Colloid printing device

Abstract

The utility model discloses a colloid printing device, and belongs to the technical field of semiconductor packaging. The colloid printing device is used for carrying out solid crystal glue printing, and the problem of low efficiency caused by one-time dispensing can be avoided. The colloid printing device can control the glue amount of the solid crystal glue through the thickness of the bearing sheet, and can also control the glue amount of the solid crystal glue through the unique arrangement of the printing hole. In the colloid printing device, the printing holes corresponding to the chips are selected through the sub-position marks for solid crystal glue printing, and the colloid printing device can be provided with the printing holes corresponding to the chips of different specifications at the same time.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor packaging, and in particular relates to a colloid printing device. Background Art

[0002] When wafer bare die is mounted, glue is dispensed with a needle and the amount of glue is controlled by linear air pressure. Only after glue is dispensed at the position corresponding to a wafer bare die can the next dispense be performed, and the glue dispensing efficiency is low. Utility Model Content

[0003] The present application provides a colloid printing device for cooperating with a solid crystal glue in a chip. The colloid printing device includes a carrier sheet, which is used to cooperate with a substrate in the chip. The carrier sheet is provided with multiple printing areas cooperating with the solid crystal glue and a position identification mark for being identified by a camera device. The position identification mark includes a sub-position mark corresponding to the chip. One of the multiple printing areas is arranged corresponding to the sub-position mark corresponding to the chip. The printing area is provided with a printing hole. The cross-section of the printing hole perpendicular to the thickness direction of the carrier sheet includes a first side edge, a second side edge, a third side edge and a fourth side edge connected in sequence end to end. The first side edge is arranged opposite to the third side edge, and the second side edge is arranged opposite to the fourth side edge. The ratio of the distance between the first side edge and the third side edge to the width of the wafer bare die in the chip is 0.95-0.99, and the ratio of the distance between the second side edge and the fourth side edge to the length of the wafer bare die is 0.95-0.99. The ratio of the thickness of the carrier sheet to the thickness of the solid crystal glue is greater than 1 and less than 1.39.

[0004] In the above scheme, the use of a colloid printing device for printing the solid crystal glue can avoid the low efficiency caused by dispensing glue one by one. The colloid printing device can control the amount of solid crystal glue by the thickness of the carrier sheet, and can also control the amount of solid crystal glue by the unique setting of the printing hole. In the colloid printing device, the printing hole corresponding to the chip is selected for solid crystal glue printing through the sub-position mark, so that the colloid printing device can simultaneously have printing holes corresponding to chips of different specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 This is a front view of a chip in some embodiments of the present application;

[0006] Figure 2 for Figure 1 A top view of the chip in the figure;

[0007] Figure 3 This is a schematic diagram of the structure of a colloid printing device in some embodiments of the present application;

[0008] Figure 4for Figure 3 A magnified schematic diagram of the middle carrier sheet at local IV;

[0009] Figure 5 for Figure 4 A schematic diagram of the partial structure of the middle carrier sheet in some embodiments;

[0010] Figure 6 for Figure 5 A schematic diagram of the structure of a medium-capacity glue hole in some embodiments;

[0011] Figure 7 for Figure 4 A schematic diagram of the partial structure of the middle carrier sheet in some embodiments;

[0012] Figure 8 for Figure 4 A schematic diagram of the partial structure of the middle carrier sheet in some embodiments;

[0013] Fig. 9 for Figure 4 A schematic diagram of the partial structure of the middle carrier sheet in some embodiments;

[0014] Fig.10 for Figure 4 Schematic diagram of the partial structure of the middle carrier sheet in some embodiments. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0016] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0017] See also Figure 1 and Figure 2 , Figure 1 This is a main view of the chip in some embodiments of the present application. Figure 2 for Figure 1 The chip 100 can be used as a final product or as a semi-finished product, which can be used after being further processed into a final product.

[0018] The chip 100 may include a substrate 101, a wafer bare die (also referred to as a die) 102 disposed opposite to the substrate 101, and a bonding adhesive 103 disposed between the substrate 101 and the wafer bare die 102 to fix the wafer bare die 102. The use of the bonding adhesive 103 can achieve the connection between the substrate 101 and the wafer bare die 102, so that the wafer bare die 102 can be fixed on the substrate 101.

[0019] For the chip 100, after the wafer is manufactured, it needs to be cut to form a wafer die 102, and the wafer die 102 is fixed on the substrate 101 by a die bonding adhesive 103, and then wire bonding, molding, ball planting, cutting and other process processes can be performed.

[0020] Furthermore, during the process of fixing the bare wafers 102 on the substrate 101, multiple bare wafers 102 can be fixed on one substrate 101 in batches, and the substrate 101 can be cut in the cutting process to separate the individual bare wafers 102. Of course, it is also possible to fix one bare wafer 102 on one substrate 101 only during the process of fixing the bare wafers 102 on the substrate 101.

[0021] It is understandable that the chip 100 (the material composition, shape structure, etc. of the chip 100 ) and the manufacturing process of the chip 100 listed here do not limit the present application, and the chip 100 and the manufacturing process of the chip 100 may also adopt technical solutions well known to those skilled in the art.

[0022] In some embodiments, a matching portion 1011 may be provided on the substrate 101 to match with the colloid printing device. In some embodiments, the matching portion 1011 may be a protrusion and / or a groove and / or a perforation, etc., and of course, it may also be other structures that can achieve positioning and connection. In some embodiments, the matching portion 1011 may be a magnet. In some embodiments, the matching portion 1011 is a protrusion such as a convex column, and the diameter may be 1.5 mm. The embodiments listed here do not limit the present application. In some embodiments, the matching portion 1011 may be a circular groove or a circular perforation, and the diameter may be 1.5 mm. The embodiments listed here do not limit the present application.

[0023] In some embodiments, the wafer die 102 may have length, width and thickness. When fixed to the substrate 101, only the bonding surfaces related to the length and width are matched with the substrate 101 through the die-bonding adhesive 103, and thus the thickness may not be described in detail.

[0024] In some embodiments, the length of the wafer die 102 may be the length of the bonding surface, and the width of the wafer die 102 may be the width of the bonding surface.

[0025] In some embodiments, the length of the wafer die 102 may be the length of the orthographic projection of the wafer die 102 on the substrate 101, and the width of the wafer die 102 may be the width of the orthographic projection of the wafer die 102 on the substrate 101. Of course, there may be errors in fixing the wafer die 102 to the substrate 101 by the die-bonding adhesive 103, so that the orthographic projection of the wafer die 102 on the substrate 101 changes.

[0026] In some embodiments, the length L0 of the wafer die 102 may be 9.17 mm and the width M0 may be 4.87 mm. In some embodiments, the length L0 of the wafer die 102 may be 7.95 mm and the width M0 may be 6.48 mm. In some embodiments, the length L0 of the wafer die 102 may be 7.95 mm and the width M0 may be 6.48 mm.

[0027] It is understandable that in the embodiments listed here, the length L0 and the width M0 of the wafer bare die 102 are not limited to the present application, and can also be adjusted using technical solutions well known to those skilled in the art.

[0028] In some embodiments, the die-bonding glue 103 may be red glue, and of course, may also be other glues that fix the wafer die 102 on the substrate 101. Red glue is a liquid epoxy resin thermosetting adhesive of a polyolefin compound.

[0029] See also Figure 3 , Figure 3 Schematic diagram of the structure of the colloid printing device 200 in some embodiments of the present application. The colloid printing device 200 can be used in the manufacturing process of the above-mentioned chip 100 as an auxiliary tool to facilitate the manufacturing of the chip 100.

[0030] Specifically, the colloid printing device 200 is used in the process of fixing the wafer bare die 102 on the substrate 101. It can print the bonding glue 103 in an area on the substrate 101 to achieve the coating and setting of the bonding glue 103 on the substrate 101, or it can print the bonding glue 103 in multiple areas on the substrate 101 at one time to achieve the coating and setting of the bonding glue 103 in multiple areas on the substrate 101.

[0031] It is understandable that after the die-bonding adhesive 103 is applied on the substrate 101 , the bare wafer 102 , for example, the bonding surface thereof, can be pressed against the die-bonding adhesive 103 to achieve connection between the bare wafer 102 and the substrate 101 .

[0032] The colloid printing device 200 can improve the dispensing efficiency of the die-bonding adhesive 103 on the substrate 101 , thereby improving the production efficiency of the chip 100 .

[0033] In addition, the colloid printing device 200 can also ensure the uniformity of the die-bonding glue 103 as much as possible, thereby improving the glue overflow phenomenon, reducing the pores or bubbles between the wafer bare chip 102 and the substrate 101, etc., so that the phenomenon of voids and local stratification between the wafer bare chip 102 and the substrate 101 is improved, thereby improving product reliability.

[0034] Furthermore, the colloid printing device 200 can also ensure the overall cleanliness of the substrate 101 by improving the overflow phenomenon, reduce the probability of gold fingers being contaminated, and reduce the pollution problem caused by the upward flipping of the die-bonding adhesive 103.

[0035] The colloid printing device 200 may include a carrier sheet 10, a carrier frame 20 surrounding the carrier sheet 10, and a flexible body 30 disposed between the carrier sheet 10 and the carrier frame 20 to connect the carrier sheet 10 and the carrier frame 20. The carrier sheet 10 is used to cooperate with the chip 100, such as the substrate 101, to realize the printing of the die-bonding adhesive 103 on the substrate 101. The carrier frame 20 can be convenient for machine clamping or user holding, and can also be convenient for fixing. While the flexible body 30 plays the role of connecting the carrier sheet 10 and the carrier frame 20, it can also reduce the position deviation of the carrier sheet 10 and the carrier frame 20 during the use of the colloid printing device 200, which can ensure the degree of cooperation between the carrier sheet 10 and the chip 100, such as the substrate 101, and the reliability of the product.

[0036] In some embodiments, the support frame 20 may be a frame made of a hard material to improve the rigidity of the support frame 20. In some embodiments, the support frame 20 may be a hard metal frame. In some embodiments, the support frame 20 may be an aluminum alloy frame. In some embodiments, the support frame 20 may be a ring frame or other forms of frame structures.

[0037] The flexible body 30 can be bent or elastically deformed. In some embodiments, the flexible body 30 can be a mesh or other flexible material. In some embodiments, the flexible body 30 can be arranged around the carrier sheet 10, and can be connected to the edge of the carrier sheet 10, and connected to the carrier frame 20 to fix the carrier sheet 10 in the carrier frame 20. In some embodiments, the matching relationship between the carrier sheet 10, the carrier frame 20 and the flexible body 30 may not be limited to the embodiments listed here, but may also be a technical solution well known to those skilled in the art. In some embodiments, based on demand, the flexible body 30 can be omitted so that the carrier sheet 10 and the carrier frame 20 are directly matched or matched by other means.

[0038] See also Figure 3 The carrier sheet 10 may be a plate-shaped structure and may be made of a hard material to improve the rigidity of the carrier sheet 10. In some embodiments, the carrier sheet 10 may be a hard metal sheet. In some embodiments, the carrier sheet 10 may be an aluminum alloy sheet. In some embodiments, the carrier sheet 10 may be a steel sheet.

[0039] In some embodiments, the length of the carrier sheet 10 may be 420 mm and the width may be 520 mm. Of course, the specifications of the carrier sheet 10 may also be adjusted according to requirements. For example, the tension of the carrier sheet 10 may be adjusted to ensure the life of the carrier sheet 10 and reduce the manufacturing cost of the carrier sheet 10 while meeting the tension requirements.

[0040] In some embodiments, the thickness of the carrier sheet 10 may be greater than the thickness of the bonding adhesive 103 in the chip 100. In some embodiments, the ratio of the thickness of the carrier sheet 10 to the thickness of the bonding adhesive 103 in the chip 100 may be greater than 1 and less than 1.39, so as to control the usage of the bonding adhesive 103. In some embodiments, the ratio of the thickness of the carrier sheet 10 to the thickness of the bonding adhesive 103 in the chip 100 may be 1.3.

[0041] In some embodiments, the thickness of the carrier sheet 10 may be 0.04-0.09 mm.

[0042] In some embodiments, the thickness of the carrier sheet 10 may be 0.05 mm.

[0043] In some embodiments, the thickness of the carrier sheet 10 may be 0.08 mm.

[0044] It is understandable that the thickness of the carrier sheet 10 can also be adjusted based on the thickness requirement of the die-bonding adhesive 103 in the chip 100. In addition, the thickness of the carrier sheet 10 can also be adjusted according to the requirements. For example, it can be adjusted according to the tension of the carrier sheet 10 to ensure the life of the carrier sheet 10 and reduce the manufacturing cost of the carrier sheet 10 while meeting the tension requirement.

[0045] See also Figure 3 and Figure 4 , Figure 4 for Figure 3 The enlarged schematic diagram of the carrier sheet 10 at local IV in FIG. A printing area 11 is provided on the carrier sheet 10. When the carrier sheet 10 and the substrate 101 are stacked, when the solid crystal adhesive 103 is applied (depending on the difference in the operation method, application can also refer to dispensing) at the printing area 11 of the carrier sheet 10, the solid crystal adhesive 103 contacts the substrate 101 at the printing area 11, and then the solid crystal adhesive 103 is printed on the substrate 101. In some embodiments, there may be multiple printing areas 11. In some embodiments, one or more printing areas 11 may be provided corresponding to one substrate 101. In some embodiments, there may be four printing areas 11 to improve production efficiency.

[0046] The printing area 11 may include a plurality of sub-printing areas 111 arranged in a preset arrangement, and each sub-printing area 111 may print a bonding adhesive 103 corresponding to a wafer die 102, so that the bonding adhesive 103 is printed in an area on the substrate 101, and a wafer die 102 is fixed on the substrate 101 through the bonding adhesive 103. The preset arrangement of the sub-printing areas 111 may be set or adjusted based on the position requirements of the wafer die 102 by those skilled in the art.

[0047] In some embodiments, the plurality of sub-printing areas 111 may be arranged in an array. In some embodiments, the number of sub-printing areas 111 may be 44, so that 44 wafer dies 102 may be printed on the substrate 101 at one time, thereby improving the dispensing efficiency and thus improving the production efficiency of the chip 100.

[0048] See also Figure 5 , Figure 5 for Figure 4 Schematic diagram of the partial structure of the carrier sheet 10 in some embodiments. The sub-printing area 111 may be provided with a printing hole 1101 that penetrates the carrier sheet 10. When the carrier sheet 10 and the substrate 101 are stacked, when the bonding adhesive 103 is dispensed in the printing hole 1101, the bonding adhesive 103 can fall on the substrate 101 through the printing hole 1101, thereby achieving the setting of the bonding adhesive 103 on the substrate 101.

[0049] In some embodiments, the amount of adhesive 103 contained in the printing hole 1101 is the amount used to fix one wafer die 102. In addition, the uniformity of the adhesive 103 is ensured as much as possible, thereby improving the adhesive overflow phenomenon, reducing the pores or bubbles between the wafer die 102 and the substrate 101, and improving the phenomenon of local stratification of the voids between the wafer die 102 and the substrate 101, thereby improving product reliability. Furthermore, by improving the adhesive overflow phenomenon, the overall cleanliness of the substrate 101 can be ensured, the probability of gold finger contamination can be reduced, and the contamination problem caused by the flipping of the adhesive 103 can also be reduced.

[0050] The cross section of the printing hole 1101 perpendicular to the thickness direction of the carrier sheet 10 can be a rectangle or a rectangle-like figure or other forms of figures, which can be set according to the needs of those skilled in the art. In some embodiments, the cross section of the printing hole 1101 perpendicular to the thickness direction of the carrier sheet 10 can be a rounded rectangle.

[0051] A cross section of the printing hole 1101 perpendicular to the thickness direction of the carrier sheet 10 may have side edges such as a first side edge 1111 , a second side edge 1112 , a third side edge 1113 and a fourth side edge 1114 .

[0052] In some embodiments, the first side 1111, the second side 1112, the third side 1113 and the fourth side 1114 may be connected end to end in sequence, and the first side 1111 is disposed opposite to the third side 1113, and the second side 1112 is disposed opposite to the fourth side 1114. In some embodiments, the distance between the first side 1111 and the third side 1113 is M1, and the distance between the second side 1112 and the fourth side 1114 is L1.

[0053] In some embodiments, the ratio of the distance M1 between the first side 1111 and the third side 1113 to the width M0 of the wafer bare chip 102 is 0.95-0.99, and then by limiting the cross-section of the printing hole 1101 perpendicular to the thickness direction of the carrier sheet 10, the application amount of the solid crystal glue 103 is limited, the overflow amount of the solid crystal glue 103 is reduced, and the overflow phenomenon is improved. It can also ensure the overall cleanliness of the substrate 101, reduce the probability of gold finger contamination, and improve product reliability.

[0054] In some embodiments, the ratio of the distance M1 between the first side 1111 and the third side 1113 to the width M0 of the wafer die 102 is 0.967.

[0055] In some embodiments, the ratio of the distance L1 between the second side 1112 and the fourth side 1114 to the length L0 of the wafer bare chip 102 is 0.95-0.99, and then by limiting the cross-section of the printing hole 1101 perpendicular to the thickness direction of the carrier sheet 10, the application amount of the bonding adhesive 103 is limited, the overflow amount of the bonding adhesive 103 is reduced, and the overflow phenomenon is improved. It can also ensure the overall cleanliness of the substrate 101, reduce the probability of gold finger contamination, and improve product reliability.

[0056] In some embodiments, the ratio of the distance L1 between the second side 1112 and the fourth side 1114 to the length L0 of the wafer die 102 is 0.987.

[0057] In some embodiments, the middle portion of the first side 1111 may be protruded toward one side close to the third side 1113 to limit the amount of the die-bonding glue 103 applied, reduce the amount of the die-bonding glue 103 overflowing, thereby improving the overflow phenomenon, and also ensuring the overall cleanliness of the substrate 101, reducing the probability of the gold finger being contaminated, and further improving the product reliability. In some embodiments, the middle portion of the first side 1111 may protrude toward one side of the third side 1113 by a protruding distance O1 of 0.12 mm. In some embodiments, the middle portion of the first side 1111 may protrude toward one side of the third side 1113 by a protruding distance O1 of 0.15 mm. In some embodiments, the middle portion of the first side 1111 may protrude toward one side of the third side 1113 by a protruding distance O1 of 0.24 mm. In some embodiments, the middle portion of the first side 1111 may protrude toward one side of the third side 1113 by a protruding distance O1 of 0.26 mm.

[0058] In some embodiments, the middle portion of the first side 1111 protrudes toward one side close to the third side 1113, so that the first side 1111 is a curve. In some embodiments, the middle portion of the first side 1111 protrudes toward one side close to the third side 1113, so that the first side 1111 is an arc curve.

[0059] In some embodiments, the middle of the third side 1113 may be protruded toward the side close to the first side 1111 to limit the amount of the solid crystal glue 103 applied, reduce the amount of the solid crystal glue 103 overflowing, thereby improving the overflow phenomenon, and can also ensure the overall cleanliness of the substrate 101, reduce the probability of the gold finger being contaminated, and improve product reliability. In some embodiments, the middle of the third side 1113 may protrude toward the side close to the first side 1111 by a protruding distance O3 of 0.12 mm. In some embodiments, the middle of the third side 1113 may protrude toward the side close to the first side 1111 by a protruding distance O3 of 0.15 mm. In some embodiments, the middle of the third side 1113 may protrude toward the side close to the first side 1111 by a protruding distance O3 of 0.24 mm. In some embodiments, the middle of the third side 1113 may protrude toward the side close to the first side 1111 by a protruding distance O3 of 0.26 mm.

[0060] In some embodiments, the middle portion of the third side 1113 may be convexly arranged toward one side close to the first side 1111, so that the third side 1113 is a curve. In some embodiments, the middle portion of the third side 1113 may be convexly arranged toward one side close to the first side 1111, so that the third side 1113 is an arc curve.

[0061] In some embodiments, the middle portion of the second side 1112 may be protruded toward the side close to the fourth side 1114 to limit the amount of the solid crystal glue 103 applied, reduce the amount of the solid crystal glue 103 overflowing, thereby improving the overflow phenomenon, and can also ensure the overall cleanliness of the substrate 101, reduce the probability of the gold finger being contaminated, and improve product reliability. In some embodiments, the middle portion of the second side 1112 may protrude toward the side close to the fourth side 1114 by a protruding distance O2 of 0.12 mm. In some embodiments, the middle portion of the second side 1112 may protrude toward the side close to the fourth side 1114 by a protruding distance O2 of 0.15 mm. In some embodiments, the middle portion of the second side 1112 may protrude toward the side close to the fourth side 1114 by a protruding distance O2 of 0.24 mm. In some embodiments, the middle portion of the second side 1112 may protrude toward the side close to the fourth side 1114 by a protruding distance O2 of 0.26 mm.

[0062] In some embodiments, the middle portion of the second side 1112 may protrude toward one side close to the fourth side 1114, so that the second side 1112 is a curve. In some embodiments, the middle portion of the second side 1112 may protrude toward one side close to the fourth side 1114, so that the second side 1112 is an arc curve.

[0063] In some embodiments, the middle of the fourth side 1114 may be protruded toward the side close to the second side 1112 to limit the amount of the solid crystal glue 103 applied, reduce the amount of glue overflowing from the solid crystal glue 103, and improve the glue overflow phenomenon. It can also ensure the overall cleanliness of the substrate 101, reduce the probability of gold finger contamination, and improve product reliability. In some embodiments, the middle of the fourth side 1114 may protrude toward the side close to the second side 1112 by a protruding distance O4 of 0.12 mm. In some embodiments, the middle of the fourth side 1114 may protrude toward the side close to the second side 1112 by a protruding distance O4 of 0.15 mm. In some embodiments, the middle of the fourth side 1114 may protrude toward the side close to the second side 1112 by a protruding distance O4 of 0.24 mm. In some embodiments, the middle of the fourth side 1114 may protrude toward the side close to the second side 1112 by a protruding distance O4 of 0.26 mm.

[0064] In some embodiments, the middle portion of the fourth side 1114 may be convexly arranged toward one side close to the second side 1112, so that the fourth side 1114 is a curve. In some embodiments, the middle portion of the fourth side 1114 may be convexly arranged toward one side close to the second side 1112, so that the fourth side 1114 is an arc curve.

[0065] It can be understood that the limitation of the side edges, such as the first side edge 1111, the second side edge 1112, the third side edge 1113 and the fourth side edge 1114, can enable the bonding adhesive 103 to fill the area between the bare wafer 102 and the substrate 101 that is not filled with the bonding adhesive 103 when the bare wafer 102 in the chip 100 presses down the bonding adhesive 103, thereby improving the overflow of the bonding adhesive 103, improving the contamination of the gold fingers during the wire bonding process, and also improving the contamination caused by the bonding adhesive 103 turning up.

[0066] In some embodiments, in order to further improve the effect of limiting the amount of the solid crystal glue 103 and the effect of dispensing, the connection between the sides can be connected by rounded edges. For example, two adjacent and connected sides of the first side 1111, the second side 1112, the third side 1113 and the fourth side 1114 are connected by rounded edges 1115. The provision of rounded edges 1115 can facilitate the filling of the solid crystal glue 103 in the printing hole 1101, and reduce the difficulty of the right angle to the filling requirements of the solid crystal glue 103. In some embodiments, the radius of curvature R1 of the rounded edge 1115 can be 0.1mm. In some embodiments, the radius of curvature R1 of the rounded edge 1115 can be 0.2mm. In some embodiments, the radius of curvature R1 of the rounded edge 1115 can be 0.23mm. Of course, the radius of curvature R1 of the rounded edge 1115 can also be adjusted according to the needs of those skilled in the art.

[0067] In some embodiments, the sub-printing area 111 may be provided with a first glue control rib 1116 and a second glue control rib 1117 in the printing hole 1101, so as to control the dispensing amount of the die-bonding glue 103 and the uniformity of the die-bonding glue 103 by dividing the printing hole 1101 into a plurality of glue holding holes 1102. The arrangement of the plurality of glue holding holes 1102 may be arranged or adjusted based on the needs of those skilled in the art.

[0068] The first adhesive control rib 1116 and the second adhesive control rib 1117 are arranged to intersect.

[0069] In some embodiments, the plurality of adhesive holes 1102 may be arranged in an array.

[0070] In some embodiments, the first adhesive control rib 1116 may be arranged side by side with the second side 1112 and the fourth side 1114, and may be connected with the first side 1111 and the third side 1113. In some embodiments, the extension direction of the first adhesive control rib 1116 may be consistent with the extension direction of the second side 1112 or the fourth side 1114 or have an angle therewith.

[0071] In some embodiments, the second adhesive control rib 1117 may be arranged side by side with the first side 1111 or the third side 1113, and may be connected to the second side 1112 and the fourth side 1114. In some embodiments, the extension direction of the second adhesive control rib 1117 may be consistent with or have an angle with the extension direction of the first side 1111 or the third side 1113.

[0072] In some embodiments, the first glue control rib 1116 and the second glue control rib 1117 can be formed by the carrier sheet 10 when the carrier sheet 10 is provided with the glue receiving hole 1102. For example, when punching or etching is performed on the carrier sheet 10, when the glue receiving hole 1102 is formed, the first glue control rib 1116 and the second glue control rib 1117 can be formed.

[0073] In some embodiments, the provision of the first glue control rib 1116 and the second glue control rib 1117 can further reduce the amount of glue 103 provided on the substrate 101, so as to reduce the amount of glue overflow of the crystal glue 103, thereby improving the glue overflow phenomenon, and can also ensure the overall cleanliness of the substrate 101, reduce the probability of gold finger contamination, and further improve product reliability.

[0074] In some embodiments, the width of the cross section of the first adhesive control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 may be 0.08 mm. In some embodiments, the width of the cross section of the first adhesive control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 may be 0.12 mm. Of course, the width of the cross section of the first adhesive control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 may be set or adjusted based on the needs of those skilled in the art.

[0075] In some embodiments, the width of the cross section of the second adhesive control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 may be 0.08 mm. In some embodiments, the width of the cross section of the second adhesive control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 may be 0.12 mm. Of course, the width of the cross section of the second adhesive control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 may be set or adjusted based on the needs of those skilled in the art.

[0076] See also Figure 6 , Figure 6 for Figure 5 Schematic diagram of the structure of the middle glue hole 1102 in some embodiments. The glue hole 1102 can be a rectangular hole or a rounded rectangular hole, or a hole of other forms. In some embodiments, the length of the cross section of the glue hole 1102 perpendicular to the thickness direction of the carrier sheet 10 can be L2, and the width can be M2.

[0077] In some embodiments, the length L2 of the adhesive hole 1102 may be 1.72 mm. In some embodiments, the length L2 of the adhesive hole 1102 may be 0.62 mm. In some embodiments, the length L2 of the adhesive hole 1102 may be 1.48 mm. In some embodiments, the length L2 of the adhesive hole 1102 may be 0.64 mm. Of course, the length L2 of the adhesive hole 1102 may be set or adjusted based on the needs of those skilled in the art.

[0078] In some embodiments, the width M2 of the adhesive hole 1102 may be 0.49 mm. In some embodiments, the width M2 of the adhesive hole 1102 may be 0.61 mm. In some embodiments, the width M2 of the adhesive hole 1102 may be 0.68 mm. In some embodiments, the width M2 of the adhesive hole 1102 may be 0.64 mm. Of course, the width M2 of the adhesive hole 1102 may be set or adjusted based on the needs of those skilled in the art.

[0079] In some embodiments, when the adhesive hole 1102 is a rounded rectangular hole, the radius of curvature R2 of the rounded corner may be 0.1 mm. In some embodiments, the radius of curvature R2 of the rounded corner may be 0.2 mm. In some embodiments, the radius of curvature R2 may be 0.23 mm. Of course, the radius of curvature R2 may also be adjusted according to the needs of those skilled in the art.

[0080] In some embodiments, Figure 5 The distance L1 is 9.17mm, the distance M1 is 4.87mm, the protruding distance O1 can be 0.12mm, the protruding distance O2 can be 0.15mm, the protruding distance O3 can be 0.12mm, the protruding distance O4 can be 0.15mm, the length L2 is 1.72mm, the width M2 is 0.49mm, the radius of curvature R1 is 0.1mm, and the radius of curvature R2 is 0.1mm. The width of the cross section of the first glue control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 can be 0.12mm. The width of the cross section of the second glue control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 can be 0.12mm.

[0081] See also Figure 7 , Figure 7 for Figure 4 Schematic diagram of the partial structure of the middle carrier sheet 10 in some embodiments. Figure 7The distance L1 is 7.95mm, the distance M1 is 6.48mm, the protruding distance O1 can be 0.12mm, the protruding distance O2 can be 0.15mm, the protruding distance O3 can be 0.12mm, the protruding distance O4 can be 0.15mm, the length L2 is 1.48mm, the width M2 is 0.68mm, the radius of curvature R1 is 0.1mm, and the radius of curvature R2 is 0.1mm. The width of the cross section of the first glue control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 can be 0.12mm. The width of the cross section of the second glue control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 can be 0.12mm.

[0082] See also Figure 8 , Figure 8 for Figure 4 Schematic diagram of the partial structure of the middle carrier sheet 10 in some embodiments. Figure 8 The distance L1 is 9.17mm, the distance M1 is 4.87mm, the protruding distance O1 can be 0.24mm, the protruding distance O2 can be 0.26mm, the protruding distance O3 can be 0.24mm, the protruding distance O4 can be 0.26mm, the length L2 is 0.62mm, the width M2 is 0.61mm, the radius of curvature R1 is 0.2mm, and the radius of curvature R2 is 0.2mm. The width of the cross section of the first glue control rib 1116 perpendicular to the thickness direction of the carrier sheet 10 can be 0.08mm. The width of the cross section of the second glue control rib 1117 perpendicular to the thickness direction of the carrier sheet 10 can be 0.08mm.

[0083] See also Fig. 9 , Fig. 9 for Figure 4 Schematic diagram of the partial structure of the middle carrier sheet 10 in some embodiments. Figure 8 The distance L1 is 7.95mm, the distance M1 is 6.48mm, the protruding distance O1 can be 0.24mm, the protruding distance O2 can be 0.26mm, the protruding distance O3 can be 0.24mm, the protruding distance O4 can be 0.26mm, the length L2 is 0.64mm, the width M2 is 0.64mm, the curvature radius R1 is 0.2mm, and the curvature radius R2 is 0.2mm. The width of the cross section of the first control glue rib 1116 perpendicular to the thickness direction of the carrier sheet 10 can be 0.08mm. The width of the cross section of the second control glue rib 1117 perpendicular to the thickness direction of the carrier sheet 10 can be 0.08mm.

[0084] See also Figure 4, the surface of one side of the carrier sheet 10 in the thickness direction is provided with a front and back identification mark 12, so that when the carrier sheet 10 and the substrate 101 are stacked and matched, the front and back identification marks 12 are located on the side of the carrier sheet 10 away from the substrate 101, and glue can be dispensed through the carrier sheet 10 at this time. In some embodiments, the front and back identification marks 12 are patterns formed by etching the carrier sheet 10, or patterns formed by filling an object in a groove, and of course, patterns formed by other methods. It can be understood that the front and back identification marks 12 can also be other structures or patterns that can be recognized by people or camera equipment.

[0085] In some embodiments, the front and back identification marks 12 may be triangular patterns.

[0086] See also Figure 4 and Fig.10 , Fig.10 for Figure 4 Schematic diagram of the local structure of the carrier sheet 10 in some embodiments. The carrier sheet 10 is provided with a positioning portion 13 that cooperates with the substrate 101, such as the matching portion 1011, so that when the carrier sheet 10 and the substrate 101 are stacked, the positioning portion 13 cooperates with the matching portion 1011 to limit the position, so that the carrier sheet 10 does not shift relative to the substrate 101 during the dispensing process of the solid crystal glue 103, thereby ensuring that the process of making the chip 100 proceeds normally. In some embodiments, the positioning portion 13 can be arranged around the printing area 11 to enhance the degree of fit between the carrier sheet 10 and the substrate 101. In some embodiments, the positioning portion 13 can be a protrusion and / or a groove and / or a perforation, etc. In some embodiments, the positioning portion 13, such as a protrusion, can extend into the matching portion 1011, such as a groove and / or a perforation, to achieve positioning. In some embodiments, the positioning portion 13, such as a groove and / or a perforation, can accommodate the matching portion 1011, such as a protrusion, to achieve positioning. Of course, the positioning portion 13 can also be other structures that can cooperate with the matching portion 1011 to achieve positioning and connection. The embodiments listed here do not limit the present application. In some embodiments, the positioning portion 13 is a protrusion such as a protrusion, and the diameter can be 1.5 mm. In some embodiments, the positioning portion 13 can be a circular groove or a circular perforation, and the diameter can be 1.5 mm.

[0087] The positioning portion 13 can be quickly matched with the matching portion 1011 on a manual or semi-automatic printing machine to achieve the positioning of the carrier sheet 10 and the substrate 101, and then can be automatically operated on an automatic printing machine, and can also achieve rapid switching between manual, semi-automatic and automatic printing machines.

[0088] In some embodiments, the positioning portion 13 may also be a magnet, so as to be connected and positioned with the matching portion 1011 , such as a magnet, through magnetic force. In some embodiments, the magnet may be embedded on the carrier sheet 10 .

[0089] See also Figure 4 and Fig.10 A position identification mark 14 may be provided on the carrier sheet 10. The printer may identify the position identification mark 14 through a camera device to realize positioning of the carrier sheet 10 and positioning of the printing area 11 on the carrier sheet 10. Then, the printer can dispensing the solid crystal adhesive 103 based on the positioning of the printing area 11.

[0090] In some embodiments, the position identification mark 14 may include a first sub-position mark 141, a second sub-position mark 142, a third sub-position mark 143, and a fourth sub-position mark 144. Each sub-position mark, such as the first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143, and the fourth sub-position mark 144, may correspond to the specification of a chip 100, such as a wafer die 102, and may also correspond to the position of the printing area 11 on the carrier sheet 10.

[0091] When producing a chip 100 of a certain specification, the printer can identify the sub-position mark corresponding to the specification of the chip 100 in the position identification mark 14 through a camera device, and then determine the position of the printing area 11 corresponding to the sub-position mark, and then the printer dispenses the solid crystal glue 103 at the position of the printing area 11.

[0092] Through the position identification mark 14, the printing area 11 of the carrier sheet 10 can be set and arranged corresponding to the chips 100 of different specifications, thereby reducing the production cost of the carrier sheet 10, reducing the replacement frequency of the carrier sheet 10, and having a wider range of applications, thereby improving the production efficiency of the chip 100.

[0093] In some embodiments, the sub-position mark can be set around the printing area 11. In some embodiments, the sub-position mark can be a pattern formed by etching the carrier sheet 10, or a pattern formed by filling an object in the groove, and of course, it can also be a pattern formed by other methods. It can be understood that the sub-position mark can also be other structures or patterns that can be recognized by people or camera equipment.

[0094] In some embodiments, the sub-location marker may be a T-shaped pattern, a circular pattern, a rectangular pattern, or other irregular graphic patterns.

[0095] See also Fig.10 , the first sub-position mark 141 may be a T-shaped pattern, the second sub-position mark 142 may be a T-shaped pattern, the third sub-position mark 143 may be a T-shaped pattern, and the fourth sub-position mark 144 may be a circular pattern.

[0096] In some embodiments, Fig.10The first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143 and the fourth sub-position mark 144 cooperate to realize the selection of four dispensing methods of the solid crystal glue 103 corresponding to the four chip 100 specifications of the carrier sheet 10. For example, the printer can determine the position of the printing area 11 corresponding to the first sub-position mark 141 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100. For example, the printer can determine the position of the printing area 11 corresponding to the second sub-position mark 142 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100. For example, the printer can determine the position of the printing area 11 corresponding to the third sub-position mark 143 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100. For example, the printer can determine the position of the printing area 11 corresponding to the fourth sub-position mark 144 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100.

[0097] In some embodiments, Fig.10 The first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143 and the fourth sub-position mark 144 cooperate to realize the selection of three dispensing methods of the solid crystal glue 103 corresponding to the three chip 100 specifications on the carrier sheet 10. For example, the printer can determine the position of the printing area 11 corresponding to the first sub-position mark 141 and the fourth sub-position mark 144 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100. For example, the printer can determine the position of the printing area 11 corresponding to the second sub-position mark 142 and the fourth sub-position mark 144 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100. For example, the printer can determine the position of the printing area 11 corresponding to the third sub-position mark 143 and the fourth sub-position mark 144 based on the recognition of the camera device, and dispense the solid crystal glue 103 corresponding to the specification of one chip 100.

[0098] It is understandable that the camera device can be a part of the printer. The colloid printing device 200 can also be a part of the printer. Furthermore, the printer can dispense the die-bonding glue 103 on the substrate 101 through the colloid printing device 200 .

[0099] In some embodiments, a plurality of printing areas 11 may be disposed on the carrier sheet 10 , and each printing area 11 may correspond to a chip 100 of a certain specification.

[0100] In some embodiments, the configuration of a printing area 11 may be as follows: Figure 5The configuration shown in FIG. 1 can be configured to correspond to and cooperate with one of the first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143 and the fourth sub-position mark 144, for example, the first sub-position mark 141. The configuration method in a printing area 11 can be adopted Figure 6 The configuration shown in FIG. 1 can be configured to correspond to and cooperate with one of the first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143 and the fourth sub-position mark 144, for example, the second sub-position mark 142. The configuration method in a printing area 11 can be adopted Figure 7 The configuration shown in FIG. 1 can be configured to correspond to and cooperate with one of the first sub-position mark 141, the second sub-position mark 142, the third sub-position mark 143 and the fourth sub-position mark 144, for example, the third sub-position mark 143. The configuration method in a printing area 11 can be adopted Figure 8 It is set as shown, and can be set correspondingly and coordinated with one of the first sub-position identifier 141, the second sub-position identifier 142, the third sub-position identifier 143 and the fourth sub-position identifier 144, for example, it is set correspondingly and coordinated with the fourth sub-position identifier 144.

[0101] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways. For example, the device implementation described above is only illustrative, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0102] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0103] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A colloid printing device, used to cooperate with the die-bonding glue in the chip, characterized in that: The colloid printing device includes a carrier sheet, which is used to cooperate with the substrate in the chip. The carrier sheet is provided with multiple printing areas that cooperate with the solid crystal glue and a position identification mark for being identified by a camera device. The position identification mark includes a sub-position mark corresponding to the chip. One of the multiple printing areas is arranged corresponding to the sub-position mark corresponding to the chip. The printing area is provided with a printing hole. The cross-section of the printing hole perpendicular to the thickness direction of the carrier sheet includes a first side, a second side, a third side and a fourth side connected in sequence end to end. The first side is arranged opposite to the third side, and the second side is arranged opposite to the fourth side. The ratio of the distance between the first side and the third side to the width of the wafer bare die in the chip is 0.95-0.99, the ratio of the distance between the second side and the fourth side to the length of the wafer bare die is 0.95-0.99, and the ratio of the thickness of the carrier sheet to the thickness of the solid crystal glue is greater than 1 and less than 1.

39.

2. The colloid printing device according to claim 1, characterized in that: The carrier sheet is provided with a positioning portion which cooperates with the substrate to limit the position.

3. The colloid printing device according to claim 1, characterized in that: A front and back identification mark is arranged on a surface of one side of the carrier sheet in the thickness direction. When the carrier sheet and the substrate are stacked and arranged in cooperation, the front and back identification mark is located on a side of the carrier sheet away from the substrate.

4. The colloid printing device according to claim 1, characterized in that: The middle portion of the first side edge, the middle portion of the second side edge, the middle portion of the third side edge, and the middle portion of the fourth side edge are all protruded into the printing hole.

5. The colloid printing device according to claim 4, characterized in that: Two adjacent and connected side edges among the first side edge, the second side edge, the third side edge and the fourth side edge are connected by a rounded edge.

6. The colloid printing device according to claim 4, characterized in that: The first side, the second side, the third side and the fourth side are arc-shaped curves respectively.

7. The colloid printing device according to claim 4, characterized in that: The printing area is provided with a first glue control rib and a second glue control rib intersecting with each other in the printing hole, and the first glue control rib cooperates with the second glue control rib to divide the printing hole into a plurality of glue holding holes arranged in an array.

8. The colloid printing device according to claim 7, characterized in that: The glue holding hole is a rounded rectangle.

9. The colloid printing device according to claim 7, characterized in that: The distance between the second side and the fourth side is 9.17mm, the distance between the first side and the third side is 4.87mm, the distance that the middle part of the first side protrudes into the printing hole is 0.12mm, the distance that the middle part of the second side protrudes into the printing hole is 0.15mm, the distance that the middle part of the third side protrudes into the printing hole is 0.12mm, the distance that the middle part of the fourth side protrudes into the printing hole is 0.15mm, the length of the cross section of the glue hole perpendicular to the thickness direction of the carrier sheet is 1.72mm, and the width is 0.49mm, the width of the cross section of the first glue control rib perpendicular to the thickness direction of the carrier sheet is 0.12mm, and the width of the cross section of the second glue control rib perpendicular to the thickness direction of the carrier sheet is 0.12mm; Or, the distance between the second side and the fourth side is 7.95mm, the distance between the first side and the third side is 6.48mm, the distance that the middle part of the first side protrudes into the printing hole is 0.12mm, the distance that the middle part of the second side protrudes into the printing hole is 0.15mm, the distance that the middle part of the third side protrudes into the printing hole is 0.12mm, the distance that the middle part of the fourth side protrudes into the printing hole is 0.15mm, the length of the cross section of the glue hole perpendicular to the thickness direction of the carrier sheet is 1.48mm, and the width is 0.68mm, the width of the cross section of the first glue control rib perpendicular to the thickness direction of the carrier sheet is 0.12mm, and the width of the cross section of the second glue control rib perpendicular to the thickness direction of the carrier sheet is 0.12mm; Or, the distance between the second side and the fourth side is 9.17mm, the distance between the first side and the third side is 4.87mm, the distance that the middle part of the first side protrudes into the printing hole is 0.24mm, the distance that the middle part of the second side protrudes into the printing hole is 0.26mm, the distance that the middle part of the third side protrudes into the printing hole is 0.24mm, the distance that the middle part of the fourth side protrudes into the printing hole is 0.26mm, the length of the cross section of the glue hole perpendicular to the thickness direction of the carrier sheet is 0.62mm, and the width is 0.61mm, the width of the cross section of the first glue control rib perpendicular to the thickness direction of the carrier sheet is 0.08mm, and the width of the cross section of the second glue control rib perpendicular to the thickness direction of the carrier sheet is 0.08mm; Or, the distance between the second side and the fourth side is 7.95mm, the distance between the first side and the third side is 6.48mm, the distance that the middle part of the first side protrudes into the printing hole is 0.24mm, the distance that the middle part of the second side protrudes into the printing hole is 0.26mm, the distance that the middle part of the third side protrudes into the printing hole is 0.24mm, the distance that the middle part of the fourth side protrudes into the printing hole is 0.26mm, the length of the cross-section of the glue hole perpendicular to the thickness direction of the carrier sheet is 0.64mm, and the width is 0.64mm, the width of the cross-section of the first glue control rib perpendicular to the thickness direction of the carrier sheet is 0.08mm, and the width of the cross-section of the second glue control rib perpendicular to the thickness direction of the carrier sheet is 0.08mm.

10. The colloid printing device according to claim 1, characterized in that: The thickness of the carrier sheet may be 0.04-0.09 mm.

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