Etching device for semiconductor chip production

Abstract

The utility model relates to the technical field of semiconductor chip production, and discloses an etching device for semiconductor chip production, which comprises a bearing plate, the left side of the top of the bearing plate is fixedly connected with an etching box, the bottom of the right side of the etching box is fixedly connected with a liquid outlet pipe, and the top end of the right side of the liquid outlet pipe is fixedly connected with a filter box. Cavities are formed in the front side and the rear side of the filter box correspondingly, limiting plates are slidably connected into the two cavities correspondingly, pulling plates are fixedly connected to the middles of the two limiting plates correspondingly, the pulling plates are sleeved with first springs, and a filter plate is arranged in the filter box. And clamping assemblies are arranged in the middles of the front side and the rear side of the filter plate. According to the utility model, the used etching liquid is filtered, the etching liquid can be recycled and reused, and the filter plate can be detached, so that a worker can clean or replace the filter plate.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip production, in particular to an etching device for semiconductor chip production. Background Art

[0002] Etching equipment is used to remove excess material on the surface of the chip. At a certain stage of the process, it may be necessary to remove some unnecessary or non-designed materials to ensure that the structure and performance of the chip meet expectations. Etching equipment can etch away materials in specific areas to help form tiny structures such as channels, wires, connectors, etc. This is crucial to the functionality and performance of the chip.

[0003] After searching: Chinese patent announcement number: CN216528790U, it relates to the field of semiconductor chip production technology, and discloses an etching device for semiconductor chip production, including a box, an etching chamber, a lifting mechanism, a placement mechanism, a top cover, a valve, a window and a discharge valve; the utility model has a reasonable and simple structure, low production cost, convenient installation, and complete functions. The motor 2 is set, which can drive the placement seat to move right to expose the placement groove, and then the semiconductor chip can be directly placed in the placement groove, thereby improving the convenience of taking and placing the semiconductor chip during etching treatment; the motor 1 set in the utility model can drive the front and rear sliders to synchronously drive the placement mechanism to move downward as a whole, so that the semiconductor chip can be moved to the etching solution for etching treatment, thereby avoiding the inconvenience and trouble caused by manual movement; the valve set in the utility model is only opened when the semiconductor chip is taken and placed, so that the emission of toxic gases is relatively limited, thereby ensuring the physical and mental health of the staff.

[0004] The above patent embodiment states that "the motor 1 provided in the utility model can drive the front and rear sliders to synchronously drive the placement mechanism to move downward as a whole, so that the semiconductor chip can be moved into the etching liquid for etching treatment." In the above embodiment, the motor 1 drives the slider 1 to move, and then the slider 1 drives the placement mechanism to move downward as a whole, so that the semiconductor can be etched, but the etching liquid cannot be filtered, recovered and reused after use, which will lead to an increase in production costs. Therefore, in view of the above-mentioned deficiencies, a new etching device for semiconductor chip production is proposed. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes an etching device for semiconductor chip production, aiming to improve the problem in the prior art that the etching liquid cannot be filtered, recovered and reused.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The top of the water pump is fixedly connected to the water pump, and the bottom of the water pump is fixedly connected to the water pump, and the bottom of the water pump is fixedly connected to the water pump, and the right top end of the water pump is fixedly connected to the water pump, and the left top end of the water pump is fixedly connected to the water pump, and the bottom of the water pump is fixedly connected to the water pump, and the left top end of the water pump is fixedly connected to the water pump, and the bottom of the water pump is fixedly connected to the water pump.

[0008] Furthermore, the snap-fit ​​assembly includes two snap-fit ​​grooves, one of which is opened in the middle of the rear side of the filter plate, and the other snap-fit ​​groove is opened on the front side of the filter plate, and the adjacent sides of the two pulling plates are respectively snap-fitted with the inside of the two snap-fit ​​grooves.

[0009] Furthermore, the top of the etching box is rotatably connected to a box cover, the four bottom corners of the box cover are fixedly connected to pressure plates, the left and right sides of the inside of the etching box are fixedly connected to fixed plates, the top of the fixed plate is fixedly connected to a fixed column, the outer part of the fixed column is provided with a second spring, the top of the fixed column is slidably connected to a sliding plate one, and the bottom end of the fixed column is slidably connected to a placement basket.

[0010] Furthermore, one end of the spring 1 is fixedly connected to the far side of the two limit plates, and the other end of the spring 1 is fixedly connected to the far side inner walls of the two cavities.

[0011] Furthermore, the outside of the pulling plate is slidably connected to the inside of the cavity, and the other end of the connecting pipe is fixedly connected to the input end of the water pump.

[0012] Furthermore, the top right side of the liquid dispensing pipe penetrates the right side inner wall of the etching box and extends outward, and the left side of the liquid outlet pipe penetrates the right side outer part of the etching box and extends inward.

[0013] Furthermore, one end of the second spring is fixedly connected to the bottom of the first sliding plate, and the other end of the second spring is fixedly connected to the top of the fixed plate.

[0014] Furthermore, the top of the sliding plate 1 contacts the bottom of the left and right sides of the placement basket, and the bottom of the pressing plate contacts the top of the left and right sides of the placement basket.

[0015] The utility model has the following beneficial effects:

[0016] 1. In the utility model, through the cooperation of the supporting plate, the etching box, the liquid outlet pipe, the filter box, the cavity, the limit plate and other structures, the used etching liquid can be filtered, the etching liquid can be recovered and reused, and the filter plate can be disassembled so that the staff can clean or replace it.

[0017] 2. In the utility model, through the cooperation of the box cover, the pressure plate, the fixed plate, the fixed column, the second spring, the first sliding plate and other structures, the placement basket can be lowered when the box cover is closed, so that the semiconductor chips placed inside the placement basket can be immersed in the etching liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of an etching device for producing semiconductor chips proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of an etching box of an etching device for producing semiconductor chips proposed by the utility model;

[0020] Figure 3 The utility model is a schematic diagram of the internal structure of a cavity of an etching device for producing semiconductor chips.

[0021] Legend:

[0022] 1. Carrying plate; 2. Etching box; 3. Liquid outlet pipe; 4. Filter box; 5. Cavity; 6. Limiting plate; 7. Pulling plate; 8. Spring 1; 9. Filter plate; 10. Engaging groove; 11. Connecting pipe 1; 12. Water pump; 13. Connecting pipe 2; 14. Liquid dispensing pipe; 15. Nozzle; 16. Box cover; 17. Pressing plate; 18. Fixed plate; 19. Fixed column; 20. Spring 2; 21. Sliding plate 1; 22. Placement basket. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1 - Figure 3The utility model provides an embodiment: an etching device for semiconductor chip production, comprising a carrier plate 1, an etching box 2 is fixedly connected to the left side of the top of the carrier plate 1, and a liquid outlet pipe 3 is fixedly connected to the bottom right of the etching box 2, so that the etching liquid inside the etching box 2 can enter the inside of the liquid outlet pipe 3 under the action of gravity, and a filter box 4 is fixedly connected to the top right of the liquid outlet pipe 3, and then the etching liquid cabinet enters the inside of the filter box 4 through the inside of the liquid outlet pipe 3, and cavities 5 are opened inside the front and back sides of the filter box 4, and the insides of the two cavities 5 are slidably connected to limit plates 6, and the middle parts of the two limit plates 6 are fixedly connected to pull plates 7.

[0025] Therefore, when the pulling plate 7 moves, it will drive the limit plate 6 to slide inside the cavity 5. A spring 8 is sleeved on the outside of the pulling plate 7, and a filter plate 9 is arranged inside the filter box 4. A snap-fit ​​assembly is provided in the middle of the front and rear sides of the filter plate 9. The snap-fit ​​assembly includes two snap-fit ​​grooves 10, one of which is provided in the middle of the rear side of the filter plate 9, and the other snap-fit ​​groove 10 is provided on the front side of the filter plate 9. The adjacent sides of the two pulling plates 7 are respectively snapped with the inside of the two snap-fit ​​grooves 10, so that the pulling plate 7 can fix the filter plate 9 inside the filter box 4 by snapping with the snap-fit ​​grooves 10. A connecting pipe 11 is fixedly connected to the right side of the filter box 4, and a water pump 12 is fixedly connected to the top front side of the supporting plate 1.

[0026] The output end of the water pump 12 is fixedly connected to a connecting pipe 2 13, the left top end of the connecting pipe 2 13 is fixedly connected to a liquid dispensing pipe 14, and the bottom of the liquid dispensing pipe 14 is fixedly connected to a plurality of nozzles 15, one end of a spring 18 is fixedly connected to the far side of the two limit plates 6, and the other end of the spring 18 is fixedly connected to the far inner wall of the two cavities 5, so that the limit plates 6 will compress the spring 18 when they move, and the outer part of the pulling plate 7 is slidably connected to the inside of the cavity 5, the other end of the connecting pipe 11 is fixedly connected to the input end of the water pump 12, the right top end of the liquid dispensing pipe 14 penetrates the right inner wall of the etching box 2 and extends outward, and the left side of the liquid outlet pipe 3 penetrates the right outer part of the etching box 2 and extends inward.

[0027] Thus, starting the water pump 12 can make the water pump 12 generate suction to the inside of the connecting pipe 11, so that the etching liquid in the etching box 2 enters the inside of the filter box 4 through the liquid outlet pipe 3, and then the etching liquid passes through the filter plate 9 to be filtered, so that the filtered etching liquid enters the inside of the connecting pipe 11, and then enters the input end of the water pump 12, and then enters the inside of the connecting pipe 2 13 from the output end of the water pump 12, and then the etching liquid enters the inside of the liquid distribution pipe 14 from the inside of the connecting pipe 2 13, and finally is sprayed out from the nozzle 15, so that it re-enters the inside of the etching box 2, completing the purification, recovery and reuse of the etching liquid.

[0028] like Figure 1 and Figure 2 As shown: the top of the etching box 2 is rotatably connected to a box cover 16, and the four corners of the bottom of the box cover 16 are fixedly connected to a pressing plate 17, the left and right sides of the inside of the etching box 2 are fixedly connected to a fixing plate 18, the top of the fixing plate 18 is fixedly connected to a fixing column 19, the outer part of the fixing column 19 is sleeved with a spring 20, the top of the fixing column 19 is slidably connected to a sliding plate 21, so that when the sliding plate 21 moves, the spring 20 will be compressed, and the bottom end of the fixing column 19 is slidably connected to a placement basket 22, one end of the spring 20 is fixedly connected to the bottom of the sliding plate 21, and the other end of the spring 20 is fixedly connected to the top of the fixed plate 18, and the top of the sliding plate 21 contacts the bottom of the left and right sides of the placement basket 22.

[0029] The bottom of the pressing plate 17 contacts the top of the left and right sides of the placement basket 22, and then pulls the box cover 16 to close the box cover 16 and the top of the etching box 2 to prevent the toxic gas of the etching solution from floating out of the device. When the box cover 16 and the top of the etching box 2 are closed, the pressing plate 17 presses the placement basket 22, and then the placement basket 22 slides outside the fixed column 19, and then the placement basket 22 drives the sliding plate 1 21 to compress the spring 2 20, so that the semiconductor chip placed inside the placement basket 22 can be placed in the etching solution to be etched.

[0030] Compared with some existing technologies, the above content enables the device to filter the used etching liquid during use, and can recycle the etching liquid for reuse, and can disassemble the filter plate 9 so that the staff can clean or replace it, and can lower the placement basket 22 when the box cover 16 is closed, so that the semiconductor chips placed inside the placement basket 22 can be immersed in the etching liquid.

[0031] Working principle: first, the etching liquid is injected into the etching box 2, and then the semiconductor chip is placed in the placement basket 22, and then the box cover 16 is closed, so that the box cover 16 and the top of the etching box 2 are closed to prevent the toxic gas of the etching liquid from floating out of the device. When the box cover 16 and the top of the etching box 2 are closed, the pressing plate 17 will press the placement basket 22, and then the placement basket 22 will slide outside the fixed column 19, and then the placement basket 22 will drive the sliding plate 1 21 to compress the spring 2 20, so that the semiconductor chip placed in the placement basket 22 can be placed in the etching liquid to be etched. When the etching of the semiconductor chip is completed, the box cover 16 is pulled, so that the box cover 16 drives the pressing plate 17 to rise, and then the pressing plate 17 stops pressing the placement basket 22, and then the spring 20 will reset, so that under the action of the spring 20 resetting, the sliding plate 1 21 will drive the placement basket 22 to rise, so that the semiconductor chip placed inside is taken out by the staff. When the etching is completed, The water pump 12 can be started to generate suction on the inside of the connecting pipe 11, so that the etching liquid in the etching box 2 can enter the inside of the filter box 4 through the liquid outlet pipe 3, and then the etching liquid can pass through the filter plate 9 to be filtered, so that the filtered etching liquid can enter the inside of the connecting pipe 11, and then enter the input end of the water pump 12, and then enter the inside of the connecting pipe 2 13 from the output end of the water pump 12, and then the etching liquid can enter the inside of the liquid distribution pipe 14 from the inside of the connecting pipe 2 13, and finally be sprayed out from the nozzle 15, so that it can re-enter the inside of the etching box 2, and complete the purification, recycling and reuse of the etching liquid. When the filter plate 9 is blocked due to long use time, the pulling plate 7 can be pulled to drive the limiting plate 6 to slide inside the cavity 5, so that the limiting plate 6 can compress the spring 18, and then the pulling plate 7 can be disengaged from the engaging groove 10, and then the filter plate 9 can be taken out from the inside of the filter box 4, so that the staff can clean or replace it.

[0032] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An etching device for producing semiconductor chips, comprising a carrier plate (1), characterized in that: The left side of the top of the carrying plate (1) is fixedly connected to an etch box (2), the right bottom of the etch box (2) is fixedly connected to a liquid outlet pipe (3), the top of the right side of the liquid outlet pipe (3) is fixedly connected to a filter box (4), the front and rear sides of the filter box (4) are provided with cavities (5), the interiors of the two cavities (5) are slidably connected to limit plates (6), the middle parts of the two limit plates (6) are fixedly connected to a pulling plate (7), the outside of the pulling plate (7) is provided with a spring (8), A filter plate (9) is arranged inside the filter box (4), and a snap-fit ​​assembly is provided in the middle of both the front and rear sides of the filter plate (9). A connecting pipe (11) is fixedly connected to the right side of the filter box (4), a water pump (12) is fixedly connected to the top front side of the supporting plate (1), a connecting pipe (13) is fixedly connected to the output end of the water pump (12), a liquid dispensing pipe (14) is fixedly connected to the top left side of the connecting pipe (13), and a plurality of nozzles (15) are fixedly connected to the bottom of the liquid dispensing pipe (14).

2. The etching device for semiconductor chip production according to claim 1, characterized in that: The snap-fit ​​assembly comprises two snap-fit ​​grooves (10), one of which is arranged at the middle of the rear side of the filter plate (9), and the other snap-fit ​​groove (10) is arranged at the front side of the filter plate (9), and the adjacent sides of the two pulling plates (7) are snap-fitted with the inside of the two snap-fit ​​grooves (10) respectively.

3. The etching device for semiconductor chip production according to claim 1, characterized in that: The top of the etching box (2) is rotatably connected to a box cover (16), and the four corners of the bottom of the box cover (16) are fixedly connected to pressure plates (17). The left and right sides of the inside of the etching box (2) are fixedly connected to fixed plates (18), and the top of the fixed plate (18) is fixedly connected to a fixed column (19), and the outside of the fixed column (19) is provided with a second spring (20). The top of the fixed column (19) is slidably connected to a sliding plate (21), and the bottom of the fixed column (19) is slidably connected to a placement basket (22).

4. The etching device for semiconductor chip production according to claim 1, characterized in that: One end of the spring one (8) is fixedly connected to the far side of the two limit plates (6), and the other end of the spring one (8) is fixedly connected to the far side inner wall of the two cavities (5).

5. The etching device for semiconductor chip production according to claim 1, characterized in that: The outside of the pulling plate (7) is slidably connected to the inside of the cavity (5), and the other end of the connecting pipe (11) is fixedly connected to the input end of the water pump (12).

6. The etching device for semiconductor chip production according to claim 1, characterized in that: The right top end of the liquid distribution pipe (14) penetrates the right inner wall of the etching box (2) and extends outwards, and the left side of the liquid outlet pipe (3) penetrates the right outer side of the etching box (2) and extends inwards.

7. The etching device for semiconductor chip production according to claim 3, characterized in that: One end of the second spring (20) is fixedly connected to the bottom of the first sliding plate (21), and the other end of the second spring (20) is fixedly connected to the top of the fixed plate (18).

8. The etching device for semiconductor chip production according to claim 3, characterized in that: The top of the sliding plate 1 (21) contacts the bottom of the left and right sides of the placement basket (22), and the bottom of the pressing plate (17) contacts the top of the left and right sides of the placement basket (22).

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