Jig convenient for code printing of semiconductor

Abstract

The utility model discloses a jig bottom plate convenient for code printing of a semiconductor. The bottom plate is provided with a first groove used for limiting a packaging substrate of the semiconductor. The bottom plate is detachably connected with the cover plate through a connecting assembly, and the cover plate is used for being matched with the bottom plate to jointly fix the packaging substrate; a plurality of code printing through holes are formed in the cover plate, and the positions of the code printing through holes are matched with the code printing positions on the fixed packaging substrate; the first groove formed in the bottom plate is matched with the bottom plate to jointly fix the packaging substrate, the stability of detecting the two-dimensional code on the packaging substrate is guaranteed, whether the code printing position on the packaging substrate is accurate or not is observed through the multiple code printing through holes formed in the cover plate, whether the code printing position deviates or not can be rapidly and conveniently detected, and the detection efficiency is improved. The problem that the semiconductor processing operation efficiency and the product quality are affected due to deviation of the two-dimensional code on the packaging substrate of an existing semiconductor is solved, and the operation efficiency and the product quality of the semiconductor are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a jig for semiconductor coding. Background Art

[0002] Before packaging, existing semiconductors need to have a two-dimensional code (2D Code) printed on the semiconductor packaging substrate. After setting the printing position on the machine, the 2D Code is printed directly on the packaging substrate. After printing, the staff will check whether there is a 2D Code on the packaging substrate, but cannot detect or accurately determine whether the printing position of the 2D Code is offset.

[0003] Workers and stations are unable to detect the 2D Code on the semiconductor packaging substrate in time. If the 2D Code coding position is offset, the semiconductor post-processing site machine operation will frequently alarm, affecting the machine operation efficiency, and even causing quality abnormalities due to the inability to read the QR code or the risk of manual QR code input errors, which in turn affects the quality of semiconductor products. Utility Model Content

[0004] In order to improve and solve the deficiencies in the prior art, a jig is provided for facilitating semiconductor coding, which solves the problem of affecting semiconductor processing efficiency and product quality caused by the offset of the two-dimensional code on the existing semiconductor packaging substrate.

[0005] In order to achieve the above technical effects, the technical solution adopted by the utility model is:

[0006] A jig for semiconductor coding, comprising:

[0007] A bottom plate, wherein a first groove for limiting a semiconductor packaging substrate is provided on the bottom plate;

[0008] A cover plate, the cover plate is detachably connected to the bottom plate via a connecting assembly, and is used to cooperate with the bottom plate to fix the packaging substrate together;

[0009] The cover plate is provided with a plurality of coding through holes, and the positions of the coding through holes match the positions of the coding on the fixed packaging substrate.

[0010] Optionally, a second groove for accommodating the packaging substrate is provided on the bottom surface of the cover plate, the second groove is located above the first groove, and the bottom area of ​​the first groove and the bottom area of ​​the second groove are both larger than the bottom area of ​​the packaging substrate.

[0011] Optionally, the connection component includes a plurality of fixing pins vertically fixed on the first groove, and the fixing pins are used to position the packaging substrate.

[0012] Optionally, a plurality of pin holes are provided on the packaging substrate, and a plurality of the fixing pins pass through the plurality of pin holes respectively to position the packaging substrate.

[0013] Optionally, a plurality of grooves are provided on the side of the packaging substrate, and a plurality of the fixing pins are respectively inserted into the plurality of grooves.

[0014] Optionally, the connecting assembly further comprises a needle cap, and the top end of the fixing needle passes through the fixing hole on the cover plate to connect to the needle cap.

[0015] Optionally, the fixing needle is spirally connected to the needle cap.

[0016] Optionally, an elastic buffer layer is provided on a surface of the cover plate facing the bottom plate, and the elastic buffer layer contacts the bottom plate and the packaging substrate.

[0017] Due to the adoption of the above technical solution, the present application has the following beneficial effects:

[0018] The first groove provided on the bottom plate cooperates with the bottom plate to fix the packaging substrate together, thereby ensuring stability when detecting the two-dimensional code on the packaging substrate. The accuracy of the coding position on the packaging substrate can be observed through a number of coding through holes provided on the cover plate, and whether the coding position is offset can be detected relatively quickly and conveniently, thereby avoiding the problem of the two-dimensional code on the existing semiconductor packaging substrate offset that affects the semiconductor processing efficiency and product quality, thereby ensuring the semiconductor operation efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a schematic diagram of a jig structure for semiconductor coding according to an embodiment of the utility model;

[0021] Figure 2 A top view of a cover plate according to an embodiment of the utility model;

[0022] Figure 3 This is a top view of the package substrate after being fixed according to the embodiment of the utility model;

[0023] Figure 4 This is a schematic structural diagram of the elastic buffer layer of an embodiment of the utility model;

[0024] Reference numerals:

[0025] 1-bottom plate; 10-first groove;

[0026] 2-cover plate; 20-second groove; 21-coding through hole; 22-fixing hole;

[0027] 3-fixed needle; 31-needle cap;

[0028] 4- packaging substrate; 40- groove;

[0029] 5-Elastic buffer layer. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The main technical problem solved by the utility model is to provide a jig for semiconductor coding, so as to solve the problem of the influence on the semiconductor processing efficiency and product quality caused by the deviation of the two-dimensional code on the packaging substrate of the existing semiconductor.

[0032] See also Figure 1 The utility model provides a jig for semiconductor coding, including:

[0033] The bottom plate 1 is provided with a first groove 10 for limiting the semiconductor packaging substrate 4.

[0034] In some embodiments, the bottom plate 1 is made of stainless steel.

[0035] The cover plate 2 is detachably connected to the bottom plate 1 via a connecting assembly, and is used to cooperate with the bottom plate 1 to fix the packaging substrate 4;

[0036] In some embodiments, the overall shape of the bottom plate 1 and the cover plate 2 is consistent with the shape of the packaging substrate 4 , and both are rectangular.

[0037] Reference Figure 1 and Figure 2 A plurality of coding through holes 21 are provided on the cover plate 2 , and the positions of the coding through holes 21 match the coding positions on the fixed packaging substrate 4 .

[0038] In some embodiments, the number and position of the coding through holes 21 are set according to the standard position (i.e., the preset coding position), and the horizontal offset between the coding through holes 21 and the standard two-dimensional code is ±0.2 mm, that is, the distance difference between the side of the two-dimensional code and the corresponding side of the coding through hole is allowed to be 0.2 mm. If the horizontal offset between the two-dimensional code on the packaging substrate and the coding through hole 21 is within ±0.2 mm, it is confirmed that the two-dimensional code position is not offset, otherwise the two-dimensional code position is offset. After the packaging substrate 4 is fixed on the bottom plate 1, coding can be performed, and after the coding is completed, the coding through hole 21 on the cover plate 2 is used to detect whether the coding position of the two-dimensional code is offset. The detection is simple and efficient, which improves the efficiency of detecting whether the two-dimensional code position is offset.

[0039] In some embodiments, the cover plate 2 may be made of a transparent acrylic material, which makes it easy to observe whether the positions of the QR code and the coding through hole 21 are consistent, and whether the horizontal offset exceeds the preset standard horizontal offset, so as to judge whether the coding position of the QR code is offset. The horizontal offset can be measured by relevant measuring instruments such as a measuring caliper.

[0040] As an optional implementation of the present application, refer to Figure 1 The bottom surface of the cover plate 2 is provided with a second groove 20 for accommodating the packaging substrate 4. The second groove 20 is located above the first groove 10. The bottom area of ​​the first groove 10 and the bottom area of ​​the second groove 20 are both larger than the bottom area of ​​the packaging substrate 4.

[0041] In some embodiments, reference Figure 1 and Figure 3 The bottom shape of the first groove 10 and the second groove 20 is consistent with the bottom shape of the packaging substrate 4, and the bottom areas of the first groove 10 and the second groove 20 are both larger than the bottom area of ​​the packaging substrate 4. After the cover plate 2 is fixed on the base plate 1, it is ensured that the cover plate 2 and the base plate 1 can jointly fix the packaging substrate 4 in the fixed space formed by the first groove 10 and the second groove 20.

[0042] As an optional implementation of the present application, see Figure 1 The connection component includes a plurality of fixing pins 3 vertically fixed on the first groove 10 , and the fixing pins 3 are used to position the packaging substrate 4 .

[0043] In some embodiments of the present application, a plurality of pin holes (not shown in the figure) are provided on the packaging substrate 4, and a plurality of fixing pins 3 respectively pass through the plurality of pin holes to position the packaging substrate 4. Preferably, the packaging substrate 4 is initially positioned through the first groove 10 and the second groove 20, and then the packaging substrate 4 is secondarily positioned through the fixing pins 3 passing through the pin holes on the packaging substrate 4, thereby improving the stability of fixing the packaging substrate 4, ensuring the stability of the position of the packaging substrate, and preventing displacement when detecting the coding position, thereby ensuring the accuracy of detecting the coding position.

[0044] In other embodiments of the present application, refer to Figure 3 , the side of the package substrate 4 is provided with a plurality of grooves 40, which may be semicircular grooves or arc grooves, and a plurality of fixing pins 3 are respectively inserted into the plurality of grooves 40, that is, the sides of the plurality of fixing pins 3 are in close contact with the grooves 40, and the position of the package substrate 4 is limited by the plurality of fixing pins 3, which plays a role of limiting. Here, the number of grooves 40 and fixing pins 3 is the same, and the number of grooves 40 and fixing pins 3 is at least three, the distance between two adjacent grooves 40 is equal, and a fixing pin 3 is inserted into each groove 40.

[0045] As an optional implementation of the present application, see Figure 1 The connecting component also includes a needle cap 31 . The cover plate 2 is provided with a fixing hole 22 for allowing the fixing needle 3 to pass through. The top end of the fixing needle 3 passes through the fixing hole 22 and is connected to the needle cap 31 .

[0046] In some embodiments, the number of fixing needles 3 is 3-5, the number of fixing holes 22 is consistent with the number of fixing needles 3, and each fixing hole 22 matches a fixing needle 3. The outer diameter of the needle cap 31 is larger than the inner diameter of the fixing hole 22, so that after the needle cap 31 is connected to the top of the fixing needle 3, the cover plate 2 can be pressed and fixed.

[0047] As an optional implementation of the present application, the fixing needle 3 is spirally connected to the needle cap 31. The structure is simple, easy to process, and low in cost. In some embodiments, an external thread is provided on the outer side of the top of the fixing needle 3, and an internal thread is provided on the inner side of the needle cap 31, and the external thread matches the internal thread to achieve a spiral detachable connection. It is convenient to fix the packaging substrate 4, and because the fixing needle 3 is spirally connected to the needle cap 31, it is convenient to disassemble and install, and it is convenient to fix the packaging substrate 4 and the subsequent disassembly and assembly.

[0048] As an optional implementation of the present application, see Figure 4 In other embodiments of the present invention, the surface of the cover plate 2 facing the bottom plate 1 is provided with an elastic buffer layer 5, and the elastic buffer layer 5 contacts the bottom plate 1 and the package substrate 4. The elastic buffer layer 5 is provided to avoid crushing the semiconductor package substrate 4 during pressing and fixing, thereby ensuring the integrity of the semiconductor package substrate 4 and the production quality of the semiconductor.

[0049] In some embodiments, the elastic buffer layer can be made of an elastic rubber or elastic silicone layer, and the elastic buffer layer can be in sheet or strip shape and is disposed on the bottom surface where the cover plate 2 contacts the bottom plate or on the inner wall of the second groove 20 .

[0050] In some embodiments, the steps of fixing the semiconductor package substrate by the fixture of the present invention are as follows:

[0051] Put the package substrate 4 into the first groove 10, and pass the fixing pin 3 through the pin hole on the package substrate 4 to fix the package substrate 4 in position;

[0052] The packaging substrate 4 is coded by a machine so that the packaging substrate 4 has a plurality of two-dimensional codes;

[0053] Make the second groove 20 of the cover plate 2 face the packaging substrate 4, so that the fixing needle 3 passes through the fixing hole 22 on the cover plate 2, and then connect the needle cap 31 to the top of the fixing needle 3 to fix the cover plate 2;

[0054] By observing the position of the coding through hole 21 and the two-dimensional code and detecting the horizontal offset through a measuring instrument, it is possible to determine whether the two-dimensional code is offset, retain the semiconductor packaging substrate with the offset two-dimensional code, and allow the semiconductor packaging substrate with no offset two-dimensional code to enter the subsequent assembly line operation, thereby ensuring the production efficiency and quality of the semiconductor.

[0055] In summary, the advantages of the fixture for semiconductor coding of the utility model are:

[0056] The first groove provided on the bottom plate cooperates with the bottom plate to fix the packaging substrate together, thereby ensuring stability when detecting the two-dimensional code on the packaging substrate. The accuracy of the coding position on the packaging substrate can be observed through a number of coding through holes provided on the cover plate, and whether the coding position is offset can be detected relatively quickly and conveniently, thereby avoiding the problem of the two-dimensional code on the existing semiconductor packaging substrate offset that affects the semiconductor processing efficiency and product quality, thereby ensuring the semiconductor operation efficiency and product quality.

[0057] It should be noted that, in this article, terms such as "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A jig for semiconductor coding, characterized in that: include: A bottom plate, wherein a first groove for limiting a semiconductor packaging substrate is provided on the bottom plate; A cover plate, the cover plate is detachably connected to the bottom plate via a connecting assembly, and is used to cooperate with the bottom plate to fix the packaging substrate together; The cover plate is provided with a plurality of coding through holes, and the positions of the coding through holes match the positions of the coding on the fixed packaging substrate.

2. The jig for semiconductor coding as claimed in claim 1, characterized in that: The bottom surface of the cover plate is provided with a second groove for accommodating the packaging substrate, the second groove is located above the first groove, and the bottom area of ​​the first groove and the bottom area of ​​the second groove are both larger than the bottom surface area of ​​the packaging substrate.

3. The jig for semiconductor coding as claimed in claim 1, characterized in that: The connection component includes a plurality of fixing pins vertically fixed on the first groove, and the fixing pins are used to position the packaging substrate.

4. The jig for semiconductor coding as claimed in claim 3, characterized in that: A plurality of pin holes are arranged on the packaging substrate, and a plurality of fixing pins respectively pass through the plurality of pin holes to position the packaging substrate.

5. The jig for semiconductor coding as claimed in claim 3, characterized in that: A plurality of grooves are arranged on the side of the packaging substrate, and a plurality of the fixing pins are respectively inserted into the plurality of the grooves.

6. The jig for semiconductor coding as claimed in claim 3, characterized in that: The connecting assembly also includes a needle cap, and the top end of the fixing needle passes through the fixing hole on the cover plate and is connected to the needle cap.

7. The jig for semiconductor coding as claimed in claim 6, characterized in that: The fixing needle is spirally connected to the needle cap.

8. The jig for semiconductor coding as claimed in claim 1, characterized in that: An elastic buffer layer is disposed on the surface of the cover plate facing the bottom plate, and the elastic buffer layer contacts the bottom plate and the packaging substrate.

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