency of controlling the water tank temperature by replacing water is relatively poor. When the polysilicon rods heated at high temperature enter the water tank, this method has the problem of not being able to control the temperature in time. The temperature of the ultrapure water in the water tank rises seriously (even exceeding 100°C), resulting in large temperature fluctuations of the ultrapure water in the water tank, which in turn leads to poor and uneven water quenching effect of the polysilicon rods. If continuous production is carried out, the temperature of the ultrapure water in the water tank continues to rise, and ultimately cannot meet the temperature conditions required for water quenching, resulting in the inability to carry out continuous production. Therefore, this method can only be applied to intermittent production. During the intermittent period, the temperature of the ultrapure water in the water tank drops to facilitate the next water quenching. Utility Model Content

[0005] Based on this, it is necessary to address the problem that the existing technology uses water replacement to control the water tank temperature, which results in serious waste of water resources and poor efficiency, resulting in insufficient time to control the temperature, resulting in poor and unbalanced water quenching effect of polysilicon rods, and cannot meet the requirements of continuous production. The present application provides a temperature-adjustable water tank for polysilicon water quenching. For the temperature of ultrapure water in the tank, cooling water temperature control is preferentially used, and on this basis, a replacement water temperature control method is added, and finally a liquid nitrogen temperature control method is added. Through these three methods, the ultrapure water temperature control efficiency in the tank is high, and the ultrapure water temperature in the tank can be quickly and effectively adjusted, solving the above-mentioned problems in the existing technology.

[0006] A temperature-adjustable water tank for polysilicon water quenching comprises a box body, an ultrapure water storage tank, a liquid nitrogen storage tank and a cooling device, wherein the box body comprises five jacket plates and a plurality of liquid nitrogen pipelines, the jacket plates are hollow structures, and a plurality of partitions are arranged therein to form a plurality of waterways, and a cooling water inlet and a cooling water outlet are arranged at both ends of the waterway, respectively, the five jacket plates are sealed and assembled to form the box body, one of the two jacket plates corresponding to any two opposite sides of the box body is provided with a displacement water inlet, and the other is provided with a displacement water outlet, the liquid nitrogen pipeline array is provided with a plurality of through holes, a plurality of liquid nitrogen pipelines are sealed and inserted at any two opposite sides of the box body, and one end passes through the jacket plates corresponding to any two opposite sides of the box body, and a plurality of through holes are all located in the box body, the liquid nitrogen storage tank is connected to the liquid nitrogen pipeline, the outlet of the ultrapure water storage tank is connected to the displacement water inlet, the cooling water outlet and the displacement water outlet are both connected to the inlet of the cooling device, and the outlet of the cooling device is connected to the cooling water inlet.

[0007] Preferably, in the above-mentioned temperature-adjustable water tank for water quenching of polysilicon, heat exchange fins are arranged in an array on the inner side of the jacket plate.

[0008] Preferably, in the above-mentioned temperature-adjustable water tank for polysilicon water quenching, the heat exchange fins are copper heat exchange fins.

[0009] Preferably, in the above-mentioned temperature-adjustable water tank for water quenching of polycrystalline silicon, the displacement water inlet and the displacement water outlet are both located on the upper side of the tank body, and the liquid nitrogen pipeline is located on the bottom side of the tank body.

[0010] Preferably, in the above-mentioned temperature-adjustable water tank for water quenching of polysilicon, baffles are arranged at intervals and in an alternating manner in the water channel.

[0011] Preferably, in the above-mentioned temperature-adjustable water tank for water quenching of polysilicon, the flow directions of cooling water in any two adjacent water channels are opposite.

[0012] Preferably, in the above-mentioned temperature-adjustable water tank for water quenching of polycrystalline silicon, the liquid nitrogen pipeline is seal-inserted on the two jacket plates provided with the displacement water inlet and the displacement water outlet.

[0013] Preferably, the above-mentioned temperature-adjustable water tank for water quenching of polysilicon further comprises a filtering device, the outlet of the replacement water is connected to the inlet of the filtering device, and the outlet of the filtering device is connected to the inlet of the cooling device.

[0014] The technical solution adopted in this application can achieve the following beneficial effects:

[0015] In a temperature-adjustable water tank for polysilicon water quenching disclosed in an embodiment of the present application, the temperature of ultrapure water in the tank is preferentially controlled by cooling water. When the temperature of the ultrapure water in the tank rises faster, the cooling water flow rate and circulation speed can be increased, and the cooling water temperature can be reduced to control the temperature. When the polysilicon rods heated at high temperature enter the water tank, the temperature of the ultrapure water in the tank rises sharply, and even the temperature control by cooling water reaches the limit. At this time, the temperature control by replacing water is started again. When these two methods are not enough to control the temperature, the temperature control by liquid nitrogen is started again. That is to say, for the ultrapure water temperature in the tank, the cooling water temperature control method is preferentially used. On this basis, a replacement water temperature control method is added, and finally a liquid nitrogen temperature control method is added. Through these three methods, the ultrapure water temperature control efficiency in the box is high, and the ultrapure water temperature in the box can be quickly and effectively adjusted, solving the problem that there is no time to control the temperature only by replacing water in the prior art. The ultrapure water temperature is effectively controlled to be kept below 50°C, avoiding large temperature fluctuations of the ultrapure water, thereby avoiding affecting the water quenching effect of the polysilicon rod material, making the water quenching effect good and balanced. Through these three methods, the temperature can be controlled to the greatest extent to meet the needs of continuous production, so that the water tank disclosed in this application can be used for continuous production. At the same time, since the ultrapure water temperature in the box is controlled by cooling water first, and liquid nitrogen is used to assist, the amount of replacement water can be reduced, thereby effectively reducing the amount of ultrapure water (replacement water) used, and thus solving the problem of serious waste of water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a temperature-adjustable water tank for polysilicon water quenching disclosed in an embodiment of the present application;

[0017] Figure 2 It is a schematic diagram of a box disclosed in an embodiment of the present application;

[0018] Figure 3 It is a schematic diagram of the box disclosed in the embodiment of the present application at another viewing angle;

[0019] Figure 4is a cross-sectional view of a box disclosed in an embodiment of the present application;

[0020] Figure 5 is a cross-sectional view of a jacket plate disclosed in an embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the liquid nitrogen pipeline disclosed in the examples of this application.

[0022] Description of the drawings: box body 100, jacket plate 110, partition 111, water channel 112, cooling water inlet 113, cooling water outlet 114, displacement water inlet 115, displacement water outlet 116, heat exchange fins 117, baffle 118, liquid nitrogen pipeline 120, through hole 121, ultrapure water storage tank 200, liquid nitrogen storage tank 300, cooling device 400, filtering device 500. DETAILED DESCRIPTION

[0023] For ease of understanding of the present application, the present application will be described more fully below with reference to relevant embodiments. The preferred embodiments of the present application are provided in the embodiments. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0024] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be a centered element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a centered element at the same time. The terms "vertical", "horizontal", "left", "right", "top", "bottom", "bottom end", "top end" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] Please refer to Figures 1 to 6 The embodiment of the present application discloses a temperature-adjustable water tank for polysilicon water quenching, comprising a tank body 100, an ultrapure water storage tank 200, a liquid nitrogen storage tank 300 and a cooling device 400, wherein:

[0027] The box body 100 includes five jacket plates 110 and a plurality of liquid nitrogen pipes 120. The five jacket plates 110 are sealed and assembled to form the box body 100. Specifically, the box body 100 is in the shape of a cube with an opening on the upper side. One of the five jacket plates 110 serves as the bottom side, and the remaining four jacket plates 110 serve as the surrounding sides. The five jacket plates 110 are sealed and connected. Ultrapure water is placed in the box body 100, and the temperature needs to be kept below 50°C. The five jacket plates 110 are sealed and connected to prevent leakage of ultrapure water. Specifically, welding can be used, and this application does not limit this. Each jacket plate 110 adopts the same structure, and each jacket plate 110 is a hollow structure, and each jacket plate 110 is spaced apart with a plurality of partitions 111 (please refer again to Figure 5 ), with multiple water channels 112 formed at intervals, and a cooling water inlet 113 and a cooling water outlet 114 are respectively provided at both ends of the water channel 112. The cooling water is introduced into the water channel 112 from the cooling water inlet 113, and then flows along the water channel 112 to the cooling water outlet 114, and then discharged from the cooling water outlet 114. In the process of the cooling water flowing along the water channel 112, heat is exchanged with the ultrapure water in the box body 100 to cool the ultrapure water in the box body 100, so that the temperature of the ultrapure water in the box body 100 is controlled by the cooling water.

[0028] Please refer again Figure 3 , one of the two jacket plates 110 corresponding to any opposite sides of the box body 100 is provided with a replacement water inlet 115, and the other is provided with a replacement water outlet 116. That is to say, among the four jacket plates 110 constituting the peripheral side of the box body 100, two jacket plates 110 are arranged opposite to each other, and there are two pairs of oppositely arranged jacket plates 110, one of which is provided with a replacement water inlet 115, and the other is provided with a replacement water outlet 116. Replacement water (ultrapure water with a lower temperature) is passed into the box body 100 through the replacement water inlet 115, and the ultrapure water with a higher temperature in the box body 100 is discharged through the replacement water outlet 116. That is to say, ultrapure water with a lower temperature is introduced through the replacement water inlet 115 to replace the ultrapure water with a higher temperature in the box body 100, and the ultrapure water with a higher temperature in the box body 100 is discharged through the replacement water outlet 116, so that the temperature of the ultrapure water in the box body 100 is controlled by the replacement water.

[0029] Please refer again Figure 6The liquid nitrogen pipeline 120 array is provided with a plurality of through holes 121, and the through holes 121 are used for the liquid nitrogen in the liquid nitrogen pipeline 120 to flow out. The plurality of liquid nitrogen pipelines 120 are sealed and inserted on any two opposite sides of the box body 100, and one end of the liquid nitrogen pipeline 120 passes through the jacket plates 110 corresponding to any two opposite sides of the box body 100. That is to say, among the four jacket plates 110 constituting the peripheral side of the box body 100, two jacket plates 110 are arranged opposite to each other, and the jacket plates 110 arranged opposite to each other have There are two pairs, and one pair of jacket plates 110 is inserted with a liquid nitrogen pipe 120. One end of the liquid nitrogen pipe 120 passes through the jacket plate 110, so that the multiple through holes 121 on the liquid nitrogen pipe 120 are all located in the box body 100. By introducing liquid nitrogen into the liquid nitrogen pipe 120, the liquid nitrogen escapes into the ultrapure water in the box body 100 through the multiple through holes 121, which can instantly reduce the temperature of the ultrapure water in the box body 100, so that the temperature of the ultrapure water in the box body 100 is controlled by the liquid nitrogen.

[0030] Please refer again Figure 1 The liquid nitrogen storage tank 300 is connected to the liquid nitrogen pipeline 120. The liquid nitrogen storage tank 300 stores liquid nitrogen for passing the liquid nitrogen in the liquid nitrogen storage tank 300 into the liquid nitrogen pipeline 120. The outlet of the ultrapure water storage tank 200 is connected to the displacement water inlet 115. The ultrapure water storage tank 200 stores ultrapure water with a lower temperature for passing the ultrapure water in the ultrapure water storage tank 200 into the displacement water inlet 115 as displacement water. The cooling water outlet 114 and the displacement water outlet 116 are both connected to the inlet of the cooling device 400. The cooling device 400 is connected to the outlet of the ultrapure water storage tank 200. Device 400 is used for cooling cooling water. Since the ultrapure water with a higher temperature that is replaced is contaminated and cannot be reused, it is used as cooling water to avoid direct waste and solve the serious problem of water resource waste. The cooling water after cooling and heat exchange is introduced into the cooling device 400 for cooling. The outlet of the cooling device 400 is connected to the cooling water inlet 113. The cooled cooling water is re-introduced into the waterway 112 through the cooling water inlet 113 for circulating cooling, thereby realizing the recycling of cooling water and avoiding water resource waste.

[0031] In a temperature-adjustable water tank for polysilicon water quenching disclosed in an embodiment of the present application, the temperature of the ultrapure water in the tank 100 is preferentially controlled by cooling water. When the temperature of the ultrapure water in the tank 100 rises faster, the cooling water flow rate and circulation speed can be increased, and the cooling water temperature can be reduced to control the temperature. When the polysilicon rods heated at high temperature enter the water tank, the temperature of the ultrapure water in the tank 100 rises sharply, and even the temperature control by cooling water reaches the limit. At this time, the temperature control by replacing water is started again. When these two methods are not enough to control the temperature, the temperature control by liquid nitrogen is started again. In other words, cooling water is preferentially used to control the temperature of the ultrapure water in the tank 100. Method, on this basis, a replacement water temperature control method is added, and finally a liquid nitrogen temperature control method is added. Through these three methods, the ultrapure water temperature control efficiency in the box 100 is high, and the ultrapure water temperature in the box 100 can be quickly and effectively adjusted, solving the problem that the temperature cannot be controlled in time only by the replacement water method in the prior art, and effectively controlling the ultrapure water temperature to be kept below 50°C, avoiding large temperature fluctuations of the ultrapure water, thereby avoiding affecting the water quenching effect of the polysilicon rod material, making the water quenching effect good and balanced. Through these three methods, the temperature can be controlled to the greatest extent, meeting the continuous production requirements, so that the water tank disclosed in this application can be used for continuous production. At the same time, since the ultrapure water temperature in the box 100 is controlled by cooling water first, and liquid nitrogen is used to assist, the amount of replacement water can be reduced, thereby effectively reducing the amount of ultrapure water (replacement water) used, and thus solving the problem of serious waste of water resources.

[0032] As described above, in the process of cooling water flowing along the water channel 112, heat is exchanged with the ultrapure water in the box 100 to cool the ultrapure water in the box 100. In order to further improve the heat exchange efficiency between the cooling water and the ultrapure water in the box 100, optionally, the inner array of the jacket plate 110 is provided with heat exchange fins 117, that is, the side of the jacket plate 110 facing the inside of the box 100 is provided with heat exchange fins 117. The heat exchange fins 117 can increase the heat exchange area, effectively improve the heat exchange efficiency between the cooling water and the ultrapure water in the box 100, thereby improving the efficiency of the cooling water in controlling the temperature, and improving the efficiency of the ultrapure water temperature in the box 100 being controlled by the cooling water. Furthermore, the heat exchange fins 117 are copper heat exchange fins, and the copper heat exchange fins have high thermal conductivity, so that the heat exchange efficiency is high.

[0033] In order to enable the cooling water to fully absorb the heat in the ultrapure water and avoid the empty circulation of the cooling water, optionally, baffles 118 are spaced and staggered in the water channel 112 to make the water channel 112 bend, thereby making the cooling water flow in a bend, extending the flow path, allowing the cooling water to fully absorb the heat in the ultrapure water, avoiding the empty circulation of the cooling water, and improving the temperature control effect.

[0034] Furthermore, in any two adjacent water channels 112 , the cooling water flows in opposite directions, so that the cooling water in any adjacent water channels 112 flows in an alternating manner, thereby improving cooling balance.

[0035] Preferably, the replacement water inlet 115 and the replacement water outlet 116 are both located on the upper side of the box 100. According to the temperature distribution of ultrapure water in the water tank, the upper ultrapure water has a higher temperature. Therefore, the replacement water inlet 115 and the replacement water outlet 116 are arranged on the upper side of the box 100 to directly replace the ultrapure water with a higher temperature in the upper layer. The liquid nitrogen pipeline 120 is located at the bottom side of the box 100, so that the liquid nitrogen releases cold from bottom to top, extending the heat exchange path, so that the liquid nitrogen can give full play to its cooling effect.

[0036] In order to facilitate the manufacture of the jacket plate 110, optionally, the liquid nitrogen pipeline 120 is sealed and inserted into two jacket plates 110 provided with a displacement water inlet 115 and a displacement water outlet 116. The five jacket plates 110 are produced uniformly, and then only the displacement water inlet 115, the displacement water outlet 116 and the liquid nitrogen pipeline 120 need to be separately provided for the two jacket plates 110. The four jacket plates 110 on the peripheral side of the box body 100 all need to be additionally processed with the displacement water inlet 115, the displacement water outlet 116 or the liquid nitrogen pipeline 120, thereby improving the convenience and convenience of production.

[0037] Since the ultrapure water discharged from the replacement water outlet 116 is contaminated and contains small particles of polysilicon, if it is directly used as cooling water for circulation, it will inevitably cause blockage or scratch the inside of the pipeline. Based on this, optionally, the temperature-adjustable water tank for polysilicon water quenching disclosed in the present application may also include a filter device 500, and the replacement water outlet 116 is connected to the inlet of the filter device 500, and the outlet of the filter device 500 is connected to the inlet of the cooling device 400. The ultrapure water discharged from the replacement water outlet 116 is filtered by the filter device 500 to filter out the small particles of polysilicon therein, and then it is used as cooling water for circulation after filtering, avoiding direct waste of ultrapure water, and can prevent small particles of polysilicon from causing blockage or scratching the inside of the pipeline, thereby improving the safety and stability of the water quenching system.

[0038] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A temperature-adjustable water tank for polysilicon water quenching, characterized in that: The invention comprises a box (100), an ultrapure water storage tank (200), a liquid nitrogen storage tank (300) and a cooling device (400), wherein the box (100) comprises five jacket plates (110) and a plurality of liquid nitrogen pipelines (120), the jacket plates (110) being of a hollow structure, and having a plurality of partition plates (111) arranged therein to form a plurality of water channels (112) at intervals, and a cooling water inlet (113) and a cooling water outlet (114) being arranged at both ends of the water channel (112), respectively; the five jacket plates (110) are sealed and assembled to form the box (100), and of the two jacket plates (110) corresponding to any two opposite sides of the box (100), one is provided with a displacement water inlet (115), and the other is provided with a displacement water outlet (114). 6), the liquid nitrogen pipeline (120) array is provided with a plurality of through holes (121), the plurality of liquid nitrogen pipelines (120) are sealed and inserted on any two opposite sides of the box (100), and one end passes through the jacket plate (110) corresponding to any two opposite sides of the box (100), the plurality of through holes (121) are all located in the box (100), the liquid nitrogen storage tank (300) is connected to the liquid nitrogen pipeline (120), the outlet of the ultrapure water storage tank (200) is connected to the displacement water inlet (115), the cooling water outlet (114) and the displacement water outlet (116) are both connected to the inlet of the cooling device (400), and the outlet of the cooling device (400) is connected to the cooling water inlet (113).

2. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: An array of heat exchange fins (117) is arranged inside the jacket plate (110).

3. The temperature-adjustable water tank for polysilicon water quenching according to claim 2, characterized in that: The heat exchange fins (117) are copper heat exchange fins.

4. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: The replacement water inlet (115) and the replacement water outlet (116) are both located on the upper side of the box body (100), and the liquid nitrogen pipeline (120) is located on the bottom side of the box body (100).

5. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: Baffles (118) are arranged in intervals and in an alternating manner in the water channel (112).

6. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: In any two adjacent water channels (112), the cooling water flows in opposite directions.

7. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: The liquid nitrogen pipeline (120) is sealed and inserted on the two jacket plates (110) provided with the displacement water inlet (115) and the displacement water outlet (116).

8. The temperature-adjustable water tank for polysilicon water quenching according to claim 1, characterized in that: It also comprises a filtering device (500), wherein the replacement water outlet (116) is connected to the inlet of the filtering device (500), and the outlet of the filtering device (500) is connected to the inlet of the cooling device (400).

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