Silicon wafer detection machine table

Abstract

The utility model provides a silicon wafer detection machine, and relates to the technical field of semiconductor equipment. The silicon wafer detection machine table comprises a laser sensor, a table disc and a base, the laser sensor is located above the table disc, at least one hole is formed in the table disc, and a laser emitting port of the laser sensor corresponds to the hole in position in an up-down mode. The detection distance of the laser sensor is larger than the distance between the laser emission port and the upper edge of the hole, the table plate is used for placing a silicon wafer, the silicon wafer covers the hole when being placed on the table plate, the table plate is located between the laser sensor and the base, and the laser sensor is arranged on the table plate. The silicon wafer detection machine can sensitively and accurately detect whether the silicon wafer is placed or not, and is not influenced by the transparency of the silicon wafer, so that the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a silicon wafer testing machine. Background Art

[0002] During the operation of the cooling table in the semiconductor process (such as L3510 or BEASG01 cooling table), the detection method is two upper and lower light sensors, one transmitting end and one receiving end. The working method is that the object blocks the transmitting end so that the receiving end cannot detect the light source. When the operating product is a silicon wafer, the opacity of the silicon wafer enables the detection sensor to sense the placement of the silicon wafer. However, when the operating product is a silicon carbide wafer, due to the transparency of silicon carbide and the influence of the refractive index of light, the detection sensor cannot accurately sense the placement of the silicon wafer every time, so it frequently reports errors, affecting work efficiency. Utility Model Content

[0003] In view of this, the embodiments of the present specification provide a silicon wafer inspection machine that can sensitively and accurately detect whether a silicon wafer is placed or not without being affected by the transparency of the silicon wafer itself, thereby improving work efficiency.

[0004] The embodiments of this specification provide the following technical solutions:

[0005] A silicon wafer inspection machine is provided, comprising a laser sensor, a table and a base, wherein the laser sensor is located above the table, at least one hole is provided on the table, a laser emission port of the laser sensor corresponds to the position of the hole in the upper and lower parts, a detection distance of the laser sensor is greater than a distance between the laser emission port and an upper edge of the hole, the table is used for placing silicon wafers, and covers the hole when the silicon wafer is placed on the table, and the table is located between the laser sensor and the base.

[0006] In some embodiments, the laser sensor is fixed by a bracket, and the bracket includes a first bracket portion fixed on the base and a second bracket portion extending from an upper end of the first bracket portion to above the table.

[0007] In some embodiments, the second bracket portion is detachable or rotatable relative to the first bracket portion.

[0008] In some embodiments, a robot arm insertion slot is provided on the table, and when the robot arm transfers the silicon wafer to the table, the robot arm insertion slot is used to accommodate the robot arm.

[0009] In some embodiments, the detection distance of the laser sensor is smaller than the distance between the laser emission port and the base.

[0010] In some embodiments, the detection distance range of the laser sensor is 8cm-14cm.

[0011] In some embodiments, the detection distance of the laser sensor is 10 cm.

[0012] Compared with the prior art, the above-mentioned technical solution adopted in the embodiments of this specification can achieve at least the following beneficial effects: changing the traditional photosensitive silicon wafer detection method of transmitting and receiving signals through the transmitting end and the receiving end, and through the specific structure and position relationship setting between the laser sensor and the plate and the base for placing the silicon wafer, it can quickly and accurately detect the placement of all silicon wafers (including silicon carbide silicon wafers), avoid frequent errors, improve the accuracy and sensitivity of silicon wafer detection, and thus improve the overall work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the structure of a silicon wafer inspection machine provided in some embodiments of the present application;

[0015] Figure 2 It is a schematic diagram of the structure of a silicon wafer inspection machine provided in some embodiments of the present application;

[0016] Figure 3 It is a schematic diagram of the structure of a silicon wafer inspection machine provided in some embodiments of the present application. DETAILED DESCRIPTION

[0017] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0018] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0019] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0020] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0021] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.

[0022] like Figure 1 and Figure 2 As shown, the silicon wafer detection machine provided by the embodiment of the present application includes a laser sensor 1, a table 2 and a base 3. The laser sensor 1 is located above the table 2. At least one hole 21 is provided on the table 2. The laser emission port 11 of the laser sensor 1 corresponds to the position of the hole 21. The detection distance of the laser sensor 1 is greater than the distance between the laser emission port 11 and the upper edge of the hole 21. The table 21 is used to place silicon wafers (i.e., wafers, not shown in the figure). When the silicon wafer is placed on the table 2, it can cover the hole, so that when the silicon wafer is placed on the table 2, the laser beam emitted by the laser emission port 11 of the laser sensor 1 reaches the silicon wafer, is reflected by the silicon wafer and then received by the laser sensor 1, thereby detecting and confirming that a silicon wafer has been placed on the table 2 of the machine.

[0023] In some embodiments, a base 3 is provided below the table 2, and the table 2 is located between the laser sensor 1 and the base 3. In some embodiments, the table 2 can be supported and fixed by legs 4 (such as three legs 4) fixed on the base 3 to ensure the stability of the table 2.

[0024] In some embodiments, the laser sensor 1 can be fixed by a bracket 5 on the side of the table 2, and the bracket 5 includes a first bracket portion 51 fixed on the base 3 and a second bracket portion 52 extending from the upper end of the first bracket portion 51 to the top of the table 2, so as to firmly fix the laser sensor 1 above the table 2. In some embodiments, the second bracket portion 52 is detachable or rotatable relative to the first bracket portion 51, so that in different detection scenarios, the fixed position of the laser sensor 1 can be changed by adjusting the second bracket portion 52 to meet different detection requirements.

[0025] In some embodiments, Figure 3 As shown, a robot arm insertion slot 22 is provided on the table 2. When a robot arm (not shown in the figure) transfers the silicon wafer to the table 2, the robot arm insertion slot 22 is used to accommodate the robot arm. When the silicon wafer is placed on the table 2, the robot arm is accommodated by the robot arm insertion slot 22 that is just adapted below, so that the silicon wafer can be placed in the correct placement position on the table 2 more smoothly and appropriately.

[0026] In some embodiments, the detection distance of the laser sensor 1 is smaller than the distance between the laser emission port 11 and the base 3, so that when no silicon wafer is placed on the table 2, the laser sensor 1 does not generate a reflection signal of the emitted laser beam, that is, there is no induction signal at this time, so as to determine whether a silicon wafer is placed on the table 2.

[0027] In some embodiments, the distance between the laser emitting port 11 and the upper edge of the hole 21 is 7 cm, the distance between the laser emitting port 11 and the base 3 is 15 cm, and the set detection distance range of the laser sensor is 8 cm-14 cm. Preferably, the set detection distance of the laser sensor is 10 cm. After the aforementioned range value or specific value setting, the laser sensor 1 can realize sensitive detection of whether the silicon wafer is placed or not.

[0028] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "one embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of this specification can be appropriately combined.

[0029] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this specification, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some currently considered useful utility model embodiments through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing processing device or mobile device.

[0030] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Claims

1. A silicon wafer inspection machine, characterized in that: The device comprises a laser sensor, a table and a base, wherein the laser sensor is located above the table, at least one hole is provided on the table, a laser emission port of the laser sensor corresponds to the position of the hole in the upper and lower parts, a detection distance of the laser sensor is greater than a distance between the laser emission port and the upper edge of the hole, the table is used for placing a silicon wafer, and when the silicon wafer is placed on the table, the hole is covered, and the table is located between the laser sensor and the base.

2. The silicon wafer inspection machine according to claim 1, characterized in that: The laser sensor is fixed by a bracket, and the bracket includes a first bracket part fixed on the base and a second bracket part extending from the upper end of the first bracket part to above the table.

3. The silicon wafer inspection machine according to claim 2, characterized in that: The second bracket part is detachable or rotatable relative to the first bracket part.

4. The silicon wafer inspection machine according to claim 1, characterized in that: A robot arm insertion slot is provided on the table. When the robot arm transfers the silicon wafer to the table, the robot arm insertion slot is used to accommodate the robot arm.

5. The silicon wafer inspection machine according to any one of claims 1 to 4, characterized in that: The detection distance of the laser sensor is smaller than the distance between the laser emission port and the base.

6. The silicon wafer inspection machine according to claim 5, characterized in that: The detection distance range of the laser sensor is 8cm-14cm.

7. The silicon wafer inspection machine according to claim 6, characterized in that: The detection distance of the laser sensor is 10 cm.

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