Coupler, radio frequency circuit board and electronic equipment
By setting up RF holes and coupling holes on multi-layer circuit boards to form RF channels and coupling channels, the problem of a separate coupler in electronic products such as 5G mobile phones increases plug-in loss and space occupancy, and the efficient coupling and circuit of RF signals are achieved Efficient use of board space.
Patent Information
- Application Number
- CN202421162363.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-02-14
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In electronic products such as 5G mobile phones, a separate coupler increases the plug-in and loss of the RF path and occupies a large amount of space, reducing the space utilization of the circuit board.
By setting up radio frequency holes and coupling holes close to each other on the multi-layer circuit board, a radio frequency channel and a coupling channel are formed, and the coupling is formed by electrical connection of the pads to achieve coupling of the radio frequency signals, reducing the dependence on separate couplers.
This method reduces the loss of RF signals and improves the space utilization of the circuit board, avoiding space and material consumption for additional couplers.
Smart Images
Figure CN222483664U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of electronic equipment, and in particular to a coupler, a radio frequency circuit board, and an electronic device. Background Art
[0002] Electronic devices such as wireless communication products such as mobile phones and tablets generally require couplers for transmission power feedback in the RF transmission path.
[0003] At present, for example, for 4G mobile phones, the coupler can be integrated with the front-end RF amplifier. However, for electronic products such as 5G mobile phones that require more RF channels, a separate coupler needs to be added during the design. The separate coupler is connected in series in the circuit, and since the coupler itself has a loss of 0.3dB to 0.5dB, the insertion loss of the RF channel is increased. In addition, since the separate coupler occupies a large placement space, the space utilization rate of the circuit board is reduced. Utility Model Content
[0004] Based on this, it is necessary to address the above technical problems. The present application provides a coupler, a radio frequency circuit board and an electronic device, which are beneficial to reducing the loss of radio frequency signals and improving the space utilization of the circuit board.
[0005] In a first aspect, the present application provides a coupler, comprising a radio frequency hole and a coupling hole arranged on a multi-layer circuit board;
[0006] A first pad is arranged on each layer of the circuit board around the radio frequency hole, and a second pad is arranged on each layer of the circuit board around the coupling hole, each of the first pads is electrically connected through the radio frequency hole to form a radio frequency channel, and each of the second pads is electrically connected through the coupling hole to form a coupling channel;
[0007] The multi-layer circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are two layers of circuit boards in the multi-layer circuit board; the first soldering pad of the first circuit board and the second soldering pad of the second circuit board have a facing area in the vertical direction, so that the radio frequency signal passes through the radio frequency channel to generate a coupling signal in the coupling channel.
[0008] In some embodiments, the first circuit board and the second circuit board are two adjacent layers of circuit boards in the multi-layer circuit board.
[0009] In some embodiments, the multi-layer circuit board includes a top circuit board, a bottom circuit board, and an inner circuit board;
[0010] The first circuit board and the second circuit board are two layers of circuit boards in the inner circuit board.
[0011] In some embodiments, the inner circuit board includes a third circuit board adjacent to the top circuit board, and a fourth circuit board adjacent to the bottom circuit board;
[0012] The first circuit board and the second circuit board are two layers of circuit boards in the inner circuit board except the third circuit board and the fourth circuit board.
[0013] In some embodiments, the multilayer circuit board includes a plurality of pairs of the first circuit board and the second circuit board.
[0014] In some embodiments, the radio frequency channel includes an input end and an output end;
[0015] The input end and the output end are both located at the first pad on any layer of the multi-layer circuit board; or, the input end and the output end are respectively located at the first pads on any two layers of the multi-layer circuit board.
[0016] In some embodiments, the coupling channel includes a coupling end and an isolation end;
[0017] The coupling end and the isolation end are both located at the second pad on any layer of the multi-layer circuit board; or, the coupling end and the isolation end are respectively located at the second pads on any two layers of the multi-layer circuit board.
[0018] In some embodiments, the distance between the RF hole and the coupling hole ranges from 0.8 mm to 1.0 mm.
[0019] In a second aspect, the present application also provides a radio frequency circuit board, including:
[0020] The coupler as described in the first aspect;
[0021] A multi-layer circuit board, the coupler is formed by the multi-layer circuit board.
[0022] In a third aspect, the present application also provides an electronic device, including the radio frequency circuit board as in the second aspect.
[0023] The coupler provided in the embodiment of the present application includes a radio frequency hole and a coupling hole arranged on a multilayer circuit board; a first pad is arranged on each layer of the circuit board around the radio frequency hole, and a second pad is arranged on each layer of the circuit board around the coupling hole, each first pad is electrically connected through the radio frequency hole to form a radio frequency channel, and each second pad is electrically connected through the coupling hole to form a coupling channel; the multilayer circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are two layers of circuit boards in the multilayer circuit board; the first pad of the first circuit board and the second pad of the second circuit board have a facing area in the vertical direction, so that the radio frequency signal passes through the radio frequency channel and generates a coupling signal in the coupling channel. Thus, by setting two through holes close to each other on the multilayer circuit board, the radio frequency channel and the coupling channel are respectively formed correspondingly, when the radio frequency channel formed by the radio frequency hole transmits the radio frequency signal, the coupling signal can be generated in the coupling channel formed by the coupling hole, so that the through hole set on the multilayer circuit board can be used to form a coupler, without the need to set up a separate coupler, which can reduce the loss of the radio frequency signal. In addition, the space of the two through holes set on the multilayer circuit board is used to replace the space of the coupler, which can reduce the layout space of the circuit board, which is conducive to improving the space utilization rate of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0026] Figure 1 A schematic diagram of the structure of a radio frequency circuit board provided in an embodiment of the present application;
[0027] Figure 2 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application;
[0028] Figure 3 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application;
[0029] Figure 4 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application;
[0030] Figure 5 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application.
[0031] Among them, 010, RF circuit board; 11, RF hole; 12, coupling hole; 21, first solder pad; 22, second solder pad; 111, RF channel; 112, coupling channel; 011, first circuit board; 012, second circuit board; 013, third circuit board; 014, fourth circuit board; 01, first layer circuit board; 02, second layer circuit board; 03, third layer circuit board; 04, fourth layer circuit board; 05, fifth layer circuit board; 06, sixth layer circuit board; 07, seventh layer circuit board; 08, eighth layer circuit board; 09, ninth layer circuit board; 10, tenth layer circuit board; A, input end; B, output end; C, coupling end; D, isolation end. DETAILED DESCRIPTION
[0032] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0033] The coupler provided in the embodiment of the present application forms a radio frequency channel and a coupling channel respectively by setting two through holes close to each other on a multi-layer circuit board. When the radio frequency channel formed by the radio frequency hole transmits a radio frequency signal, a coupling signal can be generated in the coupling channel formed by the coupling hole. Thus, the through holes set on the multi-layer circuit board can be used to form a coupler without setting up a separate coupler, which can reduce the loss of radio frequency signals. In addition, the space of the coupler can be replaced by the space of the two through holes set on the multi-layer circuit board, which can reduce the layout space of the circuit board, which is beneficial to improve the space utilization rate of the circuit board. Since there is no need to set up a coupler additionally, materials can be reduced, which is beneficial to saving costs.
[0034] The following is an illustrative description of the coupler, radio frequency circuit board, and electronic device provided in the embodiments of the present application in conjunction with the accompanying drawings.
[0035] Figure 1 A schematic diagram of the structure of a radio frequency circuit board provided in an embodiment of the present application. Figure 1As shown, the RF circuit board 010 includes a multi-layer circuit board and a coupler formed by the multi-layer circuit board. The coupler includes a RF hole 11 and a coupling hole 12 set on the multi-layer circuit board. A first soldering pad 21 is set on each layer of the circuit board around the RF hole 11, and a second soldering pad 22 is set on each layer of the circuit board around the coupling hole 12. Each first soldering pad 21 is electrically connected through the RF hole 11 to form a RF channel 111, and each second soldering pad 22 is electrically connected through the coupling hole 12 to form a coupling channel 112; the multi-layer circuit board includes a first circuit board 011 and a second circuit board 012, and the first circuit board 011 and the second circuit board 012 are two layers of circuit boards in the multi-layer circuit board; the first soldering pad 21 of the first circuit board 011 and the second soldering pad 22 of the second circuit board 012 have a facing area in the vertical direction, so that the RF signal passes through the RF channel 111 to generate a coupling signal in the coupling channel 112.
[0036] Specifically, Figure 1 The RF circuit board is shown in the figure as an example, including three layers of circuit boards, including a first layer of circuit board 01, a second layer of circuit board 02 and a third layer of circuit board 03 stacked in order from the top layer to the bottom layer. Among them, between the first layer of circuit board 01 and the second layer of circuit board 02, and between the second layer of circuit board 02 and the third layer of circuit board 03 is a dielectric board 13.
[0037] like Figure 1 As shown, two adjacent through holes are provided on the RF circuit board, which serve as the RF hole 11 and the coupling hole 12 respectively. A first solder pad 21 is formed on each layer of the circuit board around the RF hole 11, and copper is plated on the inner wall of the RF hole 11, so that the first solder pad 21 on each layer of the circuit board can be electrically connected through the RF hole 11 to form a RF channel 111, and the RF channel 111 serves as a transmission channel for RF signals; similarly, a second solder pad 22 is formed on each layer of the circuit board around the coupling hole 12, and copper is plated on the inner wall of the RF hole 11, so that the second solder pad 22 on each layer of the circuit board can be electrically connected through the coupling hole 12 to form a coupling channel 112, and the coupling channel 112 serves as a transmission channel for coupled signals.
[0038] Figure 1 In the figure, the first layer circuit board 01 is exemplarily shown as the first circuit board 011, the third layer circuit board 03 is used as the second circuit board 012, and the first pad 21 of the first circuit board 011 and the second pad 22 of the second circuit board 012 have a facing area in the vertical direction YY' (such as Figure 1 When a radio frequency signal is transmitted in the radio frequency channel 111 formed corresponding to the radio frequency hole 11, a coupling signal may be generated in the coupling channel 112 formed corresponding to the coupling hole 12.
[0039] Specifically, the diameters of the first pad 21 on the first circuit board 011 and the second pad 22 on the second circuit board 012 can be set to be d1, and the diameters of the first pad 21 and the second pad 22 on the second circuit board 02 can be set to be d2, wherein d1 is greater than d2, thereby achieving that the first pad 21 of the first circuit board 011 and the second pad 22 of the second circuit board 012 have a facing area in the vertical direction YY' (such as Figure 1 (as indicated by the line in the middle).
[0040] When the first solder pad 21 of the first circuit board 011 and the second solder pad 22 of the second circuit board 012 have a facing area in the vertical direction YY', the first solder pad 21 of the first circuit board 011 and the second solder pad 22 of the second circuit board 012 can form a pair of coupling capacitors, and the RF signal transmitted in the RF channel 111 can generate a coupling signal in the coupling channel 112.
[0041] Therefore, the embodiment of the present application sets a through hole on the multi-layer circuit board to replace the space of the coupler, and combines the design size of the pad on the multi-layer circuit board to form a coupler on the multi-layer circuit board. There is no need to set up a separate coupler, which can reduce the loss of radio frequency signals and reduce the layout space of the circuit board, which is conducive to improving the space utilization of the circuit board.
[0042] The coupler provided in the embodiment of the present application includes a radio frequency hole and a coupling hole arranged on a multilayer circuit board; a first pad is arranged on each layer of the circuit board around the radio frequency hole, and a second pad is arranged on each layer of the circuit board around the coupling hole, each first pad is electrically connected through the radio frequency hole to form a radio frequency channel, and each second pad is electrically connected through the coupling hole to form a coupling channel; the multilayer circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are two layers of circuit boards in the multilayer circuit board; the first pad of the first circuit board and the second pad of the second circuit board have a facing area in the vertical direction, so that the radio frequency signal passes through the radio frequency channel and generates a coupling signal in the coupling channel. Thus, by setting two through holes close to each other on the multilayer circuit board, the radio frequency channel and the coupling channel are respectively formed correspondingly, when the radio frequency channel formed by the radio frequency hole transmits the radio frequency signal, the coupling signal can be generated in the coupling channel formed by the coupling hole, so that the through hole set on the multilayer circuit board can be used to form a coupler, without the need to set up a separate coupler, which can reduce the loss of the radio frequency signal. In addition, the space of the two through holes set on the multilayer circuit board is used to replace the space of the coupler, which can reduce the layout space of the circuit board, which is conducive to improving the space utilization rate of the circuit board. Since there is no need to set up a coupler additionally, materials can be reduced, which is conducive to saving costs.
[0043] In some embodiments, Figure 2 This is a schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application. Figure 2As shown, the RF circuit board 010 is exemplarily shown to include three layers of circuit boards, including a first layer circuit board 01, a second layer circuit board 02 and a third layer circuit board 03 stacked in order from the top layer to the bottom layer. Two adjacent through holes are set on the RF circuit board 010, which are used as a RF hole 11 and a coupling hole 12 respectively. Figure 2 In the embodiment, the second layer circuit board 02 is used as the first circuit board 011, and the third layer circuit board 03 is used as the second circuit board 012. The first pad 21 of the first circuit board 011 and the second pad 22 of the second circuit board 012 have a facing area in the vertical direction YY' (such as Figure 2 When a radio frequency signal is transmitted in the radio frequency channel 111 formed corresponding to the radio frequency hole 11, a coupling signal may be generated in the coupling channel 112 formed corresponding to the coupling hole 12.
[0044] Specifically, compared to Figure 1 The RF circuit board shown, Figure 2 The RF circuit board shown in the figure uses the two adjacent layers of circuit boards in the multi-layer circuit board, namely the second layer circuit board 02 and the third layer circuit board 03, as the first circuit board 011 and the second circuit board 012, and increases the coupling capacitance by shortening the facing distance between the first pad 21 and the second pad 22, thereby generating a larger capacitive coupling effect, which is beneficial to improving the pickup of coupling energy in the facing area, thereby facilitating the generation of coupling signals in the corresponding coupling channel 112 when the RF signal is transmitted in the RF channel 111.
[0045] Reference Figure 1 and Figure 2 Since the first layer circuit board 01 and the third layer circuit board 03 are used as surface circuit boards, many devices usually need to be arranged on the surface circuit boards. When the size of the pads formed on the surface circuit boards is large, it is not conducive to the arrangement of other devices.
[0046] Based on this, two layers of circuit boards in the inner circuit board can be set as the first circuit board and the second circuit board respectively. Figure 3 This is a schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application. Figure 3 As shown, the RF circuit board may include four layers of circuit boards, including a first layer of circuit board 01, a second layer of circuit board 02, a third layer of circuit board 03 and a fourth layer of circuit board 04 stacked in sequence from the top layer to the bottom layer. Among them, the first layer of circuit board 01 is used as the top layer circuit board, the fourth layer of circuit board 04 is used as the bottom layer circuit board, and the second layer of circuit board 02 and the third layer of circuit board 03 are used as inner layer circuit boards.
[0047] exist Figure 3In the embodiment, the second layer circuit board 02 can be used as the first circuit board 011, and the third layer circuit board 03 can be used as the second circuit board 012. The first pad 21 of the first circuit board 011 and the second pad 22 of the second circuit board 012 have a facing area in the vertical direction YY' (such as Figure 3 When the RF channel 111 formed corresponding to the RF hole 11 transmits a RF signal, a coupling signal may be generated in the coupling channel 112 formed corresponding to the coupling hole 12.
[0048] Therefore, by setting the first circuit board 011 and the second circuit board 012 as inner circuit boards, it is beneficial to improve the space utilization rate of the surface circuit boards.
[0049] In some embodiments, the inner circuit board includes a third circuit board adjacent to the top circuit board and a fourth circuit board adjacent to the bottom circuit board; the first circuit board and the second circuit board are two layers of circuit boards in the inner circuit board except the third circuit board and the fourth circuit board.
[0050] Specifically, Figure 4 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application. Figure 4 The figure shows by way of example that the radio frequency circuit board includes six layers of circuit boards, including a first layer circuit board 01, a second layer circuit board 02, a third layer circuit board 03, a fourth layer circuit board 04, a fifth layer circuit board 05 and a sixth layer circuit board 06 stacked in sequence from the top layer to the bottom layer. Among them, the first layer circuit board 01 is the top layer circuit board, the sixth layer circuit board 06 is the bottom layer circuit board, and the second layer circuit board 02 to the fifth layer circuit board 05 are inner layer circuit boards. The second layer circuit board 02 adjacent to the top layer circuit board, i.e., the first layer circuit board 01, in the inner layer circuit board is the third circuit board 013, and the fifth layer circuit board 05 adjacent to the bottom layer circuit board, i.e., the sixth layer circuit board 06, is the fourth circuit board 014.
[0051] exist Figure 4 The fourth layer circuit board 04 can be used as the first circuit board 011, and the third layer circuit board 03 can be used as the second circuit board 012. The first pad 21 of the first circuit board 011 and the second pad 22 of the second circuit board 012 have a facing area in the vertical direction YY' (such as Figure 3 When the RF channel 111 formed corresponding to the RF hole 11 transmits a RF signal, a coupling signal may be generated in the coupling channel 112 formed corresponding to the coupling hole 12.
[0052] It should be noted that setting the first circuit board 011 and the second circuit board 012 as the two layers of circuit boards in the inner circuit board except the third circuit board 013 and the fourth circuit board 014 is beneficial to reducing the impedance of the RF signal transmitted in the RF channel 111, and reducing the impedance of the coupled signal transmitted in the coupling channel 112, which is beneficial to reducing the possibility of distortion of the RF signal and the coupled signal.
[0053] In some embodiments, the multilayer circuit board may include multiple pairs of first circuit boards and second circuit boards. Specifically, Figure 5 A schematic diagram of the structure of another radio frequency circuit board provided in an embodiment of the present application. Figure 5 The RF circuit board is exemplarily shown as a ten-layer circuit board, including a first-layer circuit board 01, a second-layer circuit board 02, a third-layer circuit board 03, a fourth-layer circuit board 04, a fifth-layer circuit board 05, a sixth-layer circuit board 06, a seventh-layer circuit board 07, an eighth-layer circuit board 08, a ninth-layer circuit board 09 and a tenth-layer circuit board 10 stacked sequentially from the top layer to the bottom layer. Among them, the first-layer circuit board 01 is used as the top-layer circuit board, the tenth-layer circuit board 10 is used as the bottom-layer circuit board, the second-layer circuit boards 02 to the ninth-layer circuit boards 09 are inner-layer circuit boards, the third-layer circuit board 03 can be the third circuit board 013, and the ninth-layer circuit board 09 can be the fourth circuit board 014.
[0054] exist Figure 5 In the embodiment, the third layer circuit board 03, the fifth layer circuit board 05 and the seventh layer circuit board 07 can be used as the second circuit board 012, and the fourth layer circuit board 04, the sixth layer circuit board 06 and the eighth layer circuit board can be used as the first circuit board 011.
[0055] Specifically, the third layer circuit board 03 and the fourth layer circuit board 04 can form a pair of first circuit board 011 and second circuit board 012, the fifth layer circuit board 05 and the sixth layer circuit board 06 can form a pair of first circuit board 011 and second circuit board 012, and the seventh layer circuit board 07 and the eighth layer circuit board 08 can form a pair of first circuit board 011 and second circuit board 012.
[0056] Among them, the first pad 21 of the fourth layer circuit board 04 and the second pad 22 formed by the third layer circuit board 03 form a pair of coupling capacitors, and the first pad 21 of the fourth layer circuit board 04 and the second pad 22 formed by the fifth layer circuit board 05 form a pair of coupling capacitors.
[0057] Similarly, the first pad 21 of the sixth layer circuit board 06 and the second pad 22 formed by the fifth layer circuit board 05 form a pair of coupling capacitors, and the first pad 21 of the sixth layer circuit board 06 and the second pad 22 formed by the seventh layer circuit board 07 form a pair of coupling capacitors.
[0058] The first pad 21 of the eighth-layer circuit board 08 and the second pad 22 formed by the seventh-layer circuit board 05 form a pair of coupling capacitors.
[0059] Therefore, by setting up multiple pairs of first circuit boards 011 and second circuit boards 012, multiple pairs of coupling capacitors can be formed, which is beneficial to improving the pickup of coupling energy, thereby facilitating the generation of coupling signals in the corresponding coupling channel 112 when the RF signal is transmitted in the RF channel 111.
[0060] In some embodiments, Figure 1 As shown, the RF channel 111 includes an input terminal A and an output terminal B. The input terminal A is connected to a RF amplifier, for example, for inputting RF signals; the output terminal B is connected to an antenna, for example, for outputting RF signals to the antenna.
[0061] Specifically, the input terminal A and the output terminal B may be located at the first pad 21 on any layer of the multi-layer circuit board. Figure 1 As shown, the input terminal A and the output terminal B are both located at the first pad 21 on the first layer circuit board 01 .
[0062] In some embodiments, the input terminal A and the output terminal B may be located at the first pads 21 on any two layers of the multi-layer circuit board. Figure 2 As shown, the input terminal A is arranged on the first pad 21 of the first layer circuit board 01 , and the output terminal B is arranged on the first pad 21 of the third layer circuit board 03 .
[0063] In some embodiments, Figure 1 As shown, the coupling channel 112 includes a coupling terminal C and an isolation terminal D. The coupling terminal C is connected to a receiving chip, for example, to obtain a coupling signal, and the isolation terminal D is grounded through an ohmic resistor.
[0064] Specifically, the coupling terminal C and the isolation terminal D are both located at the second pad 22 on any layer of the multi-layer circuit board. Figure 1 As shown, the coupling end C and the isolation end D are both located on the second pad 22 on the third layer circuit board 03 .
[0065] In some embodiments, the coupling terminal C and the isolation terminal D may be located at the second pads 22 on any two layers of the multi-layer circuit board. Figure 2 As shown, the coupling end C is arranged on the second pad 22 of the first layer circuit board 01 , and the isolation end D is arranged on the second pad 22 of the third layer circuit board 03 .
[0066] In some embodiments, Figure 5 As shown, the distance S between the RF hole 11 and the coupling hole 12 can be set in the range of 0.8 mm-1.0 mm.
[0067] Specifically, if the distance S between the RF hole 11 and the coupling hole 12 is too small, for example, when S is less than 0.8 mm, the size of the coupling portion between the first pad 21 and the second pad 22 will be reduced, resulting in a smaller coupling capacitance formed between the first pad 21 and the second pad 22, which is not conducive to the pickup of coupled energy. If the distance S between the RF hole 11 and the coupling hole 12 is too large, for example, when S is less than 1.0 mm, the loss caused by the routing between the coupling signal and the coupling hole 12 is increased. Based on this, the distance S between the RF hole 11 and the coupling hole 12 is set in the range of 0.8 mm-1.0 mm, which is conducive to optimizing the pickup of the coupled signal.
[0068] Based on the above embodiments, an embodiment of the present application provides an electronic device, including a radio frequency circuit board as described in the above embodiments, and thus has the same or similar beneficial effects, which will not be repeated here.
[0069] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0070] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A coupler, characterized in that: include: Radio frequency holes and coupling holes are provided on the multi-layer circuit board; A first pad is arranged on each layer of the circuit board around the radio frequency hole, and a second pad is arranged on each layer of the circuit board around the coupling hole, each of the first pads is electrically connected through the radio frequency hole to form a radio frequency channel, and each of the second pads is electrically connected through the coupling hole to form a coupling channel; The multi-layer circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are two layers of circuit boards in the multi-layer circuit board; the first soldering pad of the first circuit board and the second soldering pad of the second circuit board have a facing area in the vertical direction, so that the radio frequency signal passes through the radio frequency channel to generate a coupling signal in the coupling channel.
2. The coupler according to claim 1, characterized in that The first circuit board and the second circuit board are two adjacent layers of circuit boards in the multi-layer circuit board.
3. The coupler according to claim 1, characterized in that: The multi-layer circuit board comprises a top circuit board, a bottom circuit board and an inner circuit board; The first circuit board and the second circuit board are two layers of circuit boards in the inner circuit board.
4. The coupler according to claim 3, characterized in that: The inner circuit board includes a third circuit board adjacent to the top circuit board, and a fourth circuit board adjacent to the bottom circuit board; The first circuit board and the second circuit board are two layers of circuit boards in the inner circuit board except the third circuit board and the fourth circuit board.
5. The coupler according to claim 1, characterized in that: The multilayer circuit board includes a plurality of pairs of the first circuit board and the second circuit board.
6. The coupler according to claim 1, characterized in that The radio frequency channel includes an input end and an output end; The input end and the output end are both located at the first pad on any layer of the multi-layer circuit board; or, the input end and the output end are respectively located at the first pads on any two layers of the multi-layer circuit board.
7. The coupler according to claim 1, characterized in that: The coupling channel includes a coupling end and an isolation end; The coupling end and the isolation end are both located at the second pad on any layer of the multi-layer circuit board; or, the coupling end and the isolation end are respectively located at the second pads on any two layers of the multi-layer circuit board.
8. The coupler according to claim 1, characterized in that The distance between the radio frequency hole and the coupling hole ranges from 0.8 mm to 1.0 mm.
9. A radio frequency circuit board, characterized in that: include: A coupler as claimed in any one of claims 1 to 8; A multi-layer circuit board, the coupler is formed by the multi-layer circuit board.
10. An electronic device, characterized in that: Comprising the radio frequency circuit board as claimed in claim 9.