M.2 solid state disk reinforcing and heat conducting device and VPX board card

Abstract

The utility model discloses an M.2 solid state hard disk reinforcing and heat conducting device and a VPX board card, the M.2 solid state hard disk reinforcing and heat conducting device comprises a body detachably installed on a carrier plate, the body is provided with an installation groove, the open end of the installation groove faces a PCIe slot of the carrier plate, the closed end of the installation groove is provided with a threaded hole for a locking screw to penetrate through, and the locking screw penetrates through the threaded hole. A PCIe slot is formed in the body, an M.2 solid state disk inserted into the PCIe slot is fixed in a corresponding mounting groove in a locked state, a back side face heat conduction interface material is further arranged in the mounting groove, and the back side face heat conduction interface material is clamped between the M.2 solid state disk and the upper surface of the mounting groove, so that heat of the back side face of the M.2 solid state disk is conducted to the body. A carrier plate of the VPX board card is clamped between the top face cold guide plate and the bottom face cold guide plate, and the carrier plate is provided with an M.2 solid state disk reinforcing and heat conducting device. According to the utility model, the bottleneck problems of poor locking reliability and insufficient heat dissipation of the M.2 solid state disk are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, and in particular to an M.2 solid state hard disk reinforcement and heat conduction device and a VPX board card. Background Art

[0002] M.2 solid-state drives using PCIe channels have fast speeds, large data transfer volumes, and are inherently small in size. They are widely used, but currently have the following problems during use:

[0003] One end of the M.2 SSD is a gold finger, which is connected to the PCIe slot by pressure contact. The PCIe slot is connected to the carrier board by patch welding. The other end is the fastening end, which has only one semicircular hole locking position and is connected to the carrier board through a stud. However, in a vibration and shock environment, only relying on the semicircular hole to lock will result in insufficient locking force for the entire M.2 SSD, and additional reinforcement technology is required to make it meet the requirements of vibration and shock.

[0004] The heat generated by M.2 solid state drives when reading and writing is relatively concentrated on the main controller and NAND storage particles. Frequent and large-scale reading and writing will cause heat accumulation, especially when installed in a closed space, the heat dissipation is even more inadequate. If the heat dissipation is not sufficient, the reading and writing speeds will be reduced, affecting the system performance and service life. Utility Model Content

[0005] The technical problem to be solved by the utility model is as follows: In view of the above-mentioned problems in the prior art, an M.2 solid state hard disk reinforcement and heat conduction device and a VPX board are provided to solve the bottleneck problems of poor locking reliability and insufficient heat dissipation of the M.2 solid state hard disk.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] An M.2 solid-state hard disk reinforcement and heat conduction device includes a main body that is detachably mounted on a carrier board, the main body is provided with a mounting slot, the open end of the mounting slot faces the PCIe slot of the carrier board, the closed end of the mounting slot is provided with a threaded hole for a locking screw to pass through, so that the M.2 solid-state hard disk inserted into the PCIe slot is fixed in the corresponding mounting slot in a locked state, and the mounting slot is also provided with a back-side thermal interface material, and the back-side thermal interface material is clamped between the M.2 solid-state hard disk and the upper surface of the mounting slot, so that the heat of the back side of the M.2 solid-state hard disk is conducted to the main body.

[0008] Optionally, a groove is provided on the upper surface of the mounting slot, and the back-side thermal interface material is arranged in the groove.

[0009] Optionally, assembly gaps are provided between the two sides and the end of the M.2 solid state drive and the corresponding installation slot (102).

[0010] Optionally, the assembly gap is 0.1 mm.

[0011] Optionally, the body (101) is made of aluminum alloy material.

[0012] Optionally, screws are provided on the bottom surface of the carrier plate, threaded through holes are provided on the bosses on both sides of the mounting groove, the carrier plate is provided with through holes corresponding to the threaded through holes, and the screws are threadably matched with the corresponding threaded through holes after passing through the corresponding through holes.

[0013] The utility model also proposes a VPX board, including a top cold conduction plate, a carrier plate and a bottom cold conduction plate, wherein the carrier plate is clamped between the top cold conduction plate and the bottom cold conduction plate, and the carrier plate is installed with any one of the M.2 solid state hard disk reinforcement and heat conduction devices described.

[0014] Optionally, a heat-conducting boss is provided at the bottom of the top cold-conducting plate, and the heat-conducting boss corresponds one-to-one with the mounting groove of the M.2 solid-state hard disk reinforcement and heat-conducting device and the bosses on both sides of the mounting groove.

[0015] Optionally, a front side thermal conductive interface material is provided between the thermal conductive boss and the corresponding mounting groove or the corresponding boss.

[0016] Optionally, a heat dissipation fin is provided on the top of the top surface cold conduction plate.

[0017] Compared with the prior art, the advantages of the utility model are:

[0018] The utility model provides a mounting slot for placing an M.2 solid-state hard drive on a main body, the open end of the mounting slot faces the PCIe slot, and the closed end of the mounting slot is provided with a threaded hole for a locking screw to pass through, so that the M.2 solid-state hard drive inserted into the PCIe slot is fixed in the corresponding mounting slot in a locked state, and the mounting slot is limited in three directions, namely, on both sides of the M.2 solid-state hard drive and at an end away from the PCIe slot, thereby solving the problem of poor locking reliability of the M.2 solid-state hard drive.

[0019] The utility model arranges a thermal interface material on the bottom surface of the installation groove, so that the thermal interface material is sandwiched between the back side surface of the M.2 solid state drive and the bottom surface of the installation groove, thereby being able to effectively conduct the heat of particles on the back side surface of the M.2 solid state drive to the body, solving the problem of insufficient heat dissipation on the back side surface of the M.2 solid state drive in a closed space. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the M.2 solid state drive reinforcement and heat conduction device according to an embodiment of the utility model.

[0021] Figure 2 It is an exploded view of a carrier board equipped with an M.2 solid state drive reinforcement and heat conduction device in an embodiment of the utility model.

[0022] Figure 3 It is an exploded view of the VPX board in the embodiment of the present utility model.

[0023] Figure 4 It is a cross-sectional view of the VPX board in the embodiment of the present utility model.

[0024] Figure 5 It is a schematic diagram of the bottom structure of the top surface cold conduction plate in the embodiment of the utility model.

[0025] Legend: 101-main body, 102-installation slot, 103-back side thermal interface material, 104-groove, 1-top cold plate, 2-carrier board, 3-bottom cold plate, 4-front side thermal interface material, 11-thermal boss, 201-locking screw, 202-screw, 301-PCIe slot, 302-M.2 solid state drive. DETAILED DESCRIPTION

[0026] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0027] Embodiment 1

[0028] The gold finger end of the M.2 solid-state drive is connected to the PCIe slot by pressure contact. The fastening end has only one semicircular hole locking position. The locking position is not enough, resulting in insufficient locking force in a vibration and impact environment. There is a risk of large displacement, including the risk of large displacement of the main control chip and the NAND storage particle chip solder feet.

[0029] In order to solve the above problems, this embodiment proposes an M.2 solid state drive reinforcement and heat conduction device, which solves the bottleneck of poor locking reliability of M.2 solid state drives and insufficient heat dissipation of the heat of NAND storage particles on the back side in closed spaces such as VPX board modules. Figure 1 As shown, it includes a main body 101 , and a mounting groove 102 is provided on the main body 101 .

[0030] like Figure 2As shown, in this embodiment, the body 101 of the M.2 solid-state hard drive reinforcement and heat-conducting device can be detachably installed on the carrier board, the open end of the mounting slot 102 faces the PCIe slot 301 of the carrier board, and the closed end of the mounting slot 102 is provided with a threaded hole for the locking screw 201 to pass through, so that the M.2 solid-state hard drive 302 inserted into the PCIe slot 301 is fixed in the corresponding mounting slot 102 in a locked state, and the mounting slot 102 is limited in three directions on both sides of the M.2 solid-state hard drive 302 and the end away from the PCIe slot, thereby solving the problem of poor locking reliability of the M.2 solid-state hard drive.

[0031] like Figure 2 As shown, in this embodiment, a back-side thermal conductive interface material 103 is also provided in the mounting slot 102, and the back-side thermal conductive interface material 103 is clamped between the M.2 solid-state drive 302 and the upper surface of the mounting slot 102, so that the heat of the back side of the M.2 solid-state drive 302 is transferred to the main body 101.

[0032] The back-side thermal conductive interface material 103 in this embodiment is a soft rubber pad material that can fill gaps, make up for the low roughness precision and has high thermal conductivity, such as a silicone thermal conductive pad.

[0033] It should be noted that there may be one or more mounting slots 102 on the body 101, and the number of mounting slots 102 is determined by the number of PCIe slots on the carrier board. The specific number of mounting slots 102 is not limited in this embodiment. Figure 2 There are 4 PCIe slots on the carrier board, so the number of mounting slots 102 is 4.

[0034] In this embodiment, the detachable installation method of the body 101 and the carrier board is specifically screw installation, as shown in FIG. Figure 2 As shown, screws 202 are provided on the bottom surface of the carrier plate, and threaded through holes are provided on the bosses on both sides of the mounting groove 102. The carrier plate is provided with through holes corresponding to the threaded through holes. After the screws 202 pass through the corresponding through holes, they are threadedly matched with the corresponding threaded through holes, so that the main body 101 is fastened to the carrier plate through the screws 202.

[0035] In this embodiment, the locking screw 201 and the screw 202 are both M2.5*6 triple combination screws.

[0036] like Figure 1 and Figure 2As shown, in this embodiment, a groove 104 is provided on the upper surface of the mounting slot 102, and the back-side thermal interface material 103 is arranged in the groove 104. Since the width of the groove 104 is smaller than the width of the mounting slot 102, the side of the groove 104 limits the M.2 solid-state drive 302 in the mounting slot 102 in the vertical direction in the height direction, and the groove 104 provides space for accommodating the back-side thermal interface material 103.

[0037] In this embodiment, a 0.1 mm assembly gap is reserved between the installation slot 102 and the two sides and the end of the M.2 solid-state hard drive, which can allow assembly errors during the manual installation of the M.2 solid-state hard drive. At the same time, because the 0.1 mm gap is much smaller than the minimum displacement required for the solid-state hard drive itself and its own main control chip and the NAND storage particle chip solder pins to be damaged, it avoids large displacement when the locking force of the M.2 solid-state hard drive is insufficient.

[0038] In this embodiment, the body 101 is made of aluminum alloy material, specifically AL6063-T6 material, and the parts are easy to process, have high strength and high thermal conductivity.

[0039] Embodiment 2

[0040] This embodiment provides a VPX card, such as Figure 3 As shown, it includes a top cold conduction plate 1, a carrier plate 2 and a bottom cold conduction plate 3, and the carrier plate 2 is sandwiched between the top cold conduction plate 1 and the bottom cold conduction plate 3. Figure 4 As shown, the lower cavity of the top cold conduction plate 1 and the upper cavity of the bottom cold conduction plate 3 together form a closed space for accommodating the carrier board 2. In order to solve the problem of fixing and cooling the M.2 solid state drive installed on the carrier board 2 in the closed space, as shown in FIG. Figure 3 As shown, the carrier board 2 is installed with the M.2 solid state drive reinforcement and heat conduction device described in Example 1. It should be noted that the M.2 solid state drive reinforcement and heat conduction device described in Example 1 can be used to protect the M.2 solid state drive installed in a closed space.

[0041] like Figure 5 As shown, a heat-conducting boss 11 is provided at the bottom of the top cold-conducting plate 1 in this embodiment, and the heat-conducting boss 11 corresponds one-to-one with the mounting groove 102 of the M.2 solid-state hard disk reinforcement and heat-conducting device and the bosses on both sides of the mounting groove 102. A front side thermal conductive interface material 4 is provided between the heat-conducting boss 11 and the corresponding mounting groove 102 or the corresponding boss, and the heat of the front side of the M.2 solid-state hard disk 302 in the mounting groove 102 and the heat of the main body 101 of the M.2 solid-state hard disk reinforcement and heat-conducting device can be transferred to the top cold-conducting plate 1 through the front side thermal conductive interface material 4.

[0042] In this embodiment, the front side thermal conductive interface material 4 is a silicone thermal conductive pad.

[0043] like Figure 3 As shown, the top of the top cold conduction plate 1 in this embodiment is provided with heat dissipation fins, which can perform heat exchange with the air.

[0044] In this embodiment, the carrier board 2 has 4 PCIe slots, so the number of the installation slots 102 of the M.2 solid state hard disk reinforcement and heat conduction device is 4, and the body 101 of the M.2 solid state hard disk reinforcement and heat conduction device has a total of 5 bosses, each of which has 2 threaded through holes. Figure 3 As shown, the body 101 of the M.2 solid state drive reinforcement and heat conduction device is first fastened to the carrier board 2 through 10 M2.5*6 three-combination screws, and the back side thermal interface material 103 is installed in the corresponding groove 104, and then the M.2 solid state drive 302 is installed on the carrier board 2, and the M2.5*6 three-combination screw is passed through the semicircular hole of the M.2 solid state drive fastening end and then fastened to the corresponding threaded hole on the body 101, and the installation groove 102 of the body 101 limits the M.2 solid state drive in three directions. During the operation of the M.2 solid state drive, the heat of the NAND storage particles on the back side is transferred to the body 101 through the back side thermal interface material 103, and the body 101 is then transferred to the top cold plate 1 through the front side thermal interface material 4, and the heat is heat-exchanged with the air through the fins on the top cold plate 1.

[0045] In summary, the utility model discloses an M.2 solid state drive reinforcement and heat conduction device, which is an integrated device, easy to install, highly flexible, capable of limiting and fixing the M.2 solid state drive in three directions, and conducting heat dissipation to the NAND storage particles on the back side of the M.2 solid state drive. On this basis, a VPX board is designed, on which an M.2 solid state drive reinforcement and heat conduction device is installed on its carrier board to protect the M.2 solid state drive installed in a closed space, effectively solving the bottleneck problem of poor locking reliability of the M.2 solid state drive and insufficient heat dissipation of the heat of the NAND storage particles on the back side in the closed space of the VPX board module.

[0046] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. An M.2 solid state drive reinforcement and heat conduction device, characterized in that: The invention comprises a main body (101) which can be detachably mounted on a carrier board, wherein a mounting slot (102) is provided on the main body (101), wherein the open end of the mounting slot (102) faces the PCIe slot of the carrier board, and the closed end of the mounting slot (102) is provided with a threaded hole for a locking screw to pass through, so that an M.2 solid-state hard disk inserted into the PCIe slot is fixed in the corresponding mounting slot (102) in a locked state, and a back-side thermal conductive interface material (103) is also provided in the mounting slot (102), and the back-side thermal conductive interface material (103) is sandwiched between the M.2 solid-state hard disk and the upper surface of the mounting slot (102), so that the heat of the back side of the M.2 solid-state hard disk is transferred to the main body (101).

2. The M.2 solid state drive reinforcement and heat conduction device according to claim 1, characterized in that: The upper surface of the installation slot (102) is provided with a groove (104), and the back-side thermal interface material (103) is arranged in the groove (104).

3. The M.2 solid state drive reinforcement and heat conduction device according to claim 1, characterized in that: Assembly gaps are provided between the two sides and ends of the M.2 solid state hard disk and the corresponding installation slots (102).

4. The M.2 solid state drive reinforcement and heat conduction device according to claim 3, characterized in that: The assembly gap is 0.1 mm.

5. The M.2 solid state drive reinforcement and heat conduction device according to claim 1, characterized in that: The bottom surface of the carrier plate is provided with screws, the bosses on both sides of the installation groove (102) are provided with threaded through holes, the carrier plate is provided with through holes corresponding to the threaded through holes, and the screws are threadably matched with the corresponding threaded through holes after passing through the corresponding through holes.

6. The M.2 solid state drive reinforcement and heat conduction device according to claim 1, characterized in that: The body (101) is made of aluminum alloy material.

7. A VPX card, characterized in that: It comprises a top cold conduction plate (1), a carrier plate (2) and a bottom cold conduction plate (3), wherein the carrier plate (2) is sandwiched between the top cold conduction plate (1) and the bottom cold conduction plate (3), and the carrier plate (2) is installed with the M.2 solid state hard disk reinforcement and heat conduction device according to any one of claims 1 to 6.

8. The VPX board according to claim 7, characterized in that: A heat-conducting boss (11) is provided at the bottom of the top cold-conducting plate (1), and the heat-conducting boss (11) corresponds one-to-one with the mounting groove (102) of the M.2 solid-state hard disk reinforcement and heat-conducting device and the bosses on both sides of the mounting groove (102).

9. The VPX board according to claim 8, characterized in that: A front-side heat-conducting interface material (4) is provided between the heat-conducting boss (11) and the corresponding mounting groove (102) or the corresponding boss.

10. The VPX board according to claim 7, characterized in that: The top of the top surface cold conduction plate (1) is provided with heat dissipation fins.

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