Circuit board for laser

Abstract

The utility model discloses a circuit board used on a laser. Comprising a circuit board body, a positioning column, a signal input piece, a signal output piece, an LED state indicating piece, a serial port communication interface, a common power supply interface, an overvoltage and overcurrent protector, an EMI circuit, a power supply conversion chip, a power supply conversion piece, an FPGA piece, an MCU piece, a first crystal oscillator, a second crystal oscillator, a chip, a first LD butterfly piece and a second LD butterfly piece. The circuit board is reasonable in design, convenient to operate and high in working efficiency, the power conversion chip can convert a power supply into different currents to be supplied to different elements for use, and the service life of the circuit board is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a circuit board used for lasers. Background Art

[0002] There are two parts of the laser control circuit: radio frequency amplification and small signal amplification. According to the direction of signal transmission, there are also step-by-step amplification circuits. The different thermal effects and electromagnetic radiation generated by the different power levels of the amplification circuits at each level often lead to problems such as low chip heat dissipation efficiency, poor electromagnetic compatibility, and weak anti-interference ability in existing circuit boards. Summary of the invention

[0003] The utility model aims to provide a circuit board used for a laser.

[0004] To achieve the above purpose, the utility model adopts the following contents:

[0005] A circuit board for a laser, comprising: a circuit board body, a positioning column, a signal input component, a signal output component, an LED status indicator component, a serial communication interface, a common power interface, an overvoltage and overcurrent protector, an EMI circuit, a power conversion chip, a power conversion component, an FPGA component, an MCU component, a No. 1 crystal oscillator, a No. 2 crystal oscillator, a chip, a No. 1 LD butterfly component, and a No. 2 LD butterfly component;

[0006] The signal output element includes a No. 1 signal output element, a No. 2 signal output element and a No. 3 signal output element; the power conversion element includes a No. 1 power conversion element, a No. 2 power conversion element and a No. 3 power conversion element;

[0007] Positioning posts are respectively arranged at the four corners of the circuit board body; a No. 2 signal output component, a No. 1 signal output component, a signal input component, an LED status indicator component and a serial communication interface are arranged in sequence from left to right at the front end of the circuit board body; a No. 3 signal output component and a power output interface are arranged in sequence from top to bottom on the left side of the circuit board body; a common power interface, an overvoltage and overcurrent protector, an EMI circuit and a power conversion chip are arranged in sequence from top to bottom on the right side of the circuit board body; an FPGA component, an MCU component and a chip are respectively arranged in the middle of the circuit board body; a No. 2 power conversion component and a No. 2 crystal oscillator are arranged around the FPGA component; a No. 1 power conversion component and a No. 1 crystal oscillator are arranged around the MCU component; two grooves are opened on the rear side of the circuit board body, and a No. 1 LD butterfly component and a No. 2 LD butterfly component are respectively arranged in the two grooves; the No. 3 power conversion component is arranged on the middle and rear side of the circuit board body, and is used in conjunction with the No. 1 LD butterfly component and the No. 2 LD butterfly component respectively.

[0008] Preferably, there is no less than one chip, and they are correspondingly arranged on the circuit board body.

[0009] Preferably, the chips include chip number 1, chip number 2, chip number 3, chip number 4, chip number 5, chip number 6, chip number 7, chip number 8, chip number 9, chip number 10, chip number 11, chip number 12 and chip number 13.

[0010] Preferably, the power conversion chip is used in cooperation with the first power conversion component, the second power conversion component and the third power conversion component respectively.

[0011] Preferably, the FPGA component, No. 2 crystal oscillator, No. 2 power conversion component, signal input component, No. 1 signal output component, No. 2 signal output component and No. 3 signal output component are matched and used; the MCU component, No. 1 crystal oscillator and No. 1 power conversion component are used in coordination.

[0012] The device is reasonably designed and easy to operate. The fixed position is set to better fix the circuit board; the common power interface is set to facilitate connecting the external power supply to the circuit board to power the entire circuit board; the power conversion chip is set to convert the power into different currents to supply different components for use, thereby increasing the service life of the circuit board.

[0013] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0015] Figure 1 The utility model is a schematic structural diagram of a circuit board used for a laser.

[0016] In the figure, each reference numeral is:

[0017] 1-circuit board body, 2-positioning column, 3-signal input part, 41-signal output part No. 1, 42-signal output part No. 2, 43-signal output part No. 3, 51-chip No. 1, 52-chip No. 2, 53-chip No. 3, 54-chip No. 4, 55-chip No. 5, 56-chip No. 6, 57-chip No. 7, 58-chip No. 8, 59-chip No. 9, 510-chip No. 10, 511-chip No. 11, 512-chip No. 12, 513-chip No. 13 Chip, 6-LED status indicator, 7-serial communication interface, 8-public power interface, 9-overvoltage and overcurrent protector, 10-EMI circuit, 11-power conversion chip, 12-FPGA component, 13-MCU component, 141-power conversion component No. 1, 142-power conversion component No. 2, 143-power conversion component No. 3, 151-crystal oscillator No. 1, 152-crystal oscillator No. 2, 16-power output interface, 17-LD butterfly component No. 1, 18 LD butterfly component No. 2-. DETAILED DESCRIPTION

[0018] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0022] like Figure 1 As shown, a circuit board for a laser includes: a circuit board body 1, a positioning column 2, a signal input component 3, a signal output component, an LED status indicator 6, a serial communication interface 7, a common power interface 8, an overvoltage and overcurrent protector 9, an EMI circuit 10, a power conversion chip 11, a power conversion component, an FPGA component 12, an MCU component 13, a first crystal oscillator 151, a second crystal oscillator 152, a chip, a first LD butterfly component 17 and a second LD butterfly component 18;

[0023] The signal output element includes a first signal output element 41, a second signal output element 42 and a third signal output element 43; the power conversion element includes a first power conversion element 141, a second power conversion element 142 and a third power conversion element 143;

[0024] Positioning posts 2 are respectively arranged at the four corners of the circuit board body 1. A second signal output component 42, a first signal output component 41, a signal input component 3, an LED status indicator 6 and a serial communication interface 7 are arranged in sequence from left to right at the front end of the circuit board body 1; a third signal output component 43 and a power output interface 16 are arranged in sequence from top to bottom on the left side of the circuit board body 1; a common power interface 8, an overvoltage and overcurrent protector 9, an EMI circuit 10 and a power conversion chip 11 are arranged in sequence from top to bottom on the right side of the circuit board body 1, and the power conversion chip 11 is used for conversion between different voltages; An FPGA component 12, an MCU component 13 and a chip are arranged; a No. 2 power conversion component 142 and a No. 2 crystal oscillator 152 are arranged around the FPGA component 12; a No. 1 power conversion component 141 and a No. 1 crystal oscillator 151 are arranged around the MCU component 13; two grooves are opened on the rear side of the circuit board body 1, and a No. 1 LD butterfly component 17 and a No. 2 LD butterfly component 18 are respectively arranged in the two grooves; the No. 3 power conversion component 143 is arranged on the middle and rear side of the circuit board body 1, and is used in conjunction with the No. 1 LD butterfly component 17 and the No. 2 LD butterfly component 18, and the function of the LD butterfly component is power supply control and feedback.

[0025] Furthermore, there is no less than one chip, and they are correspondingly arranged on the circuit board body.

[0026] Furthermore, the chips include chip number one 51 , chip number two 52 , chip number three 53 , chip number four 54 , chip number five 55 , chip number six 56 , chip number seven 57 , chip number eight 58 , chip number nine 59 , chip number ten 510 , chip number eleven 511 , chip number twelve 512 and chip number thirteen 513 .

[0027] Furthermore, the power conversion chip 11 cooperates with the first power conversion component 141 , the second power conversion component 142 and the third power conversion component 143 .

[0028] Furthermore, the FPGA component 12 is matched and used with the second crystal oscillator 152, the second power conversion component 142, the signal input component 3, the first signal output component 41, the second signal output component 42, and the third signal output component 43; the MCU component 13, the first crystal oscillator 151 and the first power conversion component 141 are used in coordination with each other.

[0029] When the device is in use, the common power interface 8 is connected to power the circuit board. After the current flows through the over-current protector 9, the EMI circuit 10 and the power conversion chip 11, the different currents are transmitted to the No. 1 power conversion component 141, the No. 2 power conversion component 142 and the No. 3 power conversion component 143 according to the different currents required by different components; the No. 1 power conversion component 141 supplies power to the MCU component 13, and is electrically connected to the No. 1 crystal oscillator 151, the No. 1 chip 51 and the No. 2 chip 52. At this time, the No. 1 chip 51 supplies power to the serial communication interface 7, and the No. 2 chip 52 supplies power to the LED status indicator 6; the No. 2 power conversion component 142 supplies power to the FPGA component 12, and the FPG Component A 12 is electrically connected to crystal oscillator No. 2 152, signal input component 3, signal output component No. 1 41, signal output component No. 2 42 and signal output component No. 3 43; power conversion component No. 3 143 supplies power to LD butterfly component No. 1 17 and LD butterfly component No. 2 18 respectively, and LD butterfly component No. 1 17 is electrically connected to chip No. 3 53, chip No. 4 54, chip No. 55, chip No. 6 56 and chip No. 7 57 respectively; LD butterfly component No. 2 18 is electrically connected to chip No. 8 58, chip No. 9 59, chip No. 10 510, chip No. 11 511, chip No. 12 512 and chip No. 13 513 respectively, and chip No. 13 513 is a special device for temperature control.

[0030] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A circuit board for a laser, characterized in that: include: Circuit board body, positioning column, signal input component, signal output component, LED status indicator, serial communication interface, common power interface, overvoltage and overcurrent protector, EMI circuit, power conversion chip, power conversion component, FPGA component, MCU component, crystal oscillator No. 1, crystal oscillator No. 2, chip, LD butterfly component No. 1 and LD butterfly component No. 2; The signal output element includes a No. 1 signal output element, a No. 2 signal output element and a No. 3 signal output element; the power conversion element includes a No. 1 power conversion element, a No. 2 power conversion element and a No. 3 power conversion element; Positioning posts are respectively arranged at the four corners of the circuit board body; a No. 2 signal output component, a No. 1 signal output component, a signal input component, an LED status indicator component and a serial communication interface are arranged in sequence from left to right at the front end of the circuit board body; a No. 3 signal output component and a power output interface are arranged in sequence from top to bottom on the left side of the circuit board body; a common power interface, an overvoltage and overcurrent protector, an EMI circuit and a power conversion chip are arranged in sequence from top to bottom on the right side of the circuit board body; an FPGA component, an MCU component and a chip are respectively arranged in the middle of the circuit board body; a No. 2 power conversion component and a No. 2 crystal oscillator are arranged around the FPGA component; a No. 1 power conversion component and a No. 1 crystal oscillator are arranged around the MCU component; two grooves are opened on the rear side of the circuit board body, and a No. 1 LD butterfly component and a No. 2 LD butterfly component are respectively arranged in the two grooves; the No. 3 power conversion component is arranged on the middle and rear side of the circuit board body, and is used in conjunction with the No. 1 LD butterfly component and the No. 2 LD butterfly component respectively.

2. A circuit board for a laser according to claim 1, characterized in that: There is no less than one chip, and they are correspondingly arranged on the circuit board body.

3. A circuit board for a laser according to claim 2, characterized in that: The chips include chip number 1, chip number 2, chip number 3, chip number 4, chip number 5, chip number 6, chip number 7, chip number 8, chip number 9, chip number 10, chip number 11, chip number 12 and chip number 13.

4. A circuit board for a laser according to claim 1, characterized in that: The power conversion chip is used in coordination with the first power conversion component, the second power conversion component and the third power conversion component.

5. A circuit board for a laser according to claim 4, characterized in that: The FPGA component, No. 2 crystal oscillator, No. 2 power conversion component, signal input component, No. 1 signal output component, No. 2 signal output component and No. 3 signal output component are matched and used; the MCU component, No. 1 crystal oscillator and No. 1 power conversion component are matched and used.

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