Semiconductor chip stacking and packaging device

Abstract

The utility model discloses a semiconductor chip stacking and packaging device, which relates to the technical field of semiconductor chip stacking and packaging and comprises a packaging box, a moving component is fixedly mounted on the bottom surface of the packaging box, heat dissipation mechanisms are fixedly mounted on two sides of the packaging box, a lifting mechanism is fixedly mounted on the back surface of the packaging box, and the lifting mechanism is fixedly mounted on the bottom surface of the packaging box. A placing assembly is movably installed on the surface of the lifting mechanism, and the lifting mechanism comprises a protection box. By arranging the lifting mechanism, the servo motor can be started to drive the threaded rod in the protection box to rotate, so that the supporting plate drives the placement assembly to move up and down, manual placement and taking out of semiconductor chips are facilitated, and low efficiency caused by layer-by-layer taking is prevented; the connecting rods are directly arranged to connect the placing frames, so that the connection stability can be improved, and the situation that the semiconductor chip shakes and is abraded due to overall shaking caused by the counter-acting force of the spring can be prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip stacking packaging, and in particular to a semiconductor chip stacking packaging device. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits. At present, the existing semiconductor packaging devices have poor heat dissipation effects and do not have good buffering performance. When the circuit board is vibrated, the chip is easily damaged.

[0003] In the prior art, a Chinese patent document with publication number CN214705914U is proposed to solve the above-mentioned technical problems. The technical solution disclosed in the patent document is as follows: a semiconductor chip stacking packaging device, comprising a stacking box, a top cover is installed on the top of the stacking box by bolts, and a ventilation groove is opened on one side of the top outer wall of the top cover, and a dustproof net is installed inside the ventilation groove by bolts.

[0004] In order to solve the problem that the existing semiconductor packaging device has poor heat dissipation effect and does not have good buffering performance, and the chip is easily damaged when the circuit board is vibrated, the existing technology adopts the method of setting a fan, a heat dissipation groove and a spring to deal with it. However, there is still a situation where the spring connection has a certain reaction force, and the upper and lower removal needs to be done manually in sequence, which leads to the spring reaction force causing the semiconductor chip to shake up and down in the gap and wear, and the manual removal efficiency is low. Utility Model Content

[0005] The purpose of the present invention is to provide a semiconductor chip stacking packaging device to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] A semiconductor chip stacking packaging device comprises a packaging box, a moving component is fixedly installed on the bottom surface of the packaging box, a heat dissipation mechanism is fixedly installed on both sides of the packaging box, a lifting mechanism is fixedly installed on the back of the packaging box, and a placement component is movably installed on the surface of the lifting mechanism;

[0008] The lifting mechanism comprises a protection box, a servo motor, a threaded rod and a support plate.

[0009] A further improvement of the technical solution of the utility model is that: the packaging box comprises a packaging box body, a sliding rod is fixedly installed on the inner surface of the packaging box body, and a packaging cover is movably installed on the top surface of the packaging box body.

[0010] A further improvement of the technical solution of the utility model is that the moving component includes shock-absorbing wheels fixedly installed at the four ends of the bottom surface of the packaging box body, and a positioning rod is fixedly installed on the bottom surface of the packaging box body. By arranging the shock-absorbing wheels, the mobility flexibility can be improved while reducing the impact of vibration.

[0011] A further improvement of the technical solution of the utility model is that the heat dissipation mechanism includes mounting covers fixedly mounted on both sides of the packaging box body, a dustproof net is fixedly mounted on the surface of the mounting cover, and a heat dissipation fan is fixedly mounted inside the mounting cover. By arranging the heat dissipation fans on both sides, the heat dissipation efficiency can be effectively improved.

[0012] A further improvement of the technical solution of the utility model is that: the protective box is fixedly mounted on the back of the packaging box body, the servo motor is fixedly mounted on the top surface of the protective box, the threaded rod is fixedly mounted on the output end of the servo motor, and the support plate is movably mounted on the surface of the threaded rod. By setting a lifting mechanism, the servo motor can be started to drive the threaded rod in the protective box to rotate, so that the support plate drives the placement component to move up and down, which is convenient for manual placement and removal of semiconductor chips and prevents low efficiency caused by taking them out layer by layer.

[0013] A further improvement of the technical solution of the utility model is that: the placement component includes a placement frame movably mounted on the surface of the support plate, a support bracket is fixedly mounted on the inner surface of the placement frame, a connecting rod is fixedly mounted on the surface of the placement frame, and a ventilation hole is opened on the bottom surface of the placement frame. By eliminating the use of springs and directly arranging connecting rods to connect the placement frames, the connection stability can be improved while preventing the reaction force of the spring from causing the overall shaking and causing the semiconductor chip to shake and wear. By arranging the support bracket and ventilation holes on the placement frame, the fluidity of the air can be effectively improved, and the cooling fan can be prevented from being restricted when guiding air, resulting in weak fluidity and inability to contact all the semiconductor chips, thereby achieving overall cooling and heat dissipation.

[0014] A further improvement of the technical solution of the utility model is that the threaded rod and the protection box are movably connected, and the placement frame and the sliding rod are movably connected.

[0015] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0016] The utility model provides a semiconductor chip stacking packaging device. By setting a lifting mechanism, a servo motor can be started to drive the threaded rod in the protection box to rotate, so that the support plate drives the placement component to move up and down, which is convenient for manual placement and removal of semiconductor chips and prevents low efficiency caused by taking them out layer by layer.

[0017] The utility model provides a semiconductor chip stacking packaging device, which eliminates the use of springs and directly sets connecting rods to connect the placement frames, thereby improving the connection stability and preventing the reaction force of the spring from causing the entire chip to shake and cause the semiconductor chip to shake and wear.

[0018] The utility model provides a semiconductor chip stacking packaging device, which can effectively improve the fluidity of air by arranging a support frame and ventilation holes on a placement frame, prevent the cooling fan from being restricted when guiding air, resulting in weak fluidity and inability to contact all semiconductor chips, thereby achieving overall cooling and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0021] Figure 3 For this utility model Figure 2 A schematic diagram of the enlarged structure at point A;

[0022] Figure 4 This is a schematic diagram of the lifting mechanism structure of the utility model;

[0023] Figure 5 It is a schematic diagram of the placement component structure of the utility model.

[0024] In the figure: 1. packaging box; 2. moving component; 3. heat dissipation mechanism; 4. lifting mechanism; 5. placement component; 11. packaging box body; 12. sliding rod; 13. packaging cover; 21. shock-absorbing wheel; 22. positioning rod; 31. installation cover; 32. dustproof net; 33. cooling fan; 41. protection box; 42. servo motor; 43. threaded rod; 44. support plate; 51. placement frame; 52. supporting bracket; 53. connecting rod; 54. ventilation hole. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below in conjunction with the embodiments: Example

[0026] like Figure 1-5As shown, the utility model provides a semiconductor chip stacking packaging device, including a packaging box 1, the packaging box 1 includes a packaging box body 11, a sliding rod 12 is fixedly installed on the inner surface of the packaging box body 11, a packaging cover 13 is movably installed on the top surface of the packaging box body 11, a moving component 2 is fixedly installed on the bottom surface of the packaging box 1, heat dissipation mechanisms 3 are fixedly installed on both sides of the packaging box 1, a lifting mechanism 4 is fixedly installed on the back of the packaging box 1, and a placement component 5 is movably installed on the surface of the lifting mechanism 4; the lifting mechanism 4 includes a protective box 41, a servo motor 42, a threaded rod 43 and a support plate 44. By setting the lifting mechanism 4, the placement component 5 can be driven by a motor to move up and down, thereby facilitating the removal of semiconductor chips. Example

[0027] like Figure 1-5 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the moving component 2 includes shock-absorbing wheels 21 fixedly installed at the four ends of the bottom surface of the packaging box body 11, and the bottom surface of the packaging box body 11 is fixedly installed with positioning rods 22. The heat dissipation mechanism 3 includes a mounting cover 31 fixedly installed on both sides of the packaging box body 11, and a dustproof net 32 ​​is fixedly installed on the surface of the mounting cover 31. A cooling fan 33 is fixedly installed inside the mounting cover 31. When the internal temperature is high, the cooling fan 33 can be started to cooperate with the dustproof net 32 ​​to guide air, cool down and dissipate heat. Example

[0028] like Figure 1-5 As shown, on the basis of Examples 1-2, the utility model provides a technical solution: preferably, the protective box 41 is fixedly mounted on the back of the packaging box body 11, the servo motor 42 is fixedly mounted on the top surface of the protective box 41, the threaded rod 43 is fixedly mounted on the output end of the servo motor 42, the support plate 44 is movably mounted on the surface of the threaded rod 43, the placement component 5 includes a placement frame 51 movably mounted on the surface of the support plate 44, a supporting frame 52 is fixedly mounted on the inner surface of the placement frame 51, a connecting rod 53 is fixedly mounted on the surface of the placement frame 51, and a ventilation hole 54 is provided on the bottom surface of the placement frame 51, the threaded rod 43 and the protective box 41 are movably connected, and the placement frame 51 and the sliding rod 12 are movably connected. By setting a lifting mechanism 4, the servo motor 42 can be started to drive the threaded rod 43 in the protective box 41 to rotate, so that the support plate drives the placement component 5 to move up and down, which is convenient for manual placement and removal of semiconductor chips and prevents low efficiency caused by taking them out layer by layer.

[0029] The working principle of the semiconductor chip stacking packaging device is described in detail below.

[0030] like Figure 1-5As shown, when the packaging device is in use, take the packaging cover 13, start the servo motor 42 to make the threaded rod 43 realize the upward movement of the support plate 44, thereby driving the placement component 5 to move up, and place the semiconductor chip on the support frame 52 of the placement frame 51. Because the connecting rod 53 can connect multiple groups to store semiconductor chips, the servo motor 42 is driven to reversely control the rotation of the threaded rod 43 to realize the downward movement of the placement component 5 in the packaging box body 11, and the packaging cover 13 is covered for packaging. When the temperature is too high, the cooling fan 33 can be started to cooperate with the dustproof net 32 ​​for ventilation and heat dissipation. At the same time, the ventilation holes 54 on the placement frame 51 can effectively improve the fluidity of the wind. The overall packaging device can be moved and transported through the shock-absorbing wheel 21, and the positioning rod 22 can be fixed in position after moving.

[0031] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A semiconductor chip stacking packaging device, comprising a packaging box (1), characterized in that: A moving component (2) is fixedly mounted on the bottom surface of the packaging box (1), heat dissipation mechanisms (3) are fixedly mounted on both sides of the packaging box (1), a lifting mechanism (4) is fixedly mounted on the back surface of the packaging box (1), and a placement component (5) is movably mounted on the surface of the lifting mechanism (4); The lifting mechanism (4) comprises a protection box (41), a servo motor (42), a threaded rod (43) and a support plate (44).

2. The semiconductor chip stacking packaging device according to claim 1, characterized in that: The packaging box (1) comprises a packaging box body (11), a sliding rod (12) is fixedly mounted on the inner surface of the packaging box body (11), and a packaging cover (13) is movably mounted on the top surface of the packaging box body (11).

3. The semiconductor chip stacking packaging device according to claim 2, characterized in that: The moving assembly (2) comprises shock-absorbing wheels (21) fixedly mounted on four ends of the bottom surface of the packaging box body (11), and a positioning rod (22) is fixedly mounted on the bottom surface of the packaging box body (11).

4. The semiconductor chip stacking packaging device according to claim 2, characterized in that: The heat dissipation mechanism (3) comprises a mounting cover (31) fixedly mounted on both sides of the packaging box body (11), a dustproof net (32) fixedly mounted on the surface of the mounting cover (31), and a heat dissipation fan (33) fixedly mounted inside the mounting cover (31).

5. The semiconductor chip stacking packaging device according to claim 2, characterized in that: The protection box (41) is fixedly mounted on the back of the packaging box body (11), the servo motor (42) is fixedly mounted on the top surface of the protection box (41), the threaded rod (43) is fixedly mounted on the output end of the servo motor (42), and the support plate (44) is movably mounted on the surface of the threaded rod (43).

6. The semiconductor chip stacking packaging device according to claim 5, characterized in that: The placement assembly (5) comprises a placement frame (51) movably mounted on the surface of a support plate (44), a support bracket (52) fixedly mounted on the inner surface of the placement frame (51), a connecting rod (53) fixedly mounted on the surface of the placement frame (51), and a ventilation hole (54) is provided on the bottom surface of the placement frame (51).

7. The semiconductor chip stacking packaging device according to claim 6, characterized in that: The threaded rod (43) and the protection box (41) are movably connected, and the placement frame (51) and the sliding rod (12) are movably connected.

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