Laser module capable of reducing beam angle

Abstract

The utility model relates to the technical field of photoelectricity, and provides a laser module capable of reducing a beam angle, which comprises a high-thermal-conductivity heat sink; the laser chip is mounted on the high-thermal-conductivity heat sink; the optical lens is mounted on the high-thermal-conductivity heat sink and covers the laser chip; wherein the diameter of the optical lens is defined as L, the beam angle of the light of the laser chip emitted outwards through the optical lens is theta, the focal length of the optical lens is F, and L is equal to 2F * tan (1 / 2theta). According to the utility model, the light beam angle theta of the light emitted by the laser chip through the optical lens is adjusted according to a formula, so that the light beam angle theta of the light emitted by the assembled optical lens to the laser chip is reduced to a range required by a user, the energy concentration ratio of the light beam is improved, the irradiation distance is farther, and the irradiation efficiency is improved. And the production and assembly difficulty is reduced, and the manufacturing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of optoelectronic technology, in particular to a laser module capable of reducing a beam angle. Background Art

[0002] In the field of laser technology, the performance and application scope of laser module products are expanding, especially in application scenarios that require high precision, high energy density and long-distance irradiation, such as lidar, remote communications, laser ranging and other fields, which have strict requirements on the characteristics and parameters of laser beams.

[0003] However, existing laser module products often have larger beam angles, which results in lower energy concentration and closer irradiation distance, making it difficult to meet some special application scenarios. The traditional solution is to add collimating lenses and focusing lenses to the module to reduce the beam angle, but this method not only increases assembly cost and complexity, but also reduces manufacturing efficiency and prolongs the production cycle. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a laser module that can reduce the beam angle, reduce the complexity of production and assembly, and improve manufacturing efficiency.

[0005] In order to solve the above problems, the utility model provides the following technical solutions:

[0006] A laser module for reducing beam angle, comprising:

[0007] High thermal conductivity heat sink;

[0008] A laser chip is mounted on the high thermal conductivity heat sink;

[0009] An optical lens is mounted on the high thermal conductivity heat sink and covers the laser chip;

[0010] The diameter of the optical lens is defined as L, the beam angle of the light from the laser chip emitted outward through the optical lens is θ, and the focal length of the optical lens is F, then: L=2F*tan(1 / 2θ).

[0011] In one embodiment, the optical lens includes a first lens and a second lens, the first lens is close to the high thermal conductivity heat sink and abuts against the high thermal conductivity heat sink, and the second lens is away from the high thermal conductivity heat sink and is arranged on the other side of the first lens.

[0012] In one embodiment, the first lens and the second lens are integrally formed.

[0013] In one embodiment, the first lens is configured as a cylindrical structure, and the second lens is configured as a hemispherical structure.

[0014] In one embodiment, the angle range of θ is between 0° and 10°.

[0015] In one embodiment, the laser chip is located at the center of the high thermal conductivity heat sink.

[0016] In one embodiment, the thickness of the laser chip is greater than the height of the first lens on the high thermal conductivity heat sink.

[0017] In one embodiment, the number of the laser chips is at least two.

[0018] In one embodiment, the high thermal conductivity heat sink further includes a circuit layer, the circuit layer includes a positive electrode region and a negative electrode region, and at least two laser chips form a series circuit or a parallel circuit through the positive electrode region and the negative electrode region.

[0019] In one embodiment, it further comprises a metal connecting wire, and the laser chip is electrically connected to the positive electrode region and / or the negative electrode region through the metal connecting wire.

[0020] The beneficial effect of the utility model is as follows: by defining the optical lens so that the diameter of the optical lens is L, the beam angle of the light of the laser chip emitted outward through the optical lens is θ, the focal length of the optical lens is F, and the relationship between the three satisfies L=2F*tan(1 / 2θ), thereby achieving the ability to adjust the beam angle of the light of the laser chip emitted outward through the optical lens to θ according to the formula, so that the assembled optical lens can reduce the beam angle θ of the light emitted by the laser chip to the range required by the user, thereby improving the energy concentration of the light beam, irradiating a longer distance, reducing the difficulty of production and assembly, and improving manufacturing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of one embodiment of a laser module for reducing the beam angle of the utility model;

[0022] Figure 2 This is a schematic diagram of illumination of one embodiment of a laser module with a reduced beam angle according to the utility model;

[0023] Figure 3 This is a schematic diagram of parallel assembly of one embodiment of a laser module for reducing the beam angle of the utility model;

[0024] Figure 4 This is a schematic diagram of the serial assembly of one embodiment of a laser module for reducing the beam angle of the utility model.

[0025] Reference numerals:

[0026] 100, laser module; 110, high thermal conductivity heat sink; 111, laser chip; 112, optical lens; 121, first lens; 122, second lens; 141, positive electrode region; 142, negative electrode region; 132, metal connecting wire; 13a, snap-fit ​​groove;

[0027] L, diameter of the optical lens; θ, beam angle; F, focal length of the optical lens; L2, thickness of the laser chip; L3, height of the first lens. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] Please refer to Figure 1-4 As shown, this embodiment provides a laser module 100 for reducing the beam angle, which includes a high thermal conductivity heat sink 110, a laser chip 111 installed on the high thermal conductivity heat sink 110, an optical lens 112 installed on the high thermal conductivity heat sink 110 and covering the laser chip 111, and a metal connecting wire 132; wherein the high thermal conductivity heat sink 110 has a circuit layer, the circuit layer includes a positive electrode region 141 and a negative electrode region 142, in this embodiment, two laser chips 111 are designed to be arranged on the high thermal conductivity heat sink 110, and the laser chip 111 is electrically connected to the positive electrode region 141 and / or the negative electrode region 142 through the metal connecting wire 132, so that the two laser chips 111 form a series circuit or a parallel circuit through the positive electrode region 141 and the negative electrode region 142.

[0031] Preferably, the diameter of the optical lens 112 is defined as L, the beam angle of the light from the laser chip 111 emitted outward through the optical lens 112 is θ, and the focal length of the optical lens 112 is F. Then, the formula satisfied by the diameter L of the optical lens 112, the beam angle θ of the light from the laser chip 111 emitted outward through the optical lens 112, and the focal length F of the optical lens 112 is: L=2F*tan(1 / 2θ).

[0032] Specifically, three common laser chips 111 are usually used in the field of laser applications, namely, IRED laser chip 111, VC SEL laser chip 111 and EEL laser chip 111. The present embodiment uses VCSEL laser chip 111 for implementation. The light emitted by the VC SEL laser chip 111 is a circular light spot with a divergence angle (θ). The parameters of this divergence angle θ can generally be found. Generally, the larger the divergence angle θ, the larger the size of the circular light spot. The present embodiment sets a formula to limit L=2F*tan(1 / 2θ). For example, if the divergence angle is 10° and the focal length of the optical lens 112 is F=150mm, then the maximum diameter L of the light beam coming out of the optical lens 112 is equal to the diameter of the optical lens 112 L=2*150*tag(5°)=26.2466mm. Furthermore, according to the above formula, the optical lens 112 can be set to include two integrally formed lens structures of a first lens 121 and a second lens 122. The first lens 121 is set to a cylindrical structure and the second lens 122 is set to a hemispherical structure through the above formula, and a connecting surface with the same diameter is formed on a side where the first lens 121 and the second lens 122 abut against each other. The first lens 121 is close to the high thermal conductivity heat sink 110 and abuts against the high thermal conductivity heat sink 110, and the second lens 122 is away from the high thermal conductivity heat sink 110 and is arranged on the other side of the first lens 121, so that the structural shapes of the first lens 121 and the second lens 122 meet the requirements of the above formula, so that the divergence angle θ can be accurately designed, so that the divergence angle θ of the light emitted by the VCSEL laser chip 111 through the optical lens 112 is smaller, thereby further making the circular light spot formed by the light emitted by the VCSEL laser chip 111 through the optical lens 112 smaller than the circular light spot between them, so that the density of the light emitted after passing through the optical lens 112 is greater.

[0033] In the above scheme, the divergence angle can be limited by setting a formula, so that the angle range of the divergence angle θ is limited to between 0 and 10°, so as to meet the application fields that require a smaller light beam spot, such as laser ranging, laser and high-precision measurement. In other embodiments, different angle ranges of the divergence angle θ can be set by adjusting the structure of the optical lens 112.

[0034] Preferably, the laser chip 111 is located in the center of the high thermal conductivity heat sink 110. The central position enables a better irradiation effect of the laser chip 111 and prevents light deviation. In addition, the thickness L2 of the laser chip 111 is greater than the height L3 of the first lens 121 on the high thermal conductivity heat sink 110. It can be understood that the laser chip 111 in this state is covered in the first lens 121, and the first lens 121 is recessed to form a clamping groove 13a for clamping the laser chip 111. The laser chip 111 is relatively fixed to the optical lens 112 through the clamping groove 13a.

[0035] In summary, the utility model provides a laser module for reducing the beam angle, by defining the optical lens so that the diameter of the optical lens is L, the beam angle of the light of the laser chip emitted outward through the optical lens is θ, the focal length of the optical lens is F, and the relationship between the three satisfies L=2F*tan(1 / 2θ), thereby achieving the adjustment of the beam angle θ of the light of the laser chip emitted outward through the optical lens according to the formula, so that the assembled optical lens can reduce the beam angle θ of the light emitted by the laser chip to the range required by the user, thereby improving the energy concentration of the light beam, irradiating at a longer distance, reducing the difficulty of production and assembly, and improving manufacturing efficiency.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A laser module with a reduced beam angle, characterized in that: include: High thermal conductivity heat sink; A laser chip is mounted on the high thermal conductivity heat sink; An optical lens is mounted on the high thermal conductivity heat sink and covers the laser chip; The diameter of the optical lens is defined as L, the beam angle of the light from the laser chip emitted outward through the optical lens is θ, and the focal length of the optical lens is F, then: L = 2F*tan( 1 / 2 θ).

2. A laser module for reducing beam angle according to claim 1, characterized in that: The optical lens includes a first lens and a second lens. The first lens is close to the high thermal conductivity heat sink and abuts against the high thermal conductivity heat sink. The second lens is away from the high thermal conductivity heat sink and is arranged on the other side of the first lens.

3. A laser module for reducing beam angle according to claim 2, characterized in that: The first lens and the second lens are integrally formed.

4. A laser module for reducing beam angle according to claim 2, characterized in that: The first lens is configured as a cylindrical structure, and the second lens is configured as a hemispherical structure.

5. The laser module for reducing beam angle according to claim 1, characterized in that: The angle range of θ is between 0° and 10°.

6. The laser module for reducing beam angle according to claim 1, characterized in that: The laser chip is located at the center of the high thermal conductivity heat sink.

7. A laser module for reducing beam angle according to claim 2, characterized in that: The thickness of the laser chip is greater than the height of the first lens on the high thermal conductivity heat sink.

8. The laser module for reducing beam angle according to claim 1, characterized in that: The number of the laser chips is at least two.

9. A laser module for reducing beam angle according to claim 8, characterized in that: The high thermal conductivity heat sink further includes a circuit layer, wherein the circuit layer includes a positive electrode region and a negative electrode region, and at least two laser chips form a series circuit or a parallel circuit through the positive electrode region and the negative electrode region.

10. A laser module for reducing beam angle according to claim 9, characterized in that: It also includes metal connecting wires, and the laser chip is electrically connected to the positive electrode region and / or the negative electrode region through the metal connecting wires.

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