Thermal shock performance testing system

Abstract

The utility model relates to a thermal shock performance test system, which is used for testing the thermal shock stability of a sensing element of a gas sensor, and comprises a plurality of mounting supports, an electronic element plug connector, an electrochemical analyzer, a heat supply stabilized voltage supply, a first moving device, a liquid dropping device and a controller, the plurality of mounting supports are mounted on the test board along a first direction; the electronic element plug connector is mounted in the mounting hole of the mounting support; a sensing element of the gas sensor to be tested is inserted into the first end of the electronic element connector; the electrochemical analyzer and the heat supply voltage-stabilized power supply are connected with the second end of the electronic element plug connector through a cable; the first moving device is mounted on the test board along a first direction; the liquid dropping device is movably connected with the first moving device; a liquid outlet of the liquid dropping device is positioned above a sensing element of the gas sensor to be tested; the controller is installed on the test bench. And the controller is in communication connection with the electrochemical analyzer, the heat supply stabilized voltage supply, the first moving device and the liquid dropping device.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device testing, and in particular to a thermal shock performance testing system. Background Art

[0002] Fuel vehicles use gas sensors to detect exhaust gas in the exhaust pipe in real time and adjust the engine air-fuel ratio through a feedback system. The temperature of the sensing part of the gas sensor is as high as 850°C when it is working. When the car is cold started, a small amount of condensed water may be generated in the exhaust pipe. At this time, the water droplets will rapidly cool the sensor ceramic chip at high temperature, causing it to crack due to thermal stress.

[0003] The thermal shock test is used to detect the stability and reliability of the thermal shock protection layer structure in the rapidly changing temperature. At present, the thermal shock test of the thermal shock protection layer adopts the method of heating the chip in a heating furnace and keeping it warm, and then quickly quenching it with water after taking it out, and whether cracks appear on the macroscopic surface of the chip is used as the basis for thermal shock damage. Although this method has simple equipment, it is complicated to operate, time-consuming and labor-intensive, and the experimental results are greatly affected by human factors and have low repeatability. Due to the use of macroscopic observation, the results can only be used as the basis for qualitative analysis, and cannot quantitatively analyze the thermal shock stability of the chip. Summary of the invention

[0004] Based on this, it is necessary to provide a thermal shock performance testing system for analyzing the thermal shock stability of the thermal shock protection layer of the gas sensor under elevated temperature and high temperature conditions.

[0005] The present application provides a thermal shock performance testing system, which is used to test the thermal shock stability of a gas sensor sensing element. The thermal shock performance testing system includes:

[0006] A plurality of mounting supports, wherein the plurality of mounting supports are mounted on the test bench along a first direction; mounting holes are provided on the mounting supports;

[0007] An electronic component connector, the electronic component connector is installed in the mounting hole of the mounting support; the sensing element of the gas sensor to be tested is plugged into the first end of the electronic component connector;

[0008] An electrochemical analyzer, the electrochemical analyzer is connected to the second end of the electronic component connector via a cable;

[0009] A heat-supplying voltage-stabilizing power supply, wherein the heat-supplying voltage-stabilizing power supply is connected to the second end of the electronic component connector via a cable;

[0010] a first moving device, the first moving device being mounted on the test bench along a first direction;

[0011] A liquid dripping device, the liquid dripping device is movably connected to the first moving device; the liquid outlet of the liquid dripping device is located above the sensing element of the gas sensor to be tested;

[0012] A controller is mounted on the test bench; the controller is communicatively connected with the electrochemical analyzer, the heat-supplying voltage-stabilizing power supply, the first moving device and the dripping device respectively.

[0013] In one embodiment, the dripping device comprises:

[0014] A mounting bracket, wherein a first end of the mounting bracket is movably connected to a first moving device; the mounting bracket is arranged along a second direction, wherein the second direction is perpendicular to the first direction;

[0015] A dripping needle is installed at the second end of the mounting bracket; the dripping needle is arranged in a vertical direction; the water outlet of the dripping needle is located above the sensing element of the gas sensor to be tested.

[0016] In one embodiment, the dripping device further comprises:

[0017] a water tank, the water tank being mounted on the test bench;

[0018] A numerically controlled water pump is installed at the water inlet of the dripping needle; the numerically controlled water pump is connected to the water tank through a water pipe.

[0019] In one embodiment, the dripping device further comprises:

[0020] A laser locator is installed at the second end of the mounting bracket; the positioning laser output by the laser locator is projected onto the sensing element of the gas sensor to be tested; and the controller is communicatively connected with the laser locator.

[0021] In one embodiment, the first mobile device comprises:

[0022] a first movable guide rail, the first movable guide rail being mounted on the test bench along the first direction; a first end of the mounting bracket being slidably connected to the guide rail, the mounting bracket being configured to move along the first direction on the first movable guide rail;

[0023] A first drive motor, wherein the output shaft of the first drive motor is connected to the mounting bracket through a transmission track.

[0024] In one embodiment, it also includes:

[0025] a partition, the partition being located between the first moving device and the test bench, and the first moving guide rail of the first moving device being installed on an upper surface of the partition;

[0026] a second movable guide rail, the second movable guide rail being mounted on the test bench along the second direction; the second movable guide rail being slidably connected to the lower surface of the partition;

[0027] A second drive motor, wherein the output end of the second drive motor is connected to the mounting bracket through a transmission track.

[0028] In one embodiment, it also includes:

[0029] An infrared thermal imager is installed on the dripping device; the infrared thermal imager is arranged relative to the mounting hole on the mounting support; and the controller is communicatively connected with the infrared thermal imager.

[0030] In one embodiment, the gas sensor sensing element includes: a sensor chip and a thermal shock protection layer covering the sensor chip.

[0031] In one embodiment, the thermal shock protection layer is a porous structure.

[0032] In one of the embodiments, the gas sensor is configured as a wide-range oxygen sensor.

[0033] The detection device provided in the present application can quantitatively analyze the thermal shock stability of the thermal shock protection layer of the wide-band oxygen sensor, has high detection accuracy, is easy to operate, and has a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 shows a schematic structural diagram of a thermal shock performance testing system provided in an embodiment of the present application.

[0035] FIG2 shows a schematic structural diagram of a thermal shock performance testing system provided in an embodiment of the present application when no electronic component connector is installed.

[0036] FIG. 3 shows a schematic structural diagram of an electronic component connector.

[0037] Figure Number:

[0038] 100-test bench;

[0039] 200-installation support;

[0040] 300-Electronic component connectors;

[0041] 301-first end of the electronic component connector;

[0042] 302-the second end of the electronic component connector;

[0043] 400-Electrochemical Analyzer;

[0044] 500-heating voltage-stabilizing power supply;

[0045] 601-first moving guide rail;

[0046] 602-first drive motor;

[0047] 603- transmission track;

[0048] 701-Mounting bracket;

[0049] 702-Drip needle;

[0050] 703-water tank;

[0051] 704-CNC water pump;

[0052] 705-Water pipes;

[0053] 706-Laser locator;

[0054] 800-controller;

[0055] 900-partition;

[0056] 110 - second movable guide rail;

[0057] 120 - second drive motor;

[0058] 130 - third drive motor;

[0059] 140-Gas sensor sensing element. DETAILED DESCRIPTION

[0060] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0061] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0062] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0063] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0064] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0065] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0066] Referring to Figures 1 to 3, Figure 1 shows a schematic diagram of the structure of a thermal shock performance test system provided in an embodiment of the present application, Figure 2 shows a schematic diagram of the structure of a thermal shock performance test system provided in an embodiment of the present application when an electronic component connector is not installed, and Figure 3 shows a schematic diagram of the structure of an electronic component connector. A thermal shock performance test system provided in an embodiment of the present application is used to test the thermal shock stability of a gas sensor sensing element 140, and the thermal shock performance test system includes: a plurality of mounting brackets 200, an electronic component connector 300, an electrochemical analyzer 400, a heat-supplying voltage-stabilizing power supply 500, a first moving device, a dripping device, and a controller 800. A plurality of mounting supports 200 are mounted on the test bench 100 along a first direction (the x direction as shown in FIG. 1 ); a mounting hole is provided on the mounting support 200; the electronic component connector 300 is mounted in the mounting hole of the mounting support 200; the gas sensor sensing element 140 to be tested is plugged into the first end 301 of the electronic component connector; the electrochemical analyzer 400 is connected to the second end 302 of the electronic component connector through a cable; the heat-supplying and voltage-stabilizing power supply 500 is connected to the second end 302 of the electronic component connector through a cable; the first mobile device is mounted on the test bench 100 along a first direction (the x direction as shown in FIG. 1 ); the dripping device is movably connected to the first mobile device; the liquid outlet of the dripping device is located above the gas sensor sensing element 140 to be tested; the controller 800 is mounted on the test bench 100; the controller 800 is respectively connected to the electrochemical analyzer 400, the heat-supplying and voltage-stabilizing power supply 500, the first mobile device and the dripping device for communication.

[0067] In one embodiment, the gas sensor is configured as a wide-range oxygen sensor. The temperature of the sensing part of the wide-range oxygen sensor is as high as 850°C when the gas sensor is working. When the car is cold-started, a small amount of condensed water may be generated in the exhaust pipe. At this time, the water droplets will rapidly cool the sensor ceramic chip at high temperature, causing it to crack due to thermal stress.

[0068] In one embodiment, the gas sensor sensing element 140 includes: a sensor chip and a thermal shock protection layer coated on the sensor chip. The thermal shock protection layer can be coated on the ceramic chip of the wide-range oxygen sensor, and the main function of the thermal shock protection layer is to distribute the thermal stress on a wider surface of the sensor element, thereby reducing the damage to the chip caused by thermal shock.

[0069] Furthermore, the thermal shock protection layer is a porous structure. The main purpose of setting the thermal shock protection layer as a porous structure is to distribute the thermal stress on a wider surface of the sensor element through the porous structure of the thermal shock protection layer, thereby reducing the damage to the chip caused by thermal shock. The porous structure can also filter the exhaust impurities and prevent the chip from being poisoned.

[0070] The detection device provided in the present application can quantitatively analyze the thermal shock stability of the thermal shock protection layer of the wide-band oxygen sensor, has high detection accuracy, is easy to operate, and has a high degree of automation.

[0071] It should be noted here that a plurality of mounting supports 200 are arranged on the test bench 100, and a mounting hole is arranged on each mounting support 200 for mounting an electronic component connector. The number of electronic component connectors here can be added or removed according to test needs. When the electronic component connectors are fully installed on a plurality of mounting supports 200, the work efficiency can be effectively improved. After the dripping device drips liquid on the gas sensor sensing element 140 carried on the electronic component connector installed on a mounting support 200, the first moving device can drive the dripping device to move to the gas sensor sensing element 140 carried on the electronic component connector installed on the next mounting support 200 to perform the dripping operation.

[0072] It should also be noted that the second end 302 of the electronic component connector can lead out a plurality of wires, and electrically connect to the heat-stabilized voltage supply 500 and the electrochemical analyzer 400 through the lead-out plurality of wires. The heat-stabilized voltage supply 500 can provide the sensor with a heating voltage varying between 9V and 12V. The electrochemical analyzer 400 can provide the sensor with a scanning operating voltage varying between 0V and 2V, and can record the operating current of the wide-range oxygen sensor under the scanning operating voltage. Through the setting of the heat-stabilized voltage supply 500 and the electrochemical analyzer 400, the thermal shock performance of the wide-range oxygen sensor can be quantitatively tested in the dripping device before, during and after dripping.

[0073] The gas sensor sensing element 140 to be tested is fixed on the electronic component connector, and the electrochemical analyzer 400 and the heat-supplying voltage-stabilized power supply 500 can perform automatic detection with high test accuracy, and the amount of water droplets can be qualitatively tested and monitored in real time.

[0074] In one embodiment, the dripping device includes: a mounting bracket 701 and a dripping needle 702. The first end of the mounting bracket 701 is movably connected to the first moving device; the mounting bracket 701 is arranged along the second direction (the y direction as shown in FIG. 1), wherein the second direction (the y direction as shown in FIG. 1) is perpendicular to the first direction (the x direction as shown in FIG. 1); the dripping needle 702 is installed at the second end of the mounting bracket 701; the dripping needle 702 is arranged in the vertical direction; the water outlet of the dripping needle 702 is located above the gas sensor sensing element 140 to be tested.

[0075] In one embodiment, the dripping device further includes: a water tank 703 and a numerically controlled water pump 704. The water tank 703 is installed on the test bench 100; the numerically controlled water pump 704 is installed at the water inlet of the dripping needle 702; the numerically controlled water pump 704 is connected to the water tank 703 through a water pipe 705. In this embodiment, the numerically controlled water pump 704 is arranged at the water inlet of the dripping needle 702 (it can also be said to be the top of the dripping needle 702), and the dripping amount and water inlet amount of the dripping needle 702 can be accurately controlled by the numerically controlled water pump 704, and the dripping amount can be recorded.

[0076] In one embodiment, the dripping device further includes: a laser locator 706. The laser locator 706 is mounted on the second end of the mounting bracket 701; the positioning laser output by the laser locator 706 is projected onto the gas sensor sensor element 140 to be tested; and the controller 800 is in communication connection with the laser locator 706.

[0077] In this embodiment, the laser locator 706 and the dripping needle 702 are both installed at the second end of the mounting bracket 701. Here, the laser locator 706 is generally arranged in front of the dripping needle 702. When the laser locator 706 is in use, the laser beam emitted by the laser locator 706 is emitted vertically downward to determine the position information of the dripping needle 702 to be dripped (it can also be said to be the working position information of the dripping needle 702), and the determined position information of the dripping needle 702 to be dripped is sent to the controller 800. After the test starts, the controller 800 controls the water outlet of the dripping needle 702 to move to the position pre-calibrated by the laser locator 706.

[0078] In one embodiment, the first moving device includes: a first moving guide rail 601 and a first drive motor 602. The first moving guide rail 601 is installed on the test bench 100 along the first direction (x direction as shown in Figure 1); the first end of the mounting bracket 701 is slidably connected to the guide rail, and the mounting bracket 701 is configured to move along the first direction (x direction as shown in Figure 1) on the first moving guide rail 601; the output shaft of the first drive motor 602 is connected to the first moving guide rail 601 through a transmission crawler 603. It should be noted here that the way of arranging the first drive motor 602 and the transmission crawler 603 under the test bench shown in the figure is only used as an example. According to the actual layout needs, the first drive motor 602 and the transmission crawler 603 can also be directly arranged on the test bench, which can effectively shorten the layout length of the transmission crawler 603 and the transmission effect is also better. It can be understood by those skilled in the art that the first moving device is not limited to this. As long as the transmission method that can realize the movement of the dripping device along the first direction (x direction as shown in Figure 1) can be selected, it will not be listed one by one here.

[0079] In one embodiment, it further includes: a partition 900, a second movable guide rail 110 and a second drive motor 120. The partition 900 is located between the first moving device and the test bench 100, and the first movable guide rail 601 of the first moving device is installed on the upper surface of the partition 900; the second movable guide rail 110 is installed on the test bench 100 along the second direction (the y direction as shown in Figure 1); the second movable guide rail 110 is slidably connected to the lower surface of the partition 900; the output end of the second drive motor 120 is connected to the mounting bracket 701 through a transmission track 603. It should be briefly explained here that the first movable guide rail 601 and the second movable guide rail 110 are arranged in an upper and lower manner, and the partition 900 is used to support the first movable guide rail 601. The first movable guide rail is mainly used to guide the movement of the dripping device along the x direction, and the second movable guide rail 110 is mainly used to guide the movement of the dripping device along the second direction (the y direction as shown in Figure 1). The specific transmission structure is not specifically limited here, nor is it limited to the transmission structure shown in the figure.

[0080] Furthermore, a third driving motor 130 is included to drive the dripping device to move in a vertical direction to approach or move away from the gas sensor sensing element 140 to be tested, so as to ensure the dripping effect of the dripping device. It should be noted that the transmission structure between the third driving motor 130 and the dripping device is not shown in the diagram and is not specifically defined here.

[0081] In one of the embodiments, it also includes: an infrared thermal imager (not shown in the figure). The infrared thermal imager is installed on the dripping device; the infrared thermal imager is arranged relative to the mounting hole on the mounting support 200; the controller 800 is communicatively connected with the infrared thermal imager. In this embodiment, the infrared thermal imager is installed on the mounting bracket 701, and the infrared thermal imager is arranged relative to the mounting hole on the mounting support 200. In this embodiment, through the communication connection established between the infrared thermal imager and the controller 800, the thermal shock received by the gas sensor sensing element 140 (specifically, the thermal shock protection layer of the wide-band oxygen sensor) during the dripping process is visualized, which is more convenient for subsequent damage analysis and other research.

[0082] In one embodiment, the controller 800 may be an electronic device such as a computer, which is not listed one by one here. Those skilled in the art will understand that the above examples should not be used as a limitation.

[0083] In a specific embodiment, the sensor chip of the wide-range oxygen sensor is inserted into the first end 301 of the electronic component connector. The heat supply stabilized voltage power supply 500, the electrochemical analyzer 400 and the controller 800 are turned on, and a heating voltage of 9V to 12V is applied through the heat supply stabilized voltage power supply 500, and a scanning working voltage of 0V to 2V is provided by the electrochemical analyzer 400, and the working current of the wide-range oxygen sensor at this time is recorded. Next, the infrared thermal imager is turned on to record the working temperature of the head of the sensor chip of the wide-range oxygen sensor. At this time, the laser locator 706 of the dripping device is controlled to move to the center position of the thermal shock protection layer (i.e., the head of the sensor chip) of the sensor chip of the wide-range oxygen sensor and record the position information at this time (which can be three-coordinate position information). The minimum value of the dripping amount of the dripping needle 702 is set to 15μl, and the dripping speed of the dripping needle 702 is 15μl / s~450μl / s. The dripping interval time of the dripping needle 702 can also be set in seconds, which is not specifically limited here. At this point, the preparation work before the test is completed. After the test starts, the drip needle 702 is first moved to the preset position according to the position information previously calibrated by the laser locator 706, and begins to drip according to the preset dripping volume, dripping speed, dripping interval and other parameters. The controller can display and record the working current of the wide-range oxygen sensor, and the infrared thermal imager records the temperature change of the thermal shock protection layer (i.e., the head of the sensor chip) of the sensor chip of the wide-range oxygen sensor. According to the limiting current, the thermal vibration damage state of the thermal shock protection layer of the sensor chip of the wide-range oxygen sensor is analyzed, and the temperature change diagram of the infrared thermal imager is assisted to analyze the thermal vibration performance of the thermal shock protection layer of the sensor chip of the wide-range oxygen sensor. Finally, the specific results can be expressed as the water resistance of the sensor chip of the wide-range oxygen sensor.

[0084] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A thermal shock performance testing system, characterized in that: The thermal shock performance testing system is used to test the thermal shock stability of the gas sensor sensing element, and the thermal shock performance testing system includes: A plurality of mounting supports, wherein the plurality of mounting supports are mounted on the test bench along a first direction; mounting holes are provided on the mounting supports; An electronic component connector, the electronic component connector is installed in the mounting hole of the mounting support; the sensing element of the gas sensor to be tested is plugged into the first end of the electronic component connector; An electrochemical analyzer, the electrochemical analyzer is connected to the second end of the electronic component connector via a cable; A heat-supplying voltage-stabilizing power supply, wherein the heat-supplying voltage-stabilizing power supply is connected to the second end of the electronic component connector via a cable; a first moving device, the first moving device being mounted on the test bench along a first direction; A liquid dripping device, the liquid dripping device is movably connected to the first moving device; the liquid outlet of the liquid dripping device is located above the sensing element of the gas sensor to be tested; A controller is mounted on the test bench; the controller is communicatively connected with the electrochemical analyzer, the heat-supplying voltage-stabilizing power supply, the first moving device and the dripping device respectively.

2. The thermal shock performance testing system according to claim 1, characterized in that: The dripping device comprises: A mounting bracket, wherein a first end of the mounting bracket is movably connected to a first moving device; the mounting bracket is arranged along a second direction, wherein the second direction is perpendicular to the first direction; A dripping needle is installed at the second end of the mounting bracket; the dripping needle is arranged in a vertical direction; the water outlet of the dripping needle is located above the sensing element of the gas sensor to be tested.

3. The thermal shock performance testing system according to claim 2, characterized in that: The dripping device also includes: a water tank, the water tank being mounted on the test bench; A numerically controlled water pump is installed at the water inlet of the dripping needle; the numerically controlled water pump is connected to the water tank through a water pipe.

4. The thermal shock performance testing system according to claim 2, characterized in that: The dripping device also includes: A laser locator is installed at the second end of the mounting bracket; the positioning laser output by the laser locator is projected onto the sensing element of the gas sensor to be tested; and the controller is communicatively connected with the laser locator.

5. The thermal shock performance testing system according to claim 2, characterized in that: The first mobile device comprises: a first movable guide rail, the first movable guide rail being mounted on the test bench along the first direction; a first end of the mounting bracket being slidably connected to the guide rail, the mounting bracket being configured to move along the first direction on the first movable guide rail; A first drive motor, wherein the output shaft of the first drive motor is connected to the mounting bracket through a transmission track.

6. The thermal shock performance testing system according to claim 5, characterized in that: Also includes: a partition, the partition being located between the first moving device and the test bench, and the first moving guide rail of the first moving device being installed on an upper surface of the partition; a second movable guide rail, the second movable guide rail being mounted on the test bench along the second direction; the second movable guide rail being slidably connected to the lower surface of the partition; A second drive motor, wherein the output end of the second drive motor is connected to the mounting bracket through a transmission track.

7. The thermal shock performance testing system according to claim 1, characterized in that: Also includes: An infrared thermal imager, the infrared thermal imager is mounted on the liquid dripping device; the infrared thermal imager is arranged relative to the mounting hole on the mounting support; The controller is in communication connection with the infrared thermal imager.

8. The thermal shock performance testing system according to any one of claims 1 to 7, characterized in that: The gas sensor sensing element comprises: a sensing chip and a thermal shock protection layer covering the sensing chip.

9. The thermal shock performance testing system according to claim 8, characterized in that: The thermal shock protection layer is a porous structure.

10. The thermal shock performance testing system according to any one of claims 1 to 7, characterized in that: The gas sensor is configured as a wide-range oxygen sensor.

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