Antenna packaging structure

Abstract

The antenna packaging structure comprises a rewiring layer which is provided with a first surface and a second surface which are opposite to each other; the radio frequency chip is arranged on the first surface of the rewiring layer; the packaging layer is arranged on the first surface of the rewiring layer and wraps the radio frequency chip; the coplanar waveguide is arranged on the second surface of the rewiring layer; the metal cover covers the second surface of the rewiring layer, and an air cavity is formed between the metal cover and the rewiring layer; and the antenna metal layer is arranged on the surface, far away from the rewiring layer, of the metal cover. The metal cover bears the antenna metal layer and keeps the distance between the coplanar waveguide and the antenna metal layer, and the air cavity reduces the loss of signals and enhances the transceiving efficiency of the antenna.

Description

Technical Field

[0001] The utility model relates to an antenna packaging structure. Background Art

[0002] Packaged antenna is a technology that integrates antenna and chip in the package based on packaging materials and processes to achieve system-level wireless functions. Packaged antenna technology conforms to the trend of increasing integration of silicon-based semiconductor processes, provides a good antenna solution for system-level wireless chips, and is favored by a large number of chip and packaging manufacturers. Packaged antenna technology takes into account antenna performance, cost and volume, and represents an important achievement in antenna technology in recent years. Existing antenna integration mainly involves making and mounting antenna structures on packaging substrates, especially making antennas directly on the surface of circuit boards. This type of antenna packaging structure has low antenna efficiency, poor performance and high losses. Utility Model Content

[0003] On one hand, the utility model provides an antenna packaging structure, which includes:

[0004] a redistribution layer having opposing first and second surfaces;

[0005] A radio frequency chip is disposed on the first surface of the rewiring layer;

[0006] A packaging layer, disposed on the first surface of the rewiring layer and covering the radio frequency chip;

[0007] A coplanar waveguide disposed on the second surface of the redistribution layer;

[0008] a metal cover, which is disposed on the second surface of the rewiring layer and forms an air cavity between the metal cover and the rewiring layer; and

[0009] The antenna metal layer is arranged on the surface of the metal cover away from the rewiring layer.

[0010] The metal cover of the utility model carries the antenna metal layer and maintains the distance between the coplanar waveguide and the antenna metal layer. An air cavity is formed between the metal cover and the rewiring layer, which reduces signal loss and enhances the antenna's transceiver efficiency. Meanwhile, the metal cover can also improve the heat dissipation of the antenna packaging structure.

[0011] In some embodiments, a carrier chip is further disposed on the first surface of the rewiring layer, and the carrier chip and the radio frequency chip are spaced apart from each other and are covered by the packaging layer.

[0012] In some embodiments, the rewiring layer includes a plurality of dielectric layers stacked in sequence and at least one metal wiring layer embedded in the dielectric layers.

[0013] In some embodiments, a conductive column is embedded in the packaging layer, and the conductive column penetrates the packaging layer and is connected to at least one metal wiring layer in the rewiring layer.

[0014] In some embodiments, a metal bump is disposed on a side of the packaging layer away from the rewiring layer, and the metal bump is connected to the conductive pillar to achieve electrical extraction of the rewiring layer.

[0015] In some embodiments, an antenna reflector is disposed on a surface of the packaging layer away from the rewiring layer.

[0016] In some embodiments, an additional metal wiring layer is disposed between the metal bump and the conductive column, and the additional metal wiring layer is connected to the antenna reflector.

[0017] In some embodiments, a metal layer is disposed on a side of the packaging layer away from the rewiring layer, and the metal layer is used to improve heat dissipation.

[0018] In some embodiments, along the thickness direction of the antenna packaging structure, the antenna metal layer is aligned with the coplanar waveguide.

[0019] In some embodiments, the coplanar waveguide is embedded in the redistribution layer and exposed on the second surface, and the coplanar waveguide connects at least one metal wiring layer in the redistribution layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of the antenna packaging structure of an embodiment of the utility model.

[0021] Main component symbols

[0022] Antenna packaging structure 100

[0023] Rewiring layer 10

[0024] First surface 101

[0025] Second surface 102

[0026] RF chip 20

[0027] Encapsulation layer 30

[0028] Metal cover 40

[0029] Air cavity 105

[0030] Coplanar waveguide 60

[0031] Antenna metal layer 50

[0032] The first dielectric layer 11

[0033] The second dielectric layer 13

[0034] The third dielectric layer 15

[0035] Carrier chip 23

[0036] The first metal wiring layer 12

[0037] The second metal wiring layer 14

[0038] Antenna reflector 70

[0039] Dielectric layer 71

[0040] Conductive column 80

[0041] Metal Bump 90

[0042] Metal layer 75

[0043] The specific implementation mode will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0044] The accompanying drawings show embodiments of the present invention, which can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more comprehensive and complete and to enable those skilled in the art to more fully understand the scope of the present invention. For clarity, the dimensions of layers and regions are exaggerated in the drawings.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art of the utility model. It should also be understood that terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted with an overly idealized or overly formal meaning, unless clearly defined in this article.

[0046] Re-Distribution Layer (RDL) is to change the contact position (I / O pad) of the original integrated circuit (IC) through the wafer-level metal wiring process and the bump process, so that the IC can be suitable for different packaging forms. The wafer-level metal wiring process is to apply an insulating protective layer on the IC, and then define the new wire pattern by exposure and development, and then use electroplating technology to make a new metal circuit to connect the original aluminum pad and the new bump or gold pad to achieve the purpose of circuit redistribution. The re-wired metal circuit is mainly made of electroplated copper material, and nickel-gold or nickel-palladium-gold can also be plated on the copper circuit as needed. Thick copper structure has the advantages of low resistance, high heat dissipation and low cost, making it the best choice for high-current and high-power devices.

[0047] See also Figure 1 The antenna packaging structure 100 of the embodiment of the utility model comprises: a rewiring layer 10, a radio frequency chip 20 arranged on a first surface 101 of the rewiring layer 10, a packaging layer 30 arranged on the first surface 101 of the rewiring layer 10 and covering / wrapping the radio frequency chip 20, and a metal cover 40 covered on a second surface 102 of the rewiring layer 10, wherein the second surface 102 is opposite to the first surface 101. An air cavity 105 is formed between the metal cover 40 and the second surface 102 of the rewiring layer 10. A coplanar waveguide 60 is arranged on the second surface 102 of the rewiring layer 10. An antenna metal layer 50 is also arranged on the surface of the metal cover 40 away from the rewiring layer 10, and the metal cover 40 is used to carry the antenna metal layer 50. The antenna has the lowest dielectric loss in air transmission, and the air cavity 105 can reduce the antenna loss.

[0048] The rewiring layer 10 includes a plurality of dielectric layers stacked in sequence and at least one metal wiring layer embedded in the dielectric layers. In the embodiment of the utility model, the rewiring layer 10 includes a first dielectric layer 11, a second dielectric layer 13 and a third dielectric layer 15 stacked in sequence from bottom to top; wherein the first dielectric layer 11 is provided with a first metal wiring layer 12; the second dielectric layer 13 is provided with a second metal wiring layer 14; the first metal wiring layer 12 and the second metal wiring layer 14 can be electrically connected. The surface of the first dielectric layer 11 facing away from the third dielectric layer 15 forms the first surface 101 of the rewiring layer 10, and the surface of the third dielectric layer 15 facing away from the first dielectric layer 11 forms the second surface 102 of the rewiring layer 10.

[0049] The RF chip 20 is electrically connected to the first metal wiring layer 12 in the rewiring layer 10. The RF chip 20 is used to convert the radio signal communication into a certain radio signal waveform, and transmit it through the resonance of the antenna metal layer 50, which may include a power amplifier (not shown), a low noise amplifier (not shown) and an antenna switch (not shown). The RF chip 20 architecture includes two major parts: a receiving channel (not shown) and a transmitting channel (not shown).

[0050] The coplanar waveguide 60 is embedded in the rewiring layer 10 and exposed on the second surface 102. In the embodiment of the present application, the coplanar waveguide 60 is arranged in the third dielectric layer 15, and the surface of the coplanar waveguide 60 facing away from the packaging layer 30 is flush with the second surface 102. The coplanar waveguide 60 is electrically connected to at least one metal wiring layer in the rewiring layer 10. In the embodiment of the present application, the coplanar waveguide 60 is electrically connected to the second metal wiring layer 14. The coplanar waveguide 60 is spaced apart from the metal cover 40, thereby maintaining the distance between the coplanar waveguide 60 and the antenna metal layer 50, and the two are spaced apart by the air cavity 105, thereby reducing the loss of the antenna signal and enhancing the antenna's transceiver efficiency. Along the thickness direction of the antenna packaging structure 100, the antenna metal layer 50 is aligned with the coplanar waveguide 60.

[0051] The material of the first dielectric layer 11 includes one or more combinations of epoxy resin, silica gel, polyimide (PI), poly(p-phenylene-2,6-benzoxazole), PBO, benzocyclobutene (BCB), silicon oxide, phosphosilicate glass, and fluorine-containing glass. Preferably, the material of the first dielectric layer 11 is PI to further reduce the process difficulty and process cost. The material of the first metal wiring layer 12 includes one or more combinations of copper, aluminum, nickel, gold, silver, and titanium. The material of the second dielectric layer 13 includes one or more combinations of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass. Preferably, the material of the second dielectric layer 13 is PI to further reduce the process difficulty and process cost. The material of the second metal wiring layer 14 includes one or more combinations of copper, aluminum, nickel, gold, silver, and titanium. The material of the third dielectric layer 15 is the same as that of the first dielectric layer 11 , and can be selected from epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass.

[0052] The material of the packaging layer 30 includes one of polyimide, silicone and epoxy resin. In addition to the RF chip 20, a carrier chip 23 is also arranged on the first surface 101 of the rewiring layer 10, and the packaging layer 30 covers / encapsulates the carrier chip 23. The carrier chip 23 is used to improve the warpage caused by the material of the packaging layer 30. Since the carrier chip 23 occupies the packaging layer 30, the amount of material used in the packaging layer 30 can be reduced, thereby reducing the warpage. Figure 1 As shown, two carrier chips 23 are provided, which are respectively located on both sides of the RF chip 20 .

[0053] The surface of the packaging layer 30 away from the rewiring layer 10 is provided with an antenna reflector 70. Specifically, a dielectric layer 71 is stacked on the surface of the packaging layer 30 away from the rewiring layer 10, and the antenna reflector 70 is embedded in the dielectric layer 71. The antenna reflector 70 is used to reflect electromagnetic waves and redirect radio frequency energy. The material of the antenna reflector 70 can be a conductive metal, such as copper.

[0054] A conductive column 80 is embedded in the encapsulation layer 30, and the conductive column 80 penetrates the encapsulation layer 30 and is connected to the first metal wiring layer 12 of the rewiring layer 10. A metal bump 90 is provided on the surface of the dielectric layer 71 away from the rewiring layer 10, and the conductive column 80 is connected between the first metal wiring layer 12 and the metal bump 90; the electrical lead-out of the rewiring layer 10 is achieved through the conductive column 80 and the metal bump 90. The metal bump 90 includes one of tin solder, silver solder and gold-tin alloy solder. The material of the conductive column 80 includes one of Au, Ag, Cu and Al. In this embodiment, two conductive columns 80 are provided, but not limited to two.

[0055] The provision of the metal cover 40 can improve the overall heat dissipation of the antenna packaging structure 100. The metal cover 40 can also be used as an electromagnetic shielding layer without the need to provide additional electromagnetic shielding materials.

[0056] A metal layer 75 is also disposed in the dielectric layer 71 , and the metal layer 75 is spaced apart from the antenna reflector 70 . In this embodiment, the metal layer 75 is located opposite to the RF chip 20 . The metal layer 75 can improve the heat dissipation of the antenna packaging structure 100 .

[0057] The metal cover 40 of the utility model carries the antenna metal layer 50 and maintains the distance between the coplanar waveguide 60 and the antenna metal layer 50. An air cavity 105 is formed between the metal cover 40 and the rewiring layer 10, which reduces signal loss and enhances the antenna's transceiver efficiency. Meanwhile, the metal cover 40 can also improve the heat dissipation of the antenna packaging structure 100.

[0058] The above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. The up, down, left and right directions appearing in the drawings are only for the convenience of understanding. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.

Claims

1. An antenna packaging structure, characterized in that: It includes: a redistribution layer having opposing first and second surfaces; A radio frequency chip is disposed on the first surface of the rewiring layer; A packaging layer, disposed on the first surface of the rewiring layer and covering the radio frequency chip; A coplanar waveguide disposed on the second surface side of the rewiring layer; A metal cover, which is disposed on the second surface of the rewiring layer and forms an air cavity between the metal cover and the rewiring layer; as well as The antenna metal layer is arranged on the surface of the metal cover away from the rewiring layer.

2. The antenna packaging structure according to claim 1, characterized in that: A carrier chip is also disposed on the first surface of the rewiring layer. The carrier chip and the radio frequency chip are spaced apart from each other and are covered by the packaging layer.

3. The antenna packaging structure according to claim 1, characterized in that: The rewiring layer includes a plurality of dielectric layers stacked in sequence and at least one metal wiring layer embedded in the dielectric layers.

4. The antenna packaging structure according to claim 3, characterized in that: The coplanar waveguide is embedded in the rewiring layer and exposed on the second surface. The coplanar waveguide connects at least one metal wiring layer in the rewiring layer.

5. The antenna packaging structure according to claim 3, characterized in that: A conductive column is embedded in the packaging layer, and the conductive column penetrates the packaging layer and is connected to at least one metal wiring layer of the rewiring layer.

6. The antenna packaging structure according to claim 5, characterized in that: A metal bump is disposed on a side of the packaging layer away from the rewiring layer, and the metal bump is connected to the conductive column to realize electrical extraction of the rewiring layer.

7. The antenna packaging structure according to claim 6, characterized in that: An antenna reflector is disposed on a surface of the packaging layer away from the rewiring layer.

8. The antenna packaging structure according to claim 7, characterized in that: An additional metal wiring layer is further arranged between the metal bump and the conductive column, and the additional metal wiring layer is connected to the antenna reflector.

9. The antenna packaging structure according to claim 7, characterized in that: A metal layer is disposed on a side of the packaging layer away from the rewiring layer, and the metal layer is used to improve heat dissipation.

10. The antenna packaging structure according to claim 1, characterized in that: Along the thickness direction of the antenna packaging structure, the antenna metal layer is aligned with the coplanar waveguide.

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