Frame base guide structure

Abstract

The utility model discloses a frame base guide structure, which relates to the technical field of semiconductor packaging, improves the limitation of the existing single base guide structure and solves the problem of single function, and comprises a first pin, a second pin, an auxiliary pin, a main control chip and two secondary control chips, the plurality of auxiliary pins are arranged at intervals; the two secondary control chips are respectively provided with a connecting piece, and the secondary control chips are electrically connected with the main control chip through the connecting pieces; wherein the first pin and the second pin are respectively connected with the secondary control chip. The method has the effect of increasing the functional diversity of the product.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a frame-based guide structure. Background Art

[0002] In semiconductor packaging technology, the lead frame is a key component in semiconductor packaging; it is a key structural component that forms an electrical circuit by using bonding materials (such as gold wire, aluminum wire, copper wire, etc.) to achieve electrical connection between the lead end of the chip's internal circuit and the lead, and serves as a bridge to connect with external wires. In addition, in the design of the lead frame, the base conductor structure is usually the basic structure that constitutes the internal electrical connection path of the semiconductor package.

[0003] At present, the single-base conductor structure is commonly used in lead frames, which generally has only one base conductor and has the advantages of simple structure, convenient manufacturing and maintenance, low cost, etc. However, in actual applications, due to the limitations of the single-base conductor structure, there is a situation where the function is relatively single, resulting in poor overall adaptability of the product. Utility Model Content

[0004] In order to improve the overall adaptability of the product, the present application provides a frame-based guide structure.

[0005] The present application provides a frame-based guide structure, which adopts the following technical solution:

[0006] A frame-based conductor structure comprises a first pin, a second pin, an auxiliary pin, a main control chip and two secondary control chips; the auxiliary pins are multiple and arranged at intervals; the two secondary control chips are respectively provided with connectors, and the secondary control chips are electrically connected to the main control chip through the connectors; wherein the first pin and the second pin are respectively connected to the secondary control chips.

[0007] Preferably, the connecting member is a conductive wire, and the conductive member is made of a metal material; the main control chip includes a main control pad, and the secondary control chip is electrically connected to the main control pad through the conductive wire.

[0008] Preferably, the plurality of auxiliary pins are divided into two groups and are distributed on two sides; the first pin and the second pin are located on the same side; and the main control chip is located between the auxiliary pins on both sides.

[0009] Preferably, the plurality of auxiliary pins are electrically connected to the main control chip respectively through conductive wires.

[0010] In summary, the present application includes at least one of the following beneficial effects:

[0011] By assembling two secondary control chips on the base conductor structure, adjusting the positions of components such as auxiliary pins, and connecting the first pin and the second pin to the secondary control chip respectively, and then electrically connecting the pins of the MOS tube in the secondary control chip and the pads of the main control chip through conductive wires, the main control chip can realize power control, signal amplification, circuit protection / switching and other functions with the support of the MOS tube, thereby increasing the diversity of product functions and improving the overall adaptability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective schematic diagram of the overall structure of this embodiment of the present application;

[0013] Figure 2 This is a top view schematic diagram of the present application embodiment highlighting the location of the main control chip and the secondary control chip on the substrate.

[0014] Explanation of the reference numerals: 1. main control chip; 2. secondary control chip; 3. conductive wire; 4. auxiliary pin; 5. first pin; 6. second pin. DETAILED DESCRIPTION

[0015] The present application is further described in detail below in conjunction with the accompanying drawings.

[0016] Reference Figure 1 and Figure 2 The embodiment of the present application discloses a frame-based conductor structure, including a main control chip 1 and two sub-control chips 2. Without changing the size of the original base conductor structure, after adjusting the positions of other components, the two sub-control chips 2 are installed, and the two sub-control chips 2 are electrically connected to the main control chip 1, respectively, so that the main control chip 1 can realize multiple functions, so as to realize the diversity of the overall functions of the product, thereby improving the overall adaptability.

[0017] Reference Figure 1 and Figure 2 Specifically, the two ends of the main control chip 1 extend outward to be flush with the side walls of the base conductor structure after plastic packaging to meet the semiconductor packaging requirements. The two secondary control chips 2 are respectively provided with connectors, which are conductive wires 3. The conductive wires 3 are made of gold wires, aluminum wires or copper wires and have a certain conductivity. The secondary control chip 2 includes a MOS tube, and the main control chip 1 includes a main control pad. The pins of the MOS tube are electrically connected to the main control pad through the conductive wires 3.

[0018] Reference Figure 1 and Figure 2When in use, with the support of the MOS tube in the secondary control chip 2, the main control chip 1 can realize PWM (pulse width modulation) control (the main control chip 1 can realize PWM control by controlling the on-time and off-time of the MOS tube in the secondary control chip 2), power management: (the main control chip 1 can use the MOS tube in the secondary control chip 2 to realize power management function), signal amplification (the main control chip 1 can use the MOS tube in the secondary control chip 2 to realize signal amplification function), circuit protection / switching (the main control chip 1 can use the MOS tube in the secondary control chip 2 to realize circuit protection / switching function) and other functions. These functions can be applied to various electronic systems, such as motor drive, audio amplification, wireless communication and other fields, which greatly meet the requirements of the base conductor structure in the lead frame, thereby improving the overall adaptability of the product.

[0019] Reference Figure 1 and Figure 2 In addition, the frame-based conductor structure also includes auxiliary pins 4 for connecting external components. In the present embodiment, there are six auxiliary pins 4 in total; four auxiliary pins 4 are arranged in a group on the same side of the substrate, and two auxiliary pins 4 are arranged in a group on the other side of the substrate. The main control chip 1 is located between the auxiliary pins 4 on both sides for wiring connection. In addition, the frame-based conductor structure also includes a first pin 5 and a second pin 6, and the first pin 5 and the second pin 6 and the six auxiliary pins 4 constitute a lead frame. One side of the first pin 5 and one side of the second pin 6 are respectively fixed to the side of the secondary control chip 2 away from the main control chip 1, and after the secondary control chip 2 is electrically connected to the main control chip 1 through the conductive wire 3, the first pin 5 and the second pin 6 are indirectly electrically connected to the main control chip 1.

[0020] Reference Figure 1 and Figure 2 Furthermore, the plurality of auxiliary pins 4 are also electrically connected to the main control chip 1 through the conductive wires 3. That is, one end of the conductive wire 3 is welded to the auxiliary pin 4, and the other end of the conductive wire 3 is welded to the pad of the main control chip 1.

[0021] The implementation principle of a frame-based guide structure in the embodiment of the present application is:

[0022] By adding two secondary control chips 2 on the basis of the original base conductor structure, and adjusting the positions of other components (such as pins, the first pin 5, the second pin 6, etc.), and then electrically connecting the secondary control chip 2 and the auxiliary pin 4 to the main control chip 1 respectively, the purpose of adding chips is achieved without changing the size of the base conductor structure, and the pins of the MOS tube in the secondary control chip 2 and the pads of the main control chip 1 are electrically connected through the conductive wire 3; with the support of the MOS tube in the secondary control chip 2, the main control chip 1 can realize PWW control, signal amplification, circuit protection / switching and other functions, which increases the diversity of the overall functions of the product, thereby improving the overall adaptability of the product.

[0023] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A frame-based guide structure, characterized in that: The invention comprises a first pin (5), a second pin (6), an auxiliary pin (4), a main control chip (1) and two secondary control chips (2); the auxiliary pins (4) are multiple and arranged at intervals; the two secondary control chips (2) are respectively provided with a connecting piece, and the secondary control chip (2) is electrically connected to the main control chip (1) via the connecting piece; wherein the first pin (5) and the second pin (6) are respectively connected to the secondary control chip (2).

2. A frame-based guide structure according to claim 1, characterized in that: The connecting piece is a conductive wire (3), and the conductive material is made of a metal material; the main control chip (1) comprises a main control pad, and the secondary control chip (2) is electrically connected to the main control pad via the conductive wire (3).

3. A frame-based guide structure according to claim 1, characterized in that: The plurality of auxiliary pins (4) are divided into two groups and are distributed on both sides; the first pin (5) and the second pin (6) are located on the same side; and the main control chip (1) is located between the auxiliary pins (4) on both sides.

4. A frame-based guide structure according to claim 2, characterized in that: The plurality of auxiliary pins (4) are electrically connected to the main control chip (1) respectively via conductive wires (3).

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