Solar silicon wafer splitting equipment

Abstract

The utility model discloses solar silicon wafer splitting equipment which comprises a machine base, a conveying line, a wafer splitting device, a silicon wafer detection device, a carrying device and a wafer splitting detection device. The machine base is provided with a feeding position, a discharging position, a first material position and a second material position. The conveying line is arranged between the feeding position and the discharging position. The splitting device is arranged on the base; the silicon wafer detection device is arranged between the feeding position and the splitting device; the carrying device is arranged at the first material position and is used for transferring the to-be-cracked silicon wafers which are detected to be unqualified by the silicon wafer detection device and are not cracked by the cracking device to the first material position; the splitting detection device is arranged on the side, away from the feeding position, of the splitting device, the splitting detection device is used for conducting splitting quality inspection on the silicon wafers split by the splitting device, the silicon wafers detected to be qualified through the splitting detection device are discharged through the discharging position, and the silicon wafers detected to be unqualified are distributed to a second material position at the discharging position. According to the technical scheme of the utility model, the production efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar silicon wafer production, in particular to a solar silicon wafer splitting device. Background Art

[0002] The global energy transformation is an inevitable trend. The scale of the photovoltaic market will accelerate and the production capacity will further expand. In the process of photovoltaic cell processing, each solar silicon wafer needs to be split separately. The existing solar silicon wafer splitting processing equipment usually only has a silicon wafer detection device to automatically detect cracks on the silicon wafer before the splitting process, but it cannot automatically detect the silicon wafer after the splitting process. It is usually judged manually whether the silicon wafer after the splitting process is qualified. This manual detection method is inefficient, resulting in low production efficiency of solar silicon wafer splitting equipment. Utility Model Content

[0003] The main purpose of the utility model is to provide a solar silicon wafer splitting device, aiming to improve production efficiency.

[0004] To achieve the above-mentioned purpose, the solar silicon wafer splitting device proposed by the utility model comprises:

[0005] The machine base is provided with an upper material position, a lower material position, a first material position and a second material position;

[0006] A conveying line is arranged between the upper material position and the lower material position, the first material position is arranged at one side of the conveying line, and the second material position is arranged at the lower material position;

[0007] A splitting device, provided on the machine base and located above the conveying line, the splitting device is used to split the silicon wafers to be split conveyed by the conveying line, and the splitting device is located between the first material level and the upper material level;

[0008] A silicon wafer detection device, disposed between the loading position and the wafer splitting device, for detecting the silicon wafers to be split that are conveyed from the loading position via the conveying line;

[0009] a transport device, disposed at the first material level, for transferring the unqualified silicon wafers to be split that have been detected by the silicon wafer detection device and have not been split by the splitting device to the first material level; and

[0010] A chip detection device is arranged on a side of the chip detection device away from the upper material position, and is used to perform chip quality inspection on the silicon wafers after being split by the chip detection device, wherein the silicon wafers that pass the inspection by the chip detection device are unloaded through the lower material position, and the silicon wafers that fail the inspection are diverted to the second material position at the lower material position.

[0011] Optionally, the solar silicon wafer splitting equipment also includes a drying device, which is arranged between the splitting device and the unloading position, and the drying device includes a mounting cover, a fan and a heating structure, the mounting cover has an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet, the mounting cover is arranged on the upper side of the conveyor line, and the air outlet faces the conveyor line. The fan is arranged on the mounting cover, and is used to drive the airflow from the air inlet into the air duct and then be discharged from the air outlet. The heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

[0012] Optionally, the number of the conveying lines is two, and each of the conveying lines is correspondingly provided with one of the wafer splitting device, the silicon wafer detection device and the wafer splitting detection device.

[0013] Optionally, the first material level is located between the two conveying lines, and the handling device can move between the two conveying lines.

[0014] Optionally, the transport device includes a sliding module and a material picking piece, the sliding module is installed on the machine base and extends along the arrangement direction of the two conveyor lines, the material picking piece is installed on the sliding module and is located above the conveyor lines, so that it can pick up the silicon wafers to be split that have failed the inspection of the silicon wafer inspection device and have not been split by the splitting device on the two conveyor lines and transfer them to the first material position.

[0015] Optionally, the second material level is set at the end of the conveyor line and is lower than the upper surface of the conveyor line, so that unqualified silicon wafers fall from the end of the conveyor line into the second material level.

[0016] Optionally, the solar silicon wafer cracking equipment includes a loading device, which is arranged at the loading position and located between the two conveyor lines. The loading device includes a loading rotating mechanism and two loading robots. The two loading robots are installed on the loading rotating mechanism. The two loading robots are arranged at an angle and extend in the horizontal direction. The loading rotating mechanism is used to drive the two loading robots to rotate synchronously, so that any one of the loading robots moves the solar silicon wafers to be cracked at the loading position to one of the conveyor lines, while the other loading robot moves from the other conveyor line to the loading position to pick up the solar silicon wafers to be cracked.

[0017] Optionally, the solar silicon wafer splitting equipment includes a unloading device, which is arranged at the unloading position and is located between the two conveyor lines. The unloading device includes a unloading rotating mechanism and two unloading robots. The two unloading robots are installed on the unloading rotating mechanism. The two unloading robots are arranged at an angle and extend in the horizontal direction. The unloading rotating mechanism is used to drive the two unloading robots to rotate synchronously, so that any one of the unloading robots moves the silicon wafers that have passed the inspection after splitting to the unloading position, while the other unloading robot moves from the unloading position to the conveyor line to pick up the silicon wafers that have passed the inspection after splitting.

[0018] Optionally, the machine base is provided with a mounting frame, and the silicon wafer detection device and the wafer splitting device are both mounted on the mounting frame and are arranged on opposite sides of the mounting frame.

[0019] Optionally, the silicon wafer inspection device includes a silicon wafer inspection camera and an illumination lamp, and the silicon wafer inspection camera and the illumination lamp are arranged facing each other and are respectively arranged on the upper and lower sides of the conveyor line.

[0020] Optionally, the splinter detection device includes a splinter detection camera, and the splinter detection camera is disposed on the machine base and arranged toward the conveyor line.

[0021] The utility model sets an upper material position, a lower material position, and a first material position on the machine, sets a second material position at the lower material position, sets a conveyor line between the upper material position and the lower material position, and the first material position is located beside the conveyor line, sets a chip splitting device between the upper material position and the first material position, and the chip splitting device is set above the conveyor line, sets a silicon wafer detection device between the upper material position and the chip splitting device, sets a conveying device at the first material position, and sets a chip splitting device on the side of the chip splitting device away from the upper material position. In this way, when the conveyor line conveys the silicon wafers at the upper material position to the position of the silicon wafer detection device, the chip splitting detection device detects the silicon wafers to be split, and when the unqualified silicon wafers are conveyed to the bottom of the chip splitting device, the chip splitting device does not process the unqualified silicon wafers, and when the unqualified silicon wafers are conveyed to the side of the first material position, the conveying device conveys the unqualified silicon wafers to the first material position. When the qualified silicon wafers detected by the silicon wafer detection device are transported to the bottom of the splitting device, the splitting device performs splitting processing on the qualified silicon wafers, and the conveyor line continues to transport the silicon wafers after the splitting processing to the lower material position. When the silicon wafers after the splitting processing are transported to the splitting detection device, the splitting detection device detects the silicon wafers that have completed the splitting. The qualified silicon wafers after the detection by the splitting detection device are transported to the lower material position, and the unqualified silicon wafers after the detection by the splitting detection device are transported to the second material position. The silicon wafer detection device and the splitting detection device are set in this way to detect the silicon wafers before splitting and the silicon wafers after splitting respectively. Compared with manual detection of silicon wafers after splitting processing, this detection efficiency is higher, which improves the production efficiency of solar silicon wafer splitting equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 This is a schematic structural diagram of an embodiment of a solar silicon wafer splitting device of the utility model;

[0024] Figure 2 for Figure 1 Schematic diagram of the structure of the conveying line and the splitting device;

[0025] Figure 3 for Figure 1 Schematic diagram of the structure of the middle split device, the split detection device and the handling device;

[0026] Figure 4 for Figure 1 Structural schematic diagram of the middle drying device and the second material position;

[0027] Figure 5 for Figure 1 A schematic diagram of the structure of the middle mounting seat and the transport mechanism;

[0028] Figure 6 for Figure 5 A schematic diagram of the structure of the middle mounting seat and the transport mechanism from another perspective;

[0029] Figure 7 for Figure 3 Schematic diagram of the structure of the middle split device;

[0030] Figure 8 for Figure 4 The structural diagram of the drying device;

[0031] Fig. 9 for Figure 8 A cross-sectional view of the drying device;

[0032] Fig.10 for Figure 1 Structural schematic diagram of the middle feeding device;

[0033] Fig.11 for Figure 1 Schematic diagram of the structure of the middle feeding device.

[0034] Description of Figure Numbers:

[0035] 10. Machine base; 11. Upper material position; 12. Lower material position; 13. First material position; 14. Second material position; 15. Mounting frame; 20. Conveyor line; 21. Mounting seat; 211. Second guide rail; 22. Handling mechanism; 221. Second sliding seat; 2211. Second slider; 2212. First guide rail; 222. Lifting mechanism; 2221. Connector; 2222. Motor; 2223. Screw rod; 2225. First slider; 223. Handling component; 30. Slicing device; 31. Cutting mechanism; 32. Heating mechanism; 33. Cooling mechanism; 34. Blowing mechanism; 40. Wafer detection device; 41. Wafer detection phase machine; 42, lighting lamp; 50, handling device; 51, sliding module; 52, material picking part; 60, crack detection device; 70, drying device; 71, installation cover; 72, fan; 73, heating structure; 74, temperature sensor; 711, air inlet; 712, air outlet; 713, air duct; 80, loading device; 81, loading rotating mechanism; 82, loading manipulator; 821, loading robot arm; 822, loading vacuum suction cup; 83, installation part; 831, through hole; 90, unloading device; 91, loading rotating mechanism; 92, unloading manipulator; 921, unloading robot arm; 922, unloading vacuum suction cup; 100, silicon wafer DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0039] The utility model provides a solar silicon wafer splitting device.

[0040] In the embodiment of the present utility model, Figures 1 to 11As shown, the solar silicon wafer 100 splitting device includes a machine base 10, a conveyor line 20, a splitting device 30, a silicon wafer 100 detection device 40, a handling device 50 and a splitting detection device 60; the machine base 10 is provided with an upper material level 11, a lower material level 12, a first material level 13 and a second material level 14; the conveyor line 20 is provided between the upper material level 11 and the lower material level 12, the first material level 13 is provided on one side of the conveyor line 20, and the second material level 14 is provided at the lower material level 12; the splitting device 30 is provided on the machine base 10 and is located above the conveyor line 20, and the splitting device 30 is used for splitting the silicon wafer 100 to be split conveyed by the conveyor line 20, and the splitting device 30 is located between the first material level 13 and the upper material level 11; the silicon wafer 100 detection device 40 is provided Between the upper material position 11 and the splitting device 30, it is used to detect the silicon wafers 100 to be split that are transported from the upper material position 11 via the conveyor line 20; the transport device 50 is arranged at the first material position 13, and the transport device 50 is used to transfer the silicon wafers 100 to be split that have failed the inspection by the silicon wafer 100 inspection device 40 and have not been split by the splitting device 30 to the first material position 13; the splitting inspection device 60 is arranged on the side of the splitting device 30 away from the upper material position 11, and the splitting inspection device 60 is used to perform splitting quality inspection on the silicon wafers 100 after being split by the splitting device 30, wherein the silicon wafers 100 that have passed the inspection by the splitting inspection device 60 are unloaded through the unloading material position 12, and the silicon wafers 100 that have failed the inspection are diverted to the second material position 14 at the unloading material position 12.

[0041] The utility model arranges an upper material level 11, a lower material level 12, and a first material level 13 on the machine, arranges a second material level 14 at the lower material level 12, arranges a conveying line 20 between the upper material level 11 and the lower material level 12, and the first material level 13 is located beside the conveying line 20, arranges a chip splitting device 30 between the upper material level 11 and the first material level 13, and the chip splitting device 30 is arranged above the conveying line 20, arranges a silicon wafer 100 detection device 40 between the upper material level 11 and the chip splitting device 30, arranges a handling device 50 at the first material level 13, and arranges a chip splitting detection device 60 on a side of the chip splitting device 30 away from the upper material level 11. In this way, when the conveyor line 20 conveys the silicon wafer 100 at the upper material level 11 to the position of the silicon wafer 100 detection device 40, the splitting detection device 60 detects the silicon wafer 100 to be split. When the unqualified silicon wafer 100 is conveyed to the bottom of the splitting device 30, the splitting device 30 does not process the unqualified silicon wafer 100. When the unqualified silicon wafer 100 is conveyed to the side of the first material level 13, the transport device 50 transports the unqualified silicon wafer 100 to the first material level 13. When the qualified silicon wafer 100 detected by the silicon wafer 100 detection device 40 is transported to the bottom of the splitting device 30, the splitting device 30 performs splitting processing on the qualified silicon wafer 100, and the conveying line 20 continues to transport the silicon wafer 100 after the splitting processing to the direction of the lower material position 12. When the silicon wafer 100 after the splitting processing is transported to the splitting detection device 60, the splitting detection device 60 detects the silicon wafer 100 after the splitting is completed. The qualified silicon wafer 100 after the detection by the splitting detection device 60 is transported to the lower material position 12, and the unqualified silicon wafer 100 after the detection by the splitting detection device 60 is transported to the second material position 14. In this way, the silicon wafer 100 detection device 40 and the splitting detection device 60 are respectively arranged to detect the silicon wafer 100 before splitting and the silicon wafer 100 after splitting. Compared with the manual detection of the silicon wafer 100 after the splitting processing, this detection efficiency is higher, which improves the production efficiency of the solar silicon wafer 100 splitting equipment.

[0042] The first material level 13 and the second material level 14 respectively collect silicon wafers 100 with unqualified quality before the splitting process and silicon wafers 100 with unqualified quality after the splitting process, thereby preventing silicon wafers 100 with unqualified quality from being split and preventing silicon wafers 100 with unqualified quality after the splitting process from being mixed with silicon wafers with qualified quality after the splitting process. At the same time, the unqualified silicon wafers 100 can be collected, which is convenient for secondary processing for recycling, thereby reducing the waste of resources.

[0043] Specifically, the solar silicon wafer 100 splitting device further includes an electric control device, which is connected to the conveying line 20 , the splitting device 30 , the silicon wafer 100 detection device 40 , the handling device 50 and the splitting detection device 60 . When in use, the silicon wafer 100 at the upper material position 11 is loaded onto the conveyor line 20. When the conveyor line 20 conveys the silicon wafer 100 to the splitting device 30, the silicon wafer 100 detection device 40 detects the silicon wafer 100. The qualified silicon wafer 100 after the detection is split by the splitting device 30 when it is conveyed to the bottom of the splitting device 30. After the silicon wafer 100 is split into two halves, the conveyor line 20 continues to convey the two halves toward the lower material position 12. When it is conveyed to the side of the splitting detection device 60, the splitting detection device 60 detects the silicon wafer 100 after the splitting by the splitting device 30. The qualified silicon wafer 100 detected by the splitting detection device 60 will be conveyed to the lower material position 12 by the conveyor line 20, and the unqualified silicon wafer 100 detected by the splitting detection device 60 will be conveyed to the second material position 14 by the conveyor line 20. When the silicon wafer 100 is detected as unqualified by the silicon wafer 100 detection device 40, when it is transported to the bottom of the splitting device 30 by the conveyor line 20, the electronic control device controls the splitting device 30 not to split the unqualified silicon wafer 100. When the conveyor line 20 transports the unqualified silicon wafer 100 to the side of the first material level 13, the transport device 50 transports the unqualified silicon wafer 100 to the first material level 13.

[0044] In some embodiments, the slicing device 30 includes a cutting mechanism 31, a heating mechanism 32 and a cooling mechanism 33. The cutting mechanism 31 is disposed on the machine base 10, and is used to cut the two ends of a preset slicing line on the silicon wafer 100; the heating mechanism 32 is disposed on the machine base 10 and is located on one side of the cutting mechanism 31, and is used to heat the portion between the two ends of the preset slicing line on the silicon wafer 100; the cooling mechanism 33 is disposed on the machine base 10 and is located on one side of the heating mechanism 32, and the cooling mechanism 33 is provided with a cooling head, and the cooling head is used to spray a low-temperature fluid onto the preset slicing line on the silicon wafer 100 after being heated by the heating mechanism 32.

[0045] Specifically, the cutting mechanism 20 is a laser emitter, which emits laser to cut the two ends of the preset cutting line on the silicon wafer. The two ends of the preset splitting line on the cut silicon wafer 100 can be cut into grooves of a certain length or cut into notches of a certain length, which can be set according to actual conditions.

[0046] The heating assembly heats the portion between the two ends of the preset splitting line on the silicon wafer 100, and the cooling head sprays a low-temperature fluid onto the preset splitting line on the silicon wafer 100 heated by the heating mechanism 32 for cooling. The stress of the silicon wafer 100 is changed by thermal expansion and contraction, and the silicon wafer 100 is naturally split along the cutting direction of the preset splitting line under the action of the stress, and the split gap is combined with the two ends of the preset cutting line, thereby realizing the segmentation of the silicon wafer 100.

[0047] Regarding the division of the silicon wafer 100 , the solar silicon wafer 100 splitting device 30 can be selectively configured. Specifically, the selective configuration means that the solar silicon wafer 100 splitting device 30 has multiple ways to divide the silicon wafer 100 .

[0048] For example, in some embodiments, the cutting mechanism 31 may first cut one end of a preset splitting line on the silicon wafer 100, and then heat the portion between the two ends of the preset splitting line on the silicon wafer 100 through the heating mechanism 32. After the heating is completed, a low-temperature fluid is sprayed from the cooling head to the preset splitting line on the silicon wafer 100 after being heated by the heating mechanism 32. In the process of the cooling head spraying the low-temperature fluid on the preset splitting line on the silicon wafer 100, the cutting mechanism 31 cuts the other end of the preset splitting line on the silicon wafer 100, so that when the silicon wafer 100 is split from one end of the preset splitting line to the other end, the two ends of the preset splitting line are merged, thereby realizing the segmentation of the silicon wafer 100.

[0049] In this way, the silicon wafer 100 is split along the cutting direction of the preset splitting line under the action of thermal expansion and contraction, so that the silicon wafer 100 can be split without external force, reducing the risk of edge collapse and hidden cracks of the silicon wafer 100 under the action of external force, which is beneficial to improving the production quality of the solar silicon wafer 100.

[0050] For another example, in another embodiment, the cutting mechanism 31 first cuts the two ends of the preset splitting line on the silicon wafer 100, and then heats the portion between the two ends of the preset splitting line on the silicon wafer 100 through the heating mechanism 32. After the heating is completed, a low-temperature fluid is sprayed from a cooling head onto the preset splitting line on the silicon wafer 100 that has been heated by the heating mechanism 32. In this way, when the silicon wafer 100 is split from one end of the preset splitting line to the other end, the gaps at both ends of the preset splitting line can be combined to achieve the splitting of the silicon wafer 100.

[0051] It is worth noting that the cutting mechanism 31 can be selectively set, as long as it can cut the two ends of the preset splitting line on the silicon wafer 100. For example, the cutting mechanism 31 can be, but not limited to: a laser cutter, a blade cutter, etc. Similarly, the heating mechanism 32 can heat the portion between the two ends of the preset splitting line on the silicon wafer 100. For example: laser heating.

[0052] Furthermore, the cryogenic fluid sprayed by the cooling head may be a cryogenic liquid or a cryogenic gas. This application does not impose any specific limitation on this and the choice may be made based on actual conditions.

[0053] Furthermore, the cutting head of the cutting mechanism 31, the heating element of the heating mechanism 32 and the cooling head are arranged in sequence along the cutting direction of the splitting line reserved on the silicon wafer 100. In this way, when splitting the silicon wafer 100, it is only necessary to move the silicon wafer 100 from the position of the cutting mechanism 31 toward the cooling mechanism 33. When the silicon wafer 100 is moved out of the position of the cooling mechanism 33, the silicon wafer 100 can be split, and there is no need to move back and forth between the cutting mechanism 31, the heating mechanism 32 and the cooling mechanism 33, thereby improving the cutting efficiency of the silicon wafer 100.

[0054] In some embodiments, the cutting mechanism 31 includes a cutting head, a first connecting seat and a first locking assembly. The cutting head is installed on the first connecting seat, and the first connecting seat is slidably installed on the fixed frame along the second direction. The first locking assembly is adjustably connected between the fixed frame and the first connecting seat to lock the fixed frame and the first connecting seat. The second direction is perpendicular to the silicon wafer 100.

[0055] Specifically, the second direction is perpendicular to the surface of the silicon wafer 100. By driving the first connection seat to slide in the second direction, the cutting mechanism 31 can be moved away from or close to the silicon wafer 100. That is, by sliding in the second direction, the depth of the groove cut by the cutting mechanism 31 at both ends of the preset splitting line on the silicon wafer 100 can be adjusted. After the adjustment is completed, the position adjusted by the cutting mechanism 31 can be locked by the first locking component, thereby improving the user experience. Of course, in other embodiments, the cutting mechanism 31 component is fixedly installed on the fixing frame.

[0056] Furthermore, the first locking assembly includes a fixing plate and a first screw, one end of the fixing plate is fixed to the first connecting seat, and the other end is provided with a first strip hole extending along the second direction, and the fixing frame is provided with a first screw hole at a position corresponding to the first strip hole, and the first screw is screwed to the first screw hole through the first strip hole.

[0057] In this way, when the position of the cutting mechanism 31 needs to be adjusted, it is not necessary to completely screw the first screw out of the first screw hole, but only to screw it until the first connecting seat can slide on the fixing frame, thereby reducing the difficulty of adjustment for the user. At the same time, the long hole is also arranged to facilitate fine adjustment of the cutting mechanism 31. Of course, in other embodiments, one end of the fixing plate is fixed to the first connecting seat, and the other end is provided with a plurality of first through holes, and the plurality of first through holes are arranged at intervals along the second direction.

[0058] Furthermore, the cutting mechanism 31 also includes a first screw and a first knob component provided at one end of the first screw, the first screw can be rotatably mounted on the fixing frame, the first connecting seat is provided with a second screw hole, and the first screw is located in the second screw hole. Specifically, the first knob component can drive the first screw to extend and retract, the fixing frame is provided with a mounting portion 83, the first screw is rotatably mounted on the mounting portion 83 on the fixing frame, and extends out of the second screw hole, and the first screw is driven to rotate by screwing the first knob portion, so as to achieve fine adjustment of the cutting mechanism 31, thereby improving the user experience.

[0059] In some embodiments, the heating mechanism 32 includes a heating element, a second connecting seat and a second locking assembly. The heating element is installed on the second connecting seat. The second connecting seat is slidably installed on the first sliding seat along the first direction. The second locking assembly is adjustably connected between the first sliding seat and the second connecting seat to lock the first sliding seat and the second connecting seat.

[0060] Specifically, by driving the second connection seat to slide in the first direction, the position of the heating mechanism 32 can be adjusted. When there is a deviation between the heating element of the heating mechanism 32 and the cutting head of the cutting mechanism 31, the position of the heating mechanism 32 can be adjusted separately by sliding the second connection seat, so that the heating element of the heating mechanism 32 is aligned with the cutting head of the cutting mechanism 31, so as to improve the quality of the silicon wafer 100 after the segmentation. After the adjustment is completed, the adjusted position of the heating mechanism 32 can be locked by the second locking assembly, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 32 assembly is fixedly mounted on the mounting plate.

[0061] Furthermore, the second locking assembly includes a connecting block and a second screw, one end of the connecting block is fixed to the second connecting seat, and the other end is provided with a second strip hole extending along the first direction, and the first sliding seat is provided with a third screw hole at a position corresponding to the second strip hole, and the second screw is screwed to the third screw hole through the second strip hole.

[0062] Specifically, when the position of the heating mechanism 32 needs to be adjusted, it is not necessary to completely unscrew the second screw from the second screw hole, but only to screw it until the second connection seat can slide on the fixing frame, thereby reducing the difficulty of adjustment for the user. At the same time, the long hole is also arranged to facilitate fine adjustment of the heating mechanism 32. Of course, in other embodiments, one of the two connection parts is fixed to the second connection seat, and the other connection part is provided with a plurality of second via holes, and the plurality of second via holes are arranged at intervals along the second direction.

[0063] Furthermore, the heating mechanism 32 also includes a second screw and a second knob component provided at one end of the screw, the second screw can be rotatably mounted on the first sliding seat, the second connecting seat is provided with a fifth screw hole, and the second screw is located in the second screw hole. Specifically, the second knob component of the knob can drive the second screw to extend and retract, the first sliding seat is provided with a second mounting portion 83, the second screw is rotatably mounted on the second mounting portion 83 on the first sliding seat, and extends out of the fifth screw hole, and the second screw is driven to rotate by screwing the second knob portion, so as to achieve fine adjustment of the cutting mechanism 31, thereby improving the user experience.

[0064] Furthermore, the second connecting seat includes a first connecting member 2221 and a second connecting member 2221, the first connecting member 2221 is slidably installed on the first sliding seat along the first direction, the first connecting member 2221 is slidably installed on the side of the first connecting member 2221 away from the first sliding seat along the second direction, the cooling mechanism 33 is installed on the side of the second connecting member 2221 away from the first connecting member 2221, and the cooling mechanism 33 also includes a third locking assembly, which is adjustably connected between the first connecting member 2221 and the second connecting member 2221 to lock the first connecting member 2221 and the second connecting member 2221.

[0065] Specifically, by driving the second connecting member 2221 to slide in the second direction, the heating mechanism 32 can be moved away from or close to the silicon wafer 100. That is, by sliding in the second direction, the heating mechanism 32 can be adjusted to preset the splitting line heating temperature on the silicon wafer 100 to prevent the heating temperature from being too high or too low. After the adjustment is completed, the adjusted position of the heating mechanism 32 can be locked by the third locking assembly, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 32 is fixedly mounted on the second connecting member 2221.

[0066] Furthermore, the heating mechanism 32 also includes a third connecting member 2221, a second adjusting screw and a second rotating shaft. The third connecting member 2221 is provided with a connecting portion on one side parallel to the first direction, and the connecting portion is provided with a third axial hole and a second arc-shaped hole located on the outer periphery of the third axial hole. The side wall of the second connecting member 2221 is provided with a seventh screw hole corresponding to the second arc-shaped hole, and a fourth axial hole corresponding to the third axial hole. The arc center of the second arc-shaped hole is located in the seventh screw hole, the second adjusting screw is screwed to the seventh screw hole through the second arc-shaped hole, and the second rotating shaft is inserted into the fourth axial hole through the third axial hole.

[0067] Specifically, the third axial hole is the rotation origin of the third connecting member 2221. By driving the third connecting member 2221 to rotate along the extension direction of the second arc hole, the heating member angle of the heating mechanism 32 can be adjusted. After the heating mechanism 32 is installed on the third connecting member 2221, it is convenient to adjust the angle of the heating mechanism 32 to meet the requirements of splitting the silicon wafer 100. After the adjustment is completed, the position can also be fixed by screwing the second adjustment screw, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 32 is fixedly installed on the third connecting member 2221.

[0068] In some embodiments, the cooling mechanism 33 includes a cooling head, an adjustment seat and a fourth locking assembly. The cooling head is installed on the adjustment seat. The adjustment seat is slidably installed on the first sliding seat along the first direction. The fourth locking assembly is adjustably connected between the first sliding seat and the adjustment seat to lock the first sliding seat and the adjustment seat.

[0069] Specifically, by driving the adjustment seat to slide in the first direction, the position of the cooling mechanism 33 can be adjusted. When there is a deviation between the heating element of the heating mechanism 32 and the cooling head of the cooling mechanism 33, the position of the cooling mechanism 33 can be adjusted separately by sliding the adjustment seat so that the cooling head is aligned with the cutting head of the cutting mechanism 31 to improve the quality of the silicon wafer 100 after segmentation. After the adjustment is completed, the adjusted position of the cooling mechanism 33 can be locked by the fourth locking assembly to prevent displacement, thereby improving the user experience. Of course, in other embodiments, the cooling mechanism 33 assembly is fixedly mounted on the adjustment seat.

[0070] In some embodiments, the cooling mechanism 33 also includes a first connecting plate, a first adjusting screw and a first rotating shaft. The cooling head is installed at one end of the first connecting plate. The other end of the first connecting plate is provided with a first axial hole and a first arc-shaped hole located on the periphery of the first axial hole. The adjustment seat is provided with a second axial hole corresponding to the first axial hole and a sixth screw hole corresponding to the first arc-shaped hole. The arc center of the first arc-shaped hole is located in the sixth screw hole. The first adjusting screw is screwed to the sixth screw hole through the first axial hole, and the first rotating shaft is inserted into the second axial hole through the first axial hole.

[0071] Specifically, the first axial hole is the rotation origin of the first connecting plate. By driving the first connecting plate to rotate along the extension direction of the first arc hole, the cooling head angle can be adjusted. After the cooling mechanism 33 is installed on the first connecting plate, it is convenient to adjust the cooling head angle to meet the requirements of splitting the silicon wafer 100. After the adjustment is completed, the position can also be fixed by screwing the first adjustment screw, thereby improving the user experience. Of course, in other embodiments, the cooling mechanism 33 is fixedly installed on the first connecting plate.

[0072] Optionally, the splitting device 30 further includes a blower 72 structure 34, and an air duct 713 mechanism is installed on the mounting cover 71, and the air duct 713 mechanism is used to blow airflow toward a preset splitting line on the silicon wafer 100. Specifically, during the cutting process of the silicon wafer 100 by the cutting mechanism 31, debris will be generated, and the blower 72 structure 34 blowing airflow toward the preset splitting line can blow the debris away from the surface of the silicon wafer 100 to prevent the debris from adhering to the surface of the silicon wafer 100. Of course, in other embodiments, the solar silicon wafer 100 splitting device may not be provided with a blower 72 structure 34.

[0073] In some embodiments, the solar silicon wafer 100 splitting device also includes a drying device 70, which is arranged between the splitting device 30 and the unloading position 12. The drying device 70 includes a mounting cover 71, a fan 72 and a heating structure 73. The mounting cover 71 has an air inlet 711, an air outlet 712 and an air duct 713 connected between the air inlet 711 and the air outlet 712. The mounting cover 71 is arranged on the upper side of the conveyor line 20, and the air outlet 712 faces the conveyor line 20. The fan 72 is arranged on the mounting cover 71, and is used to drive the airflow from the air inlet 711 into the air duct 713 and then be discharged from the air outlet 712. The heating structure 73 is arranged in the air duct 713, and the heating structure 73 is used to heat the airflow flowing through the air duct 713.

[0074] Specifically, the fan 72 is used to speed up the flow of air, driving the external airflow to quickly flow from the air inlet 711 into the air duct 713, and then discharge from the air outlet 712, so as to flow to the silicon wafer 100 on the conveyor line 20, so as to blow water droplets off the surface of the silicon wafer 100, and the hot air flow can also heat and dry the silicon wafer 100. Among them, when the airflow flows through the heating structure 73, it can exchange heat with the heating structure 73 to take away the heat of the heating structure 73 and form a hot air flow. Driven by the fan 72, the hot air flow can quickly flow from the air outlet 712 to the conveyor line 20 to dry the solar silicon wafer 100 on the conveying mechanism, thereby improving the drying efficiency of the solar silicon wafer 100.

[0075] Furthermore, the air inlet 711 and the air outlet 712 are arranged opposite to each other. It can be understood that the air inlet 711 and the air outlet 712 are arranged on opposite sides of the mounting cover 71, so that after the airflow enters from the air inlet 711, it can quickly go to the air outlet 712 under the action of the fan 72, thereby improving the flow speed of the airflow, that is, it can improve the drying efficiency of the silicon wafer 100. Of course, in other embodiments, the air inlet 711 and the air outlet 712 can also be arranged on adjacent sides of the mounting cover 71.

[0076] Furthermore, the solar silicon wafer 100 drying device 70 also includes a temperature sensor 74, and the detection end of the temperature sensor 74 extends into the air duct 713 and is located between the heating structure 73 and the air outlet 712. We know that the temperature sensor 74 can detect the current temperature. In the embodiment, the temperature sensor 74 is set, and the detection end of the temperature sensor 74 is extended into the air duct 713 and is located between the heating structure 73 and the air outlet 712, so that it can detect how many degrees Celsius the heated airflow is. The user can judge whether the airflow temperature is too high or too low by checking the temperature detected by the temperature sensor 74. The user can perform corresponding operations according to whether the temperature is too high or too low to enhance the user's experience. Of course, in other embodiments, the solar silicon wafer 100 drying device 70 may not be provided with a temperature sensor 74.

[0077] Furthermore, the drying device 70 for solar silicon wafers 100 includes a plurality of temperature sensors 74, which are spaced apart along the conveying direction of the conveying mechanism and are arranged one by one with the plurality of fans 72. The heating structure 73 is in the shape of a long strip extending along the conveying direction of the conveying mechanism or a heating structure 73 is arranged in the air duct 713 at the position corresponding to each fan 72. Specifically, the detection end of each temperature sensor 74 extends into the air duct 713, and the detection end of each temperature sensor 74 is located between the heating structure 73 and the air outlet 712. The plurality of temperature sensors 74 are used to detect the temperature of the air flow blown out by the corresponding fan 72. By checking the data detected by each temperature sensor 74, it is determined whether the temperature of the air flow blown out by each fan 72 is consistent or almost the same, thereby ensuring the drying effect of the solar silicon wafers 100. Among them, the number of temperature sensors 74 can be set according to the conveying length of the conveying mechanism. When the conveying length of the conveying mechanism is longer, a larger number of temperature sensors 74 can be set. When the conveying length of the conveying mechanism is shorter, a smaller number of temperature sensors 74 can be set. The specific number is not specifically limited in this application and can be set according to actual conditions.

[0078] In some embodiments, there are two conveyor lines 20, and each conveyor line 20 is correspondingly provided with a splitting device 30, a silicon wafer 100 detection device 40, and a splitting detection device 60. Specifically, the two conveyor lines 20 respectively convey the silicon wafers 100, the two splitting devices 30 respectively split the silicon wafers 100, and the two conveyor lines 20 are both provided with a silicon wafer 100 detection device 40 and a splitting inspection device for detection, which improves the splitting efficiency of the solar silicon wafer 100 splitting device 30, avoids the silicon wafers 100 of unqualified quality from being split, and avoids the silicon wafers 100 of unqualified quality from being mixed with the silicon wafers 100 of qualified quality after the splitting process.

[0079] In some embodiments, the first material level 13 is located between the two conveyor lines 20, and the handling device 50 can move between the two conveyor lines 20. Specifically, the handling device 50 can collect the unqualified silicon wafers 100 on the two conveyor lines 20 after being detected by the silicon wafer 100 detection device 40 to the first material level 13. Only one collecting device is provided to recycle the unqualified silicon wafers 100 on the two conveyor lines 20 after being detected by the silicon wafer 100 detection device 40, thereby improving the space utilization rate of the solar silicon wafer 100 splitting device 30.

[0080] In some embodiments, the handling device 50 includes a sliding module 51 and a material picking piece 52. The sliding module 51 is installed on the machine base 10 and extends along the arrangement direction of the two conveyor lines 20. The material picking piece 52 is installed on the sliding module 51 and is located above the conveyor lines 20 so that the silicon wafers 100 to be split that have failed the inspection of the silicon wafer 100 inspection device 40 and have not been split by the splitting device 30 can be picked up on the two conveyor lines 20 and transferred to the first material position 13.

[0081] Specifically, the material picking member 52 picks up the unqualified silicon wafers 100 detected by the silicon wafer 100 detection device 40 on the two conveyor lines 20, and then the sliding module 51 drives the material picking member 52 to move, and moves the unqualified silicon wafers 100 detected by the silicon wafer 100 detection device 40 to the top of the first material level 13, and then the material picking member 52 is released, and the unqualified silicon wafers 100 detected by the silicon wafer 100 detection device 40 fall into the first material level 13, and the recycling is completed. This method of the sliding module 51 cooperating with the material picking member 52 to transport the silicon wafers 100 is simple in structure, low in cost, and the volume of the transport device 50 is also small. In addition, in other embodiments, a multi-joint manipulator is provided to transport the unqualified silicon wafers 100 detected by the silicon wafer 100 detection device 40.

[0082] In some embodiments, the second material level 14 is provided at the end of the conveyor line 20 and is lower than the upper surface of the conveyor line 20, so that the unqualified silicon wafers 100 fall from the end of the conveyor line 20 into the second material level 14. Specifically, in this way, the conveyor line 20 directly transports the unqualified silicon wafers 100 detected by the cracking detection device 60 to the second material level 14, and no other additional transporting devices are required, and the structure of the solar silicon wafer 100 cracking device is simpler.

[0083] In some embodiments, the solar silicon wafer 100 splitting equipment includes a loading device 80, which is arranged at the loading position 11 and is located between two conveyor lines 20. The loading device 80 includes a loading rotating mechanism 9181 and two loading robots 82. The two loading robots 82 are installed on the loading rotating mechanism 9181. The two loading robots 82 are arranged at an angle and extend in the horizontal direction. The loading rotating mechanism 9181 is used to drive the two loading robots 82 to rotate synchronously, so that any one loading robot 82 moves the solar silicon wafer 100 to be split at the loading position 11 to one of the conveyor lines 20, while the other loading robot 82 moves from the other conveyor line 20 to the loading position 11 to pick up the solar silicon wafer 100 to be split.

[0084] Specifically, driven by the loading rotating mechanism 9181, any one loading robot 82 can move the solar silicon wafer 100 to be split at the loading position 11 to one of the splitting positions, while another loading robot 82 moves from another splitting position to the loading position 11 to pick up the solar silicon wafer 100 to be split. In this way, the loading device 80 can move one solar silicon wafer 100 to be split to the splitting position and pick up another solar silicon wafer 100 to be split by moving it once, thereby improving the efficiency of transporting the solar silicon wafer 100, thereby improving the splitting efficiency of the solar silicon wafer 100 splitting device.

[0085] In some embodiments, the solar silicon wafer 100 splitting equipment includes a feeding device 90, which is arranged at a feeding position 12 and is located between two conveyor lines 20. The feeding device 90 includes a feeding rotation mechanism and two feeding robots 92. The two feeding robots 92 are installed on the feeding rotation mechanism. The two feeding robots 92 are arranged at an angle and extend in a horizontal direction. The feeding rotation mechanism is used to drive the two feeding robots 92 to rotate synchronously, so that any one feeding robot 92 moves the silicon wafer 100 that has passed the inspection after splitting to the feeding position 12, while the other feeding robot 92 moves from the feeding position 12 to the conveyor line 20 to pick up the silicon wafer 100 that has passed the inspection after splitting.

[0086] Specifically, after a solar silicon wafer 100 is split, it will become two half-wafers, and the two half-wafers will be sent to the discharge position. The unloading rotating mechanism drives the two unloading manipulators 92 to rotate. While one unloading manipulator 92 moves the two half-wafers at the splitting position to the unloading position 12, the other unloading manipulator 92 moves from the unloading position 12 to the discharge position to take the two half-wafers. In this way, the unloading device 90 can move the half-wafer and take the half-wafer at the same time in one movement, which improves the efficiency of unloading the half-wafers.

[0087] In some embodiments, the machine base 10 is provided with a mounting frame 15 , and the silicon wafer 100 detection device 40 and the wafer splitting device 30 are both mounted on the mounting frame 15 and are disposed on two opposite sides of the mounting frame 15 .

[0088] Specifically, the silicon wafer 100 detection device 40 and the wafer splitting device 30 are both installed on the mounting frame, so that the silicon wafer 100 detection device 40 and the wafer splitting device 30 occupy less space and avoid interference between the silicon wafer 100 detection device 40, the wafer splitting device 30 and other devices.

[0089] In some embodiments, it is characterized in that the silicon wafer 100 detection device 40 includes a silicon wafer 100 detection camera 41 and an illumination lamp 42 , and the silicon wafer 100 detection camera 41 and the illumination lamp 42 are arranged facing each other and are respectively arranged on the upper and lower sides of the conveyor line 20 .

[0090] Specifically, when the silicon wafer 100 passes through the position of the lighting lamp 42, the light of the lighting lamp 42 will illuminate the silicon wafer 100 passing by, and the light will penetrate the raw silicon wafer 100 to display the internal structure of the raw silicon wafer 100. At the same time, the detection camera will capture the image of the light irradiating the raw silicon wafer 100. The lighting lamp 42 and the detection camera are arranged opposite to each other. After penetrating the raw silicon wafer 100, the light of the lighting lamp 42 will be directly captured by the detection camera, so that the image captured by the detection camera is clearer, and the image is analyzed to detect whether there are damages and cracks on the surface and internal structure of the raw silicon wafer 100. In this way, both the surface of the silicon wafer 100 and the internal structure of the silicon wafer 100 can be detected, which effectively improves the detection effect and prevents the silicon wafer 100 with hidden cracks from being processed by splitting.

[0091] In some embodiments, the chip detection device 60 includes a chip detection camera, which is disposed on the machine base 10 and disposed toward the conveyor line 20. Specifically, when the chip processed by the chip device 30 passes through the chip detection camera, the detection camera detects the surface of the chip processed by the chip to detect whether the fracture of the silicon wafer 100 is qualified. Before the silicon wafer 100 is processed by the chip detection device 40, it has been detected by the silicon wafer 100 detection device 40 whether there is damage and crack inside, so there is no need to detect the inside again after the chip processing is completed, and there is no need to set up an additional lighting lamp 42.

[0092] In some embodiments, the conveyor line 20 includes a mounting seat 21 and two conveying mechanisms 22. The mounting seat 21 is arranged on the machine base 10 and is located between the loading position 11 and the splitting device 30. The two conveying mechanisms 22 are both slidably installed on the mounting seat 21 along the direction of the loading position 11 pointing to the splitting device 30. The conveying mechanism 22 has a conveying component 223 that can be raised and lowered. The conveying component 223 has a first position and a second position above the first position. The conveying component 223 conveys the silicon wafer 100 from the loading position 11 to the splitting device 30 when it is in the second position, and moves from the splitting device 30 to the loading position 11 when it is in the first position.

[0093] Specifically, the mounting seat 21 is provided with two driving mechanisms, and the two driving mechanisms are connected to the two conveying mechanisms 22 in a one-to-one correspondence, and the driving mechanisms are used to drive the corresponding conveying mechanisms 22 to slide on the mounting seat 21 .

[0094] When the transport mechanism 22 moves to the loading position 11, the transport component 223 rises to the second position to pick up the material. At this time, the driving mechanism drives the transport component 223 to transport the silicon wafer 100 from the loading position 11 to the splitting device 30 in the second position to split the silicon wafer 100.

[0095] When the transport mechanism 22 moves to below the splitting device 30 , the transport component 223 will descend to the first position for unloading. At this time, the driving mechanism drives the transport component 223 to move from the splitting position to the loading position 11 in the state of being in the first position.

[0096] This ensures that the transport mechanism 22 in the second position that transports the silicon wafer 100 from the loading position 11 to the splitting position will not interfere with the transport mechanism 22 in the first position that returns from under the splitting device 30 to the loading position 11 for loading. Therefore, when one of the two transport mechanisms 22 transports the silicon wafer 100 from the loading position 11 to under the splitting device 30, the other transport mechanism 22 can return from under the splitting device 30 to the loading position 11 for loading.

[0097] In this way, the two transport mechanisms 22 can continuously transport the silicon wafers 100 , thereby improving the transport efficiency of the solar silicon wafers 100 and facilitating improving the production efficiency of the silicon wafers 100 .

[0098] In some embodiments, two conveying mechanisms 22 are slidably installed on opposite sides of the mounting seat 21, and the conveying parts 223 of the two conveying mechanisms 22 are both located above the mounting seat 21. The mounting seat 21 is provided with two driving mechanisms, and the two driving mechanisms are connected to the two conveying mechanisms 22 in a one-to-one driving manner, so as to drive the conveying mechanisms 22 to slide on the mounting seat 21.

[0099] Specifically, the two conveying mechanisms 22 are respectively slidably installed on opposite sides of the mounting base 21, so that when the two conveying mechanisms 22 meet, the one located at the bottom does not need to move outward, thereby preventing the two conveying mechanisms 22 from interfering with each other. This can reduce the conveying space, that is, reduce the installation space required for the conveying device 50, make the overall structure of the conveying device 50 more compact, and improve the overall structural compactness of the conveying device 50.

[0100] Of course, in other implementations, the two conveying mechanisms 22 can also be installed on the same side of the mounting seat 21, and the two conveying mechanisms 22 are spaced apart up and down, and the conveying mechanism 22 located on the lower side can move in the direction away from the mounting seat 21. During the conveying process, when the two conveying mechanisms 22 meet, the conveying mechanism 22 located on the lower side moves in the direction away from the mounting seat 21 to prevent the two conveying mechanisms 22 from interfering with each other.

[0101] In some embodiments, the conveying mechanism 22 also includes a second sliding seat 221 and a lifting mechanism 222. The second sliding seat 221 is slidably installed on the mounting seat 21 along the direction of the loading position 11 pointing to the splitting position, and is connected to the driving mechanism. The lifting mechanism 222 is installed on the second sliding seat 221, and the lifting mechanism 222 is connected to the conveying component 223.

[0102] Specifically, when the driving mechanism drives the second sliding seat 221 to slide on the mounting seat 21 , the lifting mechanism 222 moves along with the sliding of the second sliding seat 221 to realize the transportation of the silicon wafer 100 .

[0103] Furthermore, the mounting seat 21 is provided with a second guide rail 211, and the second sliding seat 221 is provided with a second slider 2211, and the second slider 2211 is slidably matched with the guide rail. It can be understood that the sliding match between the second guide rail 211 and the second slider 2211 makes the second slider 221 more stable when sliding on the mounting seat 21, that is, the sliding stability of the transport mechanism 22 is improved.

[0104] Furthermore, the mounting seat 21 is provided with two second guide rails 211, which are spaced apart from each other, and the second sliding seat 221 is provided with two second sliders 2211 corresponding to the two second guide rails 211, which are slidably connected to the two second guide rails 211 in a one-to-one correspondence, so as to further improve the sliding stability of the transport mechanism 22.

[0105] In some embodiments, the lifting mechanism 222 includes a connecting member 2221, a motor 2222, a screw rod 2223 and a nut seat. The connecting member 2221 is slidably installed on the second sliding seat 221 along the up and down directions and is connected to the conveying member 223. The motor 2222 is fixed to the second sliding seat 221. The screw rod 2223 is connected to the motor 2222 and extends upward from the motor 2222. The nut seat is sleeved on the screw rod 2223 and fixed on the connecting member 2221.

[0106] Specifically, the motor 2222 is located below the screw rod 2223, and the motor 2222 drives the nut seat to move on the screw rod 2223 to drive the transport component 223 to move up and down, so that the transport component 223 moves between the first position and the second position. We know that the screw rod 2223 transmission has the characteristic of stable transmission. When applied to this solution, the motor 2222 can drive the transport component 223 up and down or descend with high stability, that is, the lifting stability of the transport component 223 is improved. Of course, in other embodiments, the lifting mechanism 222 can also be set as a cylinder, and the cylinder is directly connected to the transport component 223.

[0107] Further, a first guide rail 2212 is provided on a side of the second sliding seat 221 away from the mounting seat 21, and a first slider 2225 is provided on the connecting member 2221, and the first slider 2225 is slidably matched with the first guide rail 2212. Specifically, it can be understood that the sliding match between the first guide rail 2212 and the first slider 2225 makes the transport component 223 more stable when being lifted, that is, the lifting stability of the transport mechanism 22 is improved.

[0108] Furthermore, the second sliding seat 221 is provided with two first guide rails 2212, the two first guide rails 2212 are arranged at intervals up and down, the first screw rod 2223 is located between the two first guide rails 2212, the connecting member 2221 is provided with two first sliders 2225 corresponding to the two first guide rails 2212, and the two first sliders 2225 are connected to the two first guide rails 2212 in a one-to-one correspondence, so as to further improve the lifting stability of the transport mechanism 22.

[0109] In some embodiments, the transport component 223 is provided with an exhaust channel and multiple suction ports connected to the exhaust channel, and the multiple suction ports are all located on the side of the transport component 223 away from the mounting seat 21. The solar silicon wafer 100 splitting equipment also includes a negative pressure device, which is connected to the exhaust channel.

[0110] Specifically, the exhaust channel is connected to the negative pressure device. When the transport mechanism 22 transports the silicon wafer 100, the silicon wafer 100 will block the suction port on the transport component 223. By exhausting air through the negative pressure device, the silicon wafer 100 can be fixed on the transport component 223 to prevent the silicon wafer 100 from falling during the transport of the transport mechanism 22. At the same time, it is not necessary to fix the silicon wafer 100 when the splitting device 30 separates the silicon wafer 100, so as to prevent the silicon wafer 100 from shifting during the cutting process, thereby improving the production quality of the silicon wafer 100. At the same time, it is not necessary to set a positioning mechanism on the transport component 223 to fix the silicon wafer 100, thereby reducing the complexity of the structure. Of course, in other embodiments, a limiting structure is provided on the transport component 223 to limit the silicon wafer 100.

[0111] Furthermore, the surface of the transport component 223 has a cutting slit, which is used to correspond to the preset cutting line on the silicon wafer 100. When the transport component 223 transports the silicon wafer 100 to the splitting position, the transport component 223 is located below the splitting device 30, so that the silicon wafer 100 on the transport component 223 can be cut by the splitting device 30. In this way, when the splitting device 30 cuts the silicon wafer 100, after the sealing plate profile is cut, it can prevent the splitting device 30 from colliding with the transport component 223, thereby preventing the splitting device 30 or the transport component 223 from being damaged.

[0112] It is worth noting that in this embodiment, the production method of first cutting the solar silicon wafer and then performing other subsequent processing can improve the solar energy conversion rate of the solar silicon wafer compared to the method of first processing the solar silicon wafer and then cutting it in the prior art.

[0113] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A solar silicon wafer splitting device, characterized in that: include: The machine base is provided with an upper material position, a lower material position, a first material position and a second material position; A conveying line is arranged between the upper material position and the lower material position, the first material position is arranged at one side of the conveying line, and the second material position is arranged at the lower material position; A splitting device, provided on the machine base and located above the conveying line, the splitting device is used to split the silicon wafers to be split conveyed by the conveying line, and the splitting device is located between the first material level and the upper material level; A silicon wafer detection device, disposed between the loading position and the wafer splitting device, for detecting the silicon wafers to be split that are conveyed from the loading position via the conveying line; A transport device, disposed at the first material level, for transferring the unqualified silicon wafers to be split that have been detected by the silicon wafer detection device and have not been split by the splitting device to the first material level; as well as A chip detection device is arranged on a side of the chip detection device away from the upper material position, and is used to perform chip quality inspection on the silicon wafers after being split by the chip detection device, wherein the silicon wafers that pass the inspection by the chip detection device are unloaded through the lower material position, and the silicon wafers that fail the inspection are diverted to the second material position at the lower material position.

2. The solar silicon wafer splitting device according to claim 1, characterized in that: The solar silicon wafer splitting equipment also includes a drying device, which is arranged between the splitting device and the unloading position. The drying device includes a mounting cover, a fan and a heating structure. The mounting cover has an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet. The mounting cover is arranged on the upper side of the conveyor line, and the air outlet faces the conveyor line. The fan is arranged on the mounting cover, and is used to drive the airflow from the air inlet into the air duct and then be discharged from the air outlet. The heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

3. The solar silicon wafer splitting device according to claim 1, characterized in that: There are two conveying lines, and each conveying line is correspondingly provided with one of the wafer splitting device, the silicon wafer detection device and the wafer splitting detection device.

4. The solar silicon wafer splitting device according to claim 3, characterized in that: The first material level is located between the two conveying lines, and the handling device can move between the two conveying lines.

5. The solar silicon wafer splitting device according to claim 4, characterized in that: The transport device includes a sliding module and a material picking piece. The sliding module is installed on the machine base and extends along the arrangement direction of the two conveyor lines. The material picking piece is installed on the sliding module and is located above the conveyor lines so that the silicon wafers to be split that have failed the inspection of the silicon wafer inspection device and have not been split by the splitting device can be picked up on the two conveyor lines and transferred to the first material position.

6. The solar silicon wafer splitting device according to claim 1, characterized in that: The second material level is set at the end of the conveying line and is lower than the upper surface of the conveying line, so that unqualified silicon wafers can fall from the end of the conveying line into the second material level.

7. The solar silicon wafer splitting device according to claim 3, characterized in that: The solar silicon wafer cracking equipment includes a loading device, which is arranged at the loading position and is located between the two conveyor lines. The loading device includes a loading rotation mechanism and two loading robots. The two loading robots are installed on the loading rotation mechanism. The two loading robots are arranged at an angle and extend in the horizontal direction. The loading rotation mechanism is used to drive the two loading robots to rotate synchronously, so that any one of the loading robots moves the solar silicon wafers to be cracked at the loading position to one of the conveyor lines, while the other loading robot moves from the other conveyor line to the loading position to pick up the solar silicon wafers to be cracked.

8. The solar silicon wafer splitting device according to claim 1, characterized in that: The solar silicon wafer cracking equipment includes a unloading device, which is arranged at the unloading position and is located between the two conveyor lines. The unloading device includes a unloading rotating mechanism and two unloading robots. The two unloading robots are installed on the unloading rotating mechanism. The two unloading robots are arranged at an angle and extend in the horizontal direction. The unloading rotating mechanism is used to drive the two unloading robots to rotate synchronously, so that any one of the unloading robots moves the silicon wafers that have passed the inspection after cracking to the unloading position, while the other unloading robot moves from the unloading position to the conveyor line to pick up the silicon wafers that have passed the inspection after cracking.

9. The solar silicon wafer splitting device according to claim 1, characterized in that: The machine base is provided with a mounting frame, and the silicon wafer detection device and the wafer splitting device are both mounted on the mounting frame and are arranged on two opposite sides of the mounting frame.

10. The solar silicon wafer splitting device according to claim 1, characterized in that: The silicon wafer inspection device comprises a silicon wafer inspection camera and an illumination lamp, wherein the silicon wafer inspection camera and the illumination lamp are arranged facing each other and are respectively arranged on the upper and lower sides of the conveying line; The splinter detection device includes a splinter detection camera, which is arranged on the machine base and faces the conveying line.

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