Double-station large-area quartz wafer beveling and grinding device

Abstract

The utility model relates to a double-station large-area quartz wafer beveling and grinding device, which belongs to the technical field of quartz wafer processing and comprises a workbench and a top plate arranged at the top of the workbench, a fixed plate is fixedly connected between the top plate and the workbench, two movable tables are arranged at the top of the workbench, and the movable tables are arranged on the workbench. A pressing mechanism for fixing the quartz wafer is arranged at the top of each moving table, and a moving mechanism for moving the two moving tables is arranged in the working table. According to the double-station large-area quartz wafer beveling and grinding device, an electric push rod is arranged to drive a rotating plate to rotate, so that the rotating plate can drive a pressing plate to rotate, at the moment, by arranging a hinge piece, due to the action of gravity, the pressing plate can only be in a vertical state, and then a quartz wafer is conveniently pressed and fixed; therefore, the quartz wafer can be fixed. And the quartz wafer is driven to rotate, so that the effect of full polishing is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz wafer processing, in particular to a double-station large-area quartz wafer chamfering and grinding device. Background Art

[0002] Quartz crystals are trigonal oxide minerals and are the most widely distributed mineral species in the quartz family. Quartz has many variants due to differences in particle size, color, inclusions, etc. Colorless and transparent quartz is called crystal, smoky brown to nearly black quartz is commonly known as tea crystal or black quartz, and rose red quartz is commonly known as rose quartz; kidney-shaped and stalactite-shaped cryptocrystalline quartz is called chalcedony.

[0003] During the use of quartz wafers, a chamfering grinding device is required. After searching, Chinese patent CN216830074U in the prior art discloses a double-station quartz wafer chamfering grinding device, including a bottom box, both sides of the top of the bottom box are fixedly connected with a load-bearing plate, a mounting plate is fixedly connected between the tops of the two load-bearing plates, a moving seat is penetrated through the top of the bottom box, the moving seat is slidably connected with the bottom box, a slide groove for matching the sliding connection of the moving seat is provided on the top of the bottom box, the top of the moving seat is rotatably connected with a driving shaft, the bottom end of the driving shaft penetrates the bottom box and extends to the inside of the bottom box, a sliding frame is slidably connected to the bottom of the inner wall of the bottom box and located directly below the driving shaft, a hydraulic cylinder is fixedly connected between the back of the sliding frame and the inner wall of the bottom box, and a motor is fixedly connected to the top of the sliding frame. The utility model realizes the chamfering grinding of double-station quartz wafers by starting a motor, which effectively improves the chamfering grinding production efficiency of quartz wafers.

[0004] However, during the use of the utility model, since the grinding stone needs to contact the quartz wafer for grinding, and the mounting seat is in a fixed state and cannot move left and right, the grinding stone can only grind quartz wafers of a specific diameter and cannot grind quartz wafers of different diameters, which causes limitations of the device and cannot meet production needs. Therefore, a double-station large-area quartz wafer chamfering grinding device is proposed to solve the above-mentioned problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a double-station large-area quartz wafer chamfering grinding device, which has the advantage of being easy to grind quartz wafers of different diameters, and solves the problem that the grinding stone needs to be in contact with the quartz wafer for grinding, and the mounting seat is in a fixed state and cannot be moved left and right, so that the grinding stone can only grind quartz wafers of a specific diameter, and cannot grind quartz wafers of different diameters, which further causes the limitation of the device and cannot meet the problem of production demand.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a double-station large-area quartz wafer chamfering grinding device, comprising a workbench and a top plate arranged on the top of the workbench, a fixed plate fixedly connected between the top plate and the workbench, two moving tables arranged on the top of the workbench, a clamping mechanism for fixing the quartz wafer arranged on the top of the moving table, and a moving mechanism for moving the two moving tables arranged inside the workbench;

[0007] The clamping mechanism comprises a mounting seat fixedly connected to the top of the moving platform, two supporting plates are fixedly connected to the top of the mounting seat, a rotating plate is rotatably connected between the two supporting plates, an electric push rod is hinged between the rotating plate and the mounting seat, and a clamping plate is arranged on the side of the rotating plate away from the electric push rod;

[0008] The moving mechanism includes a servo motor fixedly mounted on one side of the workbench, an adjusting screw extending into the interior of the workbench is fixedly connected to the output shaft of the servo motor, a threaded sleeve is connected to the external thread of the adjusting screw, and a connecting block is fixedly connected between the threaded sleeve and the moving platform.

[0009] Furthermore, a connecting plate is provided between the rotating plate and the pressing plate, a hinged part hinged to the rotating plate is fixedly connected to the top of the connecting plate, and a rotating shaft is provided for the rotation connection between the connecting plate and the pressing plate.

[0010] Furthermore, a driving motor is fixedly connected inside the moving platform, a placing platform extending to the top of the moving platform is fixedly connected to the output shaft of the driving motor, and the pressing plate is located directly above the placing platform.

[0011] Furthermore, a slider extending into the interior of the moving platform is fixedly connected to the bottom of the placing platform, and a sliding groove matching the slider is provided on the upper surface of the moving platform.

[0012] Furthermore, a limiting rod is fixedly connected to one side of the workbench away from the adjusting screw, and a limiting sleeve is slidably connected to the outside of the limiting rod.

[0013] Furthermore, the number of the connecting blocks is four, the limiting sleeve and the moving platform are fixedly connected via the connecting blocks, and a connecting rod is fixedly connected between the limiting sleeve and the threaded sleeve.

[0014] Furthermore, a telescopic cylinder is fixedly installed on the bottom of the top plate, and a polishing device is fixedly connected to the output end of the telescopic cylinder.

[0015] Compared with the prior art, the utility model provides a dual-station large-area quartz wafer chamfering grinding device, which has the following beneficial effects:

[0016] 1. The double-station large-area quartz wafer chamfering grinding device drives the rotating plate to rotate by setting an electric push rod, so that the rotating plate can drive the pressing plate to rotate. At this time, by setting a hinge, due to the effect of gravity, the pressing plate can only be in a vertical state, which makes it convenient to press and fix the quartz wafer. By setting a rotating shaft, the quartz wafer can be driven to rotate while ensuring the fixation of the quartz wafer, so as to achieve a full grinding effect.

[0017] 2. The double-station large-area quartz wafer chamfer grinding device drives the adjusting screw to rotate by setting a servo motor, and then drives the threaded sleeve and the connecting block to move by adjusting the screw, so that the movable platform can move with the threaded sleeve, thereby facilitating the grinding device to grind quartz wafers of different diameters, expanding the use range of the device, and solving the problem that the grinding stone needs to contact the quartz wafer for grinding, and the mounting seat is in a fixed state and cannot move left and right, so that the grinding stone can only grind quartz wafers of a specific diameter, and cannot grind quartz wafers of different diameters, thereby causing limitations of the device and failing to meet production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a cross-sectional view of the structure of the utility model;

[0019] Figure 2 It is a structural side view of the clamping mechanism of the utility model;

[0020] Figure 3 For this utility model Figure 1 A is a schematic diagram of the enlarged structure shown;

[0021] Figure 4 It is a structural schematic diagram of the limit rod of the utility model;

[0022] Figure 5 It is a three-dimensional diagram of the structure of the utility model.

[0023] In the figure: 1 workbench, 2 top plate, 3 fixed plate, 4 moving table, 5 mounting seat, 6 support plate, 7 rotating plate, 8 electric push rod, 9 clamping plate, 10 connecting plate, 11 hinge, 12 rotating shaft, 13 driving motor, 14 placing table, 15 servo motor, 16 adjusting screw, 17 threaded sleeve, 18 connecting block, 19 limiting rod, 20 limiting sleeve, 21 connecting rod, 22 telescopic cylinder, 23 grinding device. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-5 In this embodiment, a double-station large-area quartz wafer chamfering grinding device includes a workbench 1 and a top plate 2 arranged on the top of the workbench 1, a fixed plate 3 is fixedly connected between the top plate 2 and the workbench 1, two moving tables 4 are arranged on the top of the workbench 1, and a clamping mechanism for fixing the quartz wafer is arranged on the top of the moving table 4. The clamping mechanism includes a mounting seat 5 fixedly connected to the top of the moving table 4, and two supporting plates 6 are fixedly connected to the top of the mounting seat 5. A rotating plate 7 is rotatably connected between the two supporting plates 6, an electric push rod 8 is hinged between the rotating plate 7 and the mounting seat 5, and a clamping plate 9 is arranged on the side of the rotating plate 7 away from the electric push rod 8.

[0026] Among them, a connecting plate 10 is arranged between the rotating plate 7 and the clamping plate 9, the top of the connecting plate 10 is fixedly connected with a hinge 11 hinged to the rotating plate 7, the connecting plate 10 and the clamping plate 9 are rotatably connected with a rotating shaft 12, and the bottom of the clamping plate 9 is fixedly connected with a rubber pad, which on the one hand improves the fixing effect of the quartz wafer, and on the other hand avoids the wear of the quartz wafer.

[0027] In this embodiment, a driving motor 13 is fixedly connected to the interior of the moving platform 4, and a placing platform 14 extending to the top of the moving platform 4 is fixedly connected to the output shaft of the driving motor 13. The clamping plate 9 is located directly above the placing platform 14. A slider extending to the interior of the moving platform 4 is fixedly connected to the bottom of the placing platform 14, and a sliding groove adapted to the slider is provided on the upper surface of the moving platform 4.

[0028] The shape of the slide groove is annular, and the driving motor 13 is provided to drive the placement table 14 to rotate, so that the quartz wafer also rotates, and then the quartz wafer can be polished all around.

[0029] In this embodiment, a moving mechanism for moving two moving platforms 4 is provided inside the workbench 1, and the moving mechanism includes a servo motor 15 fixedly installed on one side of the workbench 1, and an adjusting screw 16 extending to the inside of the workbench 1 is fixedly connected to the output shaft of the servo motor 15, and the external thread of the adjusting screw 16 is connected to a threaded sleeve 17, and a connecting block 18 is fixedly connected between the threaded sleeve 17 and the moving platform 4.

[0030] Among them, a limit rod 19 is fixedly connected to the side of the workbench 1 away from the adjusting screw 16, and the outside of the limit rod 19 is slidably connected to the limit sleeve 20. There are four connecting blocks 18. The limit sleeve 20 is fixedly connected to the movable platform 4 through the connecting block 18, and a connecting rod 21 is fixedly connected between the limit sleeve 20 and the threaded sleeve 17.

[0031] It should be noted that a controller is fixedly connected to the front of the workbench 1 , a bearing matched with the adjusting screw 16 is fixedly installed inside the workbench 1 , and a movable groove matched with the clamping block 18 is provided on the upper surface of the workbench 1 .

[0032] In this embodiment, a telescopic cylinder 22 is fixedly installed on the bottom of the top plate 2 , and a grinding device 23 is fixedly connected to the output end of the telescopic cylinder 22 .

[0033] The working principle of the above embodiment is:

[0034] First, place two quartz wafers on two placement tables 14 respectively, and start the two electric push rods 8 at the same time to drive the clamping plate 9 to move downward, so that the clamping plate 9 fixes the quartz wafers, and then start the servo motor 15 to drive the two moving tables 4 to move relative to each other. At this time, start the telescopic cylinder 22 to drive the polishing device 23 to move downward, so that the polishing device 23 can contact the two quartz wafers at the same time, and then start the polishing device 23 and the drive motor 13 to fully polish the quartz wafers.

[0035] The electrical components appearing in the article are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device for control such as a computer, and the existing public power connection technology is not described in detail in the article.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual-station large-area quartz wafer chamfering and grinding device, comprising a workbench (1) and a top plate (2) arranged on the top of the workbench (1), characterized in that: A fixed plate (3) is fixedly connected between the top plate (2) and the workbench (1); two movable platforms (4) are arranged on the top of the workbench (1); a clamping mechanism for fixing the quartz wafer is arranged on the top of the movable platform (4); and a moving mechanism for moving the two movable platforms (4) is arranged inside the workbench (1); The clamping mechanism comprises a mounting seat (5) fixedly connected to the top of the moving platform (4), two supporting plates (6) being fixedly connected to the top of the mounting seat (5), a rotating plate (7) being rotatably connected between the two supporting plates (6), an electric push rod (8) being hinged between the rotating plate (7) and the mounting seat (5), and a clamping plate (9) being arranged on a side of the rotating plate (7) away from the electric push rod (8); The moving mechanism comprises a servo motor (15) fixedly mounted on one side of the workbench (1); an adjusting screw (16) extending into the interior of the workbench (1) is fixedly connected to the output shaft of the servo motor (15); a threaded sleeve (17) is connected to the external thread of the adjusting screw (16); and a connecting block (18) is fixedly connected between the threaded sleeve (17) and the moving platform (4).

2. A double-station large-area quartz wafer chamfering and grinding device according to claim 1, characterized in that: A connecting plate (10) is provided between the rotating plate (7) and the pressing plate (9), the top of the connecting plate (10) is fixedly connected with a hinge (11) hinged to the rotating plate (7), and a rotating shaft (12) is provided to connect the connecting plate (10) and the pressing plate (9) for rotation.

3. A double-station large-area quartz wafer chamfering and grinding device according to claim 1, characterized in that: The interior of the movable platform (4) is fixedly connected to a driving motor (13), the output shaft of the driving motor (13) is fixedly connected to a placement platform (14) extending to the top of the movable platform (4), and the clamping plate (9) is located directly above the placement platform (14).

4. A double-station large-area quartz wafer chamfering and grinding device according to claim 3, characterized in that: The bottom of the placement platform (14) is fixedly connected to a sliding block extending into the interior of the moving platform (4), and the upper surface of the moving platform (4) is provided with a sliding groove adapted to the sliding block.

5. The double-station large-area quartz wafer chamfering and grinding device according to claim 1, characterized in that: A limiting rod (19) is fixedly connected to a side of the workbench (1) away from the adjusting screw (16), and a limiting sleeve (20) is slidably connected to the outside of the limiting rod (19).

6. A double-station large-area quartz wafer chamfering and grinding device according to claim 5, characterized in that: The number of the connecting blocks (18) is four; the limiting sleeve (20) and the moving platform (4) are fixedly connected via the connecting blocks (18); and a connecting rod (21) is fixedly connected between the limiting sleeve (20) and the threaded sleeve (17).

7. The double-station large-area quartz wafer chamfering and grinding device according to claim 1, characterized in that: A telescopic cylinder (22) is fixedly mounted on the bottom of the top plate (2), and a grinding device (23) is fixedly connected to the output end of the telescopic cylinder (22).

Images