Spraying device and coating and developing equipment

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a spraying device and coating developing equipment, the spraying device comprises a developing nozzle assembly and a blowing assembly, the developing nozzle assembly comprises a developing nozzle, the developing nozzle is provided with a liquid inlet port and a liquid spraying port, the liquid inlet port is used for introducing a developing solution, the liquid spraying port is used for spraying the developing solution, and the blowing assembly is used for blowing the developing solution; the blowing assembly comprises a gas nozzle, the gas nozzle is arranged on one side of the width direction of the developing nozzle, the gas nozzle is provided with a gas inlet port and a gas spraying port, the gas inlet port is used for introducing blowing gas, and the gas spraying port is used for spraying the blowing gas. The blowing gas can prevent the developing solution from diffusing to the front of the developing nozzle in advance, so that the moving speed of the developing nozzle can be properly reduced when thicker photoresist is developed, the problems of insufficient development and incomplete development caused by insufficient development of the photoresist at the bottom are solved, the number of times of developing and spraying does not need to be increased, and the cost is reduced. Therefore, the developing process time can be remarkably shortened, and the working efficiency of semiconductor manufacturing is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor manufacturing equipment, and specifically relates to a spraying device and a coating and developing device. Background Art

[0002] In the semiconductor manufacturing process, the target pattern is transferred from the mask to the wafer through the exposure and development processes. Exposure is the process of irradiating the light emitted by the light source device in the exposure equipment through the mask containing the target pattern onto the surface of the wafer to expose the photoresist coated on the wafer. Development is the process of applying a developer on the photoresist so that the exposed area of ​​the positive photoresist (or the non-exposed area of ​​the negative photoresist) is dissolved in the developer, thereby transferring the target pattern from the mask to the wafer.

[0003] The coating and developing equipment includes a developing nozzle. During the process of coating the developing solution, the wafer is stationary, and the developing nozzle scans in a straight line from one side of the wafer edge to the other side of the wafer to evenly spray the developing solution on the surface of the photoresist.

[0004] In the existing coating and developing equipment, during the coating of the developer, if the moving speed of the developing nozzle is too slow, the developer will diffuse to the front of the developing nozzle in advance and react with the photoresist in advance, causing the reaction products to contaminate the developing nozzle; if the moving speed of the developing nozzle is too fast, the photoresist at the bottom will not be fully developed, resulting in the defects of insufficient and incomplete development. In order to solve the problem of insufficient and incomplete development, the existing developing process generally adds one more developing spray, resulting in a significant increase in the developing process time. Utility Model Content

[0005] The purpose of the present application is to provide a spraying device and a coating and developing device to shorten the developing process time and improve the working efficiency of semiconductor manufacturing.

[0006] In order to achieve the above object, the present application provides a spraying device, comprising:

[0007] A developing nozzle assembly, comprising a developing nozzle, wherein the developing nozzle has a liquid inlet port and a liquid spray port, wherein the liquid inlet port is used to introduce a developing liquid, and the liquid spray port is used to spray out the developing liquid;

[0008] A purge assembly comprises a gas nozzle, wherein the gas nozzle is arranged on one side of the developing nozzle in the width direction, the gas nozzle has an air inlet port and an air jet port, the air inlet port is used to introduce the purge gas, the air jet port is used to eject the purge gas, the dimension of the air jet port in the length direction of the developing nozzle is greater than or equal to the dimension of the liquid spray port in the length direction of the developing nozzle, and the length direction is perpendicular to the width direction.

[0009] Optionally, the jet port includes a plurality of jet holes arranged along the length direction, with a first spacing area between adjacent jet holes, and a size of the jet port in the length direction is equal to the sum of sizes of all the jet holes in the length direction and sizes of all the first spacing areas in the length direction.

[0010] Optionally, a distance between the air injection hole and the liquid injection port in the width direction is 2 mm to 3 mm.

[0011] Optionally, the spray port includes a plurality of spray holes arranged along the length direction, with a second spacing area between adjacent spray holes, and a size of the spray port in the length direction is equal to the sum of sizes of all the spray holes in the length direction and sizes of all the second spacing areas in the length direction.

[0012] Optionally, the spraying device further comprises a control valve assembly, wherein the control valve assembly controls the opening or closing of the liquid spray hole, and the sum of the size of the liquid spray hole in the length direction and the size of the second interval area between the liquid spray holes in the length direction is the opening length of the liquid spray port;

[0013] The control valve assembly includes a first state and a second state. In the first state, the opening length of the spray port gradually increases with the center line of all the spray holes in the length direction as the center. In the second state, the opening length of the spray port gradually decreases with the center line of all the spray holes in the length direction as the center.

[0014] Optionally, the control valve assembly includes two valve plates and two translation structures, the spray hole has an inlet end and an outlet end relatively arranged, the valve plate is arranged at the inlet end of the spray hole, the two valve plates are respectively arranged on both sides of the center line, the translation structure is connected to the valve plates one by one, and the translation structure drives the valve plates to move along the length direction, so that the opening length gradually increases or decreases.

[0015] Optionally, the translation structure includes a driver, a gear and a rack, the rack is connected to the valve plate, the gear is meshed with the rack, the driver is connected to the gear, and the driver drives the gear to rotate, thereby driving the rack and the valve plate to move along the length direction.

[0016] Optionally, the developing nozzle assembly further includes a guide rod, which is disposed at the outlet end of the spray hole, the guide rod is disposed along the length direction, the length of the guide rod is greater than or equal to the size of the spray port in the length direction, and the guide rod is used to disperse the developing liquid circumferentially along the guide rod.

[0017] Optionally, the control valve assembly includes multiple valve cores and a valve control unit, the valve cores are arranged in one-to-one correspondence with the spray holes, the valve cores are used to control the conduction or cutoff of the spray holes, all the valve cores are connected to the valve control unit, and the valve control unit controls the valve cores on both sides of the center line to open or close in sequence, so that the opening length gradually increases or decreases.

[0018] The present application also provides a coating and developing device, which includes the spraying device.

[0019] The spraying device and coating and developing equipment disclosed in the present application have the following beneficial effects:

[0020] In the present application, the spraying device includes a developing nozzle assembly and a purging assembly, the developing nozzle assembly includes a developing nozzle, the developing nozzle has a liquid inlet port and a liquid spray port, the liquid inlet port is used to introduce a developing solution, and the liquid spray port is used to spray out the developing solution, the purging assembly includes a gas nozzle, the gas nozzle is arranged on one side of the width direction of the developing nozzle, the gas nozzle has an air inlet port and an air spray port, the air inlet port is used to introduce a purging gas, and the air spray port is used to spray out the purging gas. Since the purging gas can prevent the developing solution from diffusing to the front of the developing nozzle in advance, when developing a thicker photoresist, the moving speed of the developing nozzle can be appropriately reduced to solve the problem of insufficient development and incomplete development caused by insufficient development of the photoresist at the bottom without increasing the number of developing sprays, so the development process time can be significantly shortened and the work efficiency of semiconductor manufacturing can be improved.

[0021] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a three-dimensional schematic diagram of the spraying device in the embodiment of the present application.

[0025] Figure 2 It is a schematic cross-sectional view of the spraying device in the embodiment of the present application in the length direction.

[0026] Figure 3It is a schematic diagram of the spraying device applying the developer in the embodiment of the present application.

[0027] Figure 4 Schematic cross-sectional view of the gas nozzle in the embodiment of the present application.

[0028] Figure 5 It is a schematic cross-sectional view of the spraying device in the embodiment of the present application in the length direction.

[0029] Figure 6 It is a schematic diagram of a developing nozzle in which a valve core controls a liquid spray hole in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 100, developing nozzle assembly; 110, developing nozzle; 111, liquid inlet port; 112, liquid spraying port; 1121, liquid spraying hole; 1122, second spacer; 120, guide rod;

[0032] 200, purge assembly; 210, gas nozzle; 211, air inlet port; 212, jet port; 2121, jet hole; 2122, first spacer;

[0033] 300, control valve assembly; 310, valve plate; 320, translation structure; 321, gear; 322, rack; 330, valve core;

[0034] 400. Wafer. DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0036] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0037] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0038] See also Figure 1 and Figure 2 As shown, in this embodiment, the spraying device includes a developing nozzle assembly 100 and a purge assembly 200. The developing nozzle assembly 100 includes a developing nozzle 110, and the developing nozzle 110 has a liquid inlet port 111 and a liquid spray port 112. The liquid inlet port 111 is used to pass the developing liquid, and the liquid spray port 112 is used to spray the developing liquid. The purge assembly 200 includes a gas nozzle 210, and the gas nozzle 210 is arranged in the width direction of the developing nozzle 110 (i.e. Figure 1 The gas nozzle 210 has an air inlet port 211 and an air jet port 212. The air inlet port 211 is used to introduce the purge gas, and the air jet port 212 is used to eject the purge gas. The air jet port 212 is located in the length direction (i.e., the Y direction) of the developing nozzle 110. Figure 1 The size of the spray port 112 in the length direction of the developing nozzle 110 (in the X direction) is greater than or equal to the size of the spray port 112 in the length direction of the developing nozzle 110, and the length direction is perpendicular to the width direction. It should be noted that the purge assembly 200 may also include necessary structures such as an air intake pipe and a nozzle fixing mechanism.

[0039] Spraying devices are used for coating and developing equipment. Figures 1 to 3 As shown, when the coating and developing equipment is working, the wafer 400 is stationary, and the developing nozzle 110 scans in a straight line along the width direction from one side of the edge of the wafer 400 to the other side of the wafer 400, and the developing liquid is evenly sprayed on the surface of the photoresist on the wafer 400, so that the exposed area of ​​the positive photoresist (or the non-exposed area of ​​the negative photoresist) is dissolved in the developing liquid, thereby transferring the target pattern from the mask plate to the wafer 400.

[0040] During the process in which the developing nozzle 110 is linearly scanned from one side of the edge of the wafer 400 to the other side of the wafer 400 in the width direction, the gas nozzle 210 of the purge assembly 200 continuously sprays the purge gas. The purge gas is an inactive gas, which includes inert gases and nitrogen. On the one hand, the purge gas sprayed by the gas nozzle 210 forms a gas wall to prevent the developer from diffusing to the front of the developing nozzle 110 in advance. On the other hand, the purge gas sprayed by the gas nozzle 210 purges the photoresist to remove the contaminants that may exist on the surface of the photoresist in front of the developing nozzle 110. Since the purge gas can prevent the developer from diffusing to the front of the developing nozzle 110 in advance, when developing thicker photoresists, the moving speed of the developing nozzle 110 can be appropriately reduced to solve the problem of insufficient and incomplete development caused by insufficient development of the photoresist at the bottom.

[0041] In the existing coating and developing equipment, during the coating of the developer, if the moving speed of the developing nozzle 110 is too slow, the developing solution will diffuse to the front of the developing nozzle 110 in advance and react with the photoresist in advance, causing the reaction product to contaminate the developing nozzle 110. When developing thicker photoresists, in order to avoid premature diffusion of the developing solution, the moving speed of the developing nozzle 110 will be appropriately increased. In order to solve the problem of insufficient development and incomplete development caused by the excessively fast moving speed of the developing nozzle 110, one more developing spray is generally performed, resulting in a significant increase in the developing process time.

[0042] In this embodiment, the spraying device includes a developing nozzle assembly 100 and a purge assembly 200. The developing nozzle assembly 100 includes a developing nozzle 110. The developing nozzle 110 has a liquid inlet port 111 and a liquid spray port 112. The liquid inlet port 111 is used to introduce a developing solution, and the liquid spray port 112 is used to spray out the developing solution. The purge assembly 200 includes a gas nozzle 210. The gas nozzle 210 is arranged on one side of the width direction of the developing nozzle 110. The gas nozzle 210 has an air inlet port 211 and an air spray port 212. The air inlet port 211 is used to introduce a purge gas, and the air spray port 212 is used to spray out the purge gas. Since the purge gas can prevent the developing solution from diffusing to the front of the developing nozzle 110 in advance, when developing a thicker photoresist, the moving speed of the developing nozzle 110 can be appropriately reduced to solve the problem of insufficient and incomplete development caused by insufficient development of the photoresist at the bottom without increasing the number of developing sprays. Therefore, the development process time can be significantly shortened and the work efficiency of semiconductor manufacturing can be improved.

[0043] In addition, when developing thicker photoresists, there is no need to increase the number of developing sprays, and the consumption of developing solution can be reduced, thereby reducing the manufacturing cost of semiconductor devices.

[0044] See also Figure 2 and Figure 4As shown, the jet port 212 includes a plurality of jet holes 2121 arranged along the length direction, and a first spacer 2122 is provided between adjacent jet holes 2121. The size H of the jet port 212 in the length direction is equal to the sum of the sizes of all the jet holes 2121 in the length direction and the sizes of all the first spacers 2122 in the length direction. In other words, the size H of the jet port 212 in the length direction is equal to the distance between the outermost sides of the two outermost jet holes 2121. The jet holes 2121 may be circular holes and the apertures of all the jet holes 2121 are equal, and the lengths of the first spacers 2122 between adjacent jet holes 2121 may also be equal. The size H of the jet port 212 in the length direction is equal to the sum of the center distance h of the two outermost jet holes 2121 and the diameter D of the jet hole 2121. The size H of the jet port 212 in the length direction is greater than or equal to the outer diameter of the wafer 400 and the size H of the jet port 212 in the length direction is greater than or equal to the size of the liquid injection port 112 in the length direction.

[0045] The jet port 212 includes a plurality of jet holes 2121 arranged along the length direction. The purge gas ejected from the plurality of jet holes 2121 forms a gas wall, which can make the purge gas distribution more uniform on one hand, and reduce the purge gas consumption on the other hand.

[0046] It should be noted that the jet port 212 includes a plurality of jet holes 2121 arranged along the length direction, but is not limited thereto. The jet port 212 may also be a long strip hole. The dimension H of the jet port 212 in the length direction is the length of the long strip jet port 212. The length of the long strip jet port 212 is greater than or equal to the outer diameter of the wafer 400, which may depend on the specific situation.

[0047] In some embodiments, the distance between the air injection hole 2121 and the liquid injection port 112 in the width direction is 2 mm to 3 mm.

[0048] The spacing between the jet hole 2121 and the liquid spray port 112 in the width direction is limited to 2 mm to 3 mm, to ensure that the spacing between the jet hole 2121 and the liquid spray port 112 in the width direction is not too large, which will affect the effect of blocking the premature diffusion of the developer, and at the same time ensure that the spacing between the jet hole 2121 and the liquid spray port 112 in the width direction is not too small, which will cause the purge gas to disperse the developer.

[0049] See also Figure 2 , Figure 4 and Figure 5As shown, the arrangement of the liquid spray port 112 is the same as that of the air jet port 212. The liquid spray port 112 includes a plurality of liquid spray holes 1121 arranged along the length direction, and a second spacing area 1122 is provided between adjacent liquid spray holes 1121. The size of the liquid spray port 112 in the length direction is equal to the sum of the sizes of all liquid spray holes 1121 in the length direction and the sizes of all second spacing areas 1122 in the length direction. In other words, the size of the liquid spray port 112 in the length direction is equal to the distance between the outermost sides of the two outermost liquid spray holes 1121. The liquid spray holes 1121 may be circular holes and the apertures of all liquid spray holes 1121 are equal, and the lengths of the second spacing areas 1122 between adjacent liquid spray holes 1121 are also equal. The size of the liquid spray port 112 in the length direction is equal to the sum of the hole spacing between the two outermost liquid spray holes 1121 and the diameter of the liquid spray holes 1121.

[0050] The liquid spray port 112 includes a plurality of liquid spray holes 1121 arranged along the length direction. The developer is sprayed out from the plurality of liquid spray holes 1121 and coated on the photoresist, so that the developer can be distributed more evenly.

[0051] It should be noted that the liquid spray port 112 includes a plurality of liquid spray holes 1121 arranged along the length direction, but is not limited thereto. The liquid spray port 112 may also be a long strip hole. The size of the liquid spray port 112 in the length direction is the length of the long strip liquid spray port 112. The length of the long strip liquid spray port 112 is greater than or equal to the outer diameter of the wafer 400, which may depend on the specific situation.

[0052] In some embodiments, the spraying device further includes a control valve assembly 300, which controls whether the spray hole 1121 is turned on or off, that is, controls whether the developer introduced from the liquid inlet port 111 can be sprayed out from the spray hole 1121. The sum of the length of the turned-on spray hole 1121 and the length of the second spacer 1122 between the turned-on spray holes 1121 is the opening length of the spray port 112. The larger the opening length of the spray port 112, the larger the length of the developer flow (length direction dimension) formed. The control valve assembly 300 includes a first state and a second state. In the first state, the opening length of the spray port 112 gradually increases with the center line of all the spray holes 1121 in the length direction as the center; in the second state, the opening length of the spray port 112 gradually decreases with the center line of all the spray holes 1121 in the length direction as the center.

[0053] When the coating and developing equipment is working, the wafer 400 is stationary, and the developing nozzle 110 scans linearly from one side of the edge of the wafer 400 to the other side of the wafer 400 along the width direction, and sprays the developing solution evenly on the surface of the photoresist on the wafer 400. From the beginning when the developing nozzle 110 overlaps with the wafer 400 to scanning to the center of the wafer 400, the overlapping area between the developing nozzle 110 and the wafer 400 gradually increases, and the area that needs to be coated with the developing solution gradually increases; from the center of the wafer 400 to just leaving the wafer 400 (not overlapping with the wafer 400), the overlapping area between the developing nozzle 110 and the wafer 400 gradually decreases, and the area that needs to be coated with the developing solution gradually decreases. In the process of the developing nozzle 110 scanning linearly from one side of the edge of the wafer 400 to the other side of the wafer 400 along the width direction, the developing solution sprayed by the developing nozzle 110 in the overlapping area between the developing nozzle 110 and the wafer 400 can be effectively utilized, while the developing solution sprayed by the developing nozzle 110 in the non-overlapping area between the developing nozzle 110 and the wafer 400 cannot be effectively utilized. In the existing coating and developing equipment, the opening length of the developing nozzle 110 remains unchanged, and when coating the developing solution, a large amount of the developing solution is not sprayed on the photoresist of the wafer 400, resulting in a huge waste of the developing solution.

[0054] In this embodiment, the spraying device also includes a control valve assembly 300, which can control the opening length of the spray port 112 to gradually increase or gradually decrease. In the process of the developing nozzle 110 scanning in a straight line along the width direction from one side of the edge of the wafer 400 to the other side of the wafer 400, the control valve assembly 300 can control the opening length of the spray port 112 to first gradually increase and then gradually decrease, so that the changing trend of the opening length is the same as the changing trend of the overlapping area of ​​the wafer 400 and the developing nozzle 110, and the opening length is equal to or slightly larger than the length of the overlapping area of ​​the wafer 400 and the developing nozzle 110, which can reduce the waste of developing solution in the process of applying the developing solution, which is beneficial to reducing the manufacturing cost of semiconductor devices.

[0055] See also Figure 5 As shown, the control valve assembly 300 may include two valve plates 310 and two translation structures 320. The liquid spray hole 1121 has an inlet end and an outlet end that are arranged oppositely. The valve plate 310 is arranged at the inlet end of the liquid spray hole 1121. The two valve plates 310 are respectively arranged on both sides of the center line of all the liquid spray holes 1121 in the length direction. The translation structure 320 is connected to the valve plate 310 in a one-to-one correspondence. The translation structure 320 drives the valve plate 310 to move in the length direction, so that the opening length gradually increases or decreases. During the movement of the valve plate 310, the two valve plates 310 are always symmetrical with the center line of all the liquid spray holes 1121 in the length direction.

[0056] The two valve plates 310 are respectively arranged on both sides of the center line. Each valve plate 310 controls the conduction or cutoff of half of the spray holes 1121. It is not necessary to set a switch valve for each spray hole 1121 one by one. The structure of the control valve assembly 300 is simple, which is conducive to reducing the manufacturing cost of the spraying device.

[0057] It should be noted that the control valve assembly 300 may include two valve plates 310 and two translation structures 320, the translation structures 320 are connected to the valve plates 310 in a one-to-one correspondence, the translation structure 320 drives the valve plates 310 to move in the length direction, and the two valve plates 310 are always symmetrical about the center line of all the spray holes 1121 in the length direction, but is not limited to this. The control valve assembly 300 may also include two valve plates 310, a translation structure 320 and a lever mechanism, the lever mechanism connects the two valve plates 310, the translation structure 320 drives one valve plate 310 to move in the length direction, the valve plate 310 drives the other valve plate 310 to move in the length direction through the lever mechanism, and the lever mechanism makes the two valve plates 310 always symmetrical about the center line of all the spray holes 1121 in the length direction, and the specific situation may depend on the situation.

[0058] See also Figure 5 As shown, the translation structure 320 includes a driver (not shown), a gear 321 and a rack 322. The driver includes a motor. The rack 322 is connected to the valve plate 310, the gear 321 is meshed with the rack 322, the driver is connected to the gear 321, the driver drives the gear 321 to rotate, and then drives the rack 322 and the valve plate 310 to move along the length direction.

[0059] The translation structure 320 includes a driver, a gear 321 and a rack 322. The gear 321 and the rack 322 convert the rotational motion of the driver into linear motion, drive the valve plate 310 to move along the length direction, and control the opening length to gradually increase or decrease. The translation structure 320 has a simple structure and high reliability.

[0060] It should be noted that the translation structure 320 includes a driver, a gear 321 and a rack 322, that is, the translation structure 320 is a gear rack transmission mechanism, but is not limited to this. The translation structure 320 can also be a nut screw mechanism and a pulley mechanism, etc., depending on the specific situation.

[0061] See also Figure 2 , Figure 4 and Figure 5 As shown, the developing nozzle assembly 100 further includes a guide rod 120, the cross section of the guide rod 120 is circular or elliptical, and the material of the guide rod 120 includes quartz. The guide rod 120 is arranged at the outlet end of the liquid spraying hole 1121, and the guide rod 120 is arranged along the length direction. The length of the guide rod 120 is greater than or equal to the size of the liquid spraying port 112 in the length direction. The guide rod 120 is used to disperse the developer along the circumference of the guide rod 120.

[0062] The guide rod 120 is arranged at the outlet end of the spray hole 1121. The developer sprayed from the spray hole 1121 flows to the upper side of the guide rod 120 and disperses circumferentially along the guide rod 120, and then is evenly coated on the surface of the photoresist on the wafer 400. The drainage through the guide rod 120 can make the developer distribution more even on the one hand, and on the other hand, it can prevent the sprayed developer from impacting the coated developer.

[0063] In some embodiments, the control valve assembly 300 includes a plurality of valve cores 330 and a valve control unit. The valve cores 330 are arranged in a one-to-one correspondence with the liquid spraying holes 1121. Figure 6 The valve core 330 is used to control the opening or closing of the liquid spray hole 1121, and all valve cores 330 are connected to the valve control unit. The valve control unit controls the valve cores 330 on both sides of the center line to open or close in sequence, so that the opening length gradually increases or decreases.

[0064] The valve core 330 is arranged in a one-to-one correspondence with the spray hole 1121, and the conduction or cutoff of each spray hole 1121 is controlled by a separate valve core 330. The spray hole 1121 has good sealing performance in the cut-off state and is not prone to leakage of developer. At the same time, the control method for gradually increasing or decreasing the opening length of the spray port 112 is simpler, and the opening length can be more accurately achieved to be slightly larger than the length of the overlapping area between the developer nozzle 110 and the wafer 400, thereby reducing developer waste.

[0065] The present application also provides a coating and developing device, which includes the spraying device disclosed above. When the coating and developing device is working, the wafer 400 is stationary, and the developing nozzle 110 is scanned linearly from one side of the edge of the wafer 400 to the other side of the wafer 400 along the width direction, and the developer is evenly sprayed on the surface of the photoresist on the wafer 400, so that the exposed area of ​​the positive photoresist (or the non-exposed area of ​​the negative photoresist) is dissolved in the developer, thereby transferring the target pattern from the mask to the wafer 400. During the process of coating the developer, the gas nozzle 210 is always located in front of the developing nozzle 110.

[0066] The coating and developing equipment includes a spraying device, which includes a developing nozzle assembly 100 and a purging assembly 200. The developing nozzle assembly 100 includes a developing nozzle 110, which has a liquid inlet port 111 and a liquid spray port 112, wherein the liquid inlet port 111 is used to introduce a developing solution, and the liquid spray port 112 is used to spray out the developing solution. The purging assembly 200 includes a gas nozzle 210, which is arranged on one side of the developing nozzle 110 in the width direction, and the gas nozzle 210 has an air inlet port 211 and an air spray port 212, wherein the air inlet port 211 is used to introduce a purging gas, and the air spray port 212 is used to spray out the purging gas. Since the purging gas can prevent the developing solution from being diffused to the front of the developing nozzle 110 in advance, when developing a thicker photoresist, the moving speed of the developing nozzle 110 can be appropriately reduced to solve the problem of insufficient and incomplete development caused by insufficient development of the photoresist at the bottom, without increasing the number of developing sprays, thus significantly shortening the development process time and improving the working efficiency of semiconductor manufacturing.

[0067] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0070] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A spraying device, characterized in that: include: A developing nozzle assembly, comprising a developing nozzle, wherein the developing nozzle has a liquid inlet port and a liquid spray port, wherein the liquid inlet port is used to introduce a developing liquid, and the liquid spray port is used to spray out the developing liquid; A purge assembly comprises a gas nozzle, wherein the gas nozzle is arranged on one side of the developing nozzle in the width direction, the gas nozzle has an air inlet port and an air jet port, the air inlet port is used to introduce the purge gas, the air jet port is used to eject the purge gas, the dimension of the air jet port in the length direction of the developing nozzle is greater than or equal to the dimension of the liquid spray port in the length direction of the developing nozzle, and the length direction is perpendicular to the width direction.

2. The spraying device according to claim 1, characterized in that: The jet port includes a plurality of jet holes arranged along the length direction, with a first spacing area between adjacent jet holes, and a size of the jet port in the length direction is equal to the sum of sizes of all the jet holes in the length direction and sizes of all the first spacing areas in the length direction.

3. The spraying device according to claim 2, characterized in that: The distance between the air injection hole and the liquid injection port in the width direction is 2 mm to 3 mm.

4. The spraying device according to claim 1, characterized in that: The liquid spray port comprises a plurality of liquid spray holes arranged along the length direction, with a second spacing area between adjacent liquid spray holes, and a size of the liquid spray port in the length direction equal to the sum of the sizes of all the liquid spray holes in the length direction and the sizes of all the second spacing areas in the length direction.

5. The spraying device according to claim 4, characterized in that: The spraying device further comprises a control valve assembly, wherein the control valve assembly controls the opening or closing of the liquid spray hole, and the sum of the size of the liquid spray hole in the length direction and the size of the second interval area between the liquid spray holes in the length direction is the opening length of the liquid spray port; The control valve assembly includes a first state and a second state. In the first state, the opening length of the spray port gradually increases with the center line of all the spray holes in the length direction as the center. In the second state, the opening length of the spray port gradually decreases with the center line of all the spray holes in the length direction as the center.

6. The spraying device according to claim 5, characterized in that: The control valve assembly includes two valve plates and two translation structures. The liquid spray hole has an inlet end and an outlet end that are relatively arranged. The valve plate is arranged at the inlet end of the liquid spray hole. The two valve plates are respectively arranged on both sides of the center line. The translation structure is connected to the valve plates in a one-to-one correspondence. The translation structure drives the valve plates to move along the length direction, so that the opening length gradually increases or decreases.

7. The spraying device according to claim 6, characterized in that: The translation structure includes a driver, a gear and a rack, the rack is connected to the valve plate, the gear is meshed with the rack, the driver is connected to the gear, the driver drives the gear to rotate, and then drives the rack and the valve plate to move along the length direction.

8. The spraying device according to claim 6, characterized in that: The developing nozzle assembly also includes a guide rod, which is arranged at the outlet end of the spray hole, the guide rod is arranged along the length direction, the length of the guide rod is greater than or equal to the size of the spray port in the length direction, and the guide rod is used to disperse the developing liquid along the circumference of the guide rod.

9. The spraying device according to claim 5, characterized in that: The control valve assembly includes multiple valve cores and a valve control unit. The valve cores are arranged in a one-to-one correspondence with the spray holes. The valve cores are used to control the conduction or cutoff of the spray holes. All the valve cores are connected to the valve control unit. The valve control unit controls the valve cores on both sides of the center line to open or close in sequence, so that the opening length gradually increases or decreases.

10. A coating and developing device, characterized in that: It comprises the spraying device as described in any one of claims 1 to 9.

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