Display module and terminal equipment

Abstract

The utility model provides a display module and terminal equipment, the display module comprises a display panel and a driver, the display panel comprises a display part, a bending part and a turnover part, the bending part is connected between the display part and the turnover part, the turnover part is located on one side of the display part in the thickness direction and is arranged opposite to the display part, and the driver is arranged on the turnover part. The folding part comprises a first part and a second part, the first part is connected between the bending part and the second part, the first part comprises a first surface in the thickness direction, the first surface deviates from the display part, the second part comprises a second surface in the thickness direction, the second surface deviates from the display part, and the driver is installed on the second surface of the second part; the second surface is located on the side, facing the display part, of the first surface. The display module is locally thinned, and the thickness bottleneck problem of the display module is solved.

Description

Technical Field

[0001] The present application relates to the technical field of terminal devices, and in particular to a display module and a terminal device. Background Art

[0002] With the development of the times, mobile devices such as mobile phones have become multifunctional portable devices that integrate communication, audio and video, reading, and photography. Reducing the thickness of these devices is a real demand from users. As a key component of terminal devices, the thickness of the display module is also a key factor affecting the overall thickness of the terminal device, which calls for a thinner display module. However, due to the relatively fixed thickness of display modules, there is currently a bottleneck in reducing the thickness of display modules. Utility Model Content

[0003] The purpose of this application is to provide a display module and a terminal device, wherein the display module is partially thinned, thereby solving the thickness bottleneck problem of the display module.

[0004] The present application provides a display module, comprising a display panel and a driver. The display panel comprises a display portion, a bending portion, and a folding portion. The bending portion is connected between the display portion and the folding portion. The folding portion is located on one side of the display portion along a thickness direction and is disposed opposite to the display portion. The folding portion comprises a first portion and a second portion. The first portion is connected between the bending portion and the second portion. The first portion comprises a first surface along the thickness direction, the first surface facing away from the display portion. The second portion comprises a second surface along the thickness direction, the second surface facing away from the display portion. The driver is mounted on the second surface of the second portion.

[0005] The second surface is located on a side of the first surface facing the display portion.

[0006] An embodiment of the present application provides a display module, in which a driver is installed in the second part of the folded part of the display panel. By arranging the second surface of the second part to be located on the side of the first surface of the first part facing the display part, the driver can reuse a part of the thickness space with the first part. Without affecting the overall performance of the display module, the thickness of the display module is locally thinned, thereby solving the thickness bottleneck problem of the display module.

[0007] In addition, by setting the second surface of the second part to be located on the side of the first surface of the first part facing the display part, it can also ensure that the bending radius of the display panel will not be too small, thereby avoiding the problem of the display panel breaking due to the bending radius being too small, thereby ensuring the performance of the display module.

[0008] In one possible embodiment, the display module further includes an intermediate layer, which is disposed between the display portion and the folding portion. Along the thickness direction of the display module, the intermediate layer includes a first supporting layer, a heat dissipation layer, and a cushioning layer. The first supporting layer is disposed on a side of the display portion facing the folding portion, the heat dissipation layer is disposed on a side of the first supporting layer facing away from the display portion, and the cushioning layer is disposed on a side of the heat dissipation layer facing away from the first supporting layer and is disposed opposite the folding portion.

[0009] The raised layer includes a first raised portion and a second raised portion, wherein the first raised portion is arranged opposite to the first portion, and the second raised portion is arranged opposite to the second portion, and the thickness of the second raised portion is less than the thickness of the first raised portion. By setting the thickness of the second raised portion arranged opposite to the second portion to be less than the thickness of the first raised portion, the second surface of the second portion in the folding portion is located on the side of the first surface of the first portion facing the display portion. On the one hand, the thickness of the second raised portion arranged opposite to the driver in the raised layer is reduced, so that the overall thickness of the display module at the driver is reduced, solving the thickness bottleneck problem of the display module, thereby solving the thickness bottleneck problem of the terminal device at the driver position. On the other hand, the thickness of the first raised portion is used to ensure that the bending radius of the display panel will not be too small, thereby avoiding the problem of the display panel breaking at the bending portion due to the too small bending radius, thereby ensuring the performance of the display module.

[0010] In a possible embodiment, the middle layer further includes a second supporting layer, and the second supporting layer is disposed between the raising layer and the folding portion, and is arranged opposite to the folding portion.

[0011] In one possible embodiment, the display module further includes a circuit board, the circuit board is electrically connected to the driver, the heat dissipation layer includes a first heat dissipation portion and a second heat dissipation portion, the first heat dissipation portion is disposed opposite to the circuit board, and the circuit board is connected to a side of the first heat dissipation portion facing away from the display portion;

[0012] Among them, the first heat dissipation part includes a first surface along the thickness direction, the first surface is away from the display part, and the second heat dissipation part includes a second surface along the thickness direction, the second surface is away from the display part, and the second surface is located on the side of the first surface facing the display part. On the one hand, it is achieved that the position of the display module relative to the circuit board is not thinned, which solves the problem of film printing phenomenon that occurs at the position of the display part relative to the circuit board. On the other hand, it is achieved that the middle layer is thinned at the position not connected to the circuit board, thereby achieving local thinning of the thickness of the display module and solving the thickness bottleneck limitation of the display module.

[0013] In a possible implementation manner, the thickness of the second heat dissipation portion is smaller than the thickness of the first heat dissipation portion.

[0014] In a possible embodiment, the display module also includes a circuit board, which is electrically connected to the driver and connected to the side of the intermediate layer away from the display portion. The circuit board includes a first board portion and a second board portion connected to the first board portion. The thickness of the second board portion is less than the thickness of the first board portion, so as to achieve local thinning of the thickness of the circuit board, thereby achieving thinning of the second board portion in the circuit board corresponding to the thickness bottleneck of the display module in the terminal device. On the one hand, it can solve the problem of performance loss after the overall thinning of the circuit board. On the other hand, it achieves local thinning of the display module, and can solve the limitation of the thickness bottleneck of the display module, thereby solving the limitation of the thickness bottleneck of the entire terminal device.

[0015] In a possible embodiment, the display module also includes a circuit board, an electronic device and a back glue layer. The circuit board is electrically connected to the driver and is connected to the side of the intermediate layer facing away from the display unit. The circuit board includes a device area and a non-device area. The electronic device is installed in the device area of ​​the circuit board and is electrically connected to the circuit board. The back glue layer is bonded between the circuit board and the intermediate layer. The back glue layer includes a first back glue part and a second back glue part. The first back glue part is arranged opposite to the device area, and the second back glue part is arranged opposite to the non-device area. The first back glue part includes a first bonding surface along the thickness direction, and the first bonding surface faces away from the display unit. The second back glue part includes a second bonding surface along the thickness direction, and the second bonding surface faces away from the display unit. The second bonding surface is located on the side of the first bonding surface facing the display unit. By setting the second adhesive surface on the side of the first adhesive surface facing the display part, on the one hand, the first adhesive portion arranged opposite to the device area of ​​the circuit board is not thinned, thereby solving the problem of film printing at the position of the display part arranged opposite to the device area of ​​the circuit board 81. On the other hand, the second adhesive portion arranged opposite to the non-device area of ​​the circuit board is relatively thinned, thereby locally thinning the thickness of the display module, solving the thickness bottleneck limitation of the display module, and facilitating the terminal device to set other electronic devices at the thinned part of the display module.

[0016] In a possible implementation, the thickness of the second adhesive backing portion is smaller than the thickness of the second adhesive backing portion.

[0017] The present application also provides a display module, which includes a display panel, an intermediate layer, and a circuit board. The display panel includes a display portion, a bending portion, and a folding portion. The bending portion is connected between the display portion and the folding portion. The folding portion is located on one side of the display portion along the thickness direction and is arranged opposite to the display portion. The intermediate layer is arranged between the display portion and the folding portion. Along the thickness direction of the display module, the intermediate layer includes a first supporting layer, a heat dissipation layer, and a cushioning layer. The first supporting layer is arranged on a side of the display portion facing the folding portion. The heat dissipation layer is arranged on a side of the first supporting layer facing away from the display portion. The cushioning layer is arranged on a side of the heat dissipation layer facing away from the first supporting layer and is arranged opposite to the folding portion.

[0018] The heat dissipation layer includes a first heat dissipation portion and a second heat dissipation portion. The first heat dissipation portion is arranged opposite to the folding portion and the circuit board. The circuit board is electrically connected to the folding portion and is connected to a side of the first heat dissipation portion facing away from the display portion.

[0019] The first heat dissipation portion includes a first surface along the thickness direction, the first surface facing away from the display portion, and the second heat dissipation portion includes a second surface along the thickness direction, the second surface facing away from the display portion, and located on the side of the first surface facing the display portion.

[0020] The present application also provides a display module, comprising a display panel, an intermediate layer, and a circuit board. The display panel comprises a display portion, a bending portion, and a folding portion. The bending portion is connected between the display portion and the folding portion. The folding portion is located on one side of the display portion along the thickness direction and is arranged opposite to the display portion. The intermediate layer is arranged between the display portion and the folding portion. The circuit board is electrically connected to the folding portion and is connected to a side of the intermediate layer facing away from the display portion.

[0021] The circuit board includes a first board part and a second board part connected to the first board part, and the thickness of the second board part is smaller than that of the first board part.

[0022] The present application also provides a display module, which includes a display panel, an intermediate layer, a circuit board, an electronic device, and an adhesive layer. The display panel includes a display portion, a bending portion, and a folding portion. The bending portion is connected between the display portion and the folding portion. The folding portion is located on one side of the display portion along the thickness direction and is arranged opposite to the display portion. The intermediate layer is arranged between the display portion and the folding portion. The circuit board is electrically connected to the folding portion and is connected to a side of the intermediate layer away from the display portion. The circuit board includes a device area and a non-device area. The electronic device is mounted in the device area of ​​the circuit board and is electrically connected to the circuit board. The adhesive layer is bonded between the circuit board and the intermediate layer.

[0023] The back glue layer includes a first back glue part and a second back glue part. The first back glue part is arranged opposite to the device area, and the second back glue part is arranged opposite to the non-device area. The first back glue part includes a first adhesive surface along the thickness direction, and the first adhesive surface faces away from the display part. The second back glue part includes a second adhesive surface along the thickness direction, and the second adhesive surface faces away from the display part. The second adhesive surface is located on the side of the first adhesive surface facing the display part.

[0024] The present application also provides a terminal device, comprising a housing and a display module as described above, wherein the display module is mounted on the housing.

[0025] The present application also provides a terminal device, comprising a housing and a display module as described above, wherein the display module is mounted on the housing.

[0026] In a possible implementation, the terminal device further includes a battery, which is mounted on the housing and disposed opposite to the non-device area. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application;

[0029] Figure 2 for Figure 1 The cross-sectional structural diagram of the terminal device shown is at AA;

[0030] Figure 3 for Figure 2 A schematic cross-sectional view of a portion of the display module in the terminal device shown in another perspective;

[0031] Figure 4 for Figure 3 The cross-sectional structure diagram of the display module in the first embodiment is shown;

[0032] Figure 5 for Figure 3 The cross-sectional structure diagram of the display module in the second embodiment is shown;

[0033] Figure 6 for Figure 5 A schematic diagram of the top view of the display module shown;

[0034] Figure 7 for Figure 3 The schematic diagram of the top view of the display module in the third embodiment is shown;

[0035] Figure 8 for Figure 7 The cross-sectional structure diagram of the display module is shown;

[0036] Figure 9 for Figure 3 The cross-sectional structure diagram of the display module in the fourth embodiment is shown;

[0037] Figure 10 for Figure 9 A schematic diagram of the assembly structure of the circuit board and the adhesive layer in the electrical connection structure of the display module is shown;

[0038] Figure 11 for Figure 3 FIG2 is a schematic diagram of the cross-sectional structure of the display module in the fifth embodiment. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiment is only one embodiment of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0040] See also Figure 1 , Figure 1 A schematic diagram of the structure of the terminal device 1 provided in an embodiment of the present application.

[0041] For the convenience of description, we define Figure 1 The length direction of the terminal device 1 shown is the X-axis direction, the width direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

[0042] The terminal device 1 can be a mobile phone, tablet computer, computer, etc. In the embodiment of the present application, the terminal device 1 is described by taking a mobile phone as an example. The terminal device 1 includes a housing and a display module 3000. The display module 3000 is installed in the housing and is used to display images.

[0043] Specifically, the housing includes a middle frame 1000 and a bottom shell ( Figure 1 The middle frame 1000 is disposed around the bottom case. The display module 3000 is mounted on the middle frame 1000 and is disposed opposite to the bottom case.

[0044] See Figure 2 , Figure 2 for Figure 1 The cross-sectional structure diagram of the terminal device 1 at AA is shown. Figure 2 The bottom case is not shown.

[0045] The display module 3000 includes a display panel 100 and an intermediate layer 500 . The intermediate layer 500 is mounted on the display panel 100 .

[0046] Specifically, the display panel 100 includes a display portion 10, a bending portion 30 and a folding portion 50. The extension direction of the display portion 10 is the X-axis direction, and the thickness direction is the Z-axis direction. The bending portion 30 is connected between the display portion 10 and the folding portion 50, and the folding portion 50 is located on one side of the display portion 10 along the thickness direction, and is arranged opposite to the display portion 10. In this application, "A and B are arranged opposite to each other" means that the projection of A on B at least partially overlaps with B. Among them, the display portion 10 is used to display the picture, and the folding portion 50 can be used to bind chips, circuit boards, etc. In this embodiment, the COP (Chip On Pi) packaging process is used to fold the folding portion 50 of the display panel 100 toward the back of the display portion 10 to achieve the relative arrangement of the folding portion 50 and the display portion 10.

[0047] The intermediate layer 500 is disposed between the display portion 10 and the folding portion 50 to achieve a connection between the intermediate layer 500 and the display panel 100. The intermediate layer 500 not only ensures the bending radius of the display panel 100, but also supports and protects the display panel 100. Furthermore, the thickness of the intermediate layer 500 also affects the thickness of the display module 3000, and thus the thickness of the terminal device 1.

[0048] In the embodiment of the present application, the display module 3000 may further include a polarizer 610, an adhesive layer 620, and a cover plate 630. The polarizer 610 is disposed on the surface of the display portion 10 facing away from the folding portion 50, and the adhesive layer 620 is bonded between the polarizer 610 and the cover plate 630. Exemplarily, the adhesive layer 620 is made of optically clear adhesive (OCA).

[0049] See also Figure 2 and Figure 3 , Figure 3 for Figure 2 The diagram shows a cross-sectional structure diagram of a portion of the structure of the display module 3000 in the terminal device 1 at another viewing angle.

[0050] Along the thickness direction of the display unit 10, i.e., along the Z-axis, the intermediate layer 500 in the display module 3000 includes a first supporting layer 510, a heat dissipation layer 530, an elevated layer 550, and a second supporting layer 570. The first supporting layer 510 is disposed on the side of the display unit 10 facing the foldable portion 50, the heat dissipation layer 530 is disposed on the side of the first supporting layer 510 facing away from the display unit 10, the elevated layer 550 is disposed on the side of the heat dissipation layer 530 facing away from the first supporting layer 510, and the second supporting layer 570 is disposed on the side of the elevated layer 550 facing away from the heat dissipation layer 530.

[0051] Specifically, the first supporting layer 510 is provided on the side of the display unit 10 facing the folding portion 50. In this embodiment, the first supporting layer 510 is provided on the surface of the display unit 10 facing the folding portion 50. Among them, the first supporting layer 510 and the second supporting layer 570 are both used to provide internal support for the bent display panel 100. It is understandable that in other embodiments, only the first supporting layer 510 may be provided. Exemplarily, the materials of the first supporting layer 510 and the second supporting layer 570 can each be independently selected from at least one of polyamide (also known as nylon), polycarbonate (PC), polyethylene (PE), polyethylene glycol terephthalate (PET), polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinyl chloride (PVC).

[0052] The heat dissipation layer 530 can be used to balance the temperature on the back of the display panel 100 in the display module 3000, and also plays a role in protecting the display panel 100. In this embodiment, the heat dissipation layer 530 is an SCF (Super Clean Foam, heat dissipation buffer) layer. Specifically, the heat dissipation layer 530 includes a buffer layer 43, an adhesive layer 41 and a metal layer 45. Among them, the buffer layer 43 is arranged on the side of the first support layer 510 away from the display unit 10, the adhesive layer 41 is bonded between the first support layer 510 and the buffer layer 43, and the metal layer 45 is arranged on the surface of the buffer layer 43 away from the adhesive layer 41. In this embodiment, the buffer layer 43 is foam and the metal layer 45 is copper foil. It can be understood that in other embodiments, the metal layer 45 can also be other metal materials.

[0053] The padding layer 550 can be used to increase the thickness of the display module 3000 to ensure the bending radius of the display panel 100. In this embodiment, the padding layer 550 is arranged on the surface of the metal layer 45 away from the buffer layer 43, and is arranged opposite to the folding portion 50, so that the padding layer 550 is arranged on the side of the heat dissipation layer 530 away from the first support layer 510. Exemplarily, the padding layer 550 can be bonded to the surface of the metal layer 45 by adhesive. In this embodiment, the material of the padding layer 550 is polyethylene terephthalate (PET). It can be understood that in other embodiments, the padding layer 550 can also be other materials.

[0054] The second supporting layer 570 is disposed between the elevated layer 550 and the folded portion 50, and is disposed opposite the folded portion 50. In this embodiment, the second supporting layer 570 is disposed between the surface of the elevated layer 550 facing away from the metal layer 45 and the folded portion 50, thereby sandwiching the second supporting layer 570 between the elevated layer 550 and the folded portion 50.

[0055] Continue reading Figure 2 and Figure 3 In the embodiment of the present application, the display module 3000 further includes an electrical connection structure 700 and a protective layer 800 . The electrical connection structure 700 is electrically connected to the display panel 100 , and the protective layer 800 is installed on a side of the electrical connection structure 700 facing away from the display panel 100 .

[0056] Specifically, the electrical connection structure 700 is electrically connected to the folding portion 50 to achieve electrical connection between the electrical connection structure 700 and the display panel 100. The electrical connection structure 700 may include a driver 70 and a circuit board assembly 80. The driver 70 is mounted on the side of the folding portion 50 facing away from the display portion 10 and is electrically connected to the folding portion 50 to achieve electrical connection between the driver 70 and the display panel 100, thereby achieving electrical connection between the electrical connection structure 700 and the display panel 100. Exemplarily, the driver 70 may be a display driver integrated circuit (DDIC).

[0057] The circuit board assembly 80 is electrically connected to the driver 70 and fixedly connected to the intermediate layer 500. Specifically, the circuit board assembly 80 includes a circuit board 81 and an electronic device 82 (see Figure 3 ), the electronic device 82 is mounted on the surface of the circuit board 81 along the thickness direction. The circuit board 81 is electrically connected to the driver 70 to achieve signal transmission between the circuit board 81 and the driver 70, thereby achieving signal transmission between the circuit board 81 and the display panel 100. Exemplarily, the circuit board 81 can be a flexible printed circuit (FPC). The circuit board 81 can be used to transmit electrical signals to the driver 70, and the driver 70 can transmit electrical signals to the display panel 100, so that the display panel 100 displays images. The circuit board 81 is connected to the surface of the metal layer 45 away from the buffer layer 43, so that the circuit board 81 is fixedly connected to the side of the heat dissipation layer 530 away from the display unit 10, thereby achieving the circuit board 81 fixedly connected to the side of the intermediate layer 500 away from the display unit 10, thereby achieving a fixed connection between the circuit board assembly 80 and the intermediate layer 500.

[0058] In this embodiment, the electrical connection structure 700 further includes an adhesive layer 90, which is bonded between the circuit board assembly 80 and the intermediate layer 500. Specifically, the adhesive layer 90 is bonded between the circuit board 81 and the metal layer 45, so that the circuit board 81 is bonded to the surface of the metal layer 45 facing away from the buffer layer 43 via the adhesive layer 90, thereby bonding the circuit board assembly 80 to the intermediate layer 500 via the adhesive layer 90, thereby achieving a fixed connection between the circuit board assembly 80 and the intermediate layer 500.

[0059] In this embodiment, the protective layer 800 is installed on the side of the driver 70 and circuit board 81 facing away from the display portion 10, and covers the driver 70, circuit board 81, and folded portion 50. The protective layer 800 can be used to protect the electrical connection structure 700, shielding it from the effects of other components, such as static electricity from other components, and preventing moisture from entering the display module 3000 and corroding the electrical connection structure 700. Exemplarily, the protective layer 800 includes conductive fabric and Mylar sheeting.

[0060] Currently, to meet the requirements for reducing the thickness of the terminal device 1, the display module 3000 is typically thinned. However, as the thickness of the display module 3000 decreases, the overall performance of the display module 3000 is affected. The display module 3000 provided in the embodiments of the present application, based on the overall requirements of the terminal device 1, partially reduces the thickness of the display module 3000 without affecting the overall performance of the display module 3000, thereby resolving the thickness bottleneck of the display module 3000. The following describes a solution for partially thinning the display module 3000 in conjunction with specific embodiments.

[0061] See Figure 4 , Figure 4 for Figure 3 FIG. 1 is a schematic cross-sectional view of the display module 3000 in the first embodiment.

[0062] In the display module 3000 of the first embodiment, the folding portion 50 of the display panel 100 includes a first portion S11 and a second portion S12. The first portion S11 is connected between the folding portion 30 and the second portion S12. The first portion S11 includes a first surface 51 disposed along the thickness direction, i.e., along the Z-axis, facing away from the display portion 10. The second portion S12 includes a second surface 52 disposed along the thickness direction, i.e., along the Z-axis, facing away from the display portion 10.

[0063] The driver 70 in the electrical connection structure 700 is mounted on the second surface 52 of the second portion S12 of the folding portion 50 , so that the driver 70 is mounted on the side of the folding portion 50 facing away from the display portion 10 .

[0064] In the display module 3000 of the first embodiment, the second surface 52 is located on the side of the first surface 51 facing the display unit 10. In this embodiment, the second surface 52 is located on the side of the first surface 51 along the positive direction of the Z axis. Figure 4 As shown, with the display portion 10 as a reference, the difference between the height of the first surface 51 and the height of the second surface 52 from the display portion 10 is H1, and H1>0.

[0065] The applicant's research has found that the maximum thickness of the display module 3000 after bending is typically at the location of the driver 70, and the thickness at the location of the driver 70 is the bottleneck point of the thickness of the display module 3000. In the display module 3000 provided in the first embodiment, the driver 70 is installed in the second portion S12 of the folding portion 50 of the display panel 100. By arranging the second surface 52 of the second portion S12 on the side of the first surface 51 of the first portion S11 facing the display unit 10, the driver 70 can reuse a portion of the thickness space with the first portion S11. This achieves localized thinning of the display module 3000 without affecting the overall performance of the display module 3000, thus resolving the thickness bottleneck problem of the display module 3000. In addition, the applicant has also found that when the display module 3000 is thinned, the bending radius of the display panel 100 is reduced, resulting in an increase in the bending stress of the display panel 100. This causes greater stress on the internal circuits of the folding portion 30 of the display panel 100, which may cause fracture. By setting the second surface 52 of the second part S12 to be located on the side of the first surface 51 of the first part S11 facing the display part 10, it can also be ensured that the bending radius of the display panel 100 is not too small, thereby avoiding the problem of the display panel 100 breaking due to the bending radius being too small, thereby ensuring the performance of the display module 3000.

[0066] Specifically, in the specific example of the first embodiment, the thicknesses of the first supporting layer 510, the heat dissipation layer 530, and the second supporting layer 570 in the intermediate layer 500 are substantially equal. The raised layer 550 in the intermediate layer 500 includes a first raised portion 61 and a second raised portion 62. The first raised portion 61 is disposed opposite the first portion S11 of the folded portion 50, and the second raised portion 62 is disposed opposite the second portion S12 of the folded portion 50.

[0067] The thickness of the first raised portion 61 is D1, and the thickness of the second raised portion 62 is D2. The thickness of the second raised portion 62 is less than that of the first raised portion 61, i.e., D2 < D1, so that the second surface 52 is located on the side of the first surface 51 facing the display unit 10. For example, the difference between D1 and D2 is 0.06 mm.

[0068] In the specific example of the display module 3000 provided in the first embodiment, the first raised portion 61 of the raised layer 550 is disposed opposite the first portion S11 of the folding portion 50, and the second raised portion 62 is disposed opposite the second portion S12 of the folding portion 50, so that the second raised portion 62 is disposed opposite the driver 70 mounted on the second portion S12. By setting the thickness of the second raised portion 62, which is disposed opposite the second portion S12, to be less than the thickness of the first raised portion 61, the second surface 52 of the second portion S12 of the folding portion 50 is located on the side of the first surface 51 of the first portion S11 that faces the display unit 10.

[0069] On the one hand, the thickness of the second elevated portion 62 of the elevated layer 550, located opposite the driver 70, is reduced, thereby reducing the overall thickness of the display module 3000 at the driver 70, thereby resolving the thickness bottleneck of the display module 3000 and, consequently, the thickness bottleneck of the terminal device 1 at the driver 70. On the other hand, the thickness of the first elevated portion 61 ensures that the bending radius of the display panel 100 is not too small, thereby preventing the display panel 100 from breaking at the bent portion 30 due to an excessively small bending radius, thereby ensuring the performance of the display module 3000.

[0070] In the specific example of the display module 3000 of the first embodiment, the design of the unequal thickness cushioning layer 550 is used to achieve relative thinning of the display module 3000 at the driver 70. On the basis of ensuring the bending radius of the display panel 100, the thickness bottleneck problem of the display module 3000 is solved, thereby solving the limitation of the thickness bottleneck point of the entire terminal device 1.

[0071] See Figure 5 and Figure 6 , Figure 5 for Figure 3 The cross-sectional structure diagram of the display module 3000 in the second embodiment is shown. Figure 6 for Figure 5 The schematic diagram of the top structure of the display module 3000 is shown.

[0072] In the display module 3000 of the second embodiment, the heat dissipation layer 530 includes a first heat dissipation portion P1 and a second heat dissipation portion P2. The first heat dissipation portion P1 is disposed opposite the folded portion 50 and the circuit board 81. The first heat dissipation portion P1 includes a first surface 531 disposed along the thickness direction, i.e., along the Z-axis, facing away from the display unit 10. The second heat dissipation portion P2 includes a second surface 532 disposed along the thickness direction, i.e., along the Z-axis, facing away from the display unit 10.

[0073] The circuit board 81 in the electrical connection structure 700 is connected to the side of the first heat dissipation portion P1 facing away from the display portion 10 to achieve a fixed connection between the circuit board 81 and the heat dissipation layer 530 , thereby achieving a fixed connection between the circuit board 81 and the intermediate layer 500 .

[0074] In the display module 3000 of the second embodiment, the second surface 532 is located on the side of the first surface 531 facing the display portion 10. In this embodiment, the second surface 532 is located on the side of the first surface 531 along the positive direction of the Z axis.

[0075] The applicant's research has found that the electrical connection structure 700 in the display module 3000 is positioned opposite the display unit 10. Because the driver 70 and circuit board assembly 80 in the electrical connection structure 700 are relatively rigid, this can cause unevenness on the display unit 10, resulting in film marks on the display unit 10, which in turn causes an uneven display on the display unit 10. The film marks on the display unit 10 are primarily concentrated in the area opposite the circuit board 81. In the display module 3000 provided by the second embodiment, the circuit board 81 is connected to the first heat dissipation part P1 in the heat dissipation layer 530, which is arranged opposite to the circuit board 81. By arranging the second surface 532 of the second heat dissipation part P2 to be located on the side of the first surface 531 of the first heat dissipation part P1 facing the display unit 10, on the one hand, it is achieved that the position of the display module 3000 arranged opposite to the circuit board 81 is not thinned, thereby solving the problem of film printing phenomenon that occurs in the position of the display unit 10 arranged opposite to the circuit board 81. On the other hand, it is achieved that the intermediate layer 500 is thinned at the position not connected to the circuit board 81, thereby achieving local thinning of the thickness of the display module 3000, solving the thickness bottleneck limitation of the display module 3000, and facilitating the terminal device 1 to set other electronic devices at the thinned position of the display module 3000.

[0076] Specifically, in a specific example of the second embodiment, the first supporting layer 510 in the intermediate layer 500 has a substantially uniform thickness. In the heat dissipation layer 530 of the intermediate layer 500, the first heat dissipation portion P1 has a thickness of W1, and the second heat dissipation portion P2 has a thickness of W2. The thickness of the second heat dissipation portion P2 is less than that of the first heat dissipation portion P1, i.e., W2 < W1. This ensures that the second surface 532 of the second heat dissipation portion P2 is located on the side of the first surface 531 of the first heat dissipation portion P1 that faces the display unit 10. For example, the thickness W1 of the first heat dissipation portion P1 is 0.22 mm, and the thickness W2 of the second heat dissipation portion P2 is 0.19 mm.

[0077] In this embodiment, both the first heat dissipation portion P1 and the second heat dissipation portion P2 include an adhesive layer 41, a buffer layer 43, and a metal layer 45. The surface of the metal layer 45 of the first heat dissipation portion P1 facing away from the display portion 10 is a first surface 531, while the surface of the metal layer 45 of the second heat dissipation portion P2 facing away from the display portion 10 is a second surface 532. It will be appreciated that in this embodiment, by thinning at least one of the adhesive layer 41, buffer layer 43, and metal layer 45 in the second heat dissipation portion P2, the thickness of the second heat dissipation portion P2 can be reduced to be less than that of the first heat dissipation portion P1.

[0078] In the specific example of the display module 3000 provided in the second embodiment, the thickness of the second heat dissipation portion P2 in the heat dissipation layer 530 is set to be smaller than that of the first heat dissipation portion P1, so that the second surface 532 of the second heat dissipation portion P2 is located on the side of the first surface 531 of the first heat dissipation portion P1 facing the display unit 10. On the one hand, the thickness of the first heat dissipation portion P1 located opposite the circuit board 81 is not reduced, thus resolving the problem of film printing on the display unit 10 caused by thinning the heat dissipation layer 530. On the other hand, the thickness of the second heat dissipation portion P2 not located opposite the circuit board 81 is reduced, thereby thinning the intermediate layer 500 at locations not connected to the circuit board 81. This achieves a localized thinning of the display module 3000, facilitating the installation of other electronic components in the thinned areas of the display module 3000 in the terminal device 1, thus resolving the thickness bottleneck of the display module 3000.

[0079] In the specific example of the display module 3000 of the second embodiment, the design of the heat dissipation layer 530 of unequal thickness is utilized to achieve that the thickness of the first heat dissipation part P1 of the display module 3000 arranged opposite to the circuit board 81 is not thinned, and the thickness of the second heat dissipation part P2 not arranged opposite to the circuit board 81 is relatively thinned over a large area. On the basis of solving the film printing problem of the display part 10, the thickness bottleneck limitation of the display module 3000 is solved, thereby solving the thickness bottleneck limitation of the entire terminal device 1.

[0080] See Figure 7 and Figure 8 , Figure 7 for Figure 3 The schematic diagram of the top view of the display module 3000 in the third embodiment is shown. Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure of the display module 3000 is shown.

[0081] In the display module 3000 of the third embodiment, the circuit board 81 in the circuit board assembly 80 of the electrical connection structure 700 includes a first board portion 811 and a second board portion 812 connected to the first board portion 811. Exemplarily, the first board portion 811 is disposed around the circumference of the second board portion 812.

[0082] In this embodiment, the thickness of the second plate portion 812 is thinner than that of the first plate portion 811, thereby achieving localized thinning of the circuit board 81. The location of the second plate portion 812 at the thinned portion of the circuit board 81 corresponds to the thickness bottleneck of the display module 3000. The location of the second plate portion 812 in the display module 3000 of different terminal devices 1 may vary. Specifically, the thickness of the second plate portion 812 can be made thinner than that of the first plate portion 811 by stacking the thickness of the circuit board 81 separately, such as by setting different numbers of routing layers in different areas. This achieves localized thinning of the circuit board 81. For example, the number of routing layers in the second plate portion 812 is smaller than that in the first plate portion 811. In this embodiment, the thickness of the first plate portion 811 is 0.14 mm, which is a reference value for conventional double-layer routing. The thickness of the second plate portion 812 is 0.1 mm, which is a reference value for single-layer routing.

[0083] The applicant's research has found that if the overall thickness of the circuit board 81 in the display module 3000 is reduced, it will lead to performance loss and cost impacts on the circuit board 81. In the specific example of the display module 3000 of the third embodiment, by setting the thickness of the second plate portion 812 of the circuit board 81 to be thinner than the thickness of the first plate portion 811, the thickness of the circuit board 81 is locally thinned, thereby thinning the second plate portion 812 of the circuit board 81 corresponding to the thickness bottleneck of the display module 3000 in the terminal device 1. On the one hand, this can solve the problem of performance loss after the overall thinning of the circuit board 81. On the other hand, it can achieve local thinning of the display module 3000, which can also solve the thickness bottleneck limitation of the display module 3000, thereby solving the thickness bottleneck limitation of the terminal device 1.

[0084] See Figure 9 and Figure 10 , Figure 9 for Figure 3 The cross-sectional structure diagram of the display module 3000 in the fourth embodiment is shown. Figure 10 for Figure 9 FIG. 1 is a schematic diagram of the assembly structure of the circuit board 81 and the adhesive layer 90 in the electrical connection structure 700 of the display module 3000 .

[0085] In the display module 3000 of the fourth embodiment, the circuit board 81 of the circuit board assembly 80 includes a device area 801 and a non-device area 802 , wherein the device area 801 is used for mounting electronic devices 82 .

[0086] The adhesive layer 90 includes a first adhesive portion 91 and a second adhesive portion 92. The first adhesive portion 91 and the second adhesive portion 92 are both bonded between the circuit board 81 and the metal layer 45, thereby bonding the first adhesive portion 91 and the second adhesive portion 92 between the circuit board 81 and the intermediate layer 500. The first adhesive portion 91 is disposed opposite the device area 801 of the circuit board 81, and the second adhesive portion 92 is disposed opposite the non-device area 802 of the circuit board 81.

[0087] The first adhesive portion 91 includes a first adhesive surface 911 along the thickness direction, i.e., along the Z-axis direction, and the first adhesive surface 911 faces away from the display unit 10. The second adhesive portion 92 includes a second adhesive surface 922 along the thickness direction, i.e., along the Z-axis direction, and the second adhesive surface 922 faces away from the display unit 10.

[0088] In the display module 3000 of the fourth embodiment, the second adhesive surface 922 is located on the side of the first adhesive surface 911 facing the display unit 10. In this embodiment, the second adhesive surface 922 is located on the side of the first adhesive surface 911 along the positive direction of the Z axis.

[0089] The applicant has discovered that in the area of ​​the display module 3000 corresponding to the circuit board 81, the electronic device 82 mounted on the circuit board 81 can cause a relatively serious film printing phenomenon on the display unit 10. The display module 3000 provided in the fourth embodiment, by arranging the second adhesive surface 922 of the second adhesive portion 92 to be located on the side of the first adhesive surface 911 of the first adhesive portion 91 facing the display unit 10, ensures that the first adhesive portion 91 disposed opposite the device area 801 of the circuit board 81 is not thinned, thereby resolving the problem of film printing on the display unit 10 at the location opposite the device area 801 of the circuit board 81. Furthermore, the second adhesive portion 92 disposed opposite the non-device area 802 of the circuit board 81 is relatively thinned, thereby locally reducing the thickness of the display module 3000, thereby resolving the thickness bottleneck of the display module 3000 and facilitating the installation of other electronic devices in the thinned portion of the display module 3000 in the terminal device 1. For example, a battery may be provided in the terminal device 1 at a position opposite to the non-device area 802 of the circuit board 81 to resolve the thickness bottleneck problem of the terminal device 1 at the battery position.

[0090] Specifically, in the specific example of the fourth embodiment, the thickness of the second adhesive portion 92 is less than the thickness of the first adhesive portion 91, so that the second adhesive surface 922 of the second adhesive portion 92 is located on the side of the first adhesive surface 911 of the first adhesive portion 91 facing the display unit 10. For example, the thickness of the first adhesive portion 91 is 0.05 mm, and the thickness of the second adhesive portion 92 is 0.03 mm.

[0091] In the specific example of the display module 3000 provided in the fourth embodiment, the thickness of the second adhesive portion 92 arranged opposite to the non-device area 802 of the circuit board 81 is set to be smaller than the thickness of the first adhesive portion 91 arranged opposite to the device area 801, so as to achieve thinning of the non-device area 802 of the circuit board 81 in the adhesive layer 90, while the device area 801 of the circuit board 81 in the adhesive layer 90 is not thinned. On the one hand, the problem of film printing on the display part 10 caused by the overall thinness of the adhesive layer 90 can be solved. On the other hand, the second adhesive portion 92 is relatively thinned, so that the local area of ​​the display module 3000 is thinned, thereby solving the thickness bottleneck limitation of the display module 3000.

[0092] In the specific example of the display module 3000 of the fourth embodiment, the design of unequal thickness of the adhesive layer 90 is used to achieve relative thinning of the second adhesive portion 92 of the display module 3000 that is arranged opposite to the non-device area 802 of the circuit board 81. On the basis of ensuring the performance of the display module 3000, the thickness bottleneck limitation of the display module 3000 is solved, thereby solving the thickness bottleneck limitation of the terminal device 1.

[0093] See Figure 11 , Figure 11 for Figure 3 FIG. 1 is a schematic diagram of the cross-sectional structure of the display module 3000 in the fifth embodiment.

[0094] The display module 3000 of the fifth embodiment differs from the display module 3000 of the first embodiment in that the second surface 532 of the second heat dissipation portion P2 in the heat dissipation layer 530 of the display module 3000 of the fifth embodiment is located on the side of the first surface 531 of the first heat dissipation portion P1 facing the display unit 10, that is, the thinning solutions of the first embodiment and the second embodiment are adopted at the same time.

[0095] Specifically, the display module 3000 of the fifth embodiment satisfies the following conditions: the second surface 52 of the second portion S12 of the folding portion 50 is located on the side of the first surface 51 of the first portion S11 facing the display unit 10; and the second surface 532 of the second heat dissipation portion P2 is located on the side of the first surface 531 of the first heat dissipation portion P1 facing the display unit 10. For example, in the specific example of the display module 3000 of this embodiment, the display module 3000 simultaneously satisfies W2 < W1 and D2 < D1.

[0096] In the display module 3000 of the fifth embodiment, on the one hand, by arranging the second surface 52 on the side of the first surface 51 facing the display unit 10, the driver 70 can reuse a portion of the thickness space with the first portion S11. This achieves localized thinning of the thickness of the display module 3000 without affecting the overall performance of the display module 3000, thereby resolving the thickness bottleneck problem of the display module 3000. On the other hand, by arranging the second surface 532 on the side of the first surface 531 facing the display unit 10, the display module 3000 is not thinned at the location opposite the circuit board 81, thereby resolving the problem of film printing that may occur at the location opposite the circuit board 81 of the display unit 10. At the same time, the thickness of the display module 3000 is locally thinned, resolving the thickness bottleneck limitation of the display module 3000 and facilitating the installation of other electronic components in the thinned portion of the display module 3000 in the terminal device 1.

[0097] The present application also provides a display module 3000 according to a sixth embodiment. This differs from the display module 3000 according to the first embodiment in that the thickness of the second board portion 812 of the circuit board 81 of the electrical connection structure 700 in the display module 3000 according to the sixth embodiment is less than the thickness of the first board portion 811. In other words, the display module 3000 according to the sixth embodiment employs the thinning solutions of both the first and third embodiments.

[0098] Specifically, in the display module 3000 of the sixth embodiment, the following conditions are satisfied: the second surface 52 of the second portion S12 in the folding portion 50 is located on the side of the first surface 51 of the first portion S11 facing the display portion 10, and the following conditions are satisfied: the thickness of the second board portion 812 in the circuit board 81 is less than the thickness of the first board portion 811.

[0099] In the display module 3000 of the sixth embodiment, by arranging the second surface 52 on the side of the first surface 51 facing the display unit 10, the driver 70 can share a portion of the thickness space with the first portion S11. This allows the thickness of the display module 3000 to be locally thinned without affecting the overall performance of the display module 3000, thereby resolving the thickness bottleneck of the display module 3000. Furthermore, by setting the thickness of the second plate portion 812 of the circuit board 81 to be thinner than the thickness of the first plate portion 811, the thickness of the circuit board 81 is locally thinned. This allows the second plate portion 812 of the circuit board 81 corresponding to the thickness bottleneck of the display module 3000 in the terminal device 1 to be thinned, thereby resolving the performance loss associated with overall thinning of the circuit board 81. Furthermore, the display module 3000 can be locally thinned, thereby resolving the thickness bottleneck of the display module 3000 and, consequently, the overall thickness bottleneck of the terminal device 1.

[0100] This application also provides a display module 3000 according to a seventh embodiment. This differs from the display module 3000 according to the first embodiment in that the second adhesive surface 922 of the second adhesive portion 92 in the adhesive layer 90 of the display module 3000 according to the seventh embodiment is located on the side of the first adhesive surface 911 of the first adhesive portion 91 that faces the display unit 10. In other words, the display module 3000 according to the seventh embodiment employs the thinning solutions of both the first and fourth embodiments.

[0101] Specifically, in the display module 3000 of the seventh embodiment, the following conditions are satisfied: the second surface 52 of the second portion S12 in the folding portion 50 is located on the side of the first surface 51 of the first portion S11 facing the display portion 10 , and the following conditions are satisfied: the second adhesive surface 922 of the second adhesive back portion 92 is located on the side of the first adhesive back portion 911 facing the display portion 10 .

[0102] In the display module 3000 of the seventh embodiment, by positioning the second surface 52 on the side of the first surface 51 facing the display unit 10, the driver 70 can share a portion of the thickness space with the first portion S11. This allows the thickness of the display module 3000 to be locally reduced without affecting the overall performance of the display module 3000, thereby resolving the thickness bottleneck of the display module 3000. Furthermore, by positioning the second adhesive surface 922 of the second adhesive portion 92 on the side of the first adhesive surface 911 of the first adhesive portion 91 facing the display unit 10, the first adhesive portion 91, which is positioned opposite the device area 801 of the circuit board 81, remains unchanged. This resolves the issue of film printing on the display unit 10 at the location opposite the device area 801 of the circuit board 81. Furthermore, the second adhesive portion 92 is relatively thinned, thereby locally reducing the thickness of the display module 3000 and resolving the thickness bottleneck of the display module 3000.

[0103] The display modules 3000 of the fifth through seventh embodiments are described using the thinning solution of the first embodiment combined with the design solutions of the second through fourth embodiments as examples. It is understood that the design solution of the display module 3000 provided herein may also employ a combination of at least two of the thinning solutions of the first through fourth embodiments to resolve the thickness bottleneck of the display module 3000, and this will not be further elaborated herein.

[0104] The above disclosure is only a preferred embodiment of the present application, and it is certainly not intended to limit the scope of the rights of the present application. A person skilled in the art can understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present application are still within the scope of the present application.

Claims

1. A display module, characterized in that: The display module comprises a display panel, an intermediate layer, a circuit board, an electronic device and a back adhesive layer. The display panel comprises a display portion, a bending portion and a folding portion. The bending portion is connected between the display portion and the folding portion. The folding portion is located at one side of the display portion along the thickness direction and is arranged opposite to the display portion. The intermediate layer is arranged between the display portion and the folding portion. The circuit board is electrically connected to the folding portion and is connected to a side of the intermediate layer away from the display portion. The circuit board comprises a device area and a non-device area. The electronic device is installed in the device area of ​​the circuit board and is electrically connected to the circuit board. The back adhesive layer is bonded between the circuit board and the intermediate layer. The back glue layer includes a first back glue part and a second back glue part, the first back glue part is arranged opposite to the device area, and the second back glue part is arranged opposite to the non-device area, the first back glue part includes a first adhesive surface along the thickness direction, and the first adhesive surface is away from the display part, and the second back glue part includes a second adhesive surface along the thickness direction, the second adhesive surface is away from the display part, and the second adhesive surface is located on the side of the first adhesive surface facing the display part.

2. The display module according to claim 1, characterized in that: The folding portion includes a first part and a second part, the first part is connected between the bending portion and the second part, the first part includes a first surface along the thickness direction, the first surface is away from the display portion, the second part includes a second surface along the thickness direction, the second surface is away from the display portion, the display module also includes a driver, the driver is installed on the second surface of the second part; Wherein, the second surface is located on a side of the first surface facing the display portion.

3. The display module according to claim 2, characterized in that: Along the thickness direction of the display module, the middle layer includes a first supporting layer, a heat dissipation layer and a cushioning layer, wherein the first supporting layer is arranged on a side of the display portion facing the folding portion, the heat dissipation layer is arranged on a side of the first supporting layer away from the display portion, and the cushioning layer is arranged on a side of the heat dissipation layer away from the first supporting layer and is arranged opposite to the folding portion; The raising layer includes a first raising portion and a second raising portion, the first raising portion is arranged opposite to the first portion, the second raising portion is arranged opposite to the second portion, and the thickness of the second raising portion is smaller than the thickness of the first raising portion.

4. The display module according to claim 3, characterized in that: The middle layer further includes a second supporting layer, which is arranged between the cushioning layer and the folding portion and is arranged opposite to the folding portion.

5. The display module according to claim 1, characterized in that: The thickness of the second back adhesive portion is smaller than the thickness of the second back adhesive portion.

6. A terminal device, characterized in that: It comprises a housing and the display module as claimed in claim 1, wherein the display module is mounted on the housing.

7. The terminal device according to claim 6, characterized in that: The terminal device further includes a battery, which is mounted on the housing and disposed opposite to the non-device area.

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