Tablet computer rear cover heat dissipation structure

Abstract

The utility model discloses a tablet computer rear cover heat dissipation structure, and relates to the technical field of computer rear cover heat dissipation structures. The device comprises a frame, a back plate is fixedly connected to one side of the frame, a heat conduction mounting plate is fixedly connected to the interior of the frame, heat dissipation holes are formed in one side of the back plate, silent fans are symmetrically mounted on the side, close to the heat conduction mounting plate, of the back plate, and air inlets are symmetrically formed in the two ends of the frame; a plurality of air inducing grooves are formed in the side, away from the heat conduction mounting plate, of the back plate. The heat dissipation holes and the air inducing grooves are used in cooperation, so that when the back face of the back plate is attached to the table top, the heat dissipation holes can communicate with the outside through guiding of the air inducing grooves, and therefore hot air in the frame can be discharged out of the position between the back plate and the table top through guiding of the heat dissipation holes and the air inducing grooves when the silent fan is started; the exhaust area in the frame is effectively increased, and the heat dissipation effect of the tablet computer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of computer rear cover heat dissipation structures, and in particular to a tablet computer rear cover heat dissipation structure. Background Art

[0002] The size of a tablet computer is often between a mobile phone and a laptop computer. Compared to a laptop computer, a tablet computer removes the keyboard part and integrates the internal components of the tablet computer with the screen, retaining a larger screen and improving the reading experience. Also, thanks to the tablet computer's simple appearance, it is more portable.

[0003] In order to increase the usage time of tablet computers, the capacity and volume of their internal batteries are constantly increasing, which causes a large amount of heat to be generated inside the tablet computer when it is in use, thereby causing the tablet computer to heat up. When the temperature of the tablet computer reaches a certain level, it will cause damage to the tablet computer's system and internal components, thereby affecting the performance of the tablet computer.

[0004] Since the tablet computer adopts a flat structure, the back of the computer fits completely against the desktop when it is laid flat, so most manufacturers set the heat dissipation vents of the tablet computer on the four narrow sides of the computer. However, this setting greatly limits the size of the computer's heat dissipation holes, thereby reducing the heat dissipation efficiency of the tablet computer. Utility Model Content

[0005] The purpose of this application is to solve the problem that most manufacturers set the heat dissipation ports of tablet computers on the four narrow sides of the computer, which greatly limits the size of the heat dissipation holes of the computer, thereby reducing the heat dissipation efficiency of the tablet computer. This application provides a heat dissipation structure for the back cover of a tablet computer.

[0006] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions:

[0007] A tablet computer back cover heat dissipation structure comprises a frame, a back plate is fixedly connected to one side of the frame, a heat conduction mounting plate is fixedly connected to the inside of the frame, heat dissipation holes are provided on one side of the back plate, and a silent fan is symmetrically installed on the side of the back plate close to the heat conduction mounting plate, air inlets are symmetrically provided at both ends of the frame, and a plurality of air inlet grooves are provided on the side of the back plate away from the heat conduction mounting plate.

[0008] By adopting the above technical solution, firstly, by setting the heat dissipation holes and the air duct slots for use together, when the back side of the back panel fits against the desktop, the heat dissipation holes can be connected to the outside world through the guidance of the air duct slots, so that when the silent fan is started, the hot air inside the frame can be discharged between the back panel and the desktop through the heat dissipation holes and the air duct slots, thereby effectively increasing the exhaust area inside the frame and improving the heat dissipation effect of the tablet computer.

[0009] Furthermore, a dustproof net is fixedly connected to the interior of the air inlet.

[0010] By adopting the above technical solution, the probability of dust and foreign matter entering the interior of the frame is effectively reduced by setting the air inlet and using the dustproof net in conjunction with each other.

[0011] Furthermore, a semiconductor heat dissipation chip is fixedly connected to one end of the heat-conducting mounting plate, and the heat-conducting mounting plate is configured as a heat-conducting copper plate.

[0012] By adopting the above technical solution, by setting up the cooperation between the semiconductor heat dissipation chip and the heat-conducting mounting plate, it is convenient to quickly collect the heat emitted by the electrical components and introduce it into the interior of the heat-conducting mounting plate, thereby improving the heat dissipation efficiency of the tablet computer.

[0013] Furthermore, the surface of the heat-conducting mounting plate is coated with heat-dissipating silicone grease.

[0014] By adopting the above technical solution, the thermal conductivity of the heat-conducting mounting plate is effectively enhanced by arranging the heat dissipation silicone grease.

[0015] Furthermore, a plurality of heat dissipation fins are fixedly connected to one side of the heat-conducting mounting plate close to the back plate.

[0016] By adopting the above technical solution, the heat dissipation area of ​​the heat-conducting mounting plate is effectively increased by arranging heat dissipation fins.

[0017] Furthermore, four corners of the heat-conducting mounting plate on a side away from the back plate are fixedly connected with support columns.

[0018] By adopting the above technical solution, the support column is provided to effectively reduce the contact area between the electrical components and the heat-conducting mounting plate, so that the received heat is returned, further improving the heat dissipation effect of the tablet computer.

[0019] Furthermore, storage bins are symmetrically and fixedly connected on both sides of the frame, support feet are slidably connected inside the storage bins, one end of the support feet is symmetrically and fixedly connected to a support spring, the support spring is installed inside the storage bin, one end of the storage bin is symmetrically provided with a bayonet, and one end of the support foot is symmetrically provided with an elastic clip that matches the bayonet.

[0020] By adopting the above technical solution, by setting the supporting spring and the supporting foot for use together, the elastic clamp is pressed to release the clamping connection between the supporting foot and the storage bin, and the supporting spring rebounds to push out the supporting foot, driving one end of the supporting foot to push out of the interior of the storage bin along the length direction of the supporting spring, thereby increasing the distance between one end of the back panel and the desktop, reducing the obstruction of the heat dissipation holes by the desktop, thereby effectively improving the heat dissipation effect of the tablet computer.

[0021] Furthermore, the elastic clamp includes a receiving groove opened at one end of the supporting foot, the interior of the receiving groove is fixedly connected to an ejection spring, one end of the ejection spring is fixedly connected to an arc-shaped clamping block, one end of the arc-shaped clamping block is slidably connected to the interior of the receiving groove, and one end of the arc-shaped clamping block is adapted to the bayonet.

[0022] By adopting the above technical solution, by setting the arc-shaped clamping block and the ejection spring for use together, the arc-shaped clamping block can be pressed to retract into the interior of the storage groove, which can drive the support foot and the storage bin to release the clamping connection.

[0023] In summary, the present application includes at least one of the following beneficial effects:

[0024] 1. First, by setting the heat dissipation holes and the air duct slots for use together, when the back of the back panel fits against the desktop, the heat dissipation holes can be connected to the outside world through the guidance of the air duct slots, so that when the silent fan is started, the hot air inside the frame can be discharged between the back panel and the desktop through the heat dissipation holes and the air duct slots, which effectively increases the exhaust area inside the frame and improves the heat dissipation effect of the tablet computer.

[0025] 2. By setting the support spring and the support foot for use together, pressing the elastic clip releases the connection between the support foot and the storage bin, and causing the support spring to rebound to push out the support foot, driving one end of the support foot to push out of the storage bin along the length direction of the support spring, thereby increasing the distance between one end of the back panel and the desktop, reducing the obstruction of the heat dissipation holes by the desktop, thereby effectively improving the heat dissipation effect of the tablet computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the device body in this application.

[0027] Figure 2 It is an exploded view of the internal structure of the frame in this application.

[0028] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat dissipation fins in this application.

[0029] Figure 4 It is a schematic diagram of the internal structure of the storage bin in this application.

[0030] Description of reference numerals:

[0031] 1. Frame; 2. Back plate; 3. Heat-conducting mounting plate; 4. Heat dissipation holes; 5. Silent fan; 6. Air inlet; 7. Air duct; 8. Dust screen; 9. Semiconductor heat dissipation chip; 10. Heat dissipation fins; 11. Support column; 12. Storage compartment; 13. Support foot; 14. Support spring; 15. Bayonet; 16. Elastic clip; 161. Storage slot; 162. Ejection spring; 163. Arc-shaped block. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-4 This application is described in further detail.

[0033] The embodiment of the present application discloses a heat dissipation structure of a rear cover of a tablet computer.

[0034] Reference Figure 1 and Figure 2 A tablet computer back cover heat dissipation structure comprises a frame 1, a back plate 2 is fixedly connected to one side of the frame 1, a heat conduction mounting plate 3 is fixedly connected to the inside of the frame 1, a heat dissipation hole 4 is opened on one side of the back plate 2, and a silent fan 5 is symmetrically installed on the side of the back plate 2 close to the heat conduction mounting plate 3, air inlets 6 are symmetrically opened at both ends of the frame 1, and a plurality of air guide grooves 7 are opened on the side of the back plate 2 away from the heat conduction mounting plate 3.

[0035] When in use, firstly, the silent fan 5 is started to draw external air into the interior of the frame 1 through the air inlet 6, and at the same time, the air drawn into the interior of the frame 1 is fully in contact with the heat-conducting mounting plate 3 and absorbs the heat transferred from the surface of the heat-conducting mounting plate 3, and then the heat transferred from the surface of the heat-conducting mounting plate 3 is discharged from the interior of the frame 1 through the heat dissipation holes 4. When the back side of the back panel 2 is in contact with the desktop, the hot air discharged from the heat dissipation holes 4 is guided by the air ducts 7 and discharged between the back panel 2 and the desktop, thereby effectively improving the heat dissipation efficiency of the tablet computer.

[0036] Reference Figure 1 and Figure 2 A dust screen 8 is fixedly connected to the inside of the air inlet 6. When external air enters the inside of the frame 1 through the air inlet 6, the dust screen 8 is set to intercept and filter the flowing air, effectively reducing dust and foreign matter in the air from entering the inside of the frame 1, thereby affecting the heat dissipation effect of the tablet computer.

[0037] Reference Figure 1 and Figure 2 One end of the heat-conducting mounting plate 3 is fixedly connected with a semiconductor heat dissipation chip 9, and the heat-conducting mounting plate 3 is set as a heat-conducting copper plate. First, the electrical components are installed on one side of the heat-conducting mounting plate 3. When the electrical components are working and generating heat, the heat generated by the electrical components is quickly absorbed by the semiconductor heat dissipation chip 9, and then introduced into the interior of the heat-conducting mounting plate 3, and the heat generated by the electrical components is diffused out through the heat-conducting mounting plate 3, thereby effectively improving the heat dissipation effect of the tablet computer.

[0038] Reference Figure 1 and Figure 2 The surface of the heat-conducting mounting plate 3 is coated with heat-dissipating silicone grease. By coating the heat-dissipating silicone grease on the surface of the heat-conducting mounting plate 3, the heat-conducting effect of the heat-conducting mounting plate 3 is further enhanced, and the heat dissipation efficiency of the tablet computer is improved.

[0039] Reference Figure 2 and Figure 3 A plurality of heat sink fins 10 are fixedly connected to one side of the heat conducting mounting plate 3 close to the back plate 2. When the semiconductor heat sink chip 9 transfers the heat emitted by the electrical components to the heat conducting mounting plate 3, the heat dissipation area of ​​the heat conducting mounting plate 3 is effectively increased by providing the heat dissipation fins 10, thereby improving the heat dissipation effect of the heat conducting mounting plate 3.

[0040] Reference Figure 1 and Figure 2 The four corners of the heat-conducting mounting plate 3 away from the back plate 2 are fixedly connected with support columns 11. When in use, the electrical components and the heat-conducting mounting plate 3 are separated by the support columns 11, which effectively reduces the contact area between the heat-conducting mounting plate 3 and the motor components, thereby reducing the heat backflow on the surface of the heat-conducting mounting plate 3 and improving the heat dissipation effect of the tablet computer.

[0041] Reference Figure 1 and Figure 2 , Figure 4 The two sides of the frame 1 are symmetrically fixedly connected with storage bins 12, and the interior of the storage bins 12 is slidably connected with support feet 13, one end of the support feet 13 is symmetrically fixedly connected with support springs 14, and the support springs 14 are installed inside the storage bins 12. One end of the storage bin 12 is symmetrically provided with bayonet holes 15, and one end of the support feet 13 is symmetrically provided with elastic clips 16 adapted to the bayonet holes 15.

[0042] When the tablet computer needs to be used intensively, the elastic clip 16 is first pressed so that the elastic clip 16 is deformed and contracted under force, and the support foot 13 and the support spring 14 are released from the clamping, and the support spring 14 is released from the force and rebounds to push out the support foot 13, so that the support foot 13 moves along the length direction of the support spring 14, and at the same time, one end of the support foot 13 is pushed out of the storage bin 12, so that the support foot 13 supports one end of the frame 1, thereby increasing the inclination distance between the back panel 2 and the desktop, and further reducing the desktop's blocking of the heat dissipation hole 4, thereby effectively improving the heat dissipation effect of the tablet computer.

[0043] Reference Figure 1 and Figure 2 , Figure 4 The elastic clamp 16 includes a receiving groove 161 opened at one end of the supporting foot 13, and an ejection spring 162 is fixedly connected to the inside of the receiving groove 161. One end of the ejection spring 162 is fixedly connected to an arc-shaped clamping block 163, and one end of the arc-shaped clamping block 163 is slidably connected to the inside of the receiving groove 161, and one end of the arc-shaped clamping block 163 is adapted to the bayonet 15.

[0044] When in use, by pressing the arc-shaped block 163, the arc-shaped block 163 is forced to oil the ejection spring 162, and at the same time, the ejection spring 162 is forced to shrink and deform, and drive the ejection spring 162 to slide into the interior of the storage groove 161, and at the same time, the arc-shaped block 163 is disengaged from the interior of the bayonet 15, so as to facilitate the release of the clamping fixation between the support foot 13 and the storage bin 12.

[0045] The implementation principle of the heat dissipation structure of the tablet computer back cover of the present embodiment is as follows: firstly, the silent fan 5 is started to draw the external air into the frame 1 through the air inlet 6, and at the same time, the air drawn into the frame 1 is fully in contact with the heat-conducting mounting plate 3 and absorbs the heat transferred from the surface of the heat-conducting mounting plate 3, and then the air is driven by the heat transfer from the surface of the heat-conducting mounting plate 3 to be discharged from the frame 1 through the heat dissipation holes 4. When the back of the back plate 2 is attached to the desktop, the hot air discharged from the heat dissipation holes 4 is guided by the air inlet grooves 7 and discharged between the back plate 2 and the desktop, thereby effectively improving the heat dissipation efficiency of the tablet computer;

[0046] Then, when the tablet computer needs to be used intensively, the elastic clip 16 is first pressed so that the elastic clip 16 is deformed and contracted under force, and the connection between the support foot 13 and the support spring 14 is released. At the same time, the support spring 14 is released from force and rebounds to push out the support foot 13, so that the support foot 13 moves along the length direction of the support spring 14, and at the same time, one end of the support foot 13 is pushed out of the storage bin 12, so that the support foot 13 supports one end of the frame 1, thereby increasing the inclination distance between the back panel 2 and the desktop, and further reducing the desktop's blocking of the heat dissipation hole 4, thereby effectively improving the heat dissipation effect of the tablet computer.

Claims

1. A tablet computer back cover heat dissipation structure, comprising a frame (1), characterized in that: A back plate (2) is fixedly connected to one side of the frame (1), and a heat-conducting mounting plate (3) is fixedly connected inside the frame (1); a heat dissipation hole (4) is provided on one side of the back plate (2), and a silent fan (5) is symmetrically installed on the side of the back plate (2) close to the heat-conducting mounting plate (3); air inlets (6) are symmetrically provided at both ends of the frame (1), and a plurality of air inlet grooves (7) are provided on the side of the back plate (2) away from the heat-conducting mounting plate (3).

2. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: A dustproof net (8) is fixedly connected to the interior of the air inlet (6).

3. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: One end of the heat-conducting mounting plate (3) is fixedly connected to a semiconductor heat dissipation chip (9), and the heat-conducting mounting plate (3) is configured as a heat-conducting copper plate.

4. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: The surface of the heat-conducting mounting plate (3) is coated with heat-dissipating silicone grease.

5. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: A plurality of heat dissipation fins (10) are fixedly connected to one side of the heat-conducting mounting plate (3) close to the back plate (2).

6. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: The four corners of the heat-conducting mounting plate (3) on the side away from the back plate (2) are all fixedly connected with support columns (11).

7. The tablet computer back cover heat dissipation structure according to claim 1, characterized in that: Storage bins (12) are symmetrically fixedly connected to both sides of the frame (1), support legs (13) are slidably connected to the interior of the storage bins (12), one end of the support legs (13) is symmetrically fixedly connected to a support spring (14), the support spring (14) is installed inside the storage bin (12), one end of the storage bin (12) is symmetrically provided with a bayonet (15), and one end of the support legs (13) is symmetrically provided with an elastic clamp (16) adapted to the bayonet (15).

8. The tablet computer rear cover heat dissipation structure according to claim 7, characterized in that: The elastic clamp (16) comprises a receiving groove (161) formed at one end of the supporting foot (13); an ejection spring (162) is fixedly connected to the interior of the receiving groove (161); one end of the ejection spring (162) is fixedly connected to an arc-shaped clamping block (163); one end of the arc-shaped clamping block (163) is slidably connected to the interior of the receiving groove (161); and one end of the arc-shaped clamping block (163) is adapted to the bayonet (15).

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