Wafer drying groove

Abstract

The utility model relates to a wafer drying groove, a first gas ejector pipe is arranged in a groove body, a second gas ejector pipe is arranged in a cover body and is aligned with the side face of a wafer box to eject mixed gas of isopropanol and nitrogen from top to bottom, and the whole wafer box and wafers in the wafer box are dried. The side surface of the wafer box is difficult to dry, so that the gas outlet of the first gas spraying pipe is aligned with the wafer box from the side surface, and the gas outlet of the second gas spraying pipe is aligned with the wafer box from the upper part, thereby enhancing the drying effect of the side surface of the wafer box and improving the drying efficiency.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a wafer drying tank. Background Art

[0002] During each wafer manufacturing process, the wafer needs to be etched with a treatment agent, which causes contaminants such as particles to adhere to the wafer, so the wafer needs to be cleaned. After each cleaning, the wafer needs to be dried. Chinese utility model patent document CN117153741B discloses an integrated wafer cleaning and drying equipment wafer drying tank. The wafer is placed in a wafer box for drying. At this time, the wafer box and the wafer need to be dried together. The wafer box is usually difficult to dry. In this patent, since the top of the wafer box has a flange, all drying nozzles are set on the top, which makes it difficult to dry the side of the wafer box. Utility Model Content

[0003] The technical problem to be solved by the utility model is to solve the deficiencies in the prior art and thus provide a wafer drying tank with good drying effect.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A wafer drying tank, comprising:

[0006] A shell having a cavity therein;

[0007] A tank body is arranged in the shell and has a drain port at the bottom. A first jet pipe is arranged in the tank body for spraying nitrogen. A drain port is arranged at the bottom of the tank body for connecting with a gas supply and extraction device to discharge the fluid in the tank body.

[0008] A cover body is hingedly arranged on the outer shell and is used to cover the top of the tank body. A second jet pipe is arranged in the cover body, and the second jet pipe is used to spray a mixed gas of isopropyl alcohol and nitrogen;

[0009] The wafer box support frame is arranged in the tank body and is used to support the wafer box. The outlet of the first air injection pipe is aligned with the outside of the wafer box from the side.

[0010] Preferably, in the wafer drying tank of the utility model, a heating plate is attached to the outer wall of the tank body.

[0011] Preferably, in the wafer drying tank of the utility model, four second air injection pipes are arranged in the cover body.

[0012] Preferably, in the wafer drying tank of the utility model, the cover body is also provided with a gas supply pipe, the second temperature sensor is used to sense the temperature of the gas in the gas supply pipe, the cover body is provided with a gas collecting block, the gas collecting block has a channel connecting the plurality of second injection pipes and the gas supply pipe, and the isopropyl alcohol and nitrogen mixed gas is sprayed out from the second injection pipe through the gas supply pipe.

[0013] Preferably, in the wafer drying tank of the utility model, a tee is provided on the cover body, one end of the tee is connected to the gas supply pipe connected to the gas supply tank, one end is connected to the gas supply pipe connected to the gas collecting block, and one end is a second temperature sensor extending into the gas supply pipe.

[0014] Preferably, in the wafer drying tank of the utility model, a gas-liquid separator is further provided inside the shell, and the gas-liquid separator is connected to the liquid discharge port to separate the gas and liquid flowing out of the liquid discharge port.

[0015] Preferably, the wafer drying tank and wafer box support frame of the utility model include:

[0016] The bottom plate is a hollow rectangle, and a mounting groove is formed on the long side of the bottom plate;

[0017] A top block, mounted in the mounting slot, for supporting the bottom of the wafer box;

[0018] Limit blocks are arranged at the four corners of the bottom plate to limit the positions of the four corners of the wafer box;

[0019] A mounting plate is arranged on the bottom plate and is located above the hollow part, and the middle of the mounting plate is a hollow part;

[0020] The top plates are respectively mounted on both sides of the mounting plate and are used to lift up the wafers in the wafer box.

[0021] Preferably, in the wafer drying tank of the utility model, the top block comprises a top block bottom plate and a top block inclined plate, and the width of the top block inclined plate gradually decreases toward the top end.

[0022] The beneficial effects of the utility model are:

[0023] The wafer drying tank of the utility model has a first jet pipe arranged in the tank body, which is aimed at the side of the wafer box, and a second jet pipe arranged in the cover body sprays a mixed gas of isopropyl alcohol and nitrogen from top to bottom to dry the entire wafer box and the wafers in the wafer box. The side of the wafer box is difficult to dry, so the gas outlet of the first jet pipe is aimed at the wafer box from the side, and the gas outlet of the second jet pipe is aimed at the wafer box from the top, which can enhance the drying effect of the side of the wafer box and improve the drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0025] Figure 1 is a schematic structural diagram of a wafer drying tank according to an embodiment of the present application;

[0026] Figure 2 is a cross-sectional view of a wafer drying tank according to an embodiment of the present application;

[0027] Figure 3 is a sectional stereoscopic view of a wafer drying tank according to an embodiment of the present application;

[0028] Figure 4 is a three-dimensional diagram of gas supply-related components of an embodiment of the present application;

[0029] Figure 5 It is a schematic diagram of the structure in which a shell is hidden in a wafer drying tank in an embodiment of the present application;

[0030] Figure 6 is a three-dimensional diagram of a wafer box support frame according to an embodiment of the present application;

[0031] Figure 7 is a three-dimensional view of the wafer box support frame in another direction of the embodiment of the present application;

[0032] Figure 8 is a top view of a wafer box support frame according to an embodiment of the present application;

[0033] Fig. 9 is a three-dimensional diagram of a wafer box support frame equipped with a wafer box according to an embodiment of the present application;

[0034] The reference numerals in the figure are:

[0035] 1 housing;

[0036] 2. Cover;

[0037] 3 tank body;

[0038] 4 Wafer box support frame;

[0039] 9 Wafer cassette;

[0040] 11 Gas supply tank;

[0041] 12 Gas-liquid separator;

[0042] 21 second jet pipe;

[0043] 22 air supply pipe;

[0044] 23 second temperature sensor;

[0045] 24 gas collection blocks;

[0046] 25 sealing groove;

[0047] 26 hinges;

[0048] 27 tee;

[0049] 31 jet pipe;

[0050] 32 drain port;

[0051] 33 first temperature sensor;

[0052] 34 heating plate;

[0053] 41 base plate;

[0054] 42 top block;

[0055] 43 limit block;

[0056] 44 mounting plate;

[0057] 45 top plate;

[0058] 91 parting line;

[0059] 411 hollow;

[0060] 412 mounting slot;

[0061] 421 top block bottom plate;

[0062] 422 top block inclined plate;

[0063] 441 hollow part;

[0064] 442 Hexagon screw;

[0065] 451 Long waist hole. DETAILED DESCRIPTION

[0066] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0067] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of the present utility model, unless otherwise specified, "multiple" means two or more.

[0068] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0069] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0070] Example

[0071] This embodiment provides a wafer drying tank, such as Figure 1 As shown, including:

[0072] A housing 1 having a cavity therein;

[0073] The tank body 3 is arranged in the housing 1, and has a drain port 32 at the bottom. A first jet pipe 31 is arranged in the tank body 3 for spraying nitrogen. A drain port is arranged at the bottom of the tank body 3 for connecting with a gas supply and extraction device to discharge the fluid in the tank body 3;

[0074] The cover body 2 is hingedly arranged on the housing 1 (through the hinge 26), and is used to cover the top of the tank body 3. A second injection pipe 21 is arranged in the cover body 2, and the second injection pipe 21 is used to inject a mixed gas of isopropyl alcohol and nitrogen;

[0075] The wafer box support frame 4 is arranged in the tank body 3 and is used to support the wafer box. The outlet of the first air jet 31 is aligned with the outside of the wafer box from the side (preferably by adjusting the setting height and outlet direction of the air jet 31 to align with the mold line 91).

[0076] In the wafer drying tank of this embodiment, a first jet pipe 31 is arranged in the tank body 3, which is aimed at the side of the wafer box, and a second jet pipe 21 arranged in the cover body 2 sprays a mixed gas of isopropyl alcohol and nitrogen from top to bottom to dry the entire wafer box and the wafers in the wafer box. The side of the wafer box is difficult to dry, so the gas outlet of the first jet pipe 31 is aimed at the wafer box from the side, and the gas outlet of the second jet pipe 21 is aimed at the wafer box from the top, which can enhance the drying effect of the side of the wafer box and improve the drying efficiency.

[0077] It is worth mentioning that the parting line refers to the flow or overflow of the wafer box at the joint of the mold during the injection molding process, which leaves a visible mark without cutting it off or after cutting off the overflow edge, sometimes called the mold mark or interface line.

[0078] Furthermore, four second air injection pipes 21 are arranged in the cover body 2 .

[0079] Furthermore, a heating sheet 34, such as a silicone heating sheet, is attached to the outer wall of the tank body 3, and is arranged on the front end and the vertical outer walls on both sides of the tank body 3. When the wafer is dried, the temperature in the tank body 3 is adjusted by the heating sheet 34. The temperature control measures the temperature of the tank body 3 by the first temperature sensor 33, and the PLC adjusts the heating power of the heating sheet 34 according to the temperature measured by the first temperature sensor 33, thereby achieving the stability of the temperature in the tank body 3.

[0080] Four second air jets 21 are provided in the cover 2, and the second air jets 21 on both sides are aligned with the parting line 91 on the inner side of the round box. When the wafer box (wafer is loaded in the wafer box) is placed in the cell body 3, first the first air jet 31 and the second air jets 21 on both sides spray normal temperature nitrogen, first the large particle liquid on the wafer box is blown off or the size of the large particle liquid is reduced, the air in the cell body 3 is emptied simultaneously, that is, the wafer box is dried in advance, because the drying of the wafer box is usually difficult, first drying the wafer box can make the drying of the wafer box and the wafer synchronized, and then the second air jet 21 sprays isopropyl alcohol and nitrogen mixed gas to dry the wafer. Due to the inflammable and explosive characteristics of isopropyl alcohol, it is necessary to empty the air of the cell body 3, and at the same time, it is not suitable to be in a higher temperature when isopropyl alcohol just enters the cell body 3, so normal temperature nitrogen is used to blow.

[0081] Furthermore, the cover body 2 is also provided with an air supply pipe 22, and the second temperature sensor 23 is used to sense the temperature of the gas in the air supply pipe 22. The cover body 2 is provided with an air collecting block 24, and the air collecting block 24 has a channel connecting the plurality of second injection pipes 21 and the air supply pipe 22, and the isopropyl alcohol and nitrogen mixed gas is ejected from the second injection pipe 21 through the air supply pipe 22. Figure 4 As shown in FIG. 1 , there are four second injection pipes 21 , and the mixed gas of isopropyl alcohol and nitrogen first enters the gas collecting block 24 , and the four second injection pipes 21 are uniformly connected to the gas collecting block 24 .

[0082] Furthermore, the top of the tank body 3 has a sealing groove 25, and a sealing ring is arranged in the sealing groove 25 to cooperate with the cover body 2 to seal the gap between the tank body 3 and the cover body 2. By providing the above-mentioned closed structure, IPA is prevented from diffusing out of the tank body 3.

[0083] Furthermore, a tee 27 is provided on the cover body 2, one end of the tee 27 is connected to the gas supply pipe connected to the gas supply tank 11, one end is connected to the gas supply pipe connected to the gas collecting block 24, and one end is provided with a second temperature sensor 23 extending into the gas supply pipe. The gas supply pipe connected to the gas supply tank 11 passes through the hollow at the top of the shell 1 and is connected to the gas supply tank in the shell 1. Figure 4 The air supply pipe connected to the air supply tank is omitted.

[0084] Furthermore, a gas-liquid separator 12 is provided inside the housing 1 , and the gas-liquid separator 12 is connected to the liquid discharge port 32 , and is used for separating the gas and liquid flowing out of the liquid discharge port 32 , and the liquid is usually IPA.

[0085] Furthermore, the wafer box support frame 4 comprises:

[0086] The bottom plate 41 is a rectangle with a hollow 411, and a mounting groove 412 is formed on the long side of the bottom plate 41;

[0087] A top block 42 is installed in the mounting groove 412 and is used to support the bottom of the wafer box 9;

[0088] Limiting blocks 43 are arranged at the four corners of the bottom plate 41 to limit the positions of the four corners of the wafer box 9;

[0089] The mounting plate 44 is disposed on the bottom plate 41 and is located above the hollow portion 411 . The middle of the mounting plate 44 is a hollow portion 441 .

[0090] The top plates 45 are respectively mounted on both sides of the mounting plate 44 and are used to lift up the wafers in the wafer box 9 .

[0091] The wafer box support seat of this embodiment has a mounting groove 412 formed on the bottom plate 41. The setting of the mounting groove 412 is convenient for positioning and installing the top block 42. The top block 42 is used to directly contact the bottom of the wafer box 9 and slightly lift the wafer box 9. Compared with placing the wafer box 9 directly on the bottom plate 41, the contact area with the wafer box 9 can be reduced. The setting of the top plate 45 can slightly lift the wafer in the wafer box 9, so that the bottom of the wafer is separated from direct contact with the wafer box 9, thereby improving the drying effect.

[0092] The hollow part 441 on the mounting plate 44 cooperates with the hollow part 411 to ensure the bottom airflow to improve the drying effect of the wafer box. The top plate 45 is provided with a long waist hole 451 in the vertical direction. The screw passes through the long waist hole 451 to fix the top plate 45 on the mounting plate 44. The height of the top plate 45 can be adjusted by adjusting the position of the screw in the long waist hole 451. The top of the top plate 45 has an inclined surface to reduce the thickness of the top end, thereby reducing the contact area with the wafer.

[0093] Furthermore, both ends of the mounting plate 44 are mounted on the bottom plate 41 by hexagonal screws 442. The stopper block 43 is L-shaped. There are four mounting slots 412 and top blocks 42, and the four top blocks 42 are arranged in a rectangular shape. The two corresponding mounting slots 412 located on both sides of the bottom plate 41 are processed by the same milling cutter, so that the mounting slots 412 are collinear, and the processing of the four mounting slots 412 can be completed by two milling cutter processes, which is convenient for processing, and the positions of the mounting slots 412 correspond to each other.

[0094] Furthermore, the top block 42 includes a top block bottom plate 421 and a top block inclined plate 422 , and the width of the top block inclined plate 422 gradually decreases toward the top end, thereby reducing the contact area with the wafer box.

[0095] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer drying tank, characterized in that: include: A housing (1) having a cavity therein; A tank body (3) is arranged in the housing (1) and has a liquid discharge port (32) at the bottom. A first gas injection pipe (31) is arranged in the tank body (3) for spraying nitrogen. A liquid discharge port is arranged at the bottom of the tank body (3) for connecting to a gas supply and extraction device to discharge the fluid in the tank body (3); A cover body (2) is hingedly arranged on the outer shell (1) and is used to cover the top of the tank body (3). A second injection pipe (21) is arranged in the cover body (2), and the second injection pipe (21) is used to inject a mixed gas of isopropyl alcohol and nitrogen; The wafer box support frame (4) is arranged in the tank body (3) and is used to support the wafer box. The outlet of the first air injection pipe (31) is aligned with the outside of the wafer box from the side.

2. The wafer drying tank according to claim 1, characterized in that: A heating plate (34) is attached to the outer wall of the tank body (3).

3. The wafer drying tank according to claim 1, characterized in that: Four second air injection pipes (21) are arranged inside the cover body (2).

4. The wafer drying tank according to claim 3, characterized in that: The cover body (2) is also provided with an air supply pipe (22), and the second temperature sensor (23) is used to sense the temperature of the gas in the air supply pipe (22). The cover body (2) is provided with an air collecting block (24), and the air collecting block (24) has a channel connecting the plurality of second injection pipes (21) and the air supply pipe (22). The isopropyl alcohol and nitrogen mixed gas is sprayed out from the second injection pipe (21) through the air supply pipe (22).

5. The wafer drying tank according to claim 1, characterized in that: The cover body (2) is provided with a tee (27), one end of the tee (27) is connected to the air supply pipe connected to the air supply tank (11), one end is connected to the air supply pipe connected to the air collecting block (24), and one end is provided with a second temperature sensor (23) extending into the air supply pipe.

6. The wafer drying tank according to claim 1, characterized in that: A gas-liquid separator (12) is also provided inside the housing (1), and the gas-liquid separator (12) is connected to the liquid discharge port (32) and is used to separate the gas and liquid flowing out of the liquid discharge port (32).

7. The wafer drying tank according to claim 1, characterized in that: The wafer box support frame (4) comprises: The bottom plate (41) is a rectangular shape with a hollow center (411), and a mounting groove (412) is formed on the long side of the bottom plate (41); A top block (42) is installed in the installation groove (412) and is used to support the bottom of the wafer box (9); Limiting blocks (43) are arranged at the four corners of the bottom plate (41) and are used to limit the positions of the four corners of the wafer box (9); A mounting plate (44) is arranged on the bottom plate (41) and is located above the hollow portion (411); the middle of the mounting plate (44) is a hollow portion (441); The top plate (45) is respectively mounted on both sides of the mounting plate (44) and is used to lift up the wafers in the wafer box (9).

8. The wafer drying tank according to claim 7, characterized in that: The top block (42) comprises a top block bottom plate (421) and a top block inclined plate (422), and the width of the top block inclined plate (422) gradually decreases toward the top end.

Images