Circuit board aging test frame

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board aging test frame, which comprises a test frame, the bottom surface of the test frame is fixedly connected with conductive test equipment, a simulation mechanism is arranged in the test frame and comprises heating boxes, the outer surface of each heating box is fixedly connected with the inner wall of the test frame, and the inner wall of each heating box is fixedly connected with the test frame. The inner wall of the testing frame is fixedly connected with two air pumps, two separation nets, a first clamping plate and two miniature electric telescopic rods. The circuit board aging test frame is provided with the heating box, the air pump, the isolation net, the micro electric telescopic rod, the first clamping plate, the second clamping plate, the heat insulation air spraying pipe, the air hole and the heating disc, so that the circuit board can be conveniently humidified and heated to a certain degree, and the problem that the test frame is poor in functionality is solved; the problem that the accuracy of data detected by an aging test jig and the accuracy of data of actual work of a circuit board have a certain error due to the fact that humidity generated in the actual use process cannot be simulated is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board aging test rack. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit boards can be called printed circuit boards or printed circuit boards. They are excellent flexible printed circuit boards with high wiring density, light weight, thin thickness and good bending properties. Therefore, the soft-rigid combination board is a flexible circuit board and a rigid circuit board, which are combined together through processes such as pressing and other processes according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the production process of circuit boards, in order to test the service life of the circuit boards, aging tests are often performed on the circuit boards.

[0003] The utility model with the existing authorization announcement number CN202021111825.8 discloses a circuit board aging test stand. By adopting the above-mentioned technical scheme, after the fixing bolt passes through the fixing hole, the device can be directly fixed on the test stand, and the distance between the pressing plates can be adjusted according to the size of the circuit board, so that the rectangular frame formed between the pressing plates matches the size of the circuit board, so that it can be assembled on circuit boards of different sizes. At the same time, the position of the conductive column can be adjusted according to the position of the power-on hole on the circuit board, so that after the circuit board is placed, the conductive column can be directly inserted into the power-on hole, and power can be directly supplied. However, according to the above-mentioned technical scheme, the functionality of the test stand is relatively poor, and it can only fix circuit boards of different models. Due to the different installation environments of the circuit boards, the humidity of the circuit boards in the actual working process is different in the aging test stand, and the test stand cannot simulate the humidity generated in the actual process, resulting in a certain error in the accuracy of the data detected by the aging test stand and the data of the actual working of the circuit board.

[0004] Therefore, those skilled in the art provide a circuit board aging test rack to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to provide a circuit board aging test stand to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A circuit board aging test stand, comprising a test stand, a conductive test device is fixedly connected to the bottom surface of the test stand, and a simulation mechanism is arranged inside the test stand;

[0008] The simulation mechanism includes a heating box, the outer surface of each heating box is fixedly connected to the inner wall of the test frame, the inner wall of the test frame is respectively fixedly connected with two vacuum pumps, two isolation nets, a first clamping plate and two micro electric telescopic rods, the inner wall of each heating box is fixedly connected with an isolation plate and a heating plate, and a plurality of identical air holes are opened on the front of each isolation plate. The input end of each vacuum pump passes through the heating box and extends to the interior of the heating box, and the output end of each vacuum pump is fixedly connected with an insulated jet pipe. The telescopic end of each micro electric telescopic rod passes through the test frame and extends to the outside of the test frame, and the telescopic ends of the two micro electric telescopic rods are commonly fixedly connected with a second clamping plate.

[0009] As a further solution of the utility model: two groups of feet are arranged below the test stand, and the top of each group of the feet is fixedly connected to the bottom surface of the test stand.

[0010] As a further solution of the utility model: both left and right side surfaces of the test frame are movably hinged with sealed doors, and the side surfaces of the two sealed doors that are away from each other are fixedly connected with pulling handles.

[0011] As a further solution of the utility model: the side surfaces of the two heating boxes which are away from each other are fixedly connected with a water injection pipe and a drainage pipe, and the inner wall of each heating box is fixedly connected with a transparent plate.

[0012] As a further solution of the utility model: the outer surface of each of the heat-insulating air jet pipes is fixedly connected to a reinforcement plate, and the side surfaces of the two reinforcement plates close to each other are fixedly connected to the inner wall of the test frame.

[0013] As a further solution of the utility model: the telescopic end of each of the micro electric telescopic rods is fixedly connected to a fixing ring, and the back side of each of the fixing rings is fixedly connected to the front side of the second clamping plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model is provided with a heating box, an air suction pump, an isolation net, a micro electric telescopic rod, a first clamping plate, a second clamping plate, an insulating air jet pipe, air holes and a heating plate, so that the circuit board can be conveniently humidified and heated to a certain extent. The circuit board is clamped by the first clamping plate and the second clamping plate, and the heating plate is used to heat water. The water vapor is extracted by the air suction pump and neatly discharged to the surface of the circuit board through the insulating air jet pipe, so that the circuit board can be conveniently humidified and heated to a certain extent, and the anti-aging test of the circuit board is effectively and conveniently performed, so as to achieve the purpose of increasing the accuracy of the circuit board test, and avoid the problem that the functionality of the test stand is relatively poor and the humidity generated during actual use cannot be simulated, resulting in a certain error in the accuracy of the data detected by the aging test stand and the data of the actual work of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic diagram of the overall structure of a circuit board aging test stand;

[0017] Figure 2 It is a schematic diagram of a cross-sectional three-dimensional structure of a test frame in a circuit board aging test frame;

[0018] Figure 3 It is a schematic diagram of the three-dimensional structure of an air pump in a circuit board aging test rack;

[0019] Figure 4 The present invention is a schematic diagram of the cross-sectional three-dimensional structure of a heating box in a circuit board aging test rack.

[0020] In the figure: 1. test stand; 2. simulation mechanism; 201. first clamping plate; 202. second clamping plate; 203. isolation net; 204. micro electric telescopic rod; 205. heating box; 206. vacuum pump; 207. heat-insulating jet pipe; 208. isolation plate; 209. air vent; 210. heating plate; 3. sealing door; 4. pulling handle; 5. foot pad; 6. conductive test equipment; 7. fixing ring; 8. water injection pipe; 9. transparent plate; 10. drainage pipe; 11. reinforcement plate. DETAILED DESCRIPTION

[0021] See also Figure 1-4 A circuit board aging test stand comprises a test stand 1, a conductive test device 6 is fixedly connected to the bottom surface of the test stand 1, a simulation mechanism 2 is arranged inside the test stand 1, the simulation mechanism 2 comprises a heating box 205, the outer surface of each heating box 205 is fixedly connected to the inner wall of the test stand 1, two groups of feet 5 are arranged under the test stand 1, the top of each group of feet 5 is fixedly connected to the bottom surface of the test stand 1, and the stability of the test stand 1 can be increased and effectively supported by the feet 5.

[0022] The inner wall of the test frame 1 is respectively fixedly connected with two vacuum pumps 206, two isolation nets 203, a first clamping plate 201 and two micro electric telescopic rods 204, the inner wall of each heating box 205 is fixedly connected with an isolation plate 208 and a heating plate 210, and a plurality of identical air holes 209 are provided on the front of each isolation plate 208. The left and right sides of the test frame 1 are movably hinged with sealing doors 3, and the sides of the two sealing doors 3 that are away from each other are fixedly connected with pulling handles 4. Through the sealing doors 3 and the pulling handles 4, the sides of the test frame 1 can be conveniently sealed, effectively increasing the anti-slip effect.

[0023] The input end of each vacuum pump 206 passes through the heating box 205 and extends to the interior of the heating box 205. The output end of each vacuum pump 206 is fixedly connected to an insulated jet pipe 207. The side surfaces of the two heating boxes 205 that are away from each other are fixedly connected to a water injection pipe 8 and a drainage pipe 10. The inner wall of each heating box 205 is fixedly connected to a transparent plate 9. Through the water injection pipe 8 and the drainage pipe 10, the interior of the heating box 205 can be easily filled with water and drained. Through the transparent plate 9, the water level inside the heating box 205 can be observed.

[0024] The telescopic end of each micro electric telescopic rod 204 passes through the test frame 1 and extends to the outside of the test frame 1. The outer surface of each insulating jet tube 207 is fixedly connected to a reinforcement plate 11. The side surfaces of the two reinforcement plates 11 that are close to each other are fixedly connected to the inner wall of the test frame 1. The position of the insulating jet tube 207 can be positioned through the reinforcement plate 11 to prevent deviation.

[0025] The telescopic ends of the two micro electric telescopic rods 204 are commonly fixedly connected to the second clamping plate 202, and the telescopic end of each micro electric telescopic rod 204 is fixedly connected to a fixing ring 7, and the back side of each fixing ring 7 is fixedly connected to the front side of the second clamping plate 202. Through the fixing ring 7, the connection of the micro electric telescopic rod 204 can be increased to prevent it from falling off.

[0026] The working principle of the utility model is as follows: when in use, first connect the heating plate 210, the micro-electric telescopic rod 204 and the vacuum pump 206 to the power supply, and then clamp the circuit board at the bottom of the test frame 1, and then adjust the position of the second clamping plate 202 by the micro-electric telescopic rod 204, so as to facilitate the first clamping plate 201 to clamp and fix the circuit board, and then humidify the circuit board and perform a certain heating treatment on the circuit board through the simulation mechanism 2, and now inject a certain amount of water into the heating box 205, and heat the water directly through the heating plate 210, and the heated water vapor enters the air storage space outside the heating box 205 through the air vents 209 on the isolation plate 208, and then uses the vacuum pump 206 to humidify the air storage space. Water vapor is extracted from the space, and the extracted water vapor is ejected through the insulated jet pipe 207. The steam directly acts on the circuit board through the isolation net 203 inside the test frame 1. Since the water vapor contains moisture and a certain amount of heat, it can directly simulate the humidification of the circuit board and a certain amount of heating treatment, effectively ensuring the accurate anti-aging measurement of the circuit board. The anti-aging test of the circuit board can be directly carried out through the conductive test equipment 6 above. After the test is completed, all electrical components can be directly turned off to avoid the problem that the functionality of the test frame 1 is relatively poor and the humidity generated during actual use cannot be simulated, resulting in the data detected by the aging test frame 1 being inconsistent with the data accuracy of the actual working of the circuit board.

[0027] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A circuit board aging test stand, comprising a test stand (1), characterized in that: A conductive testing device (6) is fixedly connected to the bottom surface of the test frame (1), and a simulation mechanism (2) is arranged inside the test frame (1); The simulation mechanism (2) comprises a heating box (205), the outer surface of each heating box (205) being fixedly connected to the inner wall of the test frame (1), the inner wall of the test frame (1) being respectively fixedly connected to two vacuum pumps (206), two isolation nets (203), a first clamping plate (201) and two micro electric telescopic rods (204), the inner wall of each heating box (205) being fixedly connected to an isolation plate (208) and a heating plate (210), and the front side of each isolation plate (208) being open. A plurality of identical air holes (209) are provided, the input end of each of the air pumps (206) passes through the heating box (205) and extends to the interior of the heating box (205), the output end of each of the air pumps (206) is fixedly connected to a heat-insulating air jet pipe (207), the telescopic end of each of the micro electric telescopic rods (204) passes through the test frame (1) and extends to the outside of the test frame (1), and the telescopic ends of the two micro electric telescopic rods (204) are fixedly connected to a second clamping plate (202).

2. A circuit board aging test stand according to claim 1, characterized in that: Two groups of feet (5) are arranged below the test stand (1), and the top end of each group of feet (5) is fixedly connected to the bottom surface of the test stand (1).

3. A circuit board aging test stand according to claim 1, characterized in that: The left and right sides of the test frame (1) are both movably hinged with sealing doors (3), and the sides of the two sealing doors (3) that are away from each other are both fixedly connected with a pulling handle (4).

4. A circuit board aging test stand according to claim 1, characterized in that: A water injection pipe (8) and a drainage pipe (10) are fixedly connected to the side surfaces of the two heating boxes (205) that are away from each other, and a transparent plate (9) is fixedly connected to the inner wall of each heating box (205).

5. The circuit board aging test stand according to claim 1, characterized in that: The outer surface of each of the heat-insulating air jet pipes (207) is fixedly connected to a reinforcement plate (11), and the side surfaces of the two reinforcement plates (11) that are close to each other are fixedly connected to the inner wall of the test frame (1).

6. A circuit board aging test stand according to claim 1, characterized in that: The telescopic end of each of the micro electric telescopic rods (204) is fixedly connected to a fixing ring (7), and the back side of each of the fixing rings (7) is fixedly connected to the front side of the second clamping plate (202).

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