Air conditioner partner socket
By adopting a combined structure of a thermal frame and a heat dissipation fin in the air-conditioning companion socket, the problem of low heat dissipation efficiency of the existing air-conditioning companion socket is solved, more efficient heat dissipation is achieved, and the service life of the circuit board and electronic components is extended.
Patent Information
- Application Number
- CN202420288673.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-07
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-02-07
AI Technical Summary
The existing air conditioner companion socket is small in size and uses local heat dissipation holes to dissipate heat, making it difficult to quickly discharge heat, resulting in rapid aging of internal circuit boards and electronic components, affecting the life of the device.
An air-conditioning companion socket is designed, using a combined structure of a thermal frame, a thermal block, a thermal cross rod, a thermal vertical rod and a heat dissipation fin. The heat generated by the integrated circuit board is transmitted through these thermal components and finally through the thermal fins and a heat dissipation holes. Distribute and improve heat dissipation efficiency.
Through this structure, heat can be dissipated faster through the heat dissipation hole, improve heat dissipation efficiency, delay the aging of integrated circuit boards and electronic components, and extend their service life.
Smart Images

Figure CN222508255U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of air-conditioner companion sockets, in particular to an air-conditioner companion socket. Background Art
[0002] As the name suggests, the Air Conditioner Companion is used in conjunction with the air conditioner. Its main function is to control the air conditioner. It can make full use of scientific and technological power in family life, achieve the purpose of serving human life, and improve the quality of life.
[0003] Existing air conditioner companion sockets are generally small in size, so local heat dissipation holes are often used for heat dissipation. However, this heat dissipation method is difficult to quickly discharge the heat in the device, and it is easy to cause rapid aging of the companion's internal circuit boards and electronic components over a long period of time, affecting the life of the device. For this reason, we propose an air conditioner companion socket. Utility Model Content
[0004] The purpose of the utility model is to provide an air conditioner companion socket to solve the problem that the existing air conditioner companion sockets mentioned in the above background technology are generally small in size, so local heat dissipation holes are often used for heat dissipation, and this heat dissipation method is difficult to quickly discharge the heat in the device, which can easily cause rapid aging of the internal circuit boards and electronic components of the companion over a long period of time, thus affecting the life of the device.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an air-conditioning companion socket, comprising a support seat, a cover plate is clamped on the upper end of the support seat, and a socket plate is embedded in the middle of the surface of the cover plate, a plurality of heat dissipation holes are distributed in the middle of the front and rear sides of the cover plate, bolts are penetrated through the four corners of the upper end of the support seat, and a limiting mechanism is arranged inside the support seat, a group of auxiliary mechanisms are symmetrically arranged on the outside of the limiting mechanism, and module components are distributed on the middle surface of the limiting mechanism, the auxiliary mechanism comprises a heat-conducting frame, and a heat-conducting block is fixed on the outer surface of the heat-conducting frame, a heat-conducting cross bar is connected to the upper end of the heat-conducting block, and a heat-conducting fin is arranged in the upper middle of the heat-conducting cross bar, and a heat-conducting vertical rod is arranged between the heat-conducting cross bar and the heat-conducting fin.
[0006] Furthermore, the heat-conducting frame is distributed in a rectangular shape at the bottom end of the support base, and the heat-conducting frame is connected to the heat-conducting cross bar through the heat-conducting block. The heat generated by the integrated circuit board when it is working is first conducted to the heat-conducting frames at the four corners, and then conducted by the heat-conducting frame to the heat-conducting block, the heat-conducting cross bar, and the heat-conducting vertical bar in sequence.
[0007] Furthermore, the heat-conducting cross bar is connected to the heat-dissipating fins through the heat-conducting vertical bar, and the top of the heat-dissipating fin is level with the heat-dissipating hole. The heat on the integrated circuit board is finally dissipated through the heat-dissipating fins at the upper end of the heat-conducting vertical bar. Since the top of the heat-dissipating fin is level with the heat-dissipating hole, the heat can be dissipated through the heat-dissipating hole faster, thereby improving the heat dissipation efficiency.
[0008] Furthermore, the limiting mechanism includes an integrated circuit board, and a card board is connected to both sides of the integrated circuit board, a card slot is attached to the outside of the card board, baffles are attached to both sides of the upper surface of the integrated circuit board, and a fixed shaft rod passes through one side of the baffle.
[0009] Furthermore, the integrated circuit board forms a snap-fit structure through a card plate and a card slot, and the card slot and the support seat are an integrated structure. The cooperation between the card plate and the card slot facilitates rapid positioning of the integrated circuit board inside the support seat, thereby improving assembly efficiency.
[0010] Furthermore, the baffle forms a rotating structure with the support seat through a fixed shaft rod, and the fixed shaft rod is T-shaped. When the integrated circuit board is placed, the baffle is rotated along the fixed shaft rod until the lower surface of the baffle is in contact with the upper surface of the integrated circuit board, thereby effectively limiting and fixing the integrated circuit board without the need for screwing or gluing, thereby reducing damage to the integrated circuit board.
[0011] Furthermore, the support seat and the cover plate form a threaded structure through bolts, and the cover plate and the heat dissipation hole are an integrated structure. The support seat and the cover plate can be separated by removing the bolts, which is convenient for internal maintenance.
[0012] Compared with the prior art, the utility model has the following beneficial effects: in the air-conditioning companion socket, the heat generated by the integrated circuit board when working is first conducted to the heat-conducting frames at the four corners, and then conducted by the heat-conducting frames to the heat-conducting blocks, the heat-conducting horizontal bars, and the heat-conducting vertical bars in sequence, and finally dissipated through the heat dissipation fins at the upper ends of the heat-conducting vertical bars. Since the top ends of the heat dissipation fins are flush with the heat dissipation holes, the heat can be dissipated faster through the heat dissipation holes, thereby improving the heat dissipation efficiency, delaying the aging of the integrated circuit board and the electronic components, and extending the service life of the integrated circuit board and the electronic components.
[0013] The cooperation between the card plate and the card slot facilitates the rapid positioning of the integrated circuit board inside the support seat, thereby improving assembly efficiency. After the integrated circuit board is placed, the baffle is rotated along the fixed shaft until the lower surface of the baffle fits the upper surface of the integrated circuit board, thereby effectively limiting and fixing the integrated circuit board without the need for screwing or gluing, thereby reducing damage to the integrated circuit board.
[0014] The heat generated when the integrated circuit board is working is first conducted to the heat-conducting frames at the four corners, and then conducted to the heat-conducting blocks, heat-conducting horizontal bars, and heat-conducting vertical bars in turn, and finally dissipated through the heat-dissipating fins at the upper ends of the heat-conducting vertical bars. Since the tops of the heat-dissipating fins are level with the heat-dissipating holes, the heat can be dissipated faster through the heat-dissipating holes, thereby improving the heat dissipation efficiency, delaying the aging of the integrated circuit board and electronic components, and extending the service life of the integrated circuit board and electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1It is a schematic diagram of the three-dimensional structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the structure of the utility model when viewed from above;
[0017] Figure 3 This is a schematic diagram of the internal top view of the support seat of the utility model;
[0018] Figure 4 This is a schematic diagram of the disassembled structure of the limit mechanism of the utility model;
[0019] Figure 5 This is a partial front view structural diagram of the auxiliary mechanism of the utility model;
[0020] Figure 6 Schematic diagram of the working process of the module components of the utility model.
[0021] In the figure: 1. support base; 2. cover plate; 3. socket plate; 4. heat dissipation hole; 5. bolt; 6. limit mechanism; 601. integrated circuit board; 602. card plate; 603. card slot; 604. baffle; 605. fixed shaft rod; 7. auxiliary mechanism; 701. heat conduction frame; 702. heat conduction block; 703. heat conduction cross bar; 704. heat dissipation fin; 705. heat conduction vertical rod; 8. module assembly. DETAILED DESCRIPTION
[0022] like Figure 1-3 As shown, an air conditioner companion socket comprises: a support base 1, a cover plate 2 is clamped on the upper end of the support base 1, and a socket plate 3 is embedded in the middle of the surface of the cover plate 2, a plurality of heat dissipation holes 4 are distributed in the middle of the front and rear sides of the cover plate 2, bolts 5 are passed through the four corners of the upper end of the support base 1, and a limiting mechanism 6 is arranged inside the support base 1, a group of auxiliary mechanisms 7 are symmetrically arranged outside the limiting mechanism 6, and module components 8 are distributed on the middle surface of the limiting mechanism 6, the support base 1 forms a threaded structure with the cover plate 2 through the bolts 5, and the cover plate 2 and the heat dissipation holes 4 are an integrated structure.
[0023] The limiting mechanism 6 includes an integrated circuit board 601, and a card board 602 is connected to both sides of the integrated circuit board 601, and a card slot 603 is attached to the outside of the card board 602. A baffle 604 is attached to both sides of the upper surface of the integrated circuit board 601, and a fixed shaft 605 runs through one side of the baffle 604. The integrated circuit board 601 forms a card structure with the card slot 603 through the card board 602, and the card slot 603 and the support seat 1 are an integrated structure. The baffle 604 is connected to the support seat 1 through the fixed shaft 605. The seat 1 constitutes a rotating structure, and the fixed shaft 605 is T-shaped. The cooperation between the clamping plate 602 and the clamping slot 603 facilitates the rapid positioning of the integrated circuit board 601 inside the support seat 1, thereby improving the assembly efficiency. After the integrated circuit board 601 is placed, the baffle 604 is rotated along the fixed shaft 605 until the lower surface of the baffle 604 is in contact with the upper surface of the integrated circuit board 601, thereby effectively limiting and fixing the integrated circuit board 601 without the need for screwing or gluing, thereby reducing damage to the integrated circuit board 601.
[0024] like Figure 4-5 As shown, an air conditioner companion socket, the auxiliary mechanism 7 includes a heat-conducting frame 701, and a heat-conducting block 702 is fixed to the outer surface of the heat-conducting frame 701, the upper end of the heat-conducting block 702 is connected to a heat-conducting cross bar 703, and a heat-dissipating fin 704 is arranged in the upper middle part of the heat-conducting cross bar 703, and a heat-conducting vertical rod 705 is arranged between the heat-conducting cross bar 703 and the heat-dissipating fin 704, the heat-conducting frame 701 is distributed in a rectangular shape at the bottom end of the support seat 1, and the heat-conducting frame 701 is connected to the heat-conducting cross bar 703 through the heat-conducting block 702, and the heat-conducting cross bar 703 is connected to the heat-dissipating fin 704 through the heat-conducting vertical rod 705, and The top of the heat dissipation fin 704 is level with the heat dissipation hole 4. The heat generated by the integrated circuit board 601 when working is first conducted to the heat-conducting frames 701 at the four corners, and then conducted by the heat-conducting frames 701 to the heat-conducting blocks 702, the heat-conducting cross bars 703, and the heat-conducting vertical bars 705 in sequence, and finally dissipated through the heat dissipation fin 704 at the upper end of the heat-conducting vertical bars 705. Since the top of the heat dissipation fin 704 is level with the heat dissipation hole 4, the heat can be dissipated faster through the heat dissipation hole 4, thereby improving the heat dissipation efficiency, delaying the aging of the integrated circuit board 601 and the electronic components, and extending the service life of the integrated circuit board 601 and the electronic components.
[0025] like Figure 6 As shown, an air-conditioning companion socket receives a wake-up word through a voice acquisition module and a voice wake-up module, and the MCU main control module can be started to reduce the power consumption of the device. The voice acquisition module and the voice decoding module recognize user commands, and then the MCU main control module controls the infrared emission module to control the air-conditioning, thereby realizing intelligent adjustment of the air-conditioning temperature, wind speed, etc. The speaker module can respond to user command requirements to improve practicality.
[0026] In summary, the air conditioner companion socket, first of all, the cooperation between the card plate 602 and the card slot 603 facilitates the rapid positioning of the integrated circuit board 601 inside the support seat 1. After the integrated circuit board 601 is placed, the baffle 604 is rotated along the fixed shaft rod 605 until the lower surface of the baffle 604 is in contact with the upper surface of the integrated circuit board 601, so as to limit and fix the integrated circuit board 601 without screwing and gluing, thereby reducing the damage of the integrated circuit board 601. The heat generated by the integrated circuit board 601 when working is first conducted to the heat-conducting frames 701 at the four corners, and then conducted by the heat-conducting frames 701 to the heat-conducting blocks 702, the heat-conducting cross bars 703, and the heat-conducting vertical bars 705 in turn, and finally the heat dissipation at the upper end of the heat-conducting vertical bars 705 is The heat is dissipated through the heat fins 704. Since the top of the heat dissipating fins 704 is flush with the heat dissipating holes 4, the heat can be dissipated faster through the heat dissipating holes 4, thereby improving the heat dissipation efficiency and delaying the aging of the integrated circuit board 601 and electronic components. The air conditioner companion socket is directly connected to the mains power and embedded in the wall of the home. The MCU main control module can only be started after receiving the wake-up word through the voice acquisition module and the voice wake-up module, thereby reducing the power consumption of the device. The user's instructions are recognized through the voice acquisition module and the voice decoding module, and then the MCU main control module controls the infrared emission module to control the air conditioner, thereby realizing intelligent adjustment of the air conditioner temperature, wind speed, etc. The speaker module can respond to user instructions to improve practicality.
Claims
1. An air conditioner companion socket, comprising a support base (1), characterized in that: The upper end of the support seat (1) is engaged with a cover plate (2), and a socket plate (3) is embedded in the middle of the surface of the cover plate (2); a plurality of heat dissipation holes (4) are distributed in the middle of the front and rear sides of the cover plate (2); bolts (5) are passed through the four corners of the upper end of the support seat (1); a limiting mechanism (6) is arranged inside the support seat (1); a group of auxiliary mechanisms (7) are symmetrically arranged outside the limiting mechanism (6); and module components (8) are distributed on the middle surface of the limiting mechanism (6); the auxiliary mechanism (7) comprises a heat conduction frame (701); a heat conduction block (702) is fixed on the outer surface of the heat conduction frame (701); a heat conduction cross bar (703) is connected to the upper end of the heat conduction block (702); a heat dissipation fin (704) is arranged in the middle of the upper part of the heat conduction cross bar (703); and a heat conduction vertical bar (705) is arranged between the heat conduction cross bar (703) and the heat dissipation fin (704).
2. The air conditioner companion socket according to claim 1, characterized in that: The heat-conducting frame (701) is distributed in a rectangular shape at the bottom end of the support seat (1), and the heat-conducting frame (701) is connected to the heat-conducting cross bar (703) via the heat-conducting block (702).
3. The air conditioner companion socket according to claim 1, characterized in that: The heat-conducting cross bar (703) is connected to the heat-dissipating fin (704) via the heat-conducting vertical bar (705), and the top of the heat-dissipating fin (704) is flush with the heat-dissipating hole (4).
4. The air conditioner companion socket according to claim 1, characterized in that: The limiting mechanism (6) comprises an integrated circuit board (601), and a card board (602) is connected to both sides of the integrated circuit board (601), a card slot (603) is attached to the outside of the card board (602), baffles (604) are attached to both sides of the upper surface of the integrated circuit board (601), and a fixed shaft (605) passes through one side of the baffle (604).
5. The air conditioner companion socket according to claim 4, characterized in that: The integrated circuit board (601) forms a clamping structure through the clamping plate (602) and the clamping slot (603), and the clamping slot (603) and the support seat (1) are an integrated structure.
6. The air conditioner companion socket according to claim 4, characterized in that: The baffle (604) forms a rotating structure with the support seat (1) via a fixed shaft (605), and the fixed shaft (605) is in a T-shape.
7. The air conditioner companion socket according to claim 1, characterized in that: The support seat (1) forms a threaded structure with the cover plate (2) through the bolts (5), and the cover plate (2) and the heat dissipation hole (4) are an integrated structure.