Ion exchange membrane fixing device and electroplating equipment

Abstract

The utility model provides an ion exchange membrane fixing device and electroplating equipment. The ion exchange membrane fixing device comprises a fixed part, a rotating part and a supporting shaft, wherein the fixing part is used for fixing the ion exchange membrane; the support shaft has a first end and a second end; the first end is connected with the fixing part; and the second end is connected with the rotating part and used for driving the rotating part to rotate. According to the ion exchange membrane fixing device, the distribution characteristic of an electroplating liquid flow field on the surface of a wafer can be improved, so that the membrane thickness uniformity and the resistance distribution uniformity of a plating layer on the surface of the wafer are enhanced, the performance of an ion exchange membrane is improved, and the service life of the ion exchange membrane is prolonged.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an ion exchange membrane fixing device and electroplating equipment. Background Art

[0002] In the semiconductor manufacturing process, the electroplating process refers to the process of electroplating metal ions in the electroplating solution onto the surface of the wafer to form metal interconnects. For example, the copper electroplating process is based on the oxidation reaction of the anode copper surface to generate copper ions (Cu 2+ ) and electrons, and a reduction reaction occurs on the wafer surface serving as the cathode to consume copper ions; utilizing the concentration difference, copper ions are directionally transported from the anode to the cathode to replenish the copper ion loss near the cathode, thereby forming a copper interconnect structure on the wafer surface.

[0003] However, with the current electroplating process, the uniformity of the film thickness of the coating on the wafer surface needs to be further improved.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0005] Based on this, the embodiment of the present application provides an ion exchange membrane fixing device and electroplating equipment, which can improve the distribution characteristics of the electroplating liquid flow field on the wafer surface, thereby enhancing the film thickness uniformity and resistance distribution uniformity of the wafer surface coating, and improving the performance and service life of the ion exchange membrane.

[0006] According to some embodiments, the present application provides an ion exchange membrane fixing device, including a fixing component, a rotating component and a support shaft; wherein,

[0007] The fixing component is used to fix the ion exchange membrane;

[0008] The support shaft has a first end and a second end; the first end is connected to the fixed component; the second end is connected to the rotating component for driving the rotating component to rotate.

[0009] In some embodiments, the rotating component comprises:

[0010] A first sleeve sleeve, sleeved on the outer side of the second end of the support shaft;

[0011] A plurality of first blades; one end of each of the first blades is fixedly disposed on the outer periphery of the first sleeve, and the plurality of first blades are evenly spaced and distributed along the circumference of the first sleeve;

[0012] The first outer circular ring is configured as follows: the other end of each of the first blades is fixedly disposed on the first outer circular ring.

[0013] In some embodiments, the first sleeve, the first outer ring and the first blades are integrally formed.

[0014] In some embodiments, the fixing member comprises:

[0015] A second sleeve sleeve is sleeved on the outer side of the first end of the support shaft;

[0016] A plurality of second blades; one end of each of the second blades is fixedly disposed on the outer periphery of the second sleeve tube, and the plurality of second blades are evenly spaced and distributed along the circumference of the second sleeve tube;

[0017] The second outer circular ring is configured as follows: the other end of each of the second fan blades is fixedly disposed on the second outer circular ring.

[0018] In some embodiments, the second sleeve, the second outer ring and the plurality of second blades are integrally formed.

[0019] In some embodiments, the first end and the second end of the support shaft have the same shape and size, and the first blade and the second blade have the same shape and number.

[0020] In some embodiments, the support shaft is hollow inside.

[0021] In some embodiments, a flow regulating structure is installed inside the support shaft;

[0022] The flow regulating structure is used to regulate the internal flow of the support shaft, and includes a plurality of liquid holes; the plurality of liquid holes are evenly distributed in a concentric circle manner on the plane where the flow regulating structure is located, and the apertures of the liquid holes are gradually increased outward from the center of the plane where the flow regulating structure is located.

[0023] In some embodiments, the first blade includes: a first portion connected to the outer periphery of the first sleeve and extending radially of the first sleeve, and a second portion bent from an end of the first portion toward one side of the first blade.

[0024] According to some embodiments, the present application also provides an electroplating device, including:

[0025] The ion exchange membrane fixing device as described in some of the above embodiments;

[0026] An ion exchange membrane, fixed to a fixing component of the ion exchange membrane fixing device, for isolating an anode plating solution and a cathode plating solution in the electroplating equipment;

[0027] Wherein, the ion exchange membrane fixing device and the cathode plating solution are located on the same side of the ion exchange membrane.

[0028] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

[0029] The embodiments of the present application may or at least have the following advantages:

[0030] In an embodiment of the present application, the ion exchange membrane fixing device includes a fixed component, a rotating component and a support shaft. Among them, the fixed component is used to fix the ion exchange membrane, and the support shaft is used to connect the fixed component and the rotating component, and can drive the rotating component to rotate. The rotating component can rotate under the drive of the support shaft, thereby enhancing the mass transfer rate of the plating solution to improve the distribution characteristics of the plating solution flow field on the wafer surface. Improving the distribution characteristics of the plating solution flow field can enhance the uniformity of the film thickness of the coating on the wafer surface, avoid the problem of bulges, and help to make the surface resistance of the wafer uniformly distributed. In addition, improving the distribution characteristics of the plating solution flow field can make the metal ion concentration distributed in the plating solution flow field more uniform, and at the same time can also take away the heat generated during the electroplating process, avoid the problem of local overheating causing the ion exchange membrane to rupture, and thus improve the performance and service life of the ion exchange membrane. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0032] Figure 1 A schematic diagram of the three-dimensional structure of an ion exchange membrane fixing device provided in some embodiments of the present application;

[0033] Figure 2 A schematic top view of a rotating component in an ion exchange membrane fixing device provided in some embodiments of the present application when rotating;

[0034] Figure 3 A schematic cross-sectional view of an electroplating chamber in an electroplating device provided in some embodiments of the present application.

[0035] Description of reference numerals:

[0036] 10. Fixed component; 20. Rotating component; 30. Support shaft; 201. First sleeve; 202. First fan blade; 203. First outer ring; 101. Second sleeve; 102. Second fan blade; 103. Second outer ring;

[0037] 1. Anode; 2. Ion exchange membrane; 3. Ion exchange membrane fixing device; 4. Diffuser plate. DETAILED DESCRIPTION

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0040] It should be understood that when an element or layer is referred to as being "on" or "connected to," it may be directly on or connected to other elements or layers, or there may be intervening elements or layers. It should be understood that although the terms first, second, etc. may be used to describe various elements, components, and / or parts, these elements, components, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, and / or part from another element, component, and / or part. Therefore, without departing from the teachings of the present application, the first element, component, and / or part discussed below may be represented as a second element, component, and / or part; for example, a first blade may be referred to as a second blade, and similarly, a second blade may be referred to as a first blade.

[0041] Spatial relational terms such as "on..." may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatial relational terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "on..." will be oriented "below" the other elements or features. Therefore, the exemplary term "on..." may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0042] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0043] It should also be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present disclosure in a schematic manner. Although the illustrations only show components related to the present disclosure and are not drawn according to the number, shape and size of components in actual implementation, the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout type may also be more complicated.

[0044] In the semiconductor manufacturing process, the electroplating process refers to the process of electroplating metal ions in the electroplating solution onto the surface of the wafer to form metal interconnects. For example, the copper electroplating process is based on the oxidation reaction of the anode copper surface to generate copper ions (Cu 2+ ) and electrons, and a reduction reaction occurs on the wafer surface as the cathode to consume copper ions; using the concentration difference, copper ions are transported from the anode to the cathode in a direction to replenish the copper ion loss near the cathode, thereby forming a copper interconnect structure on the wafer surface. However, the current electroplating process still needs to further improve the uniformity of the film thickness of the wafer surface coating.

[0045] In view of the shortcomings of the above-mentioned related technologies, the present application provides an ion exchange membrane fixing device and electroplating equipment, which can improve the distribution characteristics of the electroplating liquid flow field on the wafer surface, thereby enhancing the uniformity of the film thickness and resistance distribution of the wafer surface coating, and improving the performance and service life of the ion exchange membrane. The details will be described in the subsequent embodiments.

[0046] According to some embodiments, the present application provides an ion exchange membrane fixing device. Figure 1 The ion exchange membrane fixing device may specifically include a fixing component 10 , a rotating component 20 and a supporting shaft 30 .

[0047] The fixing part 10 is used to fix the ion exchange membrane; the support shaft 30 has a first end and a second end; the first end is connected to the fixing part 10; the second end is connected to the rotating part 20, and can be used to drive the rotating part 20 to rotate. Figure 2 shown.

[0048] The ion exchange membrane fixing device provided in the above embodiment includes a fixing component 10, a rotating component 20 and a supporting shaft 30; wherein the fixing component 10 is used to fix the ion exchange membrane, and the supporting shaft 30 is used to connect the fixing component 10 and the rotating component 20, and can drive the rotating component 20 to rotate. The rotating component 20 can rotate under the drive of the supporting shaft 30, thereby enhancing the mass transfer rate of the plating solution, making the metal ion concentration distributed in the plating solution flow field on the wafer surface more uniform, thereby improving the distribution characteristics of the plating solution flow field on the wafer surface.

[0049] It can be understood that improving the flow field distribution characteristics of the plating solution can enhance the uniformity of the film thickness of the wafer surface coating, avoid the problem of bulges, and help to make the surface resistance of the wafer evenly distributed. In addition, improving the flow field distribution characteristics of the plating solution can make the concentration of metal ions distributed in the plating solution flow field more uniform, and at the same time can take away the heat generated during the electroplating process, avoiding local overheating problems that lead to rupture of the ion exchange membrane, thereby improving the performance and service life of the ion exchange membrane.

[0050] It is understood that the embodiment of the present application does not specifically limit the rotation direction of the rotating component 20. As an example, the rotating component 20 can rotate counterclockwise.

[0051] Please continue reading Figure 1 and Figure 2 In some embodiments, the rotating component 20 may specifically include a first sleeve 201 , a first outer ring 203 , and a plurality of first blades 202 .

[0052] The first sleeve 201 is sleeved on the outer side of the second end of the support shaft 30; among the plurality of first blades 202, each first blade 202 can be fixedly disposed on the outer periphery of the first sleeve 201 at one end, and the other end can be fixedly disposed on the first outer ring 203. In other words, the rotating component 20 is configured as a rotatable roller.

[0053] As an example, Figure 1 and Figure 2 As shown, the plurality of first blades 202 may be evenly spaced and distributed along the circumference of the first sleeve 201 .

[0054] Please continue reading Figure 1 In some embodiments, the first sleeve 201, the first outer ring 203 and the plurality of first blades 202 may be integrally formed.

[0055] Please continue reading Figure 1 In some embodiments, the fixing component 10 may specifically include a second sleeve 101 , a second outer ring 103 and a plurality of second blades 102 .

[0056] The second sleeve 101 is sleeved on the outer side of the first end of the support shaft 30; among the plurality of second blades 102, each second blade 102 can be fixedly disposed on the outer periphery of the second sleeve 101 at one end, and fixedly disposed on the second outer ring 103 at the other end. In other words, the fixing component 10 is configured as a fixing roller.

[0057] As an example, Figure 1 As shown, the plurality of second blades 102 may be evenly spaced and distributed along the circumference of the second sleeve 101 .

[0058] Please continue reading Figure 1 In some embodiments, the second sleeve 101, the second outer ring 103 and the plurality of second blades 102 may be integrally formed.

[0059] In some embodiments, the first end and the second end of the support shaft 30 may have the same shape and size, and the first blade 202 and the second blade 102 may also have the same shape and number.

[0060] That is, the fixing part 10 and the rotating part 20 can be parts of the same shape. In this way, the support shaft 30 can be subjected to a more uniform force during the rotation of the rotating part 20, which is conducive to stabilizing the overall force of the ion exchange membrane fixing device.

[0061] In some embodiments, the support shaft 30 is hollow inside.

[0062] In some embodiments, a flow regulating structure may be installed inside the support shaft 30 to regulate the flow inside the support shaft 30 .

[0063] The embodiment of the present application does not specifically limit the form of the flow regulating structure. As an example, the flow regulating structure may include but is not limited to a center cap.

[0064] As an example, the flow regulating structure may specifically include a plurality of liquid passage holes.

[0065] The embodiment of the present application does not specifically limit the aperture of the liquid hole in the flow regulating structure. As an example, the aperture of the liquid hole can range from 0.6 mm to 1.0 mm; for example, the aperture of the liquid hole can be 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1.0 mm, etc.

[0066] In some embodiments, the plurality of liquid holes may be evenly distributed on the plane where the flow regulating structure is located in a concentric circle manner, and the apertures of the liquid holes may be gradually increased from the center of the plane where the flow regulating structure is located outward. For example, among the plurality of liquid holes, the innermost circle of liquid holes may be liquid holes with an aperture of 0.6 mm, and the outermost circle of liquid holes may be liquid holes with an aperture of 1.0 mm.

[0067] When using the traditional electroplating process, the flow field in the center area of ​​the wafer is relatively unstable compared to the flow field in other areas, resulting in the coating thickness in the center area of ​​the wafer being prone to bulges; the end effect of the flow field in the edge area of ​​the wafer is more obvious, resulting in a faster deposition rate of the coating in the edge area of ​​the wafer and a larger film thickness. However, in the ion exchange membrane fixing device provided in the above embodiment, liquid holes with different apertures can be provided in the flow regulating structure to help redistribute the flow field in the center area of ​​the wafer, avoid the formation of bulges, and further improve the uniformity of the film thickness of the coating on the surface of the wafer.

[0068] In some embodiments, the first blade 202 may specifically include: a first portion connected to the outer periphery of the first sleeve 201 and extending along the radial direction of the first sleeve 201, and a second portion bent from the end of the first portion toward one side of the first blade 202. Exemplarily, the second portion on each first blade 202 is bent toward the same side of the corresponding first blade 202.

[0069] As an example, the junction between the first portion and the second portion on each first blade 202 may be located on the same circumference.

[0070] In some embodiments, the second blade 102 may specifically include: a third portion connected to the outer periphery of the second sleeve 101 and extending along the radial direction of the second sleeve 101, and a fourth portion bent from the end of the third portion toward one side of the second blade 102. Exemplarily, the fourth portion on each second blade 102 is bent toward the same side of the corresponding second blade 102.

[0071] As an example, the connection between the third portion and the fourth portion on each second blade 102 may also be located on the same circumference.

[0072] According to some embodiments, the present application also provides an electroplating device, which may specifically include: an ion exchange membrane fixing device as provided in some of the above embodiments, and an ion exchange membrane.

[0073] The ion exchange membrane can be fixed on the fixing component 10 of the above-mentioned ion exchange membrane fixing device, and is used to isolate the anode plating solution and the cathode plating solution in the electroplating equipment.

[0074] It should be noted that in the embodiment of the present application, the ion exchange membrane fixing device and the cathode plating solution should be located on the same side of the ion exchange membrane. In this case, the ion exchange membrane can also be called a cation exchange membrane.

[0075] The electroplating equipment provided in the above embodiment includes the ion exchange membrane fixing device provided in the above embodiment. Therefore, the technical effects that can be achieved by the above ion exchange membrane fixing device can also be achieved by the above electroplating equipment.

[0076] For ease of description, the following definition is that the ion exchange membrane fixing device isolates the anode plating solution in the electroplating equipment on its outside (also referred to as the anode region), and the cathode plating solution is located on its inside (also referred to as the cathode region). Thus, in the electroplating equipment provided in the above embodiment, the ion exchange membrane is fixed on the outside of the ion exchange membrane fixing device, which can isolate the anode plating solution from the cathode plating solution on the one hand, thereby avoiding cross contamination between the two; on the other hand, it can also transport metal ions to the cathode region through the metal ion concentration difference.

[0077] As an example, the ion exchange membrane fixing device and the ion exchange membrane described above may both be disposed in the electroplating chamber of the electroplating equipment.

[0078] Figure 3 Schematic cross-sectional view of an electroplating chamber in an electroplating device provided in some embodiments. Figure 3 As shown, the electroplating chamber may be provided with an anode 1, an ion exchange membrane 2 (also called a cation exchange membrane), an ion exchange membrane fixing device 3 and a diffusion plate 4 from bottom to top. The ion exchange membrane 2 may be fixedly arranged on the lower wall of the ion exchange membrane fixing device 3.

[0079] It can be understood that in the aforementioned ion exchange membrane fixing device 3, the fixing component 10 can be at least partially immersed in the plating solution, so as to fix the ion exchange membrane to prevent additives in the plating solution from entering the cathode area and causing adverse effects on the quality of the wafer surface coating.

[0080] It should be noted that Figure 3 Only the relative position relationship between the anode 1, the ion exchange membrane 2, the ion exchange membrane fixing device 3 and the diffusion plate 4 in the electroplating chamber is shown. Other necessary elements or components may also be arranged in the electroplating chamber, which is not specifically limited in the embodiment of the present application.

[0081] The copper electroplating process is used as an example for explanation below.

[0082] During the copper electroplating process, copper sulfate (CuSO4) plating solution enters the cavity from the bottom of the plating cavity and fills the entire plating cavity. When the copper sulfate plating solution contacts the wafer, a laminar flow is formed, and the presence of the laminar flow leads to the generation of an interface layer between the plating solution and the wafer. It can be understood that the embodiment of the present application provides an ion exchange membrane fixing device 3, wherein the rotation speed of the rotating component 20 affects the thickness of the interface layer between the wafer and the plating solution, thereby affecting the diffusion movement of copper ions.

[0083] That is to say, the ion exchange membrane fixing device 3 can affect the redistribution of the electroplating liquid flow field, wherein the rotating component 20 rotates on a fixed axis to enhance the fluid flow on the wafer surface, thereby reducing the impact of the unbalanced electroplating rate between the inner and outer circles of the wafer, and effectively improving the uniformity of the coating film thickness on the wafer surface.

[0084] In the electroplating apparatus, the anode 1 can be separated from the wafer by an ionic resistance element, but it is not limited to this. As an example, the ionic resistance element can be regarded as an almost constant and uniform current source near the wafer (cathode). Therefore, in some cases, it can be called a high-resistance virtual anode (HRVA), such as Figure 3 shown.

[0085] It should be noted that the ion exchange membrane fixing devices in the embodiments of the present application can be arranged in the corresponding electroplating equipment. Therefore, the technical features between the device embodiments and the equipment embodiments can be replaced and supplemented with each other without causing conflicts, so that technical personnel in this field can understand the technical content of the present application.

[0086] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An ion exchange membrane fixing device, characterized in that: It includes a fixed part, a rotating part and a supporting shaft; wherein, The fixing component is used to fix the ion exchange membrane; The support shaft has a first end and a second end; the first end is connected to the fixed component; the second end is connected to the rotating component for driving the rotating component to rotate.

2. The ion exchange membrane fixing device according to claim 1, characterized in that: The rotating component comprises: A first sleeve sleeve, sleeved on the outer side of the second end of the support shaft; A plurality of first blades; one end of each of the first blades is fixedly disposed on the outer periphery of the first sleeve, and the plurality of first blades are evenly spaced and distributed along the circumference of the first sleeve; The first outer circular ring is configured as follows: the other end of each of the first blades is fixedly disposed on the first outer circular ring.

3. The ion exchange membrane fixing device according to claim 2, characterized in that: The first sleeve, the first outer ring and the first blades are integrally arranged.

4. The ion exchange membrane fixing device according to claim 2, characterized in that: The fixing member comprises: A second sleeve sleeve is sleeved on the outer side of the first end of the support shaft; A plurality of second blades; one end of each of the second blades is fixedly disposed on the outer periphery of the second sleeve tube, and the plurality of second blades are evenly spaced and distributed along the circumference of the second sleeve tube; The second outer circular ring is configured as follows: the other end of each of the second fan blades is fixedly disposed on the second outer circular ring.

5. The ion exchange membrane fixing device according to claim 4, characterized in that: The second sleeve, the second outer ring and the plurality of second blades are integrally arranged.

6. The ion exchange membrane fixing device according to claim 4, characterized in that: The first end and the second end of the support shaft have the same shape and size, and the first blade and the second blade have the same shape and number.

7. The ion exchange membrane fixing device according to claim 1, characterized in that: The support shaft is hollow inside.

8. The ion exchange membrane fixing device according to claim 6, characterized in that: A flow regulating structure is installed inside the support shaft; The flow regulating structure is used to regulate the internal flow of the support shaft, and includes a plurality of liquid holes; the plurality of liquid holes are evenly distributed in a concentric circle manner on the plane where the flow regulating structure is located, and the apertures of the liquid holes are gradually increased outward from the center of the plane where the flow regulating structure is located.

9. The ion exchange membrane fixing device according to claim 2, characterized in that: The first blade includes: a first portion connected to the outer periphery of the first sleeve and extending along the radial direction of the first sleeve, and a second portion bent from the end of the first portion toward one side of the first blade.

10. An electroplating device, characterized in that: include: The ion exchange membrane fixing device according to any one of claims 1 to 9; An ion exchange membrane, fixed to a fixing component of the ion exchange membrane fixing device, for isolating an anode plating solution and a cathode plating solution in the electroplating equipment; Wherein, the ion exchange membrane fixing device and the cathode plating solution are located on the same side of the ion exchange membrane.

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