Circuit board glue pouring mold

By designing a circuit board filling mold including a lower mold mechanism, an upper mold, a glue filling part, a bearing plate and a cylinder, the problem of difficulty in desoldering and demolding of the circuit board body of the rotary guide drilling equipment in a vibrating environment is solved, and the problem of desoldering and demolding of the circuit board body of the rotary guide drilling equipment is realized. The stable packaging and convenient mold release of the circuit board body.

CN222495146UActive Publication Date: 2025-02-18FENGSHUN COUNTY JINHONG MOLD MFG CO LTD
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Patent Information

Application Number
CN202421313278.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-11
Publication Date
2025-02-18
Estimated Expiration
2034-06-11

AI Technical Summary

Technical Problem

The circuit board body used for rotary guide drilling equipment is prone to desoldering of components such as inductors and capacitors in vibrating environments, which leads to the inability to work. The existing potting molds have difficulties in demolding, which may damage the circuit board body or lead to packaging. Incomplete appearance.

Method used

A circuit board glue filling mold is designed, including a lower mold mechanism, an upper mold, a glue filling part, a bearing plate and a cylinder. The mold cavity is formed by a lower mold plate made of silicone and a bottom mold plate made of plastic, and the mold cavity is realized by using springs and cylinders. Stable placement and convenient mold release of the circuit board body.

Benefits of technology

It effectively solves the problem of desoldering of the circuit board body in a vibrating environment, and realizes convenient mold release of the circuit board body through improved mold design, avoiding damage to the packaging appearance.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222495146U_ABST
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Abstract

The utility model discloses a circuit board glue pouring mold, and belongs to the technical field of molds. The die mainly comprises four groups of lower die plates, the bottom mold plate is connected with the four groups of lower mold plates to form a mold cavity; the upper mold covers the four groups of lower mold plates; the two groups of glue filling parts are mounted on the upper mold; the bearing plate is placed in the mold cavity, and a sealing ring is arranged on the periphery of the bearing plate; the spring is arranged between the bottom mold plate and the bearing plate, and a circuit board body is placed on the bearing plate; and the bearing mechanism is connected to the mold plates in a sleeving mode, and the bearing mechanism is provided with sleeve plates connected to the four sets of lower mold plates in a sleeving mode and air cylinders installed on the lower mold plates. According to the circuit board glue pouring mold, through the arrangement of the bearing plate, the spring, the air cylinder and the glue pouring part, the four sets of lower mold plates are pulled to separate forming glue liquid between the four sets of lower mold plates and the circuit board body, then the air cylinder is started, and the output end of the air cylinder pushes the bearing plate to be pushed out of the four sets of lower mold plates.
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Description

Technical Field

[0001] The present application relates to the field of mold technology, and in particular to a circuit board glue potting mold. Background Art

[0002] The circuit board body is an indispensable part of electrical equipment. The working environment of electrical equipment used in daily life is relatively good, so the circuit board body does not need special protection and can be directly installed in the housing of the electrical equipment. However, the circuit board body used in rotary steerable drilling equipment often fails due to the poor working environment. The specific reason is that the drilling tool will generate strong vibrations when working. If the circuit board body is not specially protected, it will cause the inductor, capacitor and other components on the circuit board body to become unsoldered, causing the circuit board body to fail to work;

[0003] To address the above problems, the circuit board body can be potted to solve the problem. The potting mold in the prior art is composed of an upper mold and a lower mold. The following problems exist when potting with the existing mold.

[0004] Since the circuit board body used for drilling tools is relatively high, it is difficult to demold after potting. Even if a release agent is applied to the mold, demolding is still difficult in actual operation. If demolding is forced, on the one hand, the circuit board body may be damaged, and on the other hand, the adhesive film may stick to the inner wall of the mold, resulting in incomplete packaging shape of the circuit board body. At the same time, when the existing circuit board body mold is closing the mold blocks on both sides, a plurality of positioning pins and positioning buckles are usually provided to close and fix the molds on both sides. When disassembling and assembling, the corresponding positioning buckles and positioning pins need to be removed respectively, which is cumbersome and inconvenient. Therefore, it is necessary to provide a circuit board glue potting mold to solve the above problems.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Utility Model Content

[0006] Based on the above-mentioned problems existing in the prior art, the problem to be solved by the present application is: to provide a circuit board glue potting mold. Since the circuit board body used for the drilling tool is relatively high, it is difficult to demold after potting. Even if a release agent is applied in the mold, there is still a problem of difficulty in demolding in actual operation. If the mold is forced to be demolded, on the one hand, the circuit board body may be damaged. On the other hand, there is a problem that the glue film sticks to the inner wall of the mold, resulting in the problem of incomplete packaging shape of the circuit board body.

[0007] The technical solution adopted by the present application to solve its technical problems is: a circuit board glue pouring mold, including a lower mold mechanism, which includes: four groups of lower mold plates, which are spliced ​​to form a frame; a bottom mold plate, which is installed between the four groups of lower mold plates, and the bottom mold plate is connected to the four groups of lower mold plates to form a mold cavity; an upper mold, which covers the four groups of lower mold plates; two groups of glue pouring parts, which are installed on the upper mold; a receiving plate, which is placed in the mold cavity, and a sealing ring is arranged around the receiving plate; a spring, which is arranged between the bottom mold plate and the receiving plate, and a circuit board body is placed on the receiving plate; a supporting mechanism, which is sleeved on the mold plate, and the supporting mechanism has a sleeve plate sleeved on the four groups of lower mold plates and a cylinder installed on the lower mold plate.

[0008] Furthermore, the lower mold plate is made of silicone.

[0009] Furthermore, the bottom mold plate is made of plastic.

[0010] Furthermore, two sets of second gripping rods are installed on the upper mold.

[0011] Furthermore, a positioning column is installed on a side of the lower mold plate away from the bottom mold plate, and a positioning hole is opened on a side of the upper mold close to the bottom mold plate.

[0012] Furthermore, a clamping mechanism is installed on the lower mold plate and the upper mold, and the clamping mechanism includes a first fixing portion installed on the lower mold plate, the first fixing portion has four groups of first fixing holes, and a hooking portion is installed on the first fixing portion.

[0013] Furthermore, a second fixing part is installed on the upper mold, the second fixing part has four groups of second fixing holes, a connecting rod is installed on the second fixing part, a handle is rotatably connected to the connecting rod, the handle is tightly connected to the connecting rod, and a hanging rod is rotatably connected to the handle.

[0014] The beneficial effects of the present application are as follows: the present application provides a circuit board glue pouring mold, when the mold is in use, firstly, the circuit board body is placed on a receiving plate, at which time the receiving plate is subjected to the gravity of the circuit board body to compress the spring, so that the receiving plate is close to the bottom end of the inner wall of the mold cavity and contacts with the output end of the cylinder, and then the positioning holes on the upper mold are aligned with the positioning columns and covered on the lower mold plate, and then glue is injected into the mold cavity through the glue pouring part; after standing and cooling for a certain period of time, since the four groups of lower mold plates are made of silicone material, the molding glue between the four groups of lower mold plates and the circuit board body is separated by pulling, and then the cylinder is started, and the output end of the cylinder pushes the receiving plate out of the four groups of lower mold plates, and then the circuit board body after the glue pouring is removed from the receiving plate, so as to facilitate the demolding of the circuit board body, and at the same time, the output end of the cylinder is started again to reset, and at the same time, the receiving plate is suitable for being in the mold cavity under the action of the spring, so as to reset to the initial state.

[0015] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 This is an overall schematic diagram of a circuit board glue filling mold in this application;

[0018] Figure 2 for Figure 1 An enlarged schematic diagram of

[0019] Figure 3 for Figure 2 Schematic diagram of the structure of the middle and lower molds;

[0020] Figure 4 for Figure 2 A magnified schematic diagram of the middle A area;

[0021] Among them, the reference numerals in the figure are:

[0022] 1. Lower mold mechanism; 101. Lower mold plate; 102. First gripping rod; 103. Positioning column; 104. Mold cavity; 105. Bottom mold plate; 106. Receiver plate; 107. Sealing ring; 108. Spring; 2. Upper mold; 201. Second gripping rod; 202. Positioning hole; 203. Glue filling part; 3. Circuit board body; 4. Supporting mechanism; 401. Sleeve plate; 402. Supporting leg; 403. Cylinder; 5. Clamping mechanism; 501. First fixing part; 502. First fixing hole; 503. Hooking part; 504. Second fixing part; 505. Second fixing hole; 506. Connecting rod; 507. Handle; 508. Hanging rod. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] Embodiment 1:

[0026] Since the circuit board used for drilling tools is relatively high, it is difficult to demould after potting. Even if a demoulding agent is applied to the mold, demoulding is still difficult in actual operation. If demoulding is forced, the circuit board body may be damaged on the one hand, and the adhesive film may stick to the inner wall of the mold on the other hand, resulting in an incomplete package shape of the circuit board body.

[0027] In order to solve the above problems, Figure 1-Figure 3 As shown, the present application provides a circuit board glue-filling mold, including a lower mold mechanism 1, the lower mold mechanism 1 includes four groups of lower mold plates 101 arranged at the lower end position, the four groups of lower mold plates 101 are spliced ​​to form a frame, and the lower mold plates 101 are made of silicone material;

[0028] A bottom mold plate 105 is connected between the four groups of lower mold plates 101. The bottom mold plate 105 is made of plastic. A mold cavity 104 is formed by connecting the bottom mold plate 105 and the four groups of lower mold plates 101. The mold cavity 104 is used to place the circuit board body. First gripping rods 102 are fixedly installed on both sides of the two groups of lower mold plates 101. The first gripping rods 102 are used to move the lower mold mechanism 1.

[0029] The upper mold 2 is covered on the four groups of lower mold plates 101, and two groups of second gripping rods 201 are fixedly installed on the upper mold 2. The second gripping rods 201 are used to lift the upper mold 2. A positioning column 103 is installed on the side of the lower mold plate 101 away from the bottom mold plate 105. At the same time, a positioning hole 202 is opened on the side of the upper mold 2 close to the bottom mold plate 105. The positioning hole 202 is suitable for docking with the positioning column 103, so as to be suitable for closing and positioning the upper mold 2 and the lower mold mechanism 1;

[0030] At the same time, two sets of glue filling parts 203 are fixedly installed on the upper mold 2, and the glue filling parts 203 are used to fill glue into the upper mold 2 and the lower mold mechanism 1 after the mold is closed;

[0031] A receiving plate 106 is placed in the mold cavity 104, and a sealing ring 107 is arranged around the receiving plate 106. The receiving plate 106 is suitable for being clamped in the mold cavity 104 through the sealing ring 107, and a spring 108 is arranged between the bottom mold plate 105 and the receiving plate 106. The spring 108 is suitable for supporting the receiving plate 106, and the circuit board body 3 is placed on the receiving plate 106;

[0032] In order to facilitate demoulding of the circuit board body 3 after the glue is poured, Figure 2-Figure 3 As shown, a supporting mechanism 4 is sleeved on one side of the four groups of lower mold plates 101 away from the upper mold 2, and the supporting mechanism 4 includes a sleeve plate 401 sleeved on the four groups of lower mold plates 101, and a plurality of groups of supporting legs 402 are fixedly installed on one side of the sleeve plate 401 away from the four groups of lower mold plates 101. The supporting legs 402 are used to support the sleeve plate 401, and a cylinder 403 is fixedly installed on the sleeve plate 401 on one side of the supporting legs 402, and the output end of the cylinder 403 passes through the bottom mold plate 105.

[0033] To summarize, when the mold is in use, first, the circuit board body 3 is placed on the receiving plate 106. At this time, the receiving plate 106 is subjected to the gravity of the circuit board body 3 to squeeze the spring 108, so that the receiving plate 106 is close to the bottom end of the inner wall of the mold cavity 104 and contacts with the output end of the cylinder 403. Then, the positioning hole 202 on the upper mold 2 is aligned with the positioning column 103 and covered on the lower mold plate 101, and then the glue is injected into the mold cavity 104 through the glue filling part.

[0034] After standing and cooling for a certain period of time, since the four groups of lower mold plates 101 are made of silicone material, the molding glue between the four groups of lower mold plates 101 and the circuit board body 3 is separated by pulling, and then the cylinder 403 is started, and the output end of the cylinder 403 pushes the receiving plate 106 out of the four groups of lower mold plates 101, and then the circuit board body 3 after the glue filling is removed from the receiving plate 106, so as to facilitate the demoulding of the circuit board body 3, and at the same time, the output end of the cylinder 403 is started again to reset, and at the same time, the receiving plate 106 is suitable for being in the mold cavity 104 under the action of the spring 108, so as to reset to the initial state.

[0035] Embodiment 2:

[0036] When the existing circuit board body mold is used to close the mold blocks on both sides, multiple positioning pins and positioning buckles are usually provided to close and fix the molds on both sides. When disassembling and assembling, the corresponding positioning buckles and positioning pins need to be removed respectively, which is cumbersome and inconvenient.

[0037] In order to solve the above problems, Figure 1-Figure 2 and Figure 4 As shown, a clamping mechanism 5 is installed on the lower mold plate 101 and the upper mold 2, and the clamping mechanism 5 includes a first fixing portion 501 fixedly installed on the lower mold plate 101, the first fixing portion 501 has four groups of first fixing holes 502, and a hooking portion 503 is fixedly installed on the first fixing portion 501;

[0038] A second fixing portion 504 is fixedly mounted on the upper mold 2, and the second fixing portion 504 has four groups of second fixing holes 505, and a connecting rod 506 is fixedly mounted on the second fixing portion 504, and a handle 507 is rotatably connected to the connecting rod 506, and the handle 507 is tightly connected to the connecting rod 506, and a hanging rod 508 is rotatably connected to the handle 507;

[0039] Therefore, when the upper mold 2 and the lower mold plate 101 need to be closed, the positioning hole 202 on the upper mold 2 is aligned with the positioning column 103 and covered on the lower mold plate 101, and then the handle 507 is grasped and rotated clockwise to drive the hanging rod 508 to hang downward, and then the hanging rod 508 is hung on the hooking part 503, and then the handle 507 is rotated counterclockwise so that the hanging rod 508 is tightly hung on the hooking part 503, thereby effectively closing the upper mold 2 and the lower mold plate 101.

[0040] In the present application, the mold clamping mechanism 5 is a snap lock device in the prior art, which will not be described in detail here.

[0041] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board glue pouring mold, characterized in that: include: A lower mold mechanism (1), the lower mold mechanism (1) comprising: Four sets of lower mold plates (101), the four sets of lower mold plates (101) are spliced ​​to form a frame; A bottom mold plate (105), the bottom mold plate (105) being installed between the four groups of lower mold plates (101), the bottom mold plate (105) being connected to the four groups of lower mold plates (101) to form a mold cavity (104); An upper mold (2), the upper mold (2) covering the four sets of lower mold plates (101); Two sets of glue filling parts (203), the glue filling parts (203) are installed on the upper mold (2); A receiving plate (106), the receiving plate (106) being placed in the mold cavity (104), and sealing rings (107) being arranged around the receiving plate (106); a spring (108), the spring (108) being arranged between the bottom mold plate (105) and the receiving plate (106), the circuit board body (3) being placed on the receiving plate (106); A supporting mechanism (4) is sleeved on the mold plate (101), and the supporting mechanism (4) comprises a sleeve plate (401) sleeved on four groups of lower mold plates (101) and a cylinder (403) mounted on the lower mold plates (101).

2. A circuit board glue potting mold according to claim 1, characterized in that: The lower mold plate (101) is made of silicone.

3. A circuit board glue potting mold according to claim 1, characterized in that: The bottom mold plate (105) is made of plastic.

4. A circuit board glue potting mold according to claim 1, characterized in that: Two sets of second gripping rods (201) are installed on the upper mould (2).

5. The circuit board glue potting mold according to claim 1, characterized in that: A positioning column (103) is installed on a side of the lower mold plate (101) away from the bottom mold plate (105), and a positioning hole (202) is opened on a side of the upper mold (2) close to the bottom mold plate (105).

6. A circuit board glue potting mold according to claim 1, characterized in that: A mold clamping mechanism (5) is installed on the lower mold plate (101) and the upper mold (2), and the mold clamping mechanism (5) comprises a first fixing portion (501) installed on the lower mold plate (101), the first fixing portion (501) having four groups of first fixing holes (502), and a hooking portion (503) is installed on the first fixing portion (501).

7. A circuit board glue-filling mold according to claim 6, characterized in that: The upper mold (2) is provided with a second fixing portion (504), the second fixing portion (504) having four groups of second fixing holes (505), the second fixing portion (504) is provided with a connecting rod (506), the connecting rod (506) is rotatably connected to a handle (507), the handle (507) is tightly connected to the connecting rod (506), and the handle (507) is rotatably connected to a hanging rod (508).