Elastic polishing wheel for chip production

Abstract

The utility model relates to the technical field of chip production, and discloses an elastic polishing wheel for chip production, which comprises a wheel body, and a mounting hole is formed in the center of the wheel body; the wheel body comprises a buffer layer, a first polishing layer and a second polishing layer, the buffer layer is arranged between the first polishing layer and the second polishing layer, and adhesive layers are arranged between the first polishing layer and the buffer layer and between the second polishing layer and the buffer layer; the first polishing layer and the second polishing layer are both nylon non-woven fabric fiber layers, and the adhesive layer is a PVA polyvinyl alcohol layer. The chip or circuit board surface resin removing device has the advantages of being good in flexibility and machinability, not prone to blocking, free of heating to burn a workpiece, free of abrasion to the workpiece and the like, can remove the surface resin of a chip or a circuit board, and does not damage the chip or the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to an elastic polishing wheel used for chip production. Background Art

[0002] In the current chip and circuit board production process, a polishing wheel is needed to remove the resin on the surface of the chip or circuit board, but the chip or circuit board itself must not be damaged. The requirements for the polishing wheel are very high, requiring the existing polishing wheel to have sufficient elasticity, sufficient cutting, and no damage to the polishing wheel itself. However, the current polishing wheel cannot meet the use requirements. Therefore, an elastic polishing wheel for chip production is proposed. Utility Model Content

[0003] The utility model aims to solve the problem of poor elasticity and cutting performance of polishing wheels in the prior art, and proposes an elastic polishing wheel for chip production.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An elastic polishing wheel for chip production comprises a wheel body, wherein a mounting hole is provided at the center of the wheel body; the wheel body comprises a buffer layer, a first polishing layer and a second polishing layer, wherein the buffer layer is arranged between the first polishing layer and the second polishing layer, and a viscose layer is arranged between the first polishing layer and the buffer layer and between the second polishing layer and the buffer layer; the first polishing layer and the second polishing layer both adopt nylon non-woven fabric fiber layers, and the viscose layer adopts a PVA polyvinyl alcohol layer.

[0006] Preferably, the diameter of the mounting hole is 30 mm.

[0007] Preferably, a plurality of evenly distributed heat dissipation holes are formed around the surface of the wheel body, and the diameter of the heat dissipation holes is 10 mm.

[0008] Preferably, the buffer layer is an EVA foam layer.

[0009] Preferably, the adhesive layer is a PVA microporous foam layer.

[0010] Preferably, the thickness of the first polishing layer is the same as that of the second polishing layer, the thickness of the buffer layer is twice the thickness of the first polishing layer, and the thickness of the buffer layer is twice the thickness of the second polishing layer.

[0011] Compared with the prior art, the utility model provides an elastic polishing wheel for chip production, which has the following beneficial effects:

[0012] The elastic polishing wheel for chip production is provided with a first polishing layer and a second polishing layer, and both the first polishing layer and the second polishing layer are made of nylon 66 non-woven fiber layers, so that the manufactured wheel body has good flexibility and cutting performance, is not easy to be blocked, does not generate heat to burn the workpiece, and does not grind the workpiece. It can remove the resin on the surface of the chip or the circuit board without damaging the chip or the circuit board itself, and can reduce the original defective rate from 15% to 3%, greatly improving the quality of the chip or the circuit board.

[0013] The parts not involved in the device are the same as the existing technology or can be implemented by the existing technology. The utility model has good flexibility and cutting performance, is not easy to be blocked, does not generate heat to burn the workpiece, and does not grind the workpiece. It can remove the resin on the surface of the chip or circuit board without damaging the chip or circuit board itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional diagram of an elastic polishing wheel for chip production proposed by the utility model;

[0015] Figure 2 A plan view of an elastic polishing wheel for chip production proposed by the utility model;

[0016] Figure 3 The utility model is a cross-sectional view of an elastic polishing wheel for chip production.

[0017] In the figure: 1. wheel body; 2. mounting hole; 3. buffer layer; 4. first polishing layer; 5. second polishing layer; 6. adhesive layer; 7. heat dissipation hole. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0020] Example 1

[0021] Reference Figure 1-2A flexible polishing wheel for chip production includes a wheel body 1. A mounting hole 2 is opened at the center of the wheel body 1. The diameter of the mounting hole 2 is 30 mm. A plurality of evenly distributed heat dissipation holes 7 are opened around the surface of the wheel body 1. The diameter of the heat dissipation holes 7 is 10 mm. The wheel body 1 can be installed and used through the mounting hole 2. During the high-speed rotation polishing process of the wheel body 1, the temperature of the surface of the wheel body 1 can be reduced through the heat dissipation holes 7.

[0022] Example 2

[0023] Reference Figure 1-3 The wheel body 1 includes a buffer layer 3, a first polishing layer 4 and a second polishing layer 5. The buffer layer 3 is arranged between the first polishing layer 4 and the second polishing layer 5. The buffer layer 3 is made of EVA foam layer, which has good elastic buffering performance. A viscose layer 6 is arranged between the first polishing layer 4 and the buffer layer 3 and between the second polishing layer 5 and the buffer layer 3. The viscose layer 6 is made of PVA microporous foam layer. The first polishing layer 4 and the second polishing layer 5 are both made of nylon 66 non-woven fiber layers. The viscose layer 6 is made of PVA polyvinyl alcohol layer. The thickness of the first polishing layer 4 and the second polishing layer 5, the thickness of the buffer layer 3 is twice that of the first polishing layer 4, the thickness of the buffer layer 3 is twice that of the second polishing layer 5, and the first polishing layer 4 and the second polishing layer 5 are both made of nylon 66 non-woven fiber layers, so that the manufactured wheel body 1 has good flexibility and cutting performance, is not easy to be blocked, does not generate heat to burn the workpiece, and does not grind the workpiece, etc., can remove the resin on the surface of the chip or circuit board without damaging the chip or circuit board itself, and can reduce the original defective rate from 15% to 3%, greatly improving the quality of the chip or circuit board.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An elastic polishing wheel for chip production, comprising a wheel body (1), characterized in that: A mounting hole (2) is provided at the center of the wheel body (1); The wheel body (1) comprises a buffer layer (3), a first polishing layer (4) and a second polishing layer (5); the buffer layer (3) is arranged between the first polishing layer (4) and the second polishing layer (5); an adhesive layer (6) is arranged between the first polishing layer (4) and the buffer layer (3) and between the second polishing layer (5) and the buffer layer (3); The first polishing layer (4) and the second polishing layer (5) are both made of nylon 66 non-woven fabric fiber layers, and the viscose layer (6) is made of PVA polyvinyl alcohol layer.

2. The elastic polishing wheel for chip production according to claim 1, characterized in that: The diameter of the mounting hole (2) is 30 mm.

3. The elastic polishing wheel for chip production according to claim 1, characterized in that: A plurality of evenly distributed heat dissipation holes (7) are formed around the surface of the wheel body (1), and the diameter of the heat dissipation holes (7) is 10 mm.

4. The elastic polishing wheel for chip production according to claim 1, characterized in that: The buffer layer (3) is an EVA foam layer.

5. The elastic polishing wheel for chip production according to claim 1, characterized in that: The adhesive layer (6) is a PVA microporous foaming layer.

6. The elastic polishing wheel for chip production according to claim 1, characterized in that: The thickness of the first polishing layer (4) is the same as the thickness of the second polishing layer (5), the thickness of the buffer layer (3) is twice the thickness of the first polishing layer (4), and the thickness of the buffer layer (3) is twice the thickness of the second polishing layer (5).

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