Multiband hybrid imaging camera and imaging system

Abstract

The utility model discloses a multiband hybrid imaging camera and an imaging system, which can be applied to the technical field of optical imaging, and the multiband hybrid imaging camera comprises an objective lens, a spectroscope, a visible light-short wave infrared imaging module, a long wave infrared imaging module and an image fusion module, the objective lens is used for collecting light; the spectroscope is used for splitting light into a first light beam and a second light beam which are respectively sent to the visible light-short wave infrared imaging module and the long wave infrared imaging module; the visible light-short wave infrared imaging module is used for imaging visible light and short wave infrared light in the first light beam; the long-wave infrared imaging module is used for imaging long-wave infrared light in the second light beam; and the image fusion module is used for fusing the imaging picture and obtaining a visible light-short wave infrared-long wave infrared imaging picture. Therefore, multiband hybrid imaging is realized through the optical device with a simple structure, so that the size of the camera is effectively reduced, and the structural compactness of the imaging system is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical imaging, in particular to a multi-band hybrid imaging camera and an imaging system. Background Art

[0002] A single-band imaging system is a system that performs imaging in a specific band. With the continuous development of semiconductor imaging technology and the increasing complexity of its application scenarios, single-band imaging systems are gradually unable to meet the growing detection needs due to their weak detection information and low accuracy.

[0003] Existing multi-band hybrid imaging cameras usually consist of three cameras in the visible light band, short-wave infrared band and infrared band to independently complete imaging tasks. The structure is too complicated, the short-wave infrared sensor is expensive, and the imaging system composed of three cameras is relatively large.

[0004] Therefore, how to reduce the volume of the multi-band hybrid imaging camera and improve the structural compactness of the imaging system is an issue that technicians in this field need to solve urgently. Utility Model Content

[0005] Based on the above problems, the utility model provides a multi-band hybrid imaging camera and imaging system, which realizes multi-band hybrid imaging through an optical device with a simple structure, thereby effectively reducing the size of the camera and solving the problems of existing multi-band hybrid imaging cameras being too large and having too complex a structure.

[0006] In a first aspect, an embodiment of the utility model provides a multi-band hybrid imaging camera, comprising: an objective lens, a spectroscope, a visible light-short-wave infrared imaging module, a long-wave infrared imaging module, and an image fusion module;

[0007] The objective lens is used to collect light and emit the light to a beam splitter;

[0008] The beam splitter is used to receive the light, and split the light into a first light beam and a second light beam, which are sent to the visible light-short-wave infrared imaging module and the long-wave infrared imaging module respectively;

[0009] The visible light-short-wave infrared imaging module is used to image the visible light and short-wave infrared light in the first light beam and obtain a first imaging picture;

[0010] The long-wave infrared imaging module is used to image the long-wave infrared light in the second light beam and obtain a second imaging picture;

[0011] The image fusion module is used to fuse the first imaging picture and the second imaging picture to obtain a visible light-short wave infrared-long wave infrared imaging picture.

[0012] Optionally, the visible light-short wave infrared imaging module includes: a long wave infrared filter and a visible light-short wave infrared sensor module;

[0013] The long-wave infrared filter is placed in the optical path of the first light beam, and is used to filter the long-wave infrared light in the first light beam, and send the filtered visible light and short-wave infrared light to the visible light-short-wave infrared sensor module;

[0014] The visible light-short-wave infrared sensor module is used to image the visible light and the short-wave infrared light and obtain a first imaging picture.

[0015] Optionally, the visible light-short wave infrared sensor module includes a germanium visible light-short wave infrared sensor module or a germanium quantum well visible light-short wave infrared sensor module.

[0016] Optionally, the long-wave infrared imaging module includes: a visible light-short-wave infrared filter and a long-wave infrared sensor module;

[0017] The visible light-short-wave infrared filter is placed in the optical path of the second light beam, and is used to filter the visible light and short-wave infrared light in the second light beam, and send the filtered long-wave infrared light to the long-wave infrared sensor module;

[0018] The long-wave infrared sensor module is used to image the long-wave infrared light and obtain a second imaging picture.

[0019] Optionally, the long-wave infrared sensor module includes: an amorphous germanium long-wave infrared sensor module or an amorphous germanium quantum well long-wave infrared sensor module.

[0020] Optionally, the multi-band hybrid imaging camera further includes: a fixing component;

[0021] The fixing assembly is used to fix the objective lens, the beam splitter, the visible light-short-wave infrared imaging module, the long-wave infrared imaging module and the image fusion module.

[0022] Optionally, the fixing assembly includes: a camera objective lens interface and a camera housing;

[0023] The camera objective lens interface is used to fix the objective lens to the camera housing;

[0024] The camera housing is used to wrap and fix the spectroscope, the visible light-short-wave infrared imaging module, the long-wave infrared imaging module and the image fusion module.

[0025] Optionally, the multi-band hybrid imaging camera further comprises: an anti-light, anti-electric, and anti-electromagnetic radiation layer and a polytetrafluoroethylene layer;

[0026] The anti-light, anti-electric and anti-electromagnetic radiation layers and the polytetrafluoroethylene layer are sequentially wrapped around the outside of the camera housing to protect the multi-band hybrid imaging camera.

[0027] Optionally, the multi-band hybrid imaging camera further includes: a wiring interface and a universal serial bus USB interface;

[0028] The wiring port is used to supply power to the multi-band hybrid imaging camera;

[0029] The USB interface is used for data transmission or to supply power to the multi-band hybrid imaging camera.

[0030] In a second aspect, an embodiment of the utility model provides an imaging system, comprising: the above-mentioned multi-band hybrid imaging camera.

[0031] It can be seen from the above technical solutions that compared with the prior art, the utility model has the following advantages:

[0032] The utility model discloses a multi-band hybrid imaging camera, comprising: an objective lens, a spectroscope, a visible light-short-wave infrared imaging module, a long-wave infrared imaging module and an image fusion module; the objective lens is used to collect light and emit the light to the spectroscope; the spectroscope is used to receive light and split the light into a first light beam and a second light beam and send them to the visible light-short-wave infrared imaging module and the long-wave infrared imaging module respectively; the visible light-short-wave infrared imaging module is used to image the visible light and short-wave infrared light in the first light beam and obtain a first imaging picture; the long-wave infrared imaging module is used to image the long-wave infrared light in the second light beam and obtain a second imaging picture; the image fusion module is used to fuse the first imaging picture and the second imaging picture and obtain a visible light-short-wave infrared-long-wave infrared imaging picture. In this way, multi-band hybrid imaging is achieved through an optical device with a simple structure, thereby effectively reducing the size of the camera and improving the structural compactness of the imaging system. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the structure of a multi-band hybrid imaging camera provided by the utility model;

[0034] Figure 2 A schematic diagram of the structure of a visible light-short-wave infrared imaging module provided by an embodiment of the utility model;

[0035] Figure 3 A schematic diagram of the structure of a visible light-short-wave infrared imaging module provided by an embodiment of the utility model;

[0036] Figure 4 A schematic diagram of the structure of a camera lens interface and a camera housing provided by an embodiment of the utility model;

[0037] Figure 5 A schematic diagram of the structure of an anti-light, anti-electric and anti-electromagnetic radiation layer and a polytetrafluoroethylene layer provided in an embodiment of the utility model;

[0038] Figure 6 A schematic structural diagram of a wiring interface and a universal serial bus (USB) interface provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0039] As mentioned above, existing multi-band hybrid imaging cameras have the problems of large size and complex structure. Specifically, single-band imaging cameras cannot meet the growing detection needs. In order to fully utilize the advantages of visible light, short-wave infrared and long-wave infrared band imaging technologies, multi-band hybrid imaging technology is urgently needed to enhance the target recognition capability of imaging cameras, thereby achieving all-weather, wide coverage, and high-resolution imaging, and ultimately obtaining more comprehensive and accurate target information. However, existing multi-band hybrid imaging cameras usually use three cameras in the visible light band, short-wave infrared band, and infrared band to independently complete the imaging task, resulting in the problem that the imaging system has a complex structure and a large size.

[0040] In order to solve the above problems, the utility model provides a multi-band hybrid imaging camera, including: an objective lens, a spectroscope, a visible light-short wave infrared imaging module, a long wave infrared imaging module and an image fusion module; the objective lens is used to collect light and emit the light to the spectroscope; the spectroscope is used to receive light and split the light into a first light beam and a second light beam and send them to the visible light-short wave infrared imaging module and the long wave infrared imaging module respectively; the visible light-short wave infrared imaging module is used to image the visible light and short wave infrared light in the first light beam and obtain a first imaging picture; the long wave infrared imaging module is used to image the long wave infrared light in the second light beam and obtain a second imaging picture; the image fusion module is used to fuse the first imaging picture and the second imaging picture and obtain a visible light-short wave infrared-long wave infrared imaging picture.

[0041] Thus, multi-band hybrid imaging is achieved through an optical device with a simple structure, thereby effectively reducing the size of the camera and improving the structural compactness of the imaging system.

[0042] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] Figure 1 This is a schematic diagram of the structure of a multi-band hybrid imaging camera provided by the utility model. Figure 1 As shown, a multi-band hybrid imaging camera 100 provided by the present invention includes: an objective lens 101, a spectroscope 102, a visible light-short-wave infrared imaging module 103, a long-wave infrared imaging module 104 and an image fusion module 105;

[0044] The objective lens 101 is used to collect light and emit the light to the beam splitter 102;

[0045] The beam splitter 102 is used to receive the light, and split the light into a first light beam and a second light beam, which are sent to the visible light-short-wave infrared imaging module 103 and the long-wave infrared imaging module 104 respectively;

[0046] The visible light-short-wave infrared imaging module 103 is used to image the visible light and short-wave infrared light in the first light beam and obtain a first imaging picture;

[0047] The long-wave infrared imaging module 104 is used to image the long-wave infrared light in the second light beam and obtain a second imaging picture;

[0048] The image fusion module 105 is used to fuse the first imaging picture and the second imaging picture to obtain a visible light-short wave infrared-long wave infrared imaging picture.

[0049] The utility model realizes multi-band hybrid imaging through an optical device with a simple structure, thereby effectively reducing the size of the camera and improving the compactness of the imaging system. Specifically, the utility model provides a multi-band hybrid imaging camera 100, comprising: an objective lens 101, a spectroscope 102, a visible light-short-wave infrared imaging module 103, a long-wave infrared imaging module 104 and an image fusion module 105. Among them, one side of the objective lens 101 is located outside the camera to collect external light, and the other side is located inside the camera to achieve a connection with the optical components inside the camera. The objective lens 101 collects light and achieves a magnification effect on the photographed object. The light reflected by the photographed object passes through the objective lens 101 into the camera and is emitted to the spectroscope 102. The spectroscope 102 is placed inside the camera to play a role in splitting. The light reflected by the photographed object passes through the objective lens 101 and is divided into a first light beam and a second light beam on the spectroscope 102, wherein the first light beam is emitted to the visible light-short-wave infrared imaging module 103, and the second light beam is emitted to the long-wave infrared imaging module 104. The visible light-short wave infrared imaging module 103 and the long wave infrared imaging module 104 are both placed inside the camera, and play the role of filtering and imaging the light. The visible light-short wave infrared imaging module 103 can filter out the long wave infrared light in the first light beam, and image the filtered visible light and short wave infrared light to generate a first imaging picture (Vis-SWIR imaging picture). The long wave infrared imaging module 104 can filter out the visible light and short wave infrared light in the second light beam, and image the filtered long wave infrared light to generate a second imaging picture (LWIR imaging picture). The image fusion module 105 is used to synthesize pictures, mix the first imaging picture and the second imaging picture, and finally form a visible light-short wave infrared-long wave infrared imaging picture (Vis-SWIR-LWIR imaging picture), which improves the target recognition ability of the imaging camera, realizes all-weather, wide coverage, and high-resolution imaging, and finally obtains more comprehensive and accurate target information.

[0050] Figure 2 A schematic diagram of the structure of a visible light-short wave infrared imaging module provided by an embodiment of the utility model. Figure 2 As shown, it is about how to design the visible light-short wave infrared imaging module 103. Accordingly, the visible light-short wave infrared imaging module 103 includes: a long wave infrared filter 201 and a visible light-short wave infrared sensor module 202;

[0051] The long-wave infrared filter 201 is placed in the optical path of the first light beam, and is used to filter the long-wave infrared light in the first light beam, and send the filtered visible light and short-wave infrared light to the visible light-short-wave infrared sensor module 202;

[0052] The visible light-short-wave infrared sensor module 202 is used to image the visible light and the short-wave infrared light and obtain a first imaging picture.

[0053] In order to simplify the structure and realize the functions of filtering long-wave infrared light and imaging visible light and short-wave infrared light. The visible light-short-wave infrared imaging module 103 provided in the utility model adopts the structure of long-wave infrared filter 201 + visible light-short-wave infrared sensor module 202. Specifically, the long-wave infrared filter 201 is inside the camera, placed in the optical path of the first light beam, between the spectrometer and the visible light-short-wave infrared sensor module 202, and is used to filter the first light beam, filter out the long-wave infrared light, and send the filtered visible light and short-wave infrared light to the visible light-short-wave infrared sensor module 202. The visible light-short-wave infrared sensor module 202 is inside the camera, receives the visible light and short-wave infrared light filtered by the long-wave infrared filter 201, and images the visible light and short-wave infrared light to obtain a first imaging picture.

[0054] As an implementation method, it is directed to how to design a visible light-short wave infrared sensor module 202. Accordingly, the visible light-short wave infrared sensor module 202 includes one of a germanium visible light-short wave infrared sensor module 202 or a germanium quantum well visible light-short wave infrared sensor module 202.

[0055] Conventional visible light-short wave infrared-long wave infrared multi-band imaging systems usually use three cameras of visible light band (390-780nm), short wave infrared band (0.9-3μm) and long wave infrared band (7.5~14μm) to independently complete imaging tasks. Visible light sensor (mainstream sensing material is Si) and short wave infrared sensor (mainstream sensing material is InGaAs / InP) have the disadvantages of small wafer size, high cost of InP wafer, expensive manufacturing process, low yield, and inability to mass produce. Long wave infrared sensor (mainstream sensing material is amorphous silicon and vanadium oxide Vox) VOx is not compatible with CMOS process. The three sensors are built into three different cameras respectively, making the volume of the whole imaging system larger, and the sensing materials used by the three sensors are different. To this end, the embodiment of the utility model develops a semiconductor sensing material with wide-band absorption characteristics compatible with CMOS process, aiming to significantly reduce the manufacturing cost of multi-band sensors and simplify the complexity of multi-band imaging systems, thereby effectively reducing the volume of multi-band imaging systems. Specifically, the sensors corresponding to visible light and short-wave infrared light are integrated, and Ge-based semiconductor materials compatible with CMOS process are used as sensing materials, thereby greatly reducing the manufacturing cost of the visible light-short-wave infrared sensor module 202. In this regard, the visible light-short-wave infrared sensor module 202 can select a germanium Ge visible light-short-wave infrared sensor module 202 or a germanium Ge quantum well visible light-short-wave infrared sensor module 202.

[0056] In addition, in order to improve the reliability of the multi-band hybrid imaging camera 100 and enable it to operate in a high temperature environment, the visible light-short wave infrared sensor module 202 also includes a multi-stage refrigeration system. The multi-stage refrigeration system mainly includes a TEC1 module, a TEC2 module, and a liquid nitrogen refrigeration module, which reduces the impact of thermal effects on Ge or Ge quantum well visible light-short wave infrared sensors, increases their operating temperature by 80°C, and significantly improves the reliability of the multi-band hybrid imaging camera 100 operating in a high temperature environment.

[0057] Figure 3 A schematic diagram of the structure of a visible light-short wave infrared imaging module provided by an embodiment of the utility model. Figure 3 As shown, the long-wave infrared imaging module 104 includes: a visible light-short-wave infrared filter 203 and a long-wave infrared sensor module 204;

[0058] The visible light-short-wave infrared filter 203 is placed in the optical path of the second light beam, and is used to filter the visible light and short-wave infrared light in the second light beam, and send the filtered long-wave infrared light to the long-wave infrared sensor module 204;

[0059] The long-wave infrared sensor module 204 is used to image the long-wave infrared light and obtain a second imaging picture.

[0060] In order to simplify the structure and realize the functions of filtering visible light and short-wave infrared light and imaging long-wave infrared light. The long-wave infrared imaging module 104 provided in the utility model adopts the structure of visible light-short-wave infrared filter 203 + long-wave infrared sensor module 204. Specifically, the visible light-short-wave infrared filter 203 is inside the camera, placed in the optical path of the second light beam, between the spectrometer and the long-wave infrared sensor module 204, and is used to filter the second light beam, filter out visible light and short-wave infrared light, and send the filtered long-wave infrared light to the long-wave infrared sensor module 204. The long-wave infrared sensor module 204 is inside the camera, receives the long-wave infrared light filtered by the visible light-short-wave infrared filter 203, and images the long-wave infrared light to obtain a second imaging picture.

[0061] As an implementation method, it is directed to how to design a long-wave infrared sensor module 204. Accordingly, the long-wave infrared sensor module 204 includes: an amorphous germanium long-wave infrared sensor module 204 or an amorphous germanium quantum well long-wave infrared sensor module 204.

[0062] In combination with the above, the mainstream sensing materials of long-wave infrared sensors are amorphous silicon and vanadium oxide Vox, among which VOx is not compatible with CMOS technology. In the prior art, the long-wave infrared sensor and the other two sensors are respectively built into three different cameras, which makes the volume of the entire imaging system larger, and the sensing materials used by the three sensors are different. To this end, the embodiment of the utility model develops a semiconductor sensing material with wide-band absorption characteristics that is compatible with the CMOS process, aiming to greatly reduce the manufacturing cost of multi-band sensors and simplify the complexity of the multi-band imaging system, thereby effectively reducing the volume of the multi-band imaging system. Specifically, Ge-based semiconductor materials compatible with CMOS technology are used as sensing materials, thereby greatly reducing the manufacturing cost of the visible light-short-wave infrared sensor module 202. In this regard, the long-wave infrared sensor module 204 can select an amorphous germanium Ge long-wave infrared sensor module 204 or an amorphous germanium Ge quantum well long-wave infrared sensor module 204. In addition, long-wave infrared sensors can also select four group semiconductor materials such as amorphous Si, amorphous SiGe, amorphous GeSn, amorphous SiGeSn, Ge / SiGeSn quantum well, GeSn / SiGeSn quantum well as sensor materials.

[0063] In addition, in order to improve the reliability of the multi-band hybrid imaging camera 100 and enable it to operate in a high temperature environment, the long-wave infrared sensor module 204 also includes a multi-stage refrigeration system. The multi-stage refrigeration system mainly includes a TEC1 module, a TEC2 module, and a liquid nitrogen refrigeration module, which reduces the impact of thermal effects on the Ge or Ge quantum well visible light-short-wave infrared sensor, increases its operating temperature by 80°C, and significantly improves the reliability of the multi-band hybrid imaging camera 100 operating in a high temperature environment.

[0064] As an implementation method, with respect to how to fix each optical component, the multi-band hybrid imaging camera 100 further includes: a fixing component;

[0065] The fixing assembly is used to fix the objective lens 101 , the beam splitter 102 , the visible light-short-wave infrared imaging module 103 , the long-wave infrared imaging module 104 and the image fusion module 105 .

[0066] In order to obtain visible light-short wave infrared-long wave infrared imaging pictures, the multi-band hybrid imaging camera 100 requires multiple optical components to work together, and different optical components have certain requirements on the placement position and placement angle in order to be connected. To this end, the utility model provides a fixing component for fixing the objective lens 101, the beam splitter 102, the visible light-short wave infrared imaging module 103, the long wave infrared imaging module 104 and the image fusion module 105 in the multi-band hybrid imaging camera 100.

[0067] Figure 4 A schematic diagram of the structure of a camera lens interface and a camera housing provided by an embodiment of the utility model. Figure 4 As shown, the fixing assembly includes: a camera lens interface 106 and a camera housing 107;

[0068] The camera objective lens interface 106 is used to fix the objective lens 101 to the camera housing 107;

[0069] The camera housing 107 is used to enclose and fix the beam splitter 102 , the visible light-short-wave infrared imaging module 103 , the long-wave infrared imaging module 104 and the image fusion module 105 .

[0070] The inner layer of the camera housing 107 is provided with a card slot, which can fix the spectroscope 102, the visible light-short wave infrared imaging module 103, the long wave infrared imaging module 104 and the image fusion module 105, so that the various optical components can cooperate with each other. The front end of the camera housing 107 can be provided with a threaded structure for directly fixing the objective lens 101. Alternatively, the camera housing 107 is provided with a camera objective lens interface 106 at the front end through the card slot structure, and then the camera objective lens interface 106 is threadedly connected to the objective lens 101. In this way, the cooperation between the various optical components is achieved, and multi-band hybrid imaging is achieved through an optical device with a simple structure, thereby effectively reducing the size of the camera and improving the structural compactness of the imaging system.

[0071] Figure 5 A schematic diagram of the structure of an anti-light, anti-electric and anti-electromagnetic radiation layer and a polytetrafluoroethylene layer provided in an embodiment of the utility model. Figure 5 As shown, the multi-band hybrid imaging camera 100 further includes: an anti-light, anti-electric and anti-electromagnetic radiation layer 108 and a polytetrafluoroethylene layer 109;

[0072] The anti-light, anti-electric and anti-electromagnetic radiation layers 108 and the polytetrafluoroethylene layer 109 are sequentially wrapped around the outside of the camera housing 107 to protect the multi-band hybrid imaging camera 100 .

[0073] The embodiment of the utility model provides a protective layer for the multi-band hybrid imaging camera 100, which enables the multi-band hybrid imaging camera 100 to work in extreme chemical environments and extreme radioactive environments, thereby improving the stability of the multi-band hybrid imaging camera 100. Specifically, the protective layer includes an anti-light, anti-electric, and anti-electromagnetic radiation layer 108 and a polytetrafluoroethylene layer 109. The anti-light, anti-electric, and anti-electromagnetic radiation layer 108 is wrapped in the outer layer of the camera housing 107, which can block the penetration of radiated light and suppress the interference of electromagnetic waves, thereby improving the stability and life of the multi-band hybrid imaging camera 100 (common anti-light, anti-electric, and anti-electromagnetic radiation materials mainly include metals, metal oxides, carbon materials, polymers, etc.), and significantly improving the reliability of the multi-band hybrid imaging camera 100 in extreme radioactive environments. The polytetrafluoroethylene layer 109 is wrapped in the outer layer of the anti-light, anti-electric, and anti-electromagnetic radiation layer 108, which can resist acid, alkali, and various organic solvents, and significantly improves the reliability of the multi-band hybrid imaging camera 100 in extreme chemical environments.

[0074] Figure 6 A schematic diagram of the structure of a wiring interface and a universal serial bus interface 111 provided in an embodiment of the utility model. Figure 6 As shown, the multi-band hybrid imaging camera 100 further includes: a wiring interface 110 and a universal serial bus USB interface 111;

[0075] The power connection port 110 is used to supply power to the multi-band hybrid imaging camera 100;

[0076] The USB interface 111 is used for data transmission or to supply power to the multi-band hybrid imaging camera 100 .

[0077] The embodiment of the utility model provides a multi-band hybrid imaging camera 100 with a power connection port 110 and a USB port 111. One end of the power connection port 110 and the USB port 111 is connected to the outside world, and the other end is connected to the multi-band hybrid imaging camera 100. The power connection port 110 has the function of supplying power to the multi-band hybrid imaging camera 100, and the USB port 111 has the functions of external connection to a solar cell (power supply) and data transmission.

[0078] In summary, the utility model discloses a multi-band hybrid imaging camera, including: an objective lens, a spectroscope, a visible light-short-wave infrared imaging module, a long-wave infrared imaging module and an image fusion module; the objective lens is used to collect light and emit the light to the spectroscope; the spectroscope is used to receive light and split the light into a first light beam and a second light beam and send them to the visible light-short-wave infrared imaging module and the long-wave infrared imaging module respectively; the visible light-short-wave infrared imaging module is used to image the visible light and short-wave infrared light in the first light beam and obtain a first imaging picture; the long-wave infrared imaging module is used to image the long-wave infrared light in the second light beam and obtain a second imaging picture; the image fusion module is used to fuse the first imaging picture and the second imaging picture and obtain a visible light-short-wave infrared-long-wave infrared imaging picture. Thus, multi-band hybrid imaging is achieved through a simple optical device, thereby effectively reducing the camera volume and improving the structural compactness of the imaging system.

[0079] In addition, the utility model provides an imaging system, comprising: the above-mentioned multi-band hybrid imaging camera. The multi-band hybrid imaging is realized by an optical device with a simple structure, thereby effectively reducing the size of the camera and improving the compactness of the imaging system.

[0080] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-band hybrid imaging camera, characterized in that: include: Objective lens, spectroscope, visible light-short wave infrared imaging module, long wave infrared imaging module and image fusion module; The objective lens is used to collect light and emit the light to a beam splitter; The beam splitter is used to receive the light, and split the light into a first light beam and a second light beam, which are sent to the visible light-short-wave infrared imaging module and the long-wave infrared imaging module respectively; The visible light-short-wave infrared imaging module is used to image the visible light and short-wave infrared light in the first light beam and obtain a first imaging picture; The long-wave infrared imaging module is used to image the long-wave infrared light in the second light beam and obtain a second imaging picture; The image fusion module is used to fuse the first imaging picture and the second imaging picture to obtain a visible light-short wave infrared-long wave infrared imaging picture.

2. The multi-band hybrid imaging camera according to claim 1, characterized in that: The visible light-short wave infrared imaging module comprises: a long wave infrared filter and a visible light-short wave infrared sensor module; The long-wave infrared filter is placed in the optical path of the first light beam, and is used to filter the long-wave infrared light in the first light beam, and send the filtered visible light and short-wave infrared light to the visible light-short-wave infrared sensor module; The visible light-short-wave infrared sensor module is used to image the visible light and the short-wave infrared light and obtain a first imaging picture.

3. The multi-band hybrid imaging camera according to claim 2, characterized in that: The visible light-short wave infrared sensor module includes a germanium visible light-short wave infrared sensor module or a germanium quantum well visible light-short wave infrared sensor module.

4. The multi-band hybrid imaging camera according to claim 1, characterized in that: The long-wave infrared imaging module includes: a visible light-short-wave infrared filter and a long-wave infrared sensor module; The visible light-short-wave infrared filter is placed in the optical path of the second light beam, and is used to filter the visible light and short-wave infrared light in the second light beam, and send the filtered long-wave infrared light to the long-wave infrared sensor module; The long-wave infrared sensor module is used to image the long-wave infrared light and obtain a second imaging picture.

5. The multi-band hybrid imaging camera according to claim 4, characterized in that: The long-wave infrared sensor module includes: an amorphous germanium long-wave infrared sensor module or an amorphous germanium quantum well long-wave infrared sensor module.

6. The multi-band hybrid imaging camera according to claim 1, characterized in that: The multi-band hybrid imaging camera also includes: a fixing component; The fixing assembly is used to fix the objective lens, the beam splitter, the visible light-short-wave infrared imaging module, the long-wave infrared imaging module and the image fusion module.

7. The multi-band hybrid imaging camera according to claim 6, characterized in that: The fixing assembly includes: a camera lens interface and a camera housing; The camera objective lens interface is used to fix the objective lens to the camera housing; The camera housing is used to wrap and fix the spectroscope, the visible light-short-wave infrared imaging module, the long-wave infrared imaging module and the image fusion module.

8. The multi-band hybrid imaging camera according to claim 7, characterized in that: The multi-band hybrid imaging camera further comprises: an anti-light, anti-electric and anti-electromagnetic radiation layer and a polytetrafluoroethylene layer; The anti-light, anti-electric and anti-electromagnetic radiation layers and the polytetrafluoroethylene layer are sequentially wrapped around the outside of the camera housing to protect the multi-band hybrid imaging camera.

9. The multi-band hybrid imaging camera according to claim 1, characterized in that: The multi-band hybrid imaging camera also includes: a wiring interface and a universal serial bus USB interface; The wiring port is used to supply power to the multi-band hybrid imaging camera; The USB interface is used for data transmission or to supply power to the multi-band hybrid imaging camera.

10. An imaging system, characterized in that: include: The multi-band hybrid imaging camera according to any one of claims 1 to 9.

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