Bonding pad capable of improving heat dissipation performance

Abstract

The utility model relates to the technical field of bonding pads, in particular to a bonding pad capable of improving heat dissipation performance, which comprises a substrate, the substrate 1 is provided with a bonding pad area, the bonding pad area is provided with a plurality of welding holes and a heat dissipation area, the plurality of welding holes are uniformly separated by the heat dissipation area in a staggered manner, separation strips are arranged between the plurality of welding holes and the heat dissipation area, and the separation strips are fixedly connected to the bonding pad area. The welding holes are round, heat dissipation holes are evenly formed in the heat dissipation area and located on the side, close to the welding holes, in the heat dissipation area, the heat dissipation holes are round like the welding holes in shape, welding points are arranged on the peripheries of the welding holes and evenly arranged on the outer diameters of the edges of the welding holes, and the multiple welding holes in the bonding pad area are designed. Therefore, the bonding pad can be connected with a plurality of electronic elements at the same time, the carrying capacity of the bonding pad is improved, and the electronic equipment is more convenient and efficient to assemble.

Description

Technical Field

[0001] The present application relates to the technical field of solder pads, and in particular to a solder pad for improving heat dissipation performance. Background Art

[0002] With the rapid development of electronic technology, high-power electronic devices are increasingly used. However, high-power electronic devices generate a lot of heat during operation. If the heat cannot be dissipated in time, the performance of the device will be reduced or even damaged. Therefore, how to effectively dissipate heat is an important issue in the design of high-power electronic devices.

[0003] Existing pad designs mainly focus on electrical connection and support functions, and do not adequately consider the optimization of heat dissipation performance. Although some pad designs take heat dissipation into consideration, the heat dissipation effect is not ideal and it is difficult to meet the heat dissipation requirements of high-power electronic devices. Utility Model Content

[0004] In view of the shortcomings of the prior art, a soldering pad with improved heat dissipation performance is proposed. The purpose of this application is to optimize the heat dissipation structure of the soldering pad to solve the problem of poor heat dissipation performance of some soldering pads in the prior art.

[0005] The above-mentioned purpose of this application is achieved through the following technical solutions:

[0006] A soldering pad with improved heat dissipation performance comprises a substrate, wherein the substrate is provided with a soldering pad area, the soldering pad area is provided with a plurality of soldering holes and a heat dissipation area, and the plurality of soldering holes are evenly staggered by the heat dissipation area.

[0007] By adopting the above technical solution, the multiple welding holes on the pad area are designed so that the pad can connect multiple electronic components at the same time, which improves the loading capacity of the pad and makes the assembly of electronic equipment more convenient and efficient. At the same time, the uniform distribution of the welding holes also ensures that when the pad is connected to the electronic components, each connection point is evenly stressed, reducing the risk of damage to the pad due to uneven stress. The heat dissipation area is located between the welding holes, which can effectively increase the heat dissipation area of ​​the pad and improve the heat dissipation performance of the pad. In high-power electronic equipment, the timely dissipation of heat is the key to ensuring the stable operation of the equipment. The existence of the heat dissipation area enables the pad to effectively dissipate the heat generated by the components while connecting the electronic components, thereby preventing the equipment from being damaged due to overheating. The uniformly spaced layout of the heat dissipation area and the welding holes not only ensures the heat dissipation effect of the pad, but this layout method is also conducive to the positioning and installation of the pad during the manufacturing process, improving production efficiency.

[0008] Furthermore, a separation bar is provided between the plurality of solder holes and the heat dissipation area, and the separation bar is fixedly connected to the solder pad area.

[0009] By adopting the above technical solution, the setting of the separator can effectively avoid the interference of heat conduction between the solder hole and the heat dissipation area. When high-power electronic equipment is working, the electronic components near the solder hole will generate a lot of heat. If there is no separator, this heat may be directly conducted to the heat dissipation area through the solder pad area, affecting the heat dissipation effect. The existence of the separator forms a thermal resistance, which effectively isolates the heat conduction between the solder hole and the heat dissipation area, so that the heat can be dissipated more concentratedly through the heat dissipation area, improving the heat dissipation efficiency. The separator can also enhance the structural stability of the solder pad.

[0010] Furthermore, the welding hole is circular in shape.

[0011] By adopting the above technical solution, the circular weld hole helps to optimize the stress distribution during the welding process. During the welding process, the weldment will be affected by thermal stress and mechanical stress, which may cause the weldment to deform or crack. The design of the circular weld hole can make the stress distribution more uniform, reduce stress concentration, thereby reducing the risk of weldment deformation and cracking, and improve welding quality. At the same time, the circular weld hole is conducive to improving welding strength and reliability. The circular weld hole can better adapt to the thermal expansion and contraction of the welding material and reduce defects such as pores and slag inclusions during the welding process.

[0012] Furthermore, heat dissipation holes are evenly arranged in the heat dissipation area.

[0013] By adopting the above technical solution, the setting of the heat dissipation holes can significantly enhance the heat dissipation capacity of the heat dissipation zone. When high-power electronic equipment is running, the pad and the electronic components around it will generate a lot of heat. By evenly arranging the heat dissipation holes in the heat dissipation zone, an effective heat dissipation channel can be formed, so that the heat can be quickly dissipated into the air through these holes, thereby effectively reducing the temperature of the pad and the surrounding components, avoiding the performance degradation or damage of the pad and the surrounding components due to overheating, thereby extending the service life of the equipment. The evenly arranged heat dissipation holes help to achieve uniform distribution and rapid conduction of heat. The layout of the heat dissipation holes allows the heat to be diffused more evenly in the heat dissipation zone, avoiding the risk of excessive thermal stress or thermal damage caused by excessive concentration of heat in certain areas. The heat dissipation holes can also reduce the stress caused by thermal expansion of the pad, reduce the risk of deformation of the pad, and improve the stability and reliability of welding.

[0014] Furthermore, the heat dissipation hole is arranged in the heat dissipation area on a side close to the welding hole.

[0015] By adopting the above technical solution and setting the heat dissipation holes close to the soldering holes, the heat can be dissipated through the heat dissipation holes faster when it is conducted from the inside of the soldering pad to the heat dissipation area, thereby reducing the heat retention time inside the soldering pad. This targeted heat dissipation design can accelerate the flow and transfer of heat, improve the heat dissipation efficiency of the entire soldering pad, and ensure that the soldering pad can still maintain stable working performance in a high temperature environment. As a key part for connecting electronic components, soldering holes are prone to generate high heat during welding and the operation of electronic equipment. Setting the heat dissipation holes close to the soldering holes can directly dissipate heat from these high-temperature areas, quickly export heat, and prevent heat from accumulating near the soldering holes, thereby protecting the soldering holes and connected electronic components from thermal damage.

[0016] Furthermore, the shape of the heat dissipation hole is circular like the shape of the welding hole.

[0017] By adopting the above technical solution, the circular heat dissipation hole has a good heat dissipation effect. The circular shape makes the edge of the heat dissipation hole smoother, reducing the accumulation and retention of heat at the edge of the hole. At the same time, the circular heat dissipation hole can better adapt to the direction of the heat dissipation airflow, so that the heat can be dissipated more smoothly through the heat dissipation hole, thereby improving the heat dissipation efficiency. The matching of the circular heat dissipation hole and the circular solder hole also helps to optimize the structural layout of the pad. This design enables the pad to reduce the overall size of the pad as much as possible while maintaining sufficient heat dissipation capacity, thereby achieving efficient use of space. This is particularly important for electronic devices with limited space, and helps to improve the integration and overall performance of the product.

[0018] Furthermore, welding points are arranged around the welding hole, and the welding points are evenly arranged on the outer diameter of the edge of the welding hole.

[0019] By adopting the above technical solution, the uniformly arranged welding points can ensure the stability and reliability during the welding process. By evenly distributing the welding points on the outer diameter of the edge of the welding hole, the heat distribution during the welding process can be made more uniform, reducing the thermal stress concentration phenomenon that may occur during the welding process. This helps to reduce the occurrence of welding defects, optimize the force distribution of the pad, and improve the quality of the welded joint, thereby ensuring the connection stability and reliability of the pad. At the same time, the uniform distribution of welding points also helps to increase the welding speed and improve production efficiency.

[0020] Furthermore, the material of the pad area is metal copper.

[0021] By adopting the above technical solution, since metal copper has excellent thermal conductivity, during the operation of electronic equipment, the pad and the electronic components connected to it will generate heat. If the heat cannot be dissipated in time, it may cause the performance of the components to deteriorate or be damaged. The copper material can effectively conduct heat away from the pad area, reduce the temperature of the pad and the surrounding components, and ensure the stable operation of the electronic equipment.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. The multi-hole design of the pad improves the loading capacity, making the assembly of electronic equipment more convenient and efficient. The even distribution of the holes ensures that the connection points are evenly stressed, reducing the risk of damage. The heat dissipation area increases the heat dissipation area, effectively dissipates the heat of the components, and prevents the equipment from overheating and damage. The heat dissipation area and the holes are evenly spaced, which not only ensures the heat dissipation effect but also facilitates manufacturing positioning and improves production efficiency;

[0024] 2. The heat dissipation holes are set close to the solder holes to dissipate heat directly in the high-temperature area, quickly extract heat, and protect the solder holes and electronic components. The circular heat dissipation holes match the circular solder holes, with smooth edges and good heat dissipation effects, thus improving the overall heat dissipation efficiency. This design reduces the pad size while maintaining the heat dissipation capacity, and is suitable for scenarios with limited space.

[0025] 3. Evenly distributed welding points ensure welding stability and reliability, optimize heat distribution, reduce thermal stress concentration, and reduce welding defects. This layout increases welding speed and improves production efficiency. At the same time, the setting of welding points also improves the overall mechanical strength and durability of the pad, providing a guarantee for the long-term stable operation of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a three-dimensional schematic diagram of the overall structure in the embodiment;

[0027] Figure 2 It is a top view schematic diagram of the overall structure in the embodiment.

[0028] Figure numerals: 1, substrate; 2, pad area; 3, solder hole; 4, heat dissipation area; 5, separator bar; 6, heat dissipation hole; 7, soldering point. DETAILED DESCRIPTION

[0029] The present application is further described in detail below in conjunction with the accompanying drawings.

[0030] Example, see Figure 1 , Figure 2A soldering pad for improving heat dissipation performance comprises a substrate 1, wherein the substrate 1 is provided with a soldering pad area 2, wherein the soldering pad area 2 is provided with a plurality of soldering holes 3 and a heat dissipation area 4, wherein the plurality of soldering holes 3 are evenly separated by the heat dissipation area 4, and a partition bar 5 is provided between the plurality of soldering holes 3 and the heat dissipation area 4, and the partition bar 5 is fixedly connected to the soldering pad area 2, wherein the soldering holes 3 are circular in shape, heat dissipation holes 6 are evenly provided in the heat dissipation area 4, and the heat dissipation holes 6 are provided in the heat dissipation area 4 on one side close to the soldering holes 3, and the shape of the heat dissipation holes 6 is circular as the shape of the soldering holes 3, and soldering points 7 are provided around the soldering holes 3, and the soldering points 7 are evenly provided on the outer diameter of the edge of the soldering holes 3. The design of the plurality of soldering holes 3 on the soldering pad area 2 enables the soldering pad to connect a plurality of electronic components at the same time, thereby improving the loading capacity of the soldering pad and making the assembly of electronic equipment more convenient and efficient. At the same time, the uniform distribution of the soldering holes 3 also ensures that when the soldering pad is connected to the electronic components, each connection point is evenly stressed, reducing the risk of damage to the soldering pad due to uneven stress. The heat dissipation area 4 is located between the soldering holes 3, which can effectively increase the heat dissipation area of ​​the soldering pad and improve the heat dissipation performance of the soldering pad. In high-power electronic equipment, timely heat dissipation is the key to ensuring stable operation of the equipment. The existence of the heat dissipation area 4 enables the soldering pad to effectively dissipate the heat generated by the components while connecting the electronic components, thereby preventing the equipment from being damaged due to overheating. The uniform spacing between the heat dissipation area 4 and the soldering holes 3 not only ensures the heat dissipation effect of the soldering pad, but this layout method is also conducive to the positioning and installation of the soldering pad during the manufacturing process, thereby improving production efficiency.

[0031] In this embodiment, in the pad area, the heat dissipation area and the soldering hole are evenly spaced apart with dividing strips, and the heat dissipation holes in the heat dissipation area are arranged on the side close to the soldering hole. Such a setting ensures the heat dissipation effect of the pad area, increases the effective heat dissipation area of ​​the heat dissipation area, effectively dissipates the heat of the components, and prevents the equipment from being overheated and damaged.

[0032] Specific implementation process:

[0033] First, place the substrate 1 flat on a horizontal plane, insert the pins and tin wire into the soldering holes 3 of the pad area 2 in the substrate 1, and use a welding gun to solder the two parts together. During the welding process, since the heat dissipation area 4 is located between the soldering holes 3, the heat dissipation area of ​​the pad can be effectively increased and the heat dissipation performance of the pad can be improved. The existence of the heat dissipation area 4 enables the pad to effectively dissipate the heat generated by the components while connecting the electronic components, thereby preventing the equipment from being damaged due to overheating. The uniformly spaced layout of the heat dissipation area 4 and the soldering holes 3 not only ensures the heat dissipation effect of the pad, but also facilitates the positioning and installation of the pad during the manufacturing process. When multiple components are connected to the pad area 2 for welding at the same time, the separator 5 set on the pad area 2 can effectively avoid the interference of heat conduction between the soldering holes 3 and the heat dissipation area 4, form a thermal resistance between the multiple soldering holes 3, and concentrate the heat in the heat dissipation area 4 and dissipate it. The circular welding holes 3 evenly arranged near the welding holes 3 in the heat dissipation zone 4 allow the heat in the welding holes 3 to be more directly and quickly guided to the heat dissipation zone 4, thereby accelerating the flow and transfer of heat, avoiding heat accumulation near the welding holes 3, and protecting electronic devices from overheating damage.

[0034] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A solder pad for improving heat dissipation performance, characterized in that: The invention comprises a substrate (1), wherein a pad area (2) is provided on the substrate (1), a plurality of welding holes (3) and a heat dissipation area (4) are provided on the pad area (2), and the plurality of welding holes (3) are evenly spaced apart by the heat dissipation area (4).

2. A soldering pad for improving heat dissipation performance according to claim 1, characterized in that: A separation bar (5) is provided between the plurality of solder holes (3) and the heat dissipation area (4), and the separation bar (5) is fixedly connected to the solder pad area (2).

3. A soldering pad for improving heat dissipation performance according to claim 1, characterized in that: The welding hole (3) is circular in shape.

4. A soldering pad for improving heat dissipation performance according to claim 1, characterized in that: Heat dissipation holes (6) are evenly arranged in the heat dissipation area (4).

5. A soldering pad for improving heat dissipation performance according to claim 4, characterized in that: The heat dissipation hole (6) is arranged in the heat dissipation area (4) on a side close to the welding hole (3).

6. A soldering pad for improving heat dissipation performance according to claim 5, characterized in that: The shape of the heat dissipation hole (6) is circular, just like the shape of the welding hole (3).

7. A soldering pad for improving heat dissipation performance according to claim 6, characterized in that: Welding points (7) are arranged around the welding hole (3), and the welding points (7) are evenly arranged on the outer diameter of the edge of the welding hole (3).

8. A soldering pad for improving heat dissipation performance according to claim 1, characterized in that: The material of the pad area (2) is metal copper.

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