Cover body structure of lifting drying equipment

Abstract

The utility model relates to a lifting drying equipment cover body structure, and belongs to the technical field of wafer drying equipment.The lifting drying equipment cover body structure is characterized in that a supporting block is arranged in a cover body, the supporting block is driven by a driving piece to have a release state and a fixed state, and when the supporting block is in the release state, the supporting block is fixed; the wafer limiting grooves in the supporting block and the positioning block are collinear, at the moment, the wafer lifting mechanism can drive the wafer to be lifted, the wafer sequentially passes through the wafer limiting grooves in the supporting block and the positioning block, and finally the wafer stays at a first position under the supporting of the wafer lifting mechanism; when the supporting blocks are in the fixed state, the supporting blocks on the two sides get close to each other so as to make contact with the bottom of the wafer to support the wafer, the wafer is jacked up, the wafer is separated from the wafer lifting mechanism and fixed to the second position, the height of the second position is larger than that of the first position, and the wafer is separated from the lifting mechanism, so that the wafer is not prone to falling off. The influence of the lifting mechanism on the wafer can be avoided, and the drying effect is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer drying equipment, and in particular, relates to a cover structure of a pulling and drying equipment. Background Art

[0002] The Czochralski drying equipment is a common drying equipment in wafer production equipment. Its common structure can be found in Chinese patent document CN116682756A, including:

[0003] The tank body is used to accommodate and clean the wafers.

[0004] The cover body is arranged above the trough body and can reach or leave the opening of the trough body under the drive of the translation mechanism. A wafer guide groove is arranged on the inner wall of the cover body. When the cover body leaves the opening of the trough body, the wafer can be inserted into the trough body or taken out of the trough body by a robot.

[0005] The water and gas supply system is used to supply cleaning water to the tank body and dry gas to the cover body.

[0006] The wafer lifting mechanism is used to drive the wafer to do lifting and lowering movement. The wafer is now cleaned in the tank. After cleaning, the wafer is separated from the wafer box during the lifting process and sent into the cover along the wafer guide groove. At this time, the cover should be aligned with the opening of the tank. Of course, it should be pointed out that some equipment does not use a wafer box to hold the wafer, and the wafer is placed directly on the support structure.

[0007] However, in this document, the wafer still needs to be supported by the support base of the wafer lifting mechanism. The contact point between the support base and the wafer is located at the lowest point of the wafer, which is easy to collect liquid, making it difficult to fully dry the wafer. Utility Model Content

[0008] The technical problem to be solved by the utility model is to solve the deficiencies in the prior art and thus provide a lifting, cleaning and drying equipment cover structure with good drying effect.

[0009] The technical solution adopted by the utility model to solve its technical problems is:

[0010] A cover structure of a pulling and drying device, comprising:

[0011] The side panels and the top cover, the inner walls of the side panels on both sides are provided with support blocks and positioning blocks, the support blocks are driven by the driving member and have a release state and a fixed state, when the support blocks are in the release state, the wafer limiting grooves on the support blocks and the positioning blocks are in line, at this time, the wafer lifting mechanism can drive the wafer to lift, passing through the wafer limiting grooves on the support blocks and the positioning blocks in turn, and finally the wafer stays at the first position under the support of the wafer lifting mechanism; when the support blocks are in the fixed state, the support blocks on both sides approach each other so as to contact with the bottom of the wafer to support the wafer, the wafer is separated from the wafer lifting mechanism, and is fixed at the second position, and the height of the second position is higher than the height of the first position.

[0012] Preferably, in the cover structure of the pulling and drying equipment of the present invention, the support blocks are driven to rotate by the rotary drive member, so that the bottoms of the support blocks are close to each other.

[0013] Preferably, in the cover structure of the lifting and drying equipment of the present invention, the rotary drive member is located outside the cover and connected to the rotating shaft through a connecting rod, and the rotary drive member and the connecting rod are located in a protective shell at the rear end of the cover.

[0014] Preferably, in the cover structure of the lifting and drying equipment of the utility model, a guide block is further provided below the support block, and when the support block is in a released state, the guide block is colinear with the wafer limiting groove on the support block.

[0015] Preferably, in the cover structure of the pulling and drying equipment of the utility model, the top cover is a cylindrical surface, and an air jet pipe is also arranged inside the top cover.

[0016] Preferably, in the cover structure of the lifting and drying equipment of the utility model, air jet pipes are provided above the positioning block and below the guide block.

[0017] Preferably, in the cover structure of the lifting and drying equipment of the utility model, the air outlet of the air jet pipe above the positioning block is aligned with the wafer limiting groove on the positioning block; and the air outlet of the air jet pipe below the guide block is arranged in the horizontal direction.

[0018] Preferably, in the cover structure of the pulling and drying equipment of the utility model, the bottom width of the wafer limiting grooves on the guide block, the support block and the positioning block is greater than the width in the middle position.

[0019] The beneficial effects of the utility model are:

[0020] The cover structure of the lifting and drying equipment of the present application is provided with a support block in the cover body, and the support block is driven by a driving member and has a release state and a fixed state. When the support block is in the release state, the wafer limiting grooves on the support block and the positioning block are in line. At this time, the wafer lifting mechanism can drive the wafer to lift, and pass through the wafer limiting grooves on the support block and the positioning block in sequence, and finally the wafer stays at the first position under the support of the wafer lifting mechanism; when the support block is in the fixed state, the support blocks on both sides are close to each other so as to contact with the bottom of the wafer to support the wafer, lift the wafer, and the wafer is separated from the wafer lifting mechanism and fixed at the second position. The height of the second position is higher than the height of the first position. Since the wafer is separated from the lifting mechanism, the influence of the lifting mechanism on the wafer can be avoided, thereby improving the drying effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 It is a structural schematic diagram of the tank body of an embodiment of the present application;

[0023] Figure 2 is a three-dimensional cross-sectional view of the cover structure of the pulling and drying equipment according to an embodiment of the present application;

[0024] Figure 3 It is a rear stereoscopic view of the cover structure of the pulling and drying equipment in the embodiment of the present application (the front cover of the protective shell is hidden);

[0025] Figure 4 is a longitudinal sectional view of the cover structure of the pulling and drying equipment according to an embodiment of the present application;

[0026] The reference numerals in the figure are:

[0027] 100 tank;

[0028] 200 cover;

[0029] 201 top cover;

[0030] 202 side panels;

[0031] 210 guide block;

[0032] 220 support block;

[0033] 221 Rotating drive member;

[0034] 222 connecting rod;

[0035] 223 protective shell;

[0036] 230 positioning block;

[0037] 240 jet pipe;

[0038] 300 Lifting mechanism. DETAILED DESCRIPTION

[0039] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of the present utility model, unless otherwise specified, "multiple" means two or more.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0042] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0043] Example

[0044] This embodiment provides a cover structure of a pulling and drying device, such as Figure 2 As shown, including:

[0045] It includes a side plate 202 and a top cover 201, and the inner walls of the side plates 202 on both sides are provided with support blocks 220 and positioning blocks 230. The support blocks 220 are driven by a driving member and have a release state and a fixed state. When the support block 220 is in the release state, the wafer limiting grooves on the support block 220 and the positioning block 230 are in line. At this time, the wafer lifting mechanism 300 can drive the wafer to lift, and pass through the wafer limiting grooves on the support block 220 and the positioning block 230 in turn, and finally the wafer stays at the first position under the support of the wafer lifting mechanism 300; when the support block 220 is in the fixed state, the support blocks 220 on both sides approach each other so as to contact with the bottom of the wafer to support the wafer, and the wafer is separated from the wafer lifting mechanism 300 and is fixed at the second position, and the height of the second position is higher than the height of the first position.

[0046] The cover structure of the lifting and drying equipment of this embodiment is provided with a support block 220 in the cover 200. The support block 220 is driven by a driving member and has a release state and a fixed state. When the support block 220 is in the release state, the wafer limiting grooves on the support block 220 and the positioning block 230 are in line. At this time, the wafer lifting mechanism 300 can drive the wafer to lift, and pass through the wafer limiting grooves on the support block 220 and the positioning block 230 in turn, and finally the wafer stays at the first position under the support of the wafer lifting mechanism 300; when the support block 220 is in the fixed state, the support blocks 220 on both sides are close to each other so as to contact with the bottom of the wafer to support the wafer, lift the wafer, and the wafer is separated from the wafer lifting mechanism 300 and fixed at the second position. The height of the second position is higher than the height of the first position. Since the wafer is separated from the lifting mechanism 300, the influence of the lifting mechanism 300 on the wafer can be avoided, thereby improving the drying effect.

[0047] The lifting and drying equipment used in the cover structure of the present application also includes:

[0048] The tank body 100, such as Figure 1 As shown, it is used to accommodate wafers;

[0049] The cover 200, such as Figure 2 As shown, it is arranged above the tank body 100 and can reach or leave the opening of the tank body 100 driven by the translation mechanism; the cover body 200 is the cover body structure of the lifting and drying equipment of this embodiment;

[0050] The wafer lifting mechanism 300 is used to lift the wafer in the trough body 100 into the cover body 200 or to lower the wafer in the cover body 200 into the trough body 100 .

[0051] Furthermore, when the support block 220 is in the first position, the drying is performed for a first preset time, and when the rotating support block 220 is in the second position, the drying is performed for a second preset time. Since the contact position between the wafer and the wafer lifting mechanism 300 and the contact position between the wafer and the rotating support block 220 are different in the first position and the second position, a better drying effect can be achieved.

[0052] Furthermore, the support block 220 is driven to rotate by the rotary drive member 221, so that the bottoms of the support blocks 220 are close to each other, and the support block 220 rotates around the rotation axis. The rotary drive member 221 is located outside the cover body 200 and is connected to the rotation axis through a connecting rod 222. Figure 3 As shown, the rotary driving member 221 and the connecting rod 222 are located in a protective shell 223 at the rear end of the cover body 200, and the protective shell 233 plays a role in preventing dust and moisture.

[0053] Furthermore, a guide block 210 is provided below the support block 220. When the support block 220 is in the release state, the guide block 210 is collinear with the wafer limiting grooves on the support block 220 (the number of wafer limiting grooves is consistent with the number of wafers processed each time, and the collinearity here refers to a one-to-one corresponding collinearity). The guide block 210 plays a guiding role, so that the wafer can easily slide into the support block 220 and the positioning block 230. The two ends of the rotating support block 220 are fixed by bearings.

[0054] Furthermore, the top cover 201 is a cylindrical surface, and a gas injection pipe 240 is further provided in the top cover 201. The gas injection pipe 240 is used to inject heated gas to dry the wafer. The semicircular top cover 201 is more in line with the shape of the wafer.

[0055] The spray pipe 240 may spray dry hot nitrogen or isopropyl alcohol.

[0056] Furthermore, an air jet 240 is also provided above the positioning block 230 and below the guide block 210. Figure 4 As shown, there are six air injection pipes 240, which are located above the wafer, at the upper left, upper right, lower left and lower right. Multiple air injection pipes 240 can speed up the drying of the wafer and improve the drying efficiency. All the air injection pipes 240 will be collected outside the cover 200 and connected to the air supply device.

[0057] Furthermore, if Figure 4 The arrow direction → shown indicates a specific implementation of the air outlet of the jet pipe 240, the air outlet of the jet pipe 240 above the positioning block 230 is aligned with the wafer limiting groove on the positioning block 230 (at least one group of air outlets is vertically downward); the air outlet of the jet pipe 240 below the guide block 210 is arranged in the horizontal direction.

[0058] Since the wafer limiting grooves of the guide block 210, the support block 220 and the positioning block 230 are in the same line, the gas sprayed from the air injection pipe 240 above the positioning block 230 can be blown into the wafer limiting groove, thereby improving the drying effect.

[0059] Furthermore, the bottom width of the wafer limiting grooves on the guide block 210 , the support block 220 and the positioning block 230 is greater than the width in the middle to facilitate the wafer to enter the wafer limiting grooves.

[0060] It should be noted that, similar to the background art, the wafer can be cleaned in the trough body 100 . When in the trough body 100 , the wafer can be placed in a wafer box or directly supported by the wafer lifting mechanism 300 .

[0061] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A cover structure of a pulling and drying equipment, characterized in that: include: The invention comprises a side plate (202) and a top cover (201), wherein the inner walls of the side plates (202) on both sides are provided with support blocks (220) and positioning blocks (230), wherein the support blocks (220) are driven by a driving member and have a release state and a fixed state, and when the support block (220) is in the release state, the wafer limiting grooves on the support block (220) and the positioning block (230) are collinear, and at this time, the wafer lifting mechanism (300) can drive the wafer to lift, and the wafer passes through the wafer limiting grooves on the support block (220) and the positioning block (230) in sequence, and finally the wafer stays at a first position under the support of the wafer lifting mechanism (300); when the support block (220) is in the fixed state, the support blocks (220) on both sides are close to each other so as to contact with the bottom of the wafer to support the wafer, and the wafer is separated from the wafer lifting mechanism (300) and fixed at a second position, and the height of the second position is higher than the height of the first position.

2. The cover structure of the pulling and drying equipment according to claim 1, characterized in that: The support blocks (220) are driven to rotate by the rotary drive member (221), so that the bottoms of the support blocks (220) are brought closer to each other.

3. The cover structure of the pulling and drying equipment according to claim 2, characterized in that: The rotary drive member (221) is located outside the cover body (200) and is connected to the rotating shaft via a connecting rod (222). The rotary drive member (221) and the connecting rod (222) are located in a protective shell (223) at the rear end of the cover body (200).

4. The cover structure of the pulling and drying equipment according to claim 1, characterized in that: A guide block (210) is also provided below the support block (220); when the support block (220) is in a released state, the guide block (210) is colinear with the wafer limiting groove on the support block (220).

5. The cover structure of the pulling and drying equipment according to claim 1, characterized in that: The top cover (201) is a cylindrical surface, and an air injection pipe (240) is also provided inside the top cover (201).

6. The cover structure of the pulling and drying equipment according to claim 4, characterized in that: An air jet pipe (240) is provided above the positioning block (230) and below the guide block (210).

7. The cover structure of the pulling and drying equipment according to claim 6, characterized in that: The gas outlet of the gas jet pipe (240) above the positioning block (230) is aligned with the wafer limiting groove on the positioning block (230); and the gas outlet of the gas jet pipe (240) below the guide block (210) is arranged in the horizontal direction.

8. The cover structure of the pulling and drying equipment according to claim 4, characterized in that: The width of the bottom of the wafer limiting groove on the guide block (210), the support block (220) and the positioning block (230) is greater than the width at the middle position.

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