Display card device

By setting up a fan connector integration mechanism on the heat dissipation module of the display card device and setting up a fan terminal socket on the main circuit board, the automatic connection between the fan and the heat dissipation module is achieved, solving the problem of low connection efficiency in automated assembly and improving Productivity and reduced costs.

CN222482680UActive Publication Date: 2025-02-14ANHUI WEI-HONG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421291254.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2023-12-15
Filing Date
2024-06-06
Publication Date
2025-02-14
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

In the process of automatically assembling the display card, it is difficult for the prior art to efficiently realize the automatic connection between the fan and the heat dissipation module, resulting in low production efficiency and high cost.

Method used

A display card device is designed, in which a fan connector integration mechanism is provided on the heat dissipation module, and a fan terminal socket is provided in the corresponding position of the main circuit board, and an automatic connection is achieved through alignment and insertion of the terminal plug and the fan terminal socket.

Benefits of technology

This design greatly improves the efficiency of automated assembly, reduces manual operation and tool use, saves time and labor costs, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

A display card device comprises a main circuit board and a heat dissipation module. The main circuit board is provided with a fan terminal socket. The heat dissipation module is provided with a plurality of fans and a fan connector integration mechanism, wherein the position of a terminal plug of the fan connector integration mechanism on the heat dissipation module is aligned with the position of the fan terminal socket on the main circuit board. According to the connection structure, the efficiency of automatic assembly can be improved, and the terminal plug of the fan connector integration mechanism can be easily coupled and fixed with the fan terminal socket, so that additional tools or manual operation is not needed.
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Description

Technical Field

[0001] The invention relates to a display card device, in particular to a display card device which is conducive to automatic assembly. Background Art

[0002] An independent graphics card is a dedicated graphics processing device in a computer that provides efficient graphics processing performance and is suitable for applications such as gaming, video editing, and 3D design. Because high-performance processors generate a lot of heat, their cooling requirements are usually high, and an effective cooling system is required to maintain stable operation. The cooling system usually includes a cooling fan and a heat sink, and some may also include a dedicated heat pipe or liquid cooling system.

[0003] In response to the automated assembly process of graphics cards, the manufacturing of graphics cards needs to be optimized to improve production efficiency and reduce manufacturing costs. During the automated assembly process, testing and quality control of graphics cards are also crucial to ensure that each component meets the specifications and can operate normally. Therefore, the manufacturing of automated assembly graphics cards needs to focus on technological innovation, production efficiency and quality management. Utility Model Content

[0004] The present invention provides a display card device to solve the problems of the prior art.

[0005] According to some embodiments of the present invention, a display card device includes a main circuit board and a heat dissipation module. The main circuit board has a fan terminal socket. The heat dissipation module has a plurality of fans and a fan connector integration mechanism, wherein a terminal plug of the fan connector integration mechanism is aligned at a position of the heat dissipation module with a position of the fan terminal socket on the main circuit board.

[0006] According to some embodiments of the present invention, the terminal plug is inserted into the fan terminal socket.

[0007] According to some embodiments of the present invention, the fan connector integration mechanism includes a plate body, a support column and at least one terminal plug, wherein at least one terminal plug is located on the plate body, and the support column is located on the plate body and adjacent to one side of at least one terminal plug.

[0008] According to some embodiments of the present invention, the main circuit board has a locking hole aligned with the supporting column.

[0009] According to some embodiments of the present invention, the display card device further includes a locking screw, and the locking screw passes through the locking hole and is locked into the supporting column.

[0010] According to some embodiments of the present invention, the fan connector integration mechanism further includes a plurality of wires connected between the terminal plug and the fan.

[0011] According to some embodiments of the present invention, the heat dissipation module further includes a heat dissipation fin module, and the plate body of the fan connector integration mechanism is fixed on the heat dissipation fin module.

[0012] According to some embodiments of the present invention, the display card device further includes a light emitting module board and a back support board, wherein the light emitting module board is located between the main circuit board and the back support board.

[0013] According to some embodiments of the present invention, the terminal plug is a spring contact pin connector, the fan terminal socket is a contact, and the spring contact pin connector contacts the contact.

[0014] According to some embodiments of the present invention, the back support plate includes a light-transmitting hollow pattern, and the light-transmitting hollow pattern is aligned with the light-emitting module plate.

[0015] In summary, the new display card device that is conducive to automated assembly has a fan connector integration mechanism on the heat dissipation module and a fan terminal socket on the corresponding position of the main circuit board. This connection structure will increase the efficiency of automated assembly because the terminal plug of the fan connector integration mechanism can be easily coupled and fixed with the fan terminal socket without the need for additional tools or manual operation. Such a design can save time and labor costs and improve production efficiency.

[0016] The above description will be described in detail below with an implementation method, and a further explanation of the technical solution of the present invention will be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0018] Figure 1 is a three-dimensional diagram illustrating a display card device of the present invention from a first viewing angle;

[0019] Figure 2 is a three-dimensional diagram illustrating a display card device of the present invention from a second viewing angle;

[0020] Figure 3 It is shown Figure 2 The display card device is in a state where the back support plate is removed;

[0021] Figure 4 is a three-dimensional diagram illustrating a heat dissipation module of the display card device of the present invention;

[0022] Figure 5 is a three-dimensional diagram showing the main circuit board and the back support plate of the display card device of the present invention;

[0023] Figure 6is a three-dimensional diagram showing the electrical connection structure of the main circuit board and the heat dissipation module of the present invention; and

[0024] Figure 7 The diagram is an exploded view showing the electrical connection structure of the main circuit board and the heat dissipation module of the present invention.

[0025] The reference numerals are described as follows:

[0026] 100: Display card device

[0027] 110: Heat dissipation module

[0028] 110a: Fan

[0029] 110b: heat sink module

[0030] 110c: Heat pipe

[0031] 112: Heat conduction plate

[0032] 112a: Display chip bonding part

[0033] 112b: Memory chip bonding unit

[0034] 114: Fan connector integration mechanism

[0035] 114a: Terminal plug

[0036] 114b: Plate

[0037] 114c: Wire

[0038] 114d: Support column

[0039] 146: Light-emitting module board

[0040] 148: Main circuit board

[0041] 148a: Display output connector

[0042] 148b: Gold Finger Connector

[0043] 148c: Fan terminal socket

[0044] 148e: Keyhole

[0045] 149a: Display core chip

[0046] 149b: Memory chip

[0047] 149c: Electronic components

[0048] 150: Back support plate

[0049] 150a: Translucent hollow pattern

[0050] 150b: airflow hollow

[0051] 151: Locking screw

[0052] 152: Back frame

[0053] 152a: Locking hardware DETAILED DESCRIPTION

[0054] In order to make the description of the present invention more detailed and complete, reference may be made to the attached drawings and various embodiments described below, in which the same numbers represent the same or similar elements. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessary limitations on the present invention. In the embodiments and claims, unless the text specifically defines the article, "a", "an" and "the" may refer to a single or multiple.

[0055] Please also refer to Figure 1 , Figure 2 , which depicts a stereoscopic view of the display card device of the present invention from two different perspectives. The display card device 100 includes a main circuit board 148, a back support plate 150 and a heat dissipation module 110. The main circuit board 148 has a display core chip (not shown), a memory chip (not shown) and a power supply element (not shown). The display core chip is the core element of the display card, responsible for processing the calculation and rendering of graphics and images. The memory chip is a memory used to store graphic data and intermediate calculation results, usually a high-speed GDDR (Graphics Double Data Rate) memory. The power supply element includes capacitors, inductors and voltage regulators, which are used to provide stable power to various parts of the display card. The heat dissipation module 110 includes multiple fans 110a, heat dissipation fin modules 110b and heat pipes 110c, etc., which are used to cool the display core chip, memory chip and power supply element to ensure that they maintain a normal temperature during operation. The heat sink fin module 110b and the heat pipe 110c are passive heat sink components, and the fan 110a is an active heat sink component, which cooperates with the passive heat sink components to increase the heat sink efficiency of the display card device as a whole. In some embodiments of the present invention, the three fans 110a in the figure are all axial flow fans, which are used to guide the airflow to the heat sink fin module 110b.

[0056] In some embodiments of the present invention, the front end of the main circuit board 148 is also equipped with a display output connector 148a, such as an HDMI, DisplayPort or DVI connector, etc., for connecting a display and other external devices.

[0057] In some embodiments of the present invention, the bottom of the main circuit board 148 is also equipped with a gold finger connector 148b, which is the interface between the display card and the computer motherboard, and is responsible for transmitting data and power. When the gold finger connector 148b is damaged or dirty, it may cause poor connection or malfunction.

[0058] In some embodiments of the present invention, the main circuit board 148 is also equipped with an additional power connector to provide more power to meet the power requirements of the display card device during high-power operation. The heat dissipation module 110 is arranged on one side of the main circuit board 148, and the back support plate 150 is arranged on the other opposite side of the main circuit board 148. The back support plate 150 is equipped with a back frame 152 to strengthen the uniform force on the display core chip. The position of the back frame 152 corresponds to the position of the display core chip on the other side of the main circuit board 148. The heat dissipation module 110 is locked through the main circuit board 148 by multiple locking members 152a of the back frame 152, thereby strengthening the uniform force on the display core chip and ensuring that the heat dissipation module can effectively fit the display core chip to provide better heat dissipation effect. In some embodiments of the present invention, multiple locking members 152a can be used in conjunction with springs of the same specification (elastic force) to ensure uniform force on the display core chip.

[0059] Please refer to Figure 2 , Figure 3 , Figure 3 Draw Figure 2 The display card device 100 is in a state where the back support plate 150 is removed. When the display card device 100 removes the back support plate 150, the back side of the main circuit board 148 and the light-emitting module board 146 are exposed. In some embodiments of the present invention, the back support plate 150 has a light-transmitting hollow pattern 150a, which cooperates with the corresponding light-emitting module board 146 to produce the required light and shadow effects. For example, the light-emitting module board 146 uses an LED light bar or other light source, which is installed behind the light-emitting module board 146 to form a light-emitting pattern, and produces light and shadow effects through the light-transmitting hollow pattern 150a. Adjusting the brightness and color of the light-emitting module board 146 can also change the light and shadow effects. In some embodiments of the present invention, the light-emitting module board 146 is located between the main circuit board 148 and the back support plate 150.

[0060] In some embodiments of the present invention, the horizontal length of the back support plate 150 is approximately equal to the horizontal length of the heat dissipation module 110 and is greater than the horizontal length of the main circuit board 148. In some embodiments of the present invention, the portion of the back support plate 150 that exceeds the main circuit board 148 has an airflow hollow 150b design, so that the airflow generated by the fan 110a can more easily pass through the heat dissipation fin module 110b at the hollow position of the back support plate to improve the heat dissipation efficiency.

[0061] Please refer to Figure 4, which depicts a three-dimensional diagram of the heat dissipation module 110 of the display card device of the present invention. The heat dissipation module 110 includes a heat conducting plate 112, a heat dissipation fin module 110b, a heat pipe 110c, and a fan connector integration mechanism 114 on this side. The heat conducting plate 112 is an important component of the heat dissipation module, and its main function is to evenly transfer heat to the heat dissipation fin module 110b and the heat pipe 110c. The heat conducting plate 112 directly contacts the display core chip and other heat sources to ensure that the heat is effectively dispersed and conducted. The heat dissipation fin module 110b is thermally coupled to the top of the heat conducting plate 112, and its design allows air to effectively flow through the fins to take away the heat. The increased surface area of ​​the fins helps to accelerate the dissipation of heat, thereby improving the heat dissipation efficiency. The heat pipe 110c is connected in series with the heat dissipation fin module 110b, and is a heat conduction device that can effectively transfer heat from one place to another. In the heat dissipation module 110, the heat pipe is thermally coupled to the heat conducting plate 112 and the heat dissipation fin module 110b so as to quickly transfer the heat from the heat source to the fins for heat dissipation. The heat dissipation module 110 effectively dissipates the heat from the display core chip, the memory chip and the power supply element through the synergistic effect of the heat conducting plate 112, the heat dissipation fin module 110b, the heat pipe 110c and other components, and cooperates with the fan 110a of the active heat dissipation element to ensure that it maintains a normal temperature during operation, thereby ensuring the stable operation of the display card device.

[0062] In some embodiments of the present invention, the heat conducting plate 112 includes a display chip bonding portion 112a and a memory chip bonding portion 112b. The display chip bonding portion 112a and the memory chip bonding portion 112b are thermally coupled to the display core chip and the memory chip, respectively. The heat conducting plate 112 is made of a material with good thermal conductivity, such as copper or aluminum. These materials can quickly transfer heat from the surface of the chip to the entire heat conducting plate, thereby evenly dissipating the heat. In some embodiments of the present invention, the heat conducting plate 112 can be a temperature balancing plate, and the temperature balancing plate has a capillary structure. The display chip bonding portion 112a and the memory chip bonding portion 112b are tightly attached to the corresponding chips to form good contact. This kind of bonding contact helps to maximize the efficiency of heat conduction and ensure that heat can be quickly transferred from the chip to the heat conducting plate. This helps to prevent the formation of hot spots and ensure that heat can be effectively dissipated. The fan connector integration mechanism 114 is connected to the fan 110a (refer to Figure 1 ) as an electrical connection interface with the main circuit board 148.

[0063] Please refer to Figure 5, which depicts a three-dimensional diagram of the main circuit board 148 and the back support plate 150 of the display card device of the present invention. The main circuit board 148 has heating elements such as a display core chip 149a, a memory chip 149b and other electronic components 149c. When the heat dissipation module 110 is combined with the main circuit board 148, the display chip bonding portion 112a and the memory chip bonding portion 112b of the heat conducting plate 112 are thermally coupled to the display core chip 149a and the memory chip 149b respectively. After the combination, the heat dissipation module 110 and the back support plate 150 are respectively located on two opposite sides of the main circuit board 148. Their main function is to provide structural support and reinforcement. The back support plate 150 is used to prevent the main circuit board 148 from deformation or damage. As a part of the structural support, the back support plate 150 can increase the overall rigidity and stability of the main circuit board 148. This helps to reduce the bending or twisting of the main circuit board 148 during use. The back support plate 150 can evenly distribute the pressure or weight from the heat dissipation module 110 to the main circuit board 148, thereby reducing the local pressure on the main circuit board 148 and reducing the risk of deformation or damage. In addition, the back support plate 150 can also play a shockproof role, reducing the impact of external vibration on the main circuit board 148, and further ensuring the stability and reliability of the main circuit board 148 during operation. After the heat dissipation module 110 and the back support plate 150 are combined, the fan terminal socket 148c of the main circuit board 148 can be inserted into the terminal plug 114a of the fan connector integration mechanism 114 to achieve electrical connection.

[0064] Please also refer to Figure 6 , Figure 7 , Figure 6 A three-dimensional diagram showing the electrical connection structure of the main circuit board 148 and the heat dissipation module 110 of the present invention is shown. Figure 7 The exploded view of the electrical connection structure of the main circuit board 148 and the heat dissipation module 110 of the present invention is shown. In some embodiments of the present invention, the fan connector integration mechanism 114 includes a plate body 114b, a support column 114d and two terminal plugs 114a, wherein the two terminal plugs 114a are located on the plate body 114b, and the support column 114d is located on the plate body 114b and between the two terminal plugs 114a. In other embodiments of the present invention, if there is only a single terminal plug 114a on the plate body 114b, the support column 114d can be adjacent to one side of the terminal plug 114a. The fan connector integration mechanism 114 also includes a plurality of wires 114c, which are connected between the terminal plug 114a and the fan 110a. The plate body 114b is locked on the heat dissipation fin module 110b, so that the fan connector integration mechanism 114 is fixed on the heat dissipation module 110.

[0065] In some embodiments of the present invention, the main circuit board 148 has a locking hole 148e aligned with the support column 114d of the fan connector integration mechanism 114. The locking screw 151 passes through the locking hole 148e and is locked into the support column 114d, thereby fixing the terminal plug 114a and the fan terminal socket 148c to achieve electrical connection. In other embodiments of the present invention, the terminal plug 114a can be a spring contact pin connector, and the fan terminal socket 148c can be a contact point, and the electrical connection is achieved by the spring contact pin connector contacting the contact point.

[0066] The new display card device that is convenient for automated assembly has a fan connector integration mechanism on the heat dissipation module and a fan terminal socket on the corresponding position of the main circuit board. This electrical connection structure increases the efficiency of automated assembly because the terminal plug of the fan connector integration mechanism can be easily coupled and fixed with the fan terminal socket without the need for additional tools or manual operation. Such a design can save time and labor costs and improve production efficiency.

[0067] Although the present invention has been disclosed in the form of implementation methods as described above, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the following claims.

Claims

1. A display card device, characterized in that: Include: a main circuit board having a fan terminal socket; and A heat dissipation module has a plurality of fans and a fan connector integration mechanism, wherein a terminal plug of the fan connector integration mechanism is aligned at the position of the heat dissipation module with the fan terminal socket at the position of the main circuit board.

2. The display card device according to claim 1, wherein: The terminal plug is inserted into the fan terminal socket.

3. The display card device according to claim 1, wherein: The fan connector integration mechanism comprises a plate body, a support column and at least one terminal plug, wherein at least one terminal plug is located on the plate body, and the support column is located on the plate body and adjacent to one side of at least one terminal plug.

4. The display card device according to claim 3, characterized in that: The main circuit board has a locking hole aligned with the supporting column.

5. The display card device according to claim 4, characterized in that: The utility model also comprises a locking screw, which passes through the locking hole and is locked into the supporting column.

6. The display card device according to claim 1, wherein: The fan connector integration mechanism also includes a plurality of wires connected between the terminal plug and the fan.

7. The display card device according to claim 3, characterized in that: The heat dissipation module further comprises a heat dissipation fin module, and the plate body of the fan connector integration mechanism is fixed on the heat dissipation fin module.

8. The display card device according to claim 1, wherein: The invention also comprises a light emitting module board and a back supporting board, wherein the light emitting module board is located between the main circuit board and the back supporting board.

9. The display card device according to claim 8, characterized in that: The back support plate comprises a light-transmitting hollow pattern, and the light-transmitting hollow pattern is aligned with the light-emitting module plate.

10. The display card device according to claim 1, wherein: The terminal plug is a spring contact pin connector, the fan terminal socket is a contact point, and the spring contact pin connector contacts the contact point.