Temperature sensor assembly

Abstract

The utility model discloses a temperature sensor assembly, which comprises a disc surface, and further comprises a first installation assembly, the first installation assembly comprises threaded plates installed on the periphery of the disc surface in an array mode, the surfaces of the threaded plates are provided with threaded holes, and bolts are installed in the threaded holes in an inserted mode; the second mounting assembly comprises an L-shaped plate mounted on one side of the disc surface, a threaded groove is formed in the outward extending part of the L-shaped plate, and a screw is mounted in the threaded groove; the third installation assembly comprises a rod piece installed on one side of the disc face, and a suction cup is installed on one side of the rod piece. According to the utility model, through the arrangement of the annular first installation assembly, for the annular installation unit, the annular installation effect is realized through the mode of butt joint installation of the threaded holes and the bolts in the threaded plate. For a support type to-be-detected device, an L-shaped plate is arranged to be hung on the side edge of the device, and connection and fixation are achieved in the mode that a screw penetrates through a threaded groove. Suspended to-be-detected equipment is fixedly installed in a suction mode through the suction cups arranged at the tops of the rod pieces.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature sensors, in particular to a temperature sensor component. Background Art

[0002] Temperature sensor components are important electronic components used to measure temperature and convert it into a processable electrical signal. In many applications, such as industrial control, medical equipment, environmental monitoring and automatic control systems, temperature sensor components play a vital role. Temperature sensor components usually consist of two parts: a sensitive element and a conversion circuit. The sensitive element is responsible for sensing the external temperature, while the conversion circuit converts the electrical signal output by the sensitive element into a processable digital or analog signal. According to different working principles, temperature sensors can be divided into thermocouples, thermistors, integrated temperature sensors and other types. Thermocouples are a common temperature sensor, and their working principle is based on the Seebeck effect, that is, when two conductors of different materials come into contact, an electromotive force is generated, and the magnitude of the electromotive force is related to the temperature of the contact point. Thermistors use the property that the resistance of semiconductors changes with temperature to measure temperature. Its advantages are fast response speed and high sensitivity, but poor long-term stability. Integrated temperature sensors integrate temperature sensors and signal processing circuits on a chip, with the advantages of small size, high accuracy, and good linearity. When selecting temperature sensor components, it is necessary to consider parameters such as sensor type, measurement range, accuracy, stability, and response speed according to actual needs. At the same time, it is also necessary to pay attention to factors such as the sensor's installation method, connection method, and compatibility with the measurement system. In short, temperature sensor components are one of the indispensable and important components in modern industry and science and technology. With the continuous development of technology, the performance and accuracy of temperature sensor components are also constantly improving, providing more reliable and accurate temperature measurement solutions for various applications.

[0003] A Chinese invention patent with application number CN111458052B discloses a color-changing OLED temperature sensor assembly, which includes: a color-changing OLED device and an external electric drive; the color-changing OLED device includes a substrate, an encapsulation layer, a first and a second electrode between the substrate and the encapsulation layer, a first and a second light-emitting layer between the two electrodes, and the light emitted respectively has a first and a second intrinsic peak wavelength that differs by at least 30nm; the color-changing OLED device operates at a first and a second temperature to emit light of a first and a second color, respectively, and has a first color coordinate point (u1, v1) and a second color coordinate point (u2, v2) on the CIE 1976 color coordinate diagram, and the duv value between the two color coordinate points is greater than 0.006; the external electric drive provides a constant current density for the color-changing OLED device. The assembly uses the characteristic that the color of the light emitted by the color-changing OLED device changes with the temperature when driven by a constant current density, thereby determining the temperature of the detected object or the surrounding environment.

[0004] However, since temperature sensors often need to be installed at different working locations, and the temperature sensors in the prior art have a single installation method, the temperature sensors in the prior art cannot be adapted to be installed on the surface of equipment under different working conditions. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a temperature sensor component.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A temperature sensor assembly includes a disk and further includes:

[0008] A first mounting assembly, the first mounting assembly includes a threaded plate array mounted on the periphery of the disk surface, the surface of the threaded plate is provided with threaded holes, and bolts are inserted and installed inside the threaded holes;

[0009] A second mounting assembly, the second mounting assembly comprises an L-plate mounted on one side of the disk surface, a thread groove is provided at an outwardly extending portion of the L-plate, and a screw is installed inside the thread groove;

[0010] The third installation component includes a rod installed on one side of the disk surface, and a suction cup is installed on one side of the rod.

[0011] Further technical solutions include:

[0012] The first measuring component comprises a chip controller installed on one side of the disk surface, a telescopic rod is connected to one side of the chip controller, a probe is arranged at one end of the telescopic rod, and a limit rod is arranged on one side of the telescopic rod.

[0013] Further technical solutions include:

[0014] The second measuring component includes sensing sheets arranged on both sides of the disk surface.

[0015] According to a further technical solution, the structure of the sensor sheet is a semicircular patch structure.

[0016] According to a further technical solution, one side of the disk is provided with a rounded corner.

[0017] According to a further technical solution, one side of the disk is connected to the chip controller via a wire.

[0018] Compared with the prior art, the present invention provides a temperature sensor assembly having the following beneficial effects:

[0019] By setting up a first annular mounting component, the annular mounting unit can achieve an annular mounting effect by connecting and mounting the threaded holes on the threaded plate with bolts. For the bracket-type equipment to be tested, we set an L-plate to hang on the side of the equipment, and connect and fix it by screwing it through the threaded groove; for the hanging equipment to be tested, we fix it by adsorbing it with a suction cup set on the top of the rod. This device achieves a multifunctional adaptive installation effect, and specifically solves the problems existing in the prior art.

[0020] By setting up a semicircular sensing sheet device, the effect of stick-type sensing measurement of the planar heat dissipation equipment is achieved; and the second measuring component set at the end of the telescopic rod achieves the effect of depth detection, that is, the device achieves a multifunctional detection effect and avoids the technical problem of inaccurate detection caused by a single detection unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a structural schematic diagram of a temperature sensor assembly proposed by the utility model;

[0022] Figure 2 This is a structural schematic diagram of an installation assembly of a temperature sensor assembly proposed by the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of a top view of a temperature sensor assembly proposed by the utility model;

[0024] Figure 4 This is a structural schematic diagram of a bottom view of a temperature sensor assembly proposed by the utility model.

[0025] In the figure:

[0026] 1. Disk surface; 2. Fillet; 3. First mounting assembly; 4. Second mounting assembly; 5. Third mounting assembly; 6. First measuring assembly; 7. Second measuring assembly; 8. Threaded plate; 9. Threaded hole; 10. Bolt; 11. L-plate; 12. Threaded groove; 13. Screw; 14. Rod; 15. Suction cup; 16. Induction sheet; 17. Telescopic rod; 18. Probe; 19. Limit rod; 20. Chip controller; 21. Wire. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Example

[0028] Reference Figure 1 - Figure 4A temperature sensor assembly includes a disk 1, which is a base component on which the temperature sensor is installed, and further includes:

[0029] The first installation component 3 includes a threaded plate 8 installed in an array around the disk surface 1. The annular threaded plate 8 realizes the docking installation of the annular device through threaded holes 9 and bolts 10. The surface of the threaded plate 8 is provided with threaded holes 9, and the inside of the threaded holes 9 is plugged and installed with bolts 10;

[0030] The second installation component 4 includes an L-plate 11 installed on one side of the disk surface 1. The L-plate 11 has an adaptable docking installation effect for the bracket-type extended device. Its connection method is also a screw 13 threaded connection method. The thread groove 12 increases the installation range. The extended part of the L-plate 11 is provided with a thread groove 12, and the screw 13 is installed inside the thread groove 12;

[0031] The third mounting assembly 5 comprises a rod 14 mounted on one side of the disk surface 1 , and a suction cup 15 at the end of the rod 14 is used to be adsorbed on the surface of the hanging device. A suction cup 15 is mounted on one side of the rod 14 .

[0032] A temperature sensor assembly further comprising:

[0033] The first measuring component 6 includes a chip controller 20 installed on one side of the disk surface 1, which is used to convert temperature data into measurement data; a telescopic rod 17 is installed on one side of the chip controller 20, and a probe 18 at the end of the telescopic rod 17 is used for depth detection. The probe 18 is provided at one end of the telescopic rod 17, and a limit rod 19 is provided on one side of the telescopic rod 17.

[0034] A temperature sensor assembly further comprising:

[0035] The second measuring component 7 includes sensing sheets 16 arranged on both sides of the disk surface 1. The sensing sheets 16 are used for temperature detection of the planar device.

[0036] A temperature sensor assembly, wherein the structure of the sensing piece 16 is a semicircular patch structure, and the semicircular structure has a larger temperature sensing area.

[0037] A temperature sensor assembly, wherein a rounded corner 2 is arranged on one side of a disk surface 1 to prevent an operator from being cut.

[0038] A temperature sensor assembly, one side of a disk surface 1 is connected to a chip controller 20 via a wire 21, and the wire 21 is a component of an external power supply.

[0039] In the actual application of this device, in order to avoid the following defects existing in the prior art: since the temperature sensor often needs to be installed in different working parts, and the installation method of the temperature sensor in the prior art is single, the temperature sensor in the prior art cannot be adapted to be installed on the surface of the equipment under different working conditions. A multifunctional installation component and detection component are specifically proposed:

[0040] The annular first mounting assembly 3 provided in the utility model realizes the effect of annular mounting by docking the threaded hole 9 on the threaded plate 8 and the bolt 10 for the annular mounting unit. For the bracket-type equipment to be tested, we set an L plate 11 to hang on the side of the equipment, and connect and fix it by screws 13 passing through the threaded groove 12; for the hanging equipment to be tested, we realize fixed installation by adsorption of the suction cup 15 provided on the top of the rod 14. The device realizes the effect of multifunctional adaptive installation and solves the problems existing in the prior art in a targeted manner.

[0041] The present invention uses a novel arrangement of semicircular sensing sheets 16 to achieve the effect of stick-on sensing measurement of planar heat dissipation equipment; and the probe 18 of the second measuring assembly 7 arranged at the end of the telescopic rod 17 achieves the effect of depth detection, that is, the present device achieves a multifunctional detection effect and avoids the technical problem of inaccurate detection caused by a single detection unit.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A temperature sensor assembly, comprising a disk (1), characterized in that: Also includes: A first mounting assembly (3), the first mounting assembly (3) comprising a threaded plate (8) mounted in an array on the periphery of the disk surface (1), the surface of the threaded plate (8) being provided with threaded holes (9), the interior of the threaded holes (9) being plugged and mounted with bolts (10); A second mounting assembly (4), the second mounting assembly (4) comprising an L-plate (11) mounted on one side of the disk surface (1), a threaded groove (12) being provided at an outwardly extending portion of the L-plate (11), and a screw (13) being installed inside the threaded groove (12); A third mounting assembly (5), the third mounting assembly (5) comprising a rod (14) mounted on one side of the disk surface (1), a suction cup (15) being mounted on one side of the rod (14).

2. A temperature sensor assembly according to claim 1, characterized in that: Also includes: A first measuring component (6), the first measuring component (6) comprising a chip controller (20) mounted on one side of the disk surface (1), a telescopic rod (17) being mounted on one side of the chip controller (20), a probe (18) being disposed at one end of the telescopic rod (17), and a limit rod (19) being disposed on one side of the telescopic rod (17).

3. A temperature sensor assembly according to claim 2, characterized in that: Also includes: A second measuring component (7), wherein the second measuring component (7) comprises sensing sheets (16) arranged on both sides of the disk surface (1).

4. A temperature sensor assembly according to claim 3, characterized in that: The structure of the induction sheet (16) is a semicircular patch structure.

5. A temperature sensor assembly according to claim 1, characterized in that: One side of the disk surface (1) is provided with a rounded corner (2).

6. A temperature sensor assembly according to claim 2, characterized in that: One side of the disk surface (1) is connected to the chip controller (20) via a wire (21).

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