Substrate assembly and LED device

Abstract

The utility model relates to the technical field of LED packaging, and provides a substrate assembly and an LED device, and the substrate assembly comprises a substrate which is provided with an installation through hole; the heat conduction block is embedded in the mounting through hole, the heat conduction block is provided with a first surface and a second surface which are opposite to each other, the first surface is used for being connected with an LED chip, and the second surface is used for being connected with a radiator and / or a circuit board. Therefore, heat generated by the LED chip is directly transmitted to the radiator or transmitted to the radiator after passing through the circuit board, the radiating path is shortened, and the heat conduction efficiency and the radiating effect are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging, and in particular relates to a substrate component and an LED device. Background Art

[0002] In the LED packaging industry, the luminous efficiency of LED chips is limited. The proportion of electrical energy converted into thermal energy in LED devices is much higher than the proportion converted into light energy. The heat dissipation of LED devices affects the luminous efficiency and life of the devices. Therefore, how to improve the heat dissipation performance of LED devices is an issue that the industry has been studying.

[0003] At present, the main heat conduction method of LED devices is to add a heat sink at the bottom of the LED device to conduct heat away through heat conduction. When the product encapsulated with UV-LED front-mounted chips is in use, the heat is generated from the chip and needs to pass through the internal circuit of the substrate, the ceramic layer, the pad at the bottom of the substrate and the circuit board to reach the heat sink to dissipate the heat. The heat dissipation path is long, the thermal conductivity is low, and the heat dissipation effect is poor. Utility Model Content

[0004] The purpose of the present invention is to overcome at least one of the deficiencies of the prior art and to provide a substrate assembly and an LED device that can improve the heat dissipation effect.

[0005] The technical solution of the utility model is: a substrate assembly, comprising: a substrate, provided with a mounting through hole; a heat conductive block, embedded in the mounting through hole, the heat conductive block having a first surface and a second surface opposite to each other, the first surface being used for connecting to an LED chip, and the second surface being used for connecting to a heat sink and / or a circuit board.

[0006] As a further improvement of the present technical solution, the heat-conducting block includes a heat-conducting column embedded in the mounting through hole and a heat-conducting seat integrally connected to the heat-conducting column, the first surface is an end of the heat-conducting column away from the heat-conducting seat, and the second surface is an end of the heat-conducting seat away from the heat-conducting column.

[0007] As a further improvement of the technical solution, the heat-conducting seat is attached to the substrate.

[0008] As a further improvement of the present technical solution, the substrate has a relative front and back side, the front side of the substrate is provided with a first circuit layer, the back side of the substrate is provided with a second circuit layer, the first circuit layer and the second circuit layer are conductively connected, the first circuit layer includes a first electrode and a second electrode for connecting to the LED chip; the second circuit layer includes a third electrode and a fourth electrode spaced apart; the substrate is provided with conductive holes, the conductive holes include at least one first conductive hole and at least one second conductive hole, conductive material is provided in the first conductive hole and the second conductive hole, the third electrode is connected to the first electrode through at least one first conductive hole, and the fourth electrode is connected to the second electrode through at least one second conductive hole.

[0009] As a further improvement of the technical solution, the first surface of the heat conductive block is lower than the upper surfaces of the first electrode and the second electrode.

[0010] As a further improvement of the technical solution, the substrate assembly further includes a circuit board and a heat sink, wherein the circuit board is arranged between the substrate and the heat sink, the front surface of the circuit board abuts against the second surface of the heat conductive block, and the back surface of the circuit board abuts against the heat sink.

[0011] The utility model also provides an LED device, comprising any of the substrate components described above, and also comprising an LED chip, wherein the LED chip is connected to the first surface of the heat conductive block, and the LED chip is electrically connected to the first electrode and the second electrode respectively.

[0012] As a further improvement of the technical solution, the LED device further includes a light-transmitting member connected to the substrate; the light-transmitting member is formed by curing of a colloid and covers the front side of the substrate and the LED chip.

[0013] As a further improvement of the present technical solution, the LED device also includes a light-transmitting member and a ring-shaped packaging body, the packaging body is arranged on the front side of the substrate and surrounds the periphery of the LED chip, the packaging body is provided with a mounting groove for setting the light-transmitting member, the mounting groove penetrates the inner side wall and the top of at least a portion of the packaging body located above the LED chip, and the light-transmitting member, the packaging body and the front side of the substrate form a packaging cavity that seals the LED chip.

[0014] As a further improvement of the present technical solution, the LED device also includes a light-transmitting member and a ring-shaped metal tube cap, wherein the metal tube cap is arranged on the front side of the substrate and surrounds the periphery of the LED chip, and the light-transmitting member is welded to the top of the metal tube cap, and the light-transmitting member, the metal tube cap and the front side of the substrate form a packaging cavity that seals the LED chip.

[0015] The utility model provides a substrate assembly and an LED device, the substrate assembly comprising: a substrate, provided with a mounting through hole; a heat conductive block, embedded in the mounting through hole, the heat conductive block having a first surface and a second surface opposite to each other, the first surface being used to connect with an LED chip, and the second surface being used to connect with a heat sink and / or a circuit board. Therefore, the heat generated by the LED chip can be directly transferred to the heat sink or transferred to the heat sink through the circuit board, shortening the heat dissipation path, and because the heat conductive block has better thermal conductivity than the substrate, the heat conductive efficiency and heat dissipation effect of the LED chip can be improved; and the heat conductive block of the utility model does not participate in electrical conduction, and adopts a thermal-electrical separation design, which can better reduce the influence of heat on electrical parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a top view of a substrate assembly provided in the first embodiment of the utility model;

[0018] Figure 2 yes Figure 1 Sectional view at AA in the middle;

[0019] Figure 3 is a top view of an LED device provided in a second embodiment of the present utility model;

[0020] Figure 4 yes Figure 3 Sectional view at the middle BB;

[0021] Figure 5 is a cross-sectional view of an LED device (the light-transmitting member is planar) provided in the second embodiment of the present utility model;

[0022] Figure 6 is a cross-sectional view of an LED device (including a circuit board and a heat sink) provided in a second embodiment of the present utility model;

[0023] Figure 7 is a cross-sectional view of an LED device (heat sink including a heat conducting portion) provided in a second embodiment of the utility model;

[0024] Figure 8 is a cross-sectional view of an LED device provided in a third embodiment of the present utility model;

[0025] Fig. 9is a cross-sectional view of an LED device (the light-transmitting member is planar) provided in a fifth embodiment of the present utility model;

[0026] Fig.10 It is a cross-sectional view of an LED device (the light-transmitting member is hemispherical) provided in the fifth embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0028] It should be noted that the terms “setting” and “connection” should be understood in a broad sense. For example, it can be directly setting or connecting, or it can be indirectly setting or connecting through a central component or a central structure.

[0029] In addition, if there are terms such as "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientation or positional relationship in the embodiments of the present invention, they are based on the orientation or positional relationship or the conventional placement state or use state shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must it be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0030] The various specific technical features and embodiments described in the specific implementation methods can be combined in any suitable manner unless there is any contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present utility model will not be described separately.

[0031] First embodiment:

[0032] like Figure 1 and Figure 2 As shown, the utility model provides a substrate assembly that can be applied to an LED device. The substrate assembly 100 includes: a substrate 10, which is provided with a mounting through hole 11; a heat conductive block 20, which is embedded in the mounting through hole 11, and the heat conductive block 20 has a first surface 21 and a second surface 22 opposite to each other, wherein the first surface 21 is used to connect with the LED chip, and the second surface 22 is used to connect with the heat sink 60 (refer to Figure 7) and / or circuit board 50 (reference Figure 6 ) connection, therefore, the heat generated by the LED chip can be directly transferred to the heat sink 60 or transferred to the heat sink 60 after passing through the circuit board 50, thereby shortening the heat dissipation path. The heat conductive block 20 is generally made of a material with good thermal conductivity, such as a metal material. Since the heat conductive block 20 has a higher thermal conductivity than the substrate 10, the thermal conductivity efficiency and heat dissipation effect of the LED chip can be improved; and in the utility model, the heat conductive block 20 does not participate in electrical conduction, and a thermal-electric separation design is adopted, which can better reduce the influence of heat on electrical parameters (for example, to a certain extent, it reduces the possibility of an increase in circuit resistance and a decrease in voltage due to an increase in temperature).

[0033] For the substrate 10, see Figure 1 and Figure 2 Preferably, the substrate 10 may have a front side 12 and a back side 13 opposite to each other, the front side 12 of the substrate 10 is provided with a first circuit layer 121, the back side 13 of the substrate 10 is provided with a second circuit layer 131, the first circuit layer 121 is connected to the second circuit layer 131, and the first circuit layer 121 includes a circuit for connecting to the LED chip 210 (reference Figure 4 ) connects the first electrode 1211 and the second electrode 1212, thereby enabling electrical connection between the LED chip 210 and the first circuit layer 121.

[0034] Preferably, the second circuit layer 131 includes a third electrode 1311 and a fourth electrode 1312 spaced apart; the substrate 10 is provided with a conductive hole 14, the conductive hole 14 includes at least one first conductive hole 141 and at least one second conductive hole 142, the first conductive hole 141 and the second conductive hole 142 are provided with a conductive material 143, the third electrode 1311 is connected to the first electrode 1211 through at least one first conductive hole 141, and the fourth electrode 1312 is connected to the second electrode 1212 through at least one second conductive hole 142. Therefore, the substrate 10 in the utility model realizes the electrical connection between the first circuit layer 121 and the second circuit layer 131 through the conductive hole 14 provided with the conductive material 143, and because the LED device also realizes heat conduction through the thermal conductive block 20, the LED device realizes thermal and electrical separation, which can better reduce the influence of heat on electrical parameters (for example, to a certain extent, reduce the possibility of the device voltage decreasing with the increase of temperature).

[0035] In some embodiments, see Figures 1 to 4The heat conducting block 20 includes a heat conducting column 23 embedded in the mounting through hole 11 and a heat conducting seat 24 integrally connected to the heat conducting column. The first surface 21 is an end of the heat conducting column 23 away from the heat conducting seat 24, and the second surface 22 is an end of the heat conducting seat 24 away from the heat conducting column 23. The heat conducting seat 24 is attached to the substrate 10, so that the heat conducting block 20 can be conveniently embedded in the mounting through hole 11, and the heat conducting block 20 can also be conveniently connected to the heat sink 60 through the heat conducting seat 24 (refer to Figure 7 ) and / or circuit board 50 (reference Figure 6 ), the outer dimensions of the heat-conducting seat 24 are larger than the outer dimensions of the heat-conducting column 23, and the contact area between the heat-conducting seat 24 and the heat sink 60 or / and the circuit board 50 can be larger to further improve the heat dissipation effect of the device. Preferably, the heat-conducting block 20 can be columnar (e.g., cylindrical), or the longitudinal cross-section of the heat-conducting block 20 can also be in an inverted "T" shape, etc., of course, the utility model is not limited thereto.

[0036] Preferably, the heat conducting block 20 can be made of copper material, so that the heat conducting block 20 has good thermal conductivity. Of course, the present invention does not limit the material of the heat conducting block 20, as long as it can play a good thermal conductivity role.

[0037] In some embodiments, see Figure 6 and Figure 7 The substrate assembly 100 further includes a circuit board 50 and a heat sink 60 . The circuit board 50 is disposed between the substrate 10 and the heat sink 60 . The front side of the circuit board 50 abuts against the second surface 22 of the heat conductive block 20 , and the back side of the circuit board 50 abuts against the heat sink 60 .

[0038] Preferably, please combine Figure 6 The circuit board 50 is provided with a first solder pad 51 and a second solder pad 52 , and the circuit board 50 is connected to the third electrode 1311 and the fourth electrode 1312 through the first solder pad 51 and the second solder pad 52 , respectively.

[0039] Preferably, the circuit board 50 includes a circuit board substrate 53 , a first solder resist layer 54 and a circuit structure (circuit layer) 55 , and the first solder resist layer 54 and the circuit structure 55 are disposed on the circuit board substrate 53 .

[0040] Preferably, the circuit board 50 further includes a second solder resist layer 56 , and the second solder resist layer 56 is disposed on the circuit structure 55 , and the circuit structure 55 is located between the first solder resist layer 54 and the second solder resist layer 56 .

[0041] Preferably, see Figure 7The circuit board substrate 53 includes a protrusion 531, and the protrusion 531 is used to connect with the heat conductive block 20. The heat generated by the LED chip 210 can be transferred to the heat sink 60 through the circuit board substrate 53, thereby improving the heat dissipation efficiency.

[0042] In some embodiments, the protrusion 531 of the circuit board substrate 53 may be provided with a thermal through hole, and the heat sink 60 extends a thermal conductive portion 61 toward the heat conductive block 20, the thermal conductive portion 61 extends into the thermal through hole, and the thermal conductive portion 61 is directly connected to the heat sink 60, thereby further shortening the heat conduction path and improving the heat dissipation effect. Alternatively, the heat conductive block 20 extends a thermal conductive portion toward the heat sink 60 that extends into the thermal through hole and is in direct contact with the heat sink 60.

[0043] In the production process of the substrate assembly 100, the substrate 10 can be firstly manufactured; secondly, holes are drilled in the substrate 10 by laser drilling or mechanical drilling, and the single hole diameter can be 0.09 to 0.15 mm, and a conductive material 143 is plated in the hole by vacuum plating, and the conductive material 143 can be a metal such as tungsten (W), titanium (Ti), nickel (Ni), chromium (Cr), copper (Cu) or an alloy thereof; then mechanical drilling is performed on the substrate 10 to drill out a mounting through hole 11 adapted to the heat conductive block 20, and then the heat conductive block 20 is embedded in the mounting through hole 11, and then the heat conductive block 20 is polished to improve its flatness; then the surface film of the substrate 10 is metalized to improve the performance of the surface of the substrate 10; then a first circuit layer 121 and a second circuit layer 131 are manufactured; finally, metal layers can be respectively provided on the surfaces of the first circuit layer 121, the second circuit layer 131 and the heat conductive block 20 to improve oxidation resistance.

[0044] Among them, the substrate 10 can be made of ceramic materials by a casting method, for example, aluminum nitride ceramics (AlN), gallium nitride ceramics (GaN), aluminum oxide ceramics (Al2O3), silicon carbide ceramics (SiC) and other materials, so as to meet the heat dissipation and insulation properties of the LED device.

[0045] Specifically, the thin film metallization method of the surface of the substrate 10 can be to place the thin film metal on the surface of the substrate 10 by vacuum plating or magnetron sputtering, and the thin film metal can be tungsten (W), titanium (Ti), nickel (Ni), chromium (Cr) and other metals or alloys thereof. In specific applications, the thin film metal can be tungsten titanium alloy (WT i), and the thickness of the tungsten titanium alloy (WTi) can be 0.1 microns. In specific applications, the thin film metal can be nickel-chromium alloy (CrNi), and the thickness of the nickel-chromium alloy (CrNi) can be 0.25 microns.

[0046] The steps of making the first circuit layer 121 and the second circuit layer 131 may be: copper plating on the surface of the substrate 10; pressing a dry film on the copper-plated surface of the substrate 10 and respectively setting the patterns of the first circuit layer 121 and the second circuit layer 131 on the dry film; exposing and developing the first circuit layer 121 and the second circuit layer 131; etching the circuit to remove unnecessary copper; removing the dry film on the surface of the substrate 10; grinding the substrate 10, the first circuit layer 121 and the second circuit layer 131. The thickness of the copper plating may be 50 microns to 80 microns; the purpose of pressing the dry film is to make the dry film cover the copper surface of the substrate 10 so that the patterns of the first circuit layer 121 and the second circuit layer 131 can be respectively engraved on the dry film; the first circuit layer 121 and the second circuit layer 131 may be ground with an abrasive belt to improve the flatness of the surfaces of the substrate 10, the first circuit layer 121 and the second circuit layer 131.

[0047] The surfaces of the first circuit layer 121 and the second circuit layer 131 may be provided with a metal layer, so as to facilitate the connection of the bonding wire and improve the oxidation resistance of the circuit; further, the surface of the heat conductive block 20 may also be provided with a metal layer, so as to improve the oxidation resistance of the heat conductive block 20. Preferably, the material of the metal layer may be nickel, palladium and gold, and the nickel layer, the palladium layer and the gold layer are stacked in sequence, wherein the thickness of the nickel layer may be greater than 3 microns, the thickness of the palladium layer may be greater than 0.05 microns, and the thickness of the gold layer may be greater than 0.05 microns.

[0048] Second embodiment:

[0049] The utility model provides an LED device, see Figures 3 to 7 The LED device 200 includes the substrate assembly 100 described in the first embodiment, and also includes an LED chip 210. The LED chip 210 is connected to the first surface 21 of the thermal block 20, and the LED chip 210 is electrically connected to the first electrode 1211 and the second electrode 1212 respectively.

[0050] Preferably, the LED chip 210 is a normal chip. During the production process, a bonding adhesive may be applied to the heat conductive block 20, and then the LED chip 210 may be placed on the bonding adhesive. Finally, the bonding adhesive may be cured by high temperature baking to fix the LED chip 210. Furthermore, the bonding adhesive may be an insulating adhesive or a silver adhesive. Then, the electrical connection between the LED chip 210 and the first electrode 1211 and the second electrode 1212 may be achieved by bonding wires (bonding wires).

[0051] Preferably, the size of the bottom surface of the LED chip 210 is smaller than the size of the first surface 21 of the heat conductive block 20, and the LED chip 210 can be completely seated within the first surface 21 of the heat conductive block 20, thereby ensuring the heat conductive effect of the heat conductive block 20. The first surface 21 of the heat conductive block 20 can be connected to one, two or more LED chips 210.

[0052] In some embodiments, please combine Figure 2 and Figure 4 , the first surface 21 (i.e., the upper end surface) of the heat conductive block 20 is lower than the upper surfaces of the first electrode 1211 and the second electrode 1212, so that the bottom surface of the LED chip 210 connected to the first surface 21 is also lower than the upper surfaces of the first electrode 1211 and the second electrode 1212 (i.e., the LED chip 210 sinks toward the inside of the substrate 10 relative to the upper surfaces of the first electrode 1211 and the second electrode 1212). This has the advantage of reducing the longitudinal dimension (i.e., height) of the LED device 200, making the LED device structure 200 more compact, and reducing the length of the bonding wire, which is generally a precious metal such as gold or silver. Reducing the length of the bonding wire can reduce production costs and improve production efficiency.

[0053] In some embodiments, the LED device 200 further includes a light-transmitting member 220, which is connected to the substrate 10. Preferably, the light-transmitting member 220 is formed by curing colloid and covers the front surface 12 of the substrate 10 and the LED chip 210, thereby improving the sealing effect of the device.

[0054] Furthermore, the colloid can be made of materials such as silica gel, epoxy resin or fluororesin.

[0055] In a specific application, a layer of glue in a specific shape can be encapsulated on the surface of the LED chip 210 by injection molding or dispensing, thereby forming the light-transmitting member 220; the shape of the light-transmitting member 220 can be a plane (see Figure 6 ), hemispherical (see Figure 4 ) or spherical shapes, the utility model is not limited to this.

[0056] Third embodiment:

[0057] The third embodiment of the present utility model provides an LED device 200', see Figure 8, which is different from the second embodiment, the light-transmitting member 220' in the third embodiment is packaged in a semi-inorganic manner. Specifically, the LED device 200' further includes a light-transmitting member 220' and a ring-shaped packaging body 230', wherein the packaging body 230' is disposed on the front surface 12 of the substrate 10 and surrounds the periphery of the LED chip 210, and the packaging body 230' is provided with a mounting groove 2301' for arranging the light-transmitting member 220', wherein the mounting groove 2301' penetrates the inner side wall and the top of at least a portion of the packaging body 230' located above the LED chip 210, and the light-transmitting member 220', the packaging body 230' and the front surface 12 of the substrate 10 form a packaging cavity that seals the LED chip 210.

[0058] Preferably, the material of the light-transmitting element 220' can be quartz or sapphire, and the shape of the light-transmitting element 220' can be flat (see Figure 8 and Fig. 9 ), hemispherical (see Fig.10 ) or spherical shapes, the utility model is not limited to this.

[0059] Furthermore, the light-transmitting member 220' is arranged in the installation groove 2301' by glue, and the glue has a better sealing effect, thereby improving the airtightness of the device. In the production process, the glue can be a material such as silicone, epoxy resin or fluororesin. First, the glue is arranged in the installation groove 2301', and then the light-transmitting member 220' is covered in the installation groove 2301'. Finally, the glue can be cured by high-temperature baking or light curing to complete the bonding.

[0060] Preferably, the packaging body 230 ′ and the substrate 10 may be integrally formed, which is convenient for manufacturing.

[0061] Fourth embodiment: Embodiment 4 of the present invention provides an LED device, which is different from Embodiment 3 in that the light-transmitting member in Embodiment 4 is packaged in a fully inorganic manner. Specifically, the light-transmitting member is soldered to the mounting groove of the package body by solder, and the connection is firm and not easily affected by LED light.

[0062] Preferably, the solder may be a gold-tin alloy to facilitate connection, wherein the gold content is 80 wt %, the tin content is 20 wt %, and the melting point of the gold-tin alloy is 280° C.

[0063] Fifth embodiment: The fifth embodiment of the present utility model provides an LED device 200, please refer to Fig. 9 and Fig.10 Different from the fourth embodiment, the light-transmitting member 220' in the fifth embodiment is connected to the substrate 10 via a metal cap 230".

[0064] Specifically, the LED device 200" also includes a light-transmitting member 220' and a ring-shaped metal tube cap 230", wherein the metal tube cap 230" is arranged on the front side 12 of the substrate 10 and surrounds the periphery of the LED chip 210, and the light-transmitting member 220' is welded to the top of the metal tube cap 230" (before the metal tube cap is connected to the substrate, the light-transmitting member can be welded to the top of the metal tube cap, that is, the light-transmitting member and the metal tube cap are prefabricated as one, and then the metal tube cap is welded to the substrate), and the light-transmitting member 220', the metal tube cap 230" and the front side 12 of the substrate 10 form a packaging cavity that seals the LED chip 210.

[0065] Preferably, the metal tube cap 230" is mounted on the substrate 10 by laser welding, so that the connection is firm and not easily affected by LED light.

[0066] The utility model provides a substrate assembly and an LED device, wherein the substrate assembly 100 comprises: a substrate 10, provided with a mounting through hole 11; a heat conducting block 20, embedded in the mounting through hole 11, wherein the heat conducting block 20 has a first surface 21 and a second surface 22 opposite to each other, wherein the first surface 21 is used to connect with an LED chip 210, and the second surface 22 is used to connect with a heat sink 60 and / or a circuit board 50. Therefore, the heat generated by the LED chip 210 is directly transferred to the heat sink 60 or transferred to the heat sink 60 through the circuit board 50, thereby shortening the heat dissipation path, and since the heat conducting block 20 is generally made of a material with good heat conduction effect such as a metal material, the heat conducting block 20 has a higher heat conductivity relative to the substrate 10, thereby improving the heat conduction efficiency and heat dissipation effect of the LED chip; and in the utility model, the heat conducting block 20 does not participate in the conduction, and adopts a thermal-electric separation design, which can better reduce the influence of heat on electrical parameters.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A substrate assembly, characterized in that: include: A base plate having a mounting through hole; A heat conductive block is embedded in the mounting through hole, and has a first surface and a second surface opposite to each other, wherein the first surface is used for connecting to the LED chip, and the second surface is used for connecting to the heat sink and / or the circuit board.

2. The substrate assembly according to claim 1, characterized in that: The heat-conducting block includes a heat-conducting column embedded in the mounting through hole and a heat-conducting seat integrally connected to the heat-conducting column, the first surface is an end of the heat-conducting column away from the heat-conducting seat, and the second surface is an end of the heat-conducting seat away from the heat-conducting column.

3. The substrate assembly according to claim 2, characterized in that: The heat conducting seat is attached to the substrate.

4. The substrate assembly according to claim 1, characterized in that: The substrate has a front side and a back side opposite to each other, a first circuit layer is arranged on the front side of the substrate, a second circuit layer is arranged on the back side of the substrate, the first circuit layer and the second circuit layer are connected, and the first circuit layer includes a first electrode and a second electrode for connecting to the LED chip; The second circuit layer includes a third electrode and a fourth electrode spaced apart; the substrate is provided with conductive holes, the conductive holes include at least one first conductive hole and at least one second conductive hole, conductive materials are provided in the first conductive holes and the second conductive holes, the third electrode is connected to the first electrode through at least one first conductive hole, and the fourth electrode is connected to the second electrode through at least one second conductive hole.

5. The substrate assembly according to claim 4, characterized in that: The first surface of the heat conductive block is lower than upper surfaces of the first electrode and the second electrode.

6. The substrate assembly according to any one of claims 1 to 5, characterized in that: The substrate assembly also includes a circuit board and a heat sink. The circuit board is arranged between the substrate and the heat sink. The front side of the circuit board abuts against the second surface of the heat conductive block, and the back side of the circuit board abuts against the heat sink.

7. An LED device, characterized in that: The substrate assembly comprises the substrate assembly according to any one of claims 1 to 6, and further comprises an LED chip, wherein the LED chip is connected to the first surface of the heat conductive block, and the LED chip is electrically connected to the first electrode and the second electrode respectively.

8. The LED device according to claim 7, characterized in that: The LED device further comprises a light-transmitting member connected to the substrate; the light-transmitting member is formed by curing of colloid and covers the front side of the substrate and the LED chip.

9. The LED device according to claim 7, characterized in that: The LED device also includes a light-transmitting member and a ring-shaped packaging body, wherein the packaging body is arranged on the front side of the substrate and surrounds the periphery of the LED chip, and the packaging body is provided with a mounting groove for setting the light-transmitting member, and the mounting groove penetrates the inner side wall and the top of at least a part of the packaging body located above the LED chip, and the light-transmitting member, the packaging body and the front side of the substrate form a packaging cavity that seals the LED chip.

10. The LED device according to claim 7, characterized in that: The LED device also includes a light-transmitting member and a ring-shaped metal tube cap, wherein the metal tube cap is arranged on the front side of the substrate and surrounds the periphery of the LED chip, the light-transmitting member is welded to the top of the metal tube cap, and the light-transmitting member, the metal tube cap and the front side of the substrate form a packaging cavity that seals the LED chip.

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