Wafer teaching auxiliary device and wafer teaching system

Abstract

The utility model provides a wafer teaching auxiliary device and a wafer teaching system, and the wafer teaching auxiliary device comprises a main body substrate, a first convex edge, and a second convex edge. The size and the shape of the main body substrate are consistent with those of the wafer. The first convex edge and the second convex edge are respectively arranged on two side parts of the lower surface of the main body substrate. And the first convex edge and the second convex edge are symmetrically distributed. According to the technical scheme, even if the workbench for bearing the wafer is located in a narrow space, a worker can complete alignment and clamping of the first convex edge and the second convex edge of the main body substrate and the edge of the bearing table without observation, time and labor are saved, meanwhile, alignment accuracy can be guaranteed, and therefore the teaching work of taking and placing the wafer by a mechanical arm can be more convenient.

Description

Technical Field

[0001] The present application relates to the field of wafer teaching technology, and more specifically, to a wafer teaching auxiliary device and a wafer teaching system. Background Art

[0002] Robots are widely used in the field of semiconductor integrated circuit manufacturing technology. Robots are important equipment in wafer transfer systems and are used to store and transport wafers before and after process processing. They can receive instructions and accurately locate a point in three-dimensional or two-dimensional space to pick up and place wafers.

[0003] Before the robot can accurately pick up and place the wafer, it is necessary to teach the robot the pick-up and placement position of the wafer. In the current teaching method, a transparent acrylic plate of the same size as the standard wafer is generally placed on the workbench (or fixture) used to carry the wafer. The worker visually aligns the acrylic plate and the workbench, and then moves the robot to align the robot and the acrylic plate to complete the pick-up and placement, thereby completing the teaching.

[0004] However, in some narrow spaces, or in low and flat spaces, the workers have limited operating space and restricted vision, making it difficult to align the acrylic plate and the workbench, which makes the teaching process more difficult. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a wafer teaching auxiliary device and a wafer teaching system. Even if the workbench carrying the wafer is in a small space, the wafer teaching auxiliary device of the present application can facilitate the staff to conveniently and accurately implement the teaching work of the robot to pick up and place the wafer.

[0006] In a first aspect, a wafer teaching auxiliary device is provided, comprising a main substrate, a first flange and a second flange. The main substrate is consistent with the size and shape of the wafer. The first flange and the second flange are respectively arranged on both side edges of the lower surface of the main substrate. The first flange and the second flange are symmetrically distributed.

[0007] In an implementable solution, the main substrate of the wafer teaching auxiliary device is circular, and the first convex edge and the second convex edge form a circle with a predetermined diameter.

[0008] In an implementable scheme, in a wafer teaching auxiliary device, along the clockwise or counterclockwise direction, the first flange includes a first end and a second end, the second flange also includes a first end and a second end, the first end of the first flange is adjacent to the second end of the second flange to form a first gap, and the first end of the second flange is adjacent to the second end of the first flange to form a second gap.

[0009] In one feasible solution, the distances between the first neutral gear and the second neutral gear are the same and symmetrically distributed.

[0010] In an implementable solution, the arc length of the first convex edge corresponds to a central angle range of 90° to 150°, and the arc length of the second convex edge corresponds to a central angle range of 90° to 150°.

[0011] In an implementable scheme, a first groove and a second groove are arranged on the upper surface of the main substrate of the wafer teaching auxiliary device; the first groove is located directly above the first convex edge, and the shape of the first groove is the same as the shape of the bottom surface of the first convex edge; the second groove is located directly above the second convex edge, and the shape of the second groove is the same as the shape of the bottom surface of the second convex edge.

[0012] According to the second aspect of the present application, a wafer teaching system is also provided, characterized in that it includes the aforementioned wafer teaching auxiliary device; and also includes a carrier platform and a lifting device;

[0013] The lifting devices are evenly distributed around the circumference of the load-bearing platform, and the lifting devices include a lifting head;

[0014] When in use, after the first and second flanges of the wafer teaching auxiliary device are stuck on the edge of the carrier, the lifting device drives the lifting head to rise to lift the wafer teaching auxiliary device so that the lower surface of the main substrate of the wafer teaching auxiliary device is a predetermined distance away from the upper surface of the carrier.

[0015] In an implementable solution, a first position sensor is arranged on the side of the carrier platform. After the first convex edge and the second convex edge of the wafer teaching auxiliary device are clamped on the edge of the carrier platform, the inner side of the first convex edge or the second convex edge blocks the first position sensor.

[0016] In an implementable solution, the wafer teaching system includes a wafer robot, and the wafer robot is provided with a marking line for aligning with an edge of a main substrate of the wafer teaching auxiliary device.

[0017] In an implementable solution, the wafer teaching system also includes a camera, which is arranged above the carrier platform and faces a position where the edge of the main substrate of the wafer teaching auxiliary device is aligned with the marking line of the wafer robot.

[0018] Compared with the prior art, the beneficial effects of this application are at least:

[0019] When in use, the first convex edge and the second convex edge of the lower surface of the main substrate of the wafer teaching auxiliary device are stuck on the edge of the carrier to complete the alignment of the main substrate and the carrier. Even if the space above the carrier is small, which is not conducive to observation by the staff, the existence of the first convex edge and the second convex edge allows the staff to complete the alignment operation of the main substrate and the carrier without observation, saving time and effort while ensuring accurate alignment.

[0020] After that, after the main substrate and the carrier are aligned, the main substrate and the carrier are separated by a certain distance, and the wafer robot enters between the main substrate and the carrier to align the wafer robot with the wafer teaching auxiliary device. Since the alignment of the wafer robot and the main substrate is at the edge position, the alignment can be completed by the staff's visual inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a structural diagram of a wafer teaching auxiliary device according to an embodiment of the present application;

[0023] Figure 2 The state of a wafer teaching auxiliary device and a carrier platform when aligned according to an embodiment of the present application is shown Figure 1 ;

[0024] Figure 3 The state of a wafer teaching auxiliary device and a carrier platform when aligned according to an embodiment of the present application is shown Figure 2 ;

[0025] Figure 4 A diagram showing a wafer teaching auxiliary device and a robot teaching alignment state according to an embodiment of the present application;

[0026] Figure 5 is a structural diagram of another wafer teaching auxiliary device according to an embodiment of the present application;

[0027] Figure 6 It is a structural diagram of a stacked state of multiple wafer teaching auxiliary devices according to an embodiment of the present application;

[0028] Figure 7 It is a simplified structural diagram of the carrier platform of a wafer teaching system according to an embodiment of the present application.

[0029] In the figure: 1, main substrate; 2, first convex edge; 3, second convex edge; 11, first gap; 12, second gap; 4, first groove; 5, second groove; 100, carrier platform; 101, first position sensor; 200, lifting device; 201, lifting head; 300, wafer robot; 301, identification line; 302, second position sensor; 400, camera. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0032] like Figure 1 As shown, this embodiment first provides a wafer teaching auxiliary device, including a main substrate 1, a first convex edge 2 and a second convex edge 3. The main substrate 1 is consistent with the size and shape of the wafer, and the first convex edge 2 and the second convex edge 3 are respectively arranged on both side edges of the lower surface of the main substrate 1. Among them, the first convex edge 2 and the second convex edge 3 are symmetrically distributed.

[0033] like Figure 2 As shown, when in use, the first convex edge 2 and the second convex edge 3 on the lower surface of the main substrate 1 of the wafer teaching auxiliary device are stuck on the edge of the carrier 100 to complete the alignment of the main substrate 1 and the carrier 100. Even if the space above the carrier 100 is small, which is not conducive to the staff's observation, the existence of the first convex edge 2 and the second convex edge 3 allows the staff to complete the alignment operation of the main substrate 1 and the carrier 100 without observation, saving time and effort while ensuring accurate alignment.

[0034] Afterwards, if Figure 3 and Figure 4 As shown, after the main substrate 1 and the carrier table 100 are aligned, the main substrate 1 and the carrier table 100 are separated by a certain distance, and the wafer robot 300 enters between the main substrate 1 and the carrier table 100 to align the wafer robot 300 with the main substrate 1 of the wafer teaching auxiliary device. Since the alignment of the wafer robot 300 and the main substrate 1 is at the edge position, the alignment can be completed by the staff's visual inspection.

[0035] It should be noted that the carrier 100 is a workbench for carrying wafers, and can also be called a wafer fixture. The main substrate 1, the first flange 2, and the second flange 3 are generally obtained as a whole by machining, and can be supported by acrylic plate processing. The main substrate 1, the first flange 2, and the second flange 3 can also be a split structure, for example, the first flange 2 and the second flange 3 can be assembled with the main substrate 1 using a structure of screws and threaded holes.

[0036] In this embodiment, if Figure 1-Figure 4 As shown, the main substrate 1 is generally a circle that is exactly the same shape as the wafer, and the first convex edge 2 and the second convex edge 3 form a circle with a predetermined diameter. The corresponding upper surface of the carrier 100 for carrying the wafer is also generally circular, so that the inner side of the circle formed by the first convex edge 2 and the second convex edge 3 can be accurately matched with the circular outer wall of the carrier 100 to complete the alignment.

[0037] In this embodiment, if Figure 1 As shown, in the wafer teaching auxiliary device, along the clockwise or counterclockwise direction of the circular main substrate 1, the first flange 2 includes a first end and a second end, and the second flange 3 also includes a first end and a second end. The first end of the first flange 2 is adjacent to the second end of the second flange 3 to form a first gap 11, and the first end of the second flange 3 is adjacent to the second end of the first flange 2 to form a second gap 12. Figure 4 As shown, the first gap 11 and the second gap 12 facilitate the wafer robot 300 to enter the bottom of the main substrate 1 to hold up the main substrate 1 .

[0038] In this embodiment, if Figure 1 As shown, the distance between the first gap 11 and the second gap 12 is the same and symmetrically distributed, so that the wafer robot 300 can enter the bottom of the main substrate 1 from the first gap 11 or the second gap 12 to lift the main substrate 1, making the use of the wafer teaching auxiliary device more convenient.

[0039] In this embodiment, if Figure 1 As shown, the central angle range of the arc length of the first convex edge 2 is 90° to 150°, and the central angle range of the arc length of the second convex edge 3 is 90° to 150°. For example, the central angles corresponding to the arc lengths of the first convex edge 2 and the second convex edge 3 may be 90°, 100°, 120°, etc.

[0040] In this embodiment, the height of the first flange 2 and the second flange 3 may be 2-5 mm, for example, 3 mm, and the width may be 3-8 mm, for example, 5 mm.

[0041] In this embodiment, if Figure 5As shown, the upper surface of the main substrate 1 may be provided with a first groove 4 and a second groove 5. The first groove 4 is located directly above the first convex edge 2, and the shape of the first groove 4 is the same as the bottom shape of the first convex edge 2. The second groove 5 is located directly above the second convex edge 3, and the shape of the second groove 5 is the same as the bottom shape of the second convex edge 3.

[0042] like Figure 6 As shown, when there are multiple wafer teaching auxiliary devices, the multiple wafer teaching auxiliary devices can be stacked and stored, and the first convex edge 2 and the second convex edge 3 of the upper wafer teaching auxiliary device are placed in the first groove 4 and the second groove 5 of the lower wafer teaching auxiliary device, so that the stacked storage of the multiple wafer teaching auxiliary devices is more stable. At the same time, when taking out, there are gaps between adjacent wafer teaching auxiliary devices, which is convenient for taking out.

[0043] like Figure 5 and Figure 7 As shown, this embodiment also provides a wafer teaching system, including the wafer teaching auxiliary device in the above scheme; and also including a carrier 100 and a lifting device 200. The lifting device 200 is evenly distributed around the circumference of the carrier 100, and the lifting device 200 includes a lifting head 201.

[0044] When in use, after the first flange 2 and the second flange 3 of the wafer teaching auxiliary device are stuck on the edge of the carrier 100, the lifting device 200 drives the lifting head 201 to rise to lift the wafer teaching auxiliary device so that the lower surface of the main substrate 1 of the wafer teaching auxiliary device is a predetermined distance away from the upper surface of the carrier 100.

[0045] It should be noted that the lifting head 201 of the lifting device 200 can move to a position lower than the carrier 100, and after the wafer teaching auxiliary device is placed, the lifting head 201 of the lifting device 200 is at a position lower than the first flange 2 and the second flange 3. When the lifting head 201 of the lifting device 200 rises, the lifting head can lift the first flange 2 and the second flange 3 to achieve a predetermined distance between the lower surface of the main substrate 1 and the upper surface of the carrier 100. In addition, the lifting head 201 can also have a slope toward the side of the carrier 100. When the lifting head 201 rises, the slope is used to fit the edge of the main substrate 1 of the wafer teaching auxiliary device to lift the wafer teaching auxiliary device to rise.

[0046] In this embodiment, if Figure 3 As shown, a first position sensor 101 is arranged on the side of the carrier 100 , and after the first convex edge 2 and the second convex edge 3 of the wafer teaching auxiliary device are clamped on the edge of the carrier 100 , the inner side of the first convex edge 2 or the second convex edge 3 blocks the first position sensor 101 .

[0047] When the wafer teaching auxiliary device is aligned with the carrier 100, the inner side of the first convex edge 2 or the second convex edge 3 blocks the first position sensor 101. The first position sensor 101 can further be used to transmit a blocking signal to prompt the staff that the wafer teaching auxiliary device and the carrier 100 have been aligned.

[0048] In this embodiment, if Figure 4 As shown, the wafer teaching system includes a wafer robot 300 , and the wafer robot 300 is provided with a marking line 301 for aligning with the edge of the main substrate 1 of the wafer teaching auxiliary device.

[0049] During use, when the lower surface of the main substrate 1 of the wafer teaching auxiliary device is at a predetermined distance from the upper surface of the carrier 100, the wafer robot 300 enters the lower side of the wafer teaching auxiliary device through between the first convex edge 2 and the second convex edge 3, and aligns the marking line 301 with the edge of the main substrate 1 of the wafer teaching auxiliary device to complete the robot teaching alignment.

[0050] like Figure 4 As shown, a second position sensor 302 can also be set on the inner side of the wafer robot 300 adjacent to the identification line 301. When the edge of the main substrate 1 just covers the second position sensor 302, it means that the edge of the main substrate 1 will be aligned with the identification line 301, so as to remind the staff to operate carefully and complete the alignment.

[0051] In this embodiment, if Figure 7 As shown, the wafer teaching system may further include a camera 400, which is disposed above the carrier 100 and faces the position where the edge of the main substrate 1 of the wafer teaching auxiliary device is aligned with the identification line 301 of the wafer robot 300. The camera 400 facilitates the staff to observe whether the edge of the main substrate 1 is aligned with the identification line 301 of the wafer robot 300.

[0052] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer teaching auxiliary device, characterized in that: include: A main substrate (1) having the same size and shape as the wafer; A first convex edge (2) and a second convex edge (3), wherein the first convex edge (2) and the second convex edge (3) are respectively arranged on both side edges of the lower surface of the main substrate (1); Wherein, the first convex edge (2) and the second convex edge (3) are symmetrically distributed.

2. The wafer teaching auxiliary device according to claim 1, characterized in that: The main substrate (1) is circular, and the first convex edge (2) and the second convex edge (3) form a circle with a predetermined diameter.

3. The wafer teaching auxiliary device according to claim 2, characterized in that: In a clockwise or counterclockwise direction, the first flange (2) comprises a first end and a second end, and the second flange (3) also comprises a first end and a second end. The first end of the first flange (2) is adjacent to the second end of the second flange (3) to form a first gap (11), and the first end of the second flange (3) is adjacent to the second end of the first flange (2) to form a second gap (12).

4. The wafer teaching auxiliary device according to claim 3, characterized in that: The distance between the first neutral position (11) and the second neutral position (12) is the same and symmetrically distributed.

5. The wafer teaching auxiliary device according to any one of claims 2 to 4, characterized in that: The arc length of the first convex edge (2) corresponds to a central angle range of 90° to 150°, and the arc length of the second convex edge (3) corresponds to a central angle range of 90° to 150°.

6. The wafer teaching auxiliary device according to any one of claims 2 to 4, characterized in that: A first groove (4) and a second groove (5) are provided on the upper surface of the main substrate (1); The first groove (4) is located directly above the first convex edge (2), and the shape of the first groove (4) is the same as the shape of the bottom surface of the first convex edge (2); The second groove (5) is located directly above the second convex edge (3), and the shape of the second groove (5) is the same as the shape of the bottom surface of the second convex edge (3).

7. A wafer teaching system, characterized in that: It comprises the wafer teaching auxiliary device as claimed in any one of claims 1 to 6; and also comprises a carrier platform (100) and a lifting device (200); The lifting devices (200) are evenly distributed around the circumference of the supporting platform (100), and the lifting devices (200) include a lifting head (201); When in use, after the first convex edge (2) and the second convex edge (3) of the wafer teaching auxiliary device are clamped on the edge of the carrier (100), the lifting device (200) drives the lifting head (201) to rise to lift the wafer teaching auxiliary device, so that the lower surface of the main substrate (1) of the wafer teaching auxiliary device is at a predetermined distance from the upper surface of the carrier (100).

8. The wafer teaching system according to claim 7, characterized in that: A first position sensor (101) is arranged on the side of the carrier platform (100), and after the first convex edge (2) and the second convex edge (3) of the wafer teaching auxiliary device are clamped on the edge of the carrier platform (100), the inner side of the first convex edge (2) or the second convex edge (3) blocks the first position sensor (101).

9. The wafer teaching system according to claim 7, characterized in that: It comprises a wafer robot (300), on which a marking line (301) is provided for aligning with the edge of a main substrate (1) of the wafer teaching auxiliary device.

10. The wafer teaching system according to claim 9, characterized in that: It also includes a camera (400) which is arranged above the carrier platform (100) and faces a position where the edge of the main substrate (1) of the wafer teaching auxiliary device is aligned with the identification line (301) of the wafer robot (300).

Images