Backboard and photovoltaic module

Abstract

The utility model discloses a back plate and a photovoltaic assembly. The back plate comprises a substrate; the phase change material layer is arranged on one side of the substrate; and the bonding layer is arranged on one side, far away from the substrate, of the phase change material layer. Therefore, a large amount of heat can be absorbed, the heat transfer speed can be increased, the temperature can be reduced, the heat conduction and heat dissipation effects can be improved, and the power generation efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a back plate and a photovoltaic component. Background Art

[0002] The photovoltaic modules convert part of the solar energy received into electrical energy, and absorb the other part. The absorbed heat causes the working temperature of the photovoltaic modules to rise, and the working efficiency and power generation to decrease, which has a negative impact on the life of the system (for every 1°C increase in ambient temperature, the power generation efficiency decreases by 0.4% to 0.5%). Therefore, an effective method for heat dissipation of photovoltaic modules is needed to reduce the temperature of photovoltaic modules.

[0003] In the prior art, the backplane material used is a polymer material, which has relatively poor thermal conductivity and heat dissipation effects, causing the temperature of the photovoltaic module to rise, thereby affecting the power generation efficiency of the photovoltaic module. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a back plate that can absorb a large amount of heat and increase the speed of heat transfer, thereby reducing the temperature, improving the heat conduction and heat dissipation effects, and improving the power generation efficiency.

[0005] The utility model further provides a photovoltaic component.

[0006] According to the backplane of the first aspect of the utility model, the backplane includes: a substrate; a phase change material layer, the phase change material layer is arranged on one side of the substrate; and an adhesive layer, the adhesive layer is arranged on a side of the phase change material layer away from the substrate.

[0007] As a result, the back panel can absorb a large amount of heat and increase the speed of heat transfer, thereby reducing the temperature, improving thermal conductivity and heat dissipation, and improving power generation efficiency.

[0008] According to some embodiments of the present invention, the phase change material layer is one of an organic phase change material layer, an inorganic phase change material layer, a composite phase change material layer and a eutectic phase change material layer.

[0009] According to some embodiments of the present invention, the backplane further comprises: a heat-conducting layer connected to a side of the substrate away from the phase change material layer.

[0010] According to some embodiments of the present invention, the heat conducting layer is an aluminum nitride ceramic layer; and / or the substrate is a metal substrate.

[0011] According to some embodiments of the present invention, the thickness of the ceramic layer is d1, which satisfies the relationship: 200 μm≤d1≤800 μm.

[0012] According to some embodiments of the present invention, the back plate further includes: a water-blocking layer, wherein the water-blocking layer is connected between the adhesive layer and the phase change material layer.

[0013] According to some embodiments of the present invention, the thickness of the adhesive layer is d2, and d2 satisfies the relationship: 2μm≤d2≤200μm; and / or the thickness of the water-blocking layer is d3, and d3 satisfies the relationship: 50μm≤d3≤700μm; and / or the thickness of the phase change material layer is d4, and d4 satisfies the relationship: 100μm≤d4≤800μm; and / or the thickness of the substrate is d5, and d5 satisfies the relationship: 2μm≤d4≤300μm.

[0014] According to some embodiments of the present invention, the adhesive layer is a PE layer, and the water-blocking layer is a PET layer.

[0015] A photovoltaic assembly according to an embodiment of the second aspect of the utility model includes: the above-mentioned backplane.

[0016] According to some embodiments of the utility model, the back plate is provided with an opening; the photovoltaic assembly further includes: a junction box, the junction box is arranged at the opening, and the minimum distance between the edge of the opening and the junction box is d6, and d6 satisfies the relationship: d6≥5mm.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 It is a cross-sectional view of a back plate according to an embodiment of the utility model.

[0020] Reference numerals:

[0021] 100, back panel;

[0022] 10. substrate; 20. phase change material layer; 30. adhesive layer;

[0023] 40. Thermal conductive layer; 50. Water blocking layer. DETAILED DESCRIPTION

[0024] Embodiments of the present invention are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary.

[0025] Reference below Figure 1A back plate 100 according to an embodiment of the present invention is described.

[0026] like Figure 1 As shown, according to the backplane 100 of the first embodiment of the utility model, the backplane 100 includes: a substrate 10, a phase change material layer 20 and an adhesive layer 30, the phase change material layer 20 is arranged on one side of the substrate 10, and the adhesive layer 30 is arranged on the side of the phase change material layer 20 away from the substrate 10.

[0027] Specifically, the traditional backplane is made of polymer materials, and has poor thermal conductivity and heat dissipation, which leads to high temperature at the backplane, affecting the power generation efficiency. Some backplanes are fluorine-containing backplanes, which will cause environmental pollution.

[0028] Therefore, the back panel 100 is provided with a phase change material layer 20. The phase change material layer 20 can change the material state under the condition of unchanged temperature, and can absorb or release a large amount of heat. By utilizing the high heat storage density of the phase change material layer 20, a large amount of heat can be absorbed, thereby reducing the temperature of the back panel 100. Since the phase change material layer 20 is connected to one side of the substrate 10, the phase change material layer 20 can be bonded to the substrate 10 by a thermal conductive adhesive. The phase change material layer 20 can transfer the remaining heat after absorption to the substrate 10. Since the substrate 10 has thermal conductivity, the remaining heat of the phase change material layer 20 can be quickly transferred, which can avoid heat accumulation and speed up the heat dissipation, thereby improving the thermal conductivity and heat dissipation effects, and also improving the power generation efficiency. Moreover, the substrate 10 can also provide a fixed packaging function for the phase change material layer 20.

[0029] Furthermore, the adhesive layer 30 is located on the side of the phase change material layer 20 away from the substrate 10 , so that the adhesive layer 30 can be easily bonded to the adhesive film inside the photovoltaic panel.

[0030] Therefore, the back plate 100 can absorb a large amount of heat and increase the speed of heat transfer, thereby reducing the temperature, improving the thermal conductivity and heat dissipation effects, and improving the power generation efficiency.

[0031] According to some embodiments of the present invention, Figure 1 As shown, the phase change material layer 20 is one of an organic phase change material layer, an inorganic phase change material layer, a composite phase change material layer and a eutectic phase change material layer.

[0032] Among them, the phase change material layer 20 can be an organic phase change material layer. For example, the organic phase change material layer can be industrial paraffin. The organic phase change material layer has the characteristics of high phase change temperature, small supercooling, large phase change latent heat and good thermal stability, so it can absorb more heat while maintaining a stable state.

[0033] The phase change material layer 20 may also be an inorganic phase change material layer. The inorganic phase change material layer may be a molten salt. Its energy storage density is higher than that of the organic phase change material layer. It has the characteristics of high energy storage density, low cost, short melting range, high thermal enthalpy value and non-flammability, so that it can further absorb a large amount of heat.

[0034] Furthermore, the phase change material layer 20 may also be a composite phase change material layer. The composite phase change material layer is composed of multiple phase change materials, which can overcome the defects of a single phase change material and thus have the characteristics of multiple phase change materials.

[0035] In addition, the phase change material layer 20 may be a eutectic phase change material layer. Since the eutectic phase change material layer may have two or more crystal structures in a solid state, it may have multiple properties, and the eutectic phase change temperature is usually relatively stable.

[0036] Therefore, the phase change material layer 20 can be selected according to the characteristics required in actual use and has a certain adaptability.

[0037] According to some embodiments of the present invention, Figure 1 As shown, the back plate 100 further includes: a heat conducting layer 40 , and the heat conducting layer 40 is connected to a side of the substrate 10 away from the phase change material layer 20 .

[0038] Among them, a heat-conducting layer 40 is also provided on the back plate 100, and the heat-conducting layer 40 is located on the outside. When the temperature on the back plate 100 is high, the heat is absorbed by the phase change material layer 20, thereby reducing the temperature. Since the heat transfer coefficient of the phase change material layer 20 is low and the heat release is slow, a substrate 10 is provided on one side of the phase change material layer 20. The residual heat of the phase change material layer 20 passes through the substrate 10, and the substrate 10 can transfer the remaining heat to the heat-conducting layer 40. Since the heat-conducting layer 40 has the characteristic of high thermal conductivity efficiency, the remaining heat can further accelerate the conduction of heat through the heat-conducting layer 40, thereby improving the thermal conductivity and heat dissipation effects.

[0039] According to a specific embodiment of the present invention, the heat conducting layer 40 is an aluminum nitride ceramic layer, and the substrate 10 is a metal substrate.

[0040] Specifically, the heat conducting layer 40 can be an aluminum nitride ceramic layer. The melting point of aluminum nitride ceramic is relatively high, which is 2450°C. It has good stability in a high temperature non-oxidizing environment within 2000°C, high thermal conductivity, which is 170W / (mK) to 320W / (mK), high electrical insulation resistance, excellent dielectric constant and low dielectric loss, and good mechanical properties. Therefore, the aluminum nitride ceramic layer has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity and low dielectric loss, and is a better heat dissipation and packaging material.

[0041] In addition, the substrate 10 can be a metal substrate. Since the aluminum nitride ceramic layer has the characteristics of high thermal conductivity, high temperature resistance and chemical corrosion resistance, the heat-conducting layer 40 and the substrate 10 are superimposed together for heat dissipation, which can further accelerate the heat conduction and heat dissipation speed, thereby reducing the temperature, which can be reduced by more than 10° C. Moreover, the aluminum nitride ceramic layer has the characteristics of high weather resistance and environmental protection. In this way, the heat-conducting layer 40 has the advantages of high weather resistance and low carbon environmental protection, thereby improving the service life and reliability of the backplane 100.

[0042] According to some embodiments of the present invention, Figure 1 As shown, the thickness of the ceramic layer is d1, which satisfies the relationship: 200 μm≤d1≤800 μm.

[0043] Among them, the thickness range of the ceramic layer set on the substrate 10 is controlled to be 200μm to 800μm. In this way, the setting thickness of the backplane 100 can be controlled. Within the thickness range of the ceramic layer, the thickness of the ceramic layer can be changed according to the thermal conductivity of the ceramic layer, so that the ceramic layer can have different thermal conductivity and heat dissipation effects.

[0044] According to some embodiments of the present invention, Figure 1 As shown, the back plate 100 further includes: a water-blocking layer 50 , and the water-blocking layer 50 is connected between the adhesive layer 30 and the phase change material layer 20 .

[0045] Among them, one side of the water-blocking layer 50 is connected to the adhesive layer 30, and the other side of the water-blocking layer 50 is connected to the phase change material layer 20. The water-blocking layer 50 can play a waterproof role, thereby preventing rainwater or water vapor from entering the back plate 100 and affecting the internal circuit of the photovoltaic panel, thereby protecting the photovoltaic panel.

[0046] In addition, the water-blocking layer 50 also has an insulating effect, which can further prevent short circuits from occurring inside the photovoltaic panel. Since the back panel 100 is located below the battery cells in the photovoltaic panel, the water-blocking layer 50 in the back panel 100 can provide insulation protection for the battery cells, thereby further protecting the photovoltaic panel.

[0047] According to some embodiments of the present invention, Figure 1 As shown, the thickness of the adhesive layer 30 is d2, and d2 satisfies the relationship: 2μm≤d2≤200μm, the thickness of the water-blocking layer 50 is d3, and d3 satisfies the relationship: 50μm≤d3≤700μm, the thickness of the phase change material layer 20 is d4, and d4 satisfies the relationship: 100μm≤d4≤800μm, and the thickness of the substrate 10 is d5, and d5 satisfies the relationship: 2μm≤d4≤300μm.

[0048] Among them, the setting of the adhesive layer 30 can make the back plate 100 tightly connected to the battery cell through the adhesive film, so that the heat generated by the battery cell can be transferred to the outside through the adhesive layer 30, and the heat generated by the battery cell can be absorbed by the phase change material layer 20. Then, the remaining heat of the phase change material layer 20 is superimposed and dissipated through the substrate 10 and the thermal conductive layer 40. In this way, the heat dissipation speed can be increased, thereby improving the heat dissipation performance of the back plate 100.

[0049] Furthermore, the thickness of the adhesive layer 30 ranges from 2 μm to 200 μm. Since the adhesive layer 30 is connected to the cell through the adhesive film, the adhesion between the adhesive layer 30 and the adhesive film can be adjusted by changing the thickness of the adhesive layer 30. The thickness of the water-blocking layer 50 ranges from 50 μm to 700 μm, which can change the waterproof performance of the water-blocking layer 50, thereby improving the safety of the cell inside the photovoltaic panel. The thickness of the phase change material layer 20 ranges from 100 μm to 800 μm, which can change the heat absorption capacity of the phase change material layer 20, thereby avoiding the high temperature of the backplane 100. In addition, the thickness of the substrate 10 ranges from 2μm to 300μm, which can change the thermal conductivity of the backplane 100. Moreover, by changing the thickness of the adhesive layer 30, the thickness of the water-blocking layer 50, the thickness of the phase change material layer 20, the thickness of the substrate 10 and the thickness of the ceramic layer, the thickness of the entire backplane 100 can be adjusted, so that the backplane 100 can have a good heat dissipation effect.

[0050] According to the specific embodiment of the utility model, Figure 1 As shown, the adhesive layer 30 is a PE layer, and the water-blocking layer 50 is a PET layer.

[0051] Specifically, the adhesive layer 30 is set as a PE layer, which is a polyethylene layer. The PE layer has good adhesion, so that the PE layer and the adhesive film can be more stably bonded. Among them, the water-blocking layer 50 is set as a PET layer, which is a polyethylene terephthalate plastic layer. The PET layer not only has good waterproofness, but also good insulation, so that it can play a double protection role for the battery cell.

[0052] The photovoltaic assembly according to the embodiment of the second aspect of the utility model includes: the back plate 100 of the above embodiment.

[0053] According to some embodiments of the present invention, the back plate 100 is provided with an opening, and the photovoltaic module further includes: a junction box, which is arranged at the opening, and the minimum distance between the edge of the opening and the junction box is d6, and d6 satisfies the relationship: d6≥5mm.

[0054] Among them, the length of the photovoltaic module can be set to 1600mm to 2500mm, and the width of the photovoltaic module can be set to 900mm to 1400mm. Since the junction box needs to be installed on the photovoltaic module, openings are provided at positions corresponding to the back panel 100 and the junction box, which can facilitate the placement of the junction box. Moreover, the minimum distance between the edges of the opening and the junction box can be set to 5mm. In this way, contact between the back panel 100 and the junction box can be avoided. Since a metal substrate is provided inside the back panel 100, the lead wires of the junction box can be prevented from contacting the metal substrate to cause leakage problems.

[0055] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purpose of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A backplane, characterized in that: include: substrate; A phase change material layer, wherein the phase change material layer is disposed on one side of the substrate; as well as An adhesive layer, the adhesive layer being disposed on a side of the phase change material layer away from the substrate; A water-blocking layer is connected between the adhesive layer and the phase-change material layer.

2. The back plate according to claim 1, characterized in that: The phase change material layer is one of an organic phase change material layer, an inorganic phase change material layer, a composite phase change material layer and a eutectic phase change material layer.

3. The back plate according to claim 1, characterized in that: Also includes: A heat-conducting layer is connected to a side of the substrate away from the phase-change material layer.

4. The back plate according to claim 3, characterized in that: The heat conducting layer is an aluminum nitride ceramic layer; and / or The substrate is a metal substrate.

5. The back plate according to claim 4, characterized in that: The thickness of the ceramic layer is d1, which satisfies the relationship: 200 μm≤d1≤800 μm.

6. The back plate according to claim 5, characterized in that: The thickness of the adhesive layer is d2, and d2 satisfies the relationship: 2 μm≤d2≤200 μm; and / or The thickness of the water-blocking layer is d3, and d3 satisfies the relationship: 50 μm≤d3≤700 μm; and / or The thickness of the phase change material layer is d4, and d4 satisfies the relationship: 100 μm≤d4≤800 μm; and / or The thickness of the substrate is d5, and d5 satisfies the relationship: 2μm≤d4≤300μm.

7. The back plate according to claim 1, characterized in that: The adhesive layer is a PE layer, and the water-blocking layer is a PET layer.

8. A photovoltaic module, characterized in that: include: The backplane according to any one of claims 1 to 7.

9. The photovoltaic module according to claim 8, characterized in that: The back plate is provided with an opening; The photovoltaic module further comprises: A junction box is arranged at the opening, and the minimum distance between the edge of the opening and the junction box is d6, and d6 satisfies the relationship: d6≥5mm.

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