Printed circuit board (PCB) manufacturing board without ring design

Abstract

The utility model provides a PCB manufacturing plate with no ring design, which relates to the technical field of PCB processing, and comprises a processing substrate and a PCB main body, L-shaped warp chutes are arranged on two sides of the surface of the processing substrate, L-shaped weft chutes are arranged on two sides of the surface of the processing substrate perpendicular to the L-shaped warp chutes, limit springs are arranged in the L-shaped warp chutes and the L-shaped weft chutes, and the PCB main body is arranged in the L-shaped warp chutes and the L-shaped weft chutes. A longitudinal clamping plate and a latitudinal clamping plate are connected to the ends of the limiting springs correspondingly, a discharging through groove is formed in the center of the surface of the machining base plate, a PCB body is arranged on the surface of the machining base plate, and an L-shaped longitudinal sliding groove and an L-shaped latitudinal sliding groove which are formed in the surface of the machining base plate are matched with the longitudinal clamping plate and the latitudinal clamping plate to clamp the PCB body. According to the invention, the PCB main bodies with different sizes can be conveniently adjusted and adapted in different widths and lengths, the limiting and clamping of the PCB main bodies are maintained, the stacking and limiting of the PCB main bodies in the vertical direction are facilitated, the suitability during manufacturing is increased, the structure is simple, and the size suitability is strong.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB processing, in particular to a PCB manufacturing plate with no ring design. Background Art

[0002] In the current PCB processing industry, clamping and positioning of the PCB body is an important technical link. Traditional PCB clamping methods often use fixed-size fixtures, which requires frequent replacement of fixtures or manual adjustments when clamping PCB bodies of different sizes, greatly reducing processing efficiency and adaptability. In addition, as the integration of electronic products continues to increase, the size of PCB boards continues to decrease, but the complexity of circuits and signal transmission speeds are increasing, which puts higher requirements on the heat dissipation and electromagnetic shielding performance of PCB boards. Traditional PCB designs often use single-layer or simple stacking methods, which cannot meet the heat dissipation and electromagnetic shielding requirements of high-density, high-integration circuit boards.

[0003] The above patent documents and prior art have the following technical problems:

[0004] 1. The traditional PCB clamping method cannot quickly and flexibly adapt to PCB bodies of different sizes, resulting in low processing efficiency and unable to meet the rapid iteration and diversification needs of the modern electronic manufacturing industry;

[0005] 2. The heat dissipation efficiency is poor when PCB boards are stacked and installed. The traditional heat dissipation design cannot meet the heat dissipation requirements of high-density circuit boards, causing circuit components to fail due to overheating. Utility Model Content

[0006] The utility model aims to solve the shortcomings of the prior art, that is, poor clamping adaptability of PCB boards during processing and poor heat dissipation effect caused by stacking of PCB boards, and proposes a PCB manufacturing plate material with no ring design.

[0007] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a PCB production plate material with a ring-free design, comprising a processing substrate and a PCB board body, L-shaped warp grooves are opened on both sides of the surface of the processing substrate, L-shaped weft grooves are opened on both sides of the surface of the processing substrate perpendicular to the L-shaped warp grooves, limit springs are arranged inside the L-shaped warp grooves and the L-shaped weft grooves, the ends of the limit springs are respectively connected with warp clamps and weft clamps, a material discharge groove is opened at the center of the surface of the processing substrate, and the PCB board body is arranged on the surface of the processing substrate.

[0008] Preferably, linear heat dissipation arc grooves are distributed in a linear array on the bottom surface of the PCB board body, an isolation layer is provided on the bottom surface of the PCB board body, and meridian arc grooves are evenly distributed in a linear array on the surface of the isolation layer.

[0009] Preferably, the linear heat dissipation arc grooves and the meridian arc grooves have the same groove width, and the spacing between adjacent linear heat dissipation arc grooves and the spacing between adjacent meridian arc grooves are the same.

[0010] Preferably, two ends of adjacent warp clamps are located at the inner wall of the weft clamp, and the inner walls of the warp clamp and the weft clamp are both against the side of the PCB board body.

[0011] Preferably, the warp splints and the weft splints have the same height and width, and the surfaces of the warp splints and the weft splints are both coated with an insulating coating.

[0012] Preferably, the isolation layer is the same size as the PCB board body, and an isolation layer is connected between adjacent PCB board bodies.

[0013] Preferably, the size of the opening of the blanking slot is smaller than the cross-sectional size of the surface of the PCB board body, and the bottom ends of the warp clamps and the weft clamps are respectively matched with the inner wall gaps of the L-shaped warp slot and the L-shaped weft slot.

[0014] Beneficial Effects

[0015] In the utility model, the L-shaped warp groove and the L-shaped weft groove arranged on the surface of the processed substrate cooperate with the warp clamp and the weft clamp to clamp the PCB board body, so that it is convenient to adjust and adapt the PCB board bodies of different sizes to different widths and lengths, maintain the limited clamping of the PCB board body, and facilitate the stacking and limiting of the PCB board body in the vertical direction, thereby increasing the adaptability during manufacturing, having a simple structure and strong size adaptability.

[0016] In the utility model, a linear heat dissipation arc groove is arranged on the surface of the PCB board body for surface heat dissipation, and an isolation layer is added between adjacent PCB board bodies for heat dissipation and isolation, so that the entire PCB board body adopts a stacked multi-layer design, achieving a more compact circuit layout and higher signal conduction efficiency, while taking into account stable heat dissipation, and effectively reducing the interference of electromagnetic radiation through the isolation layer, maintaining stable heat dissipation and signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0018] Figure 2 This is a surface structure diagram of a processed substrate of the utility model;

[0019] Figure 3This is a diagram of the main connection structure of the PCB board of the utility model;

[0020] Figure 4 This is a structural diagram of the PCB board body of the utility model;

[0021] Figure 5 It is a schematic diagram of the etching effect of the utility model.

[0022] Legend:

[0023] 1. Processing substrate; 2. L-shaped warp groove; 3. L-shaped weft groove; 4. Warp clamp; 5. Weft clamp; 6. Limit spring; 7. Feeding slot; 8. PCB board body; 9. Linear heat dissipation arc groove; 10. Isolation layer board; 11. Warp arc groove; 12. Electroplating hole. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0025] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment one:

[0027] Reference Figure 1-5 A PCB manufacturing plate with no ring design includes a processing substrate 1 and a PCB board body 8. L-shaped warp grooves 2 are provided on both sides of the surface of the processing substrate 1. L-shaped weft grooves 3 are provided on both sides of the surface of the processing substrate 1 perpendicular to the L-shaped warp grooves 2. Limit springs 6 are provided inside the L-shaped warp grooves 2 and the L-shaped weft grooves 3. The ends of the limit springs 6 are respectively connected with warp clamps 4 and weft clamps 5. A material unloading slot 7 is provided at the center of the surface of the processing substrate 1. A PCB board body 8 is provided on the surface of the processing substrate 1. The PCB board is clamped by the warp clamps 4 and weft clamps 5 provided on the surface of the processing substrate 1. The main body 8 is clamped, and the flexible clamping plate design can adapt to PCB board main bodies 8 of different sizes, thereby improving the versatility of the processed substrate 1. The use of the limit spring 6 ensures the stable clamping of the clamping plate to prevent the PCB board main body 8 from moving or shaking during the processing. The design of the blanking slot 7 facilitates the rapid removal of the PCB board main body 8 after the processing is completed, and is convenient for adjusting and adapting different widths and lengths of PCB board main bodies 8 of different sizes, maintaining the limited clamping of the PCB board main body 8, and facilitating the vertical stacking and limiting of the PCB board main body 8, thereby increasing the adaptability during production, and having a simple structure and strong size adaptability.

[0028] In order to increase the heat dissipation and signal isolation strength of the surface of the PCB board main body 8, a linear heat dissipation arc groove 9 is distributed in a linear array on the bottom surface of the PCB board main body 8, an isolation layer 10 is provided on the bottom surface of the PCB board main body 8, and a meridian arc groove 11 is evenly distributed in a linear array on the surface of the isolation layer 10. The design of the linear heat dissipation arc groove 9 and the meridian arc groove 11 increases the heat dissipation area and improves the heat dissipation efficiency of the PCB board main body 8. The isolation layer 10 and the meridian arc groove 11 on its surface provide additional electrical isolation, which increases the safety of the PCB board. The entire PCB board main body 8 adopts a stacked multi-layer design to achieve a more compact circuit layout and higher signal conduction efficiency, while taking into account stable heat dissipation. The isolation layer 10 effectively reduces the interference of electromagnetic radiation and maintains stable heat dissipation and signal transmission. Specific embodiment 2:

[0030] Reference Figure 1-5 In order to improve the heat dissipation of the PCB board body 8, the linear heat dissipation arc groove 9 and the meridian arc groove 11 are set to have the same groove width, the spacing between adjacent linear heat dissipation arc grooves 9 and the spacing between adjacent meridian arc grooves 11 are the same, and the groove width and spacing of the linear heat dissipation arc groove 9 and the meridian arc groove 11 are kept consistent, ensuring the uniformity of heat dissipation and isolation performance. The uniform groove width and spacing make the heat dissipation and isolation performance more stable and reliable, reducing performance fluctuations caused by design differences. Specific embodiment three:

[0032] Reference Figure 1-5 , the two ends of the adjacent warp splints 4 are located at the inner wall position of the weft splint 5, the inner walls of the warp splints 4 and the weft splints 5 are both against the side of the PCB board body 8, and the two ends of the warp splints 4 are located at the inner wall position of the weft splint 5, ensuring that when clamping, the warp splints 4 and the weft splints 5 can fit tightly with the side of the PCB board body 8 at the same time. This design makes the clamping more stable and further prevents the movement of the PCB board body 8 during the processing. The warp splints 4 and the weft splints 5 are the same in height and width. The surfaces of the warp splints 4 and the weft splints 5 are coated with an insulating coating. The same size ensures the interchangeability of the splints, simplifies the maintenance and replacement process, and the insulating coating improves the splints Electrical safety reduces the risk caused by leakage or short circuit. The isolation layer 10 is the same size as the PCB board body 8. An isolation layer 10 is connected between adjacent PCB board bodies 8. The uniform size ensures the perfect match between the isolation layer 10 and the PCB board body 8, and improves the isolation effect. The adjacent PCB board bodies 8 are connected by the isolation layer 10, which simplifies the installation and disassembly process. The size of the slot of the blanking slot 7 is smaller than the surface cross-sectional size of the PCB board body 8, which is convenient for the stacked PCB board body 8 to be lifted up and taken out through the bottom of the blanking slot 7. The bottom ends of the warp clamp 4 and the weft clamp 5 are respectively matched with the inner wall gaps of the L-shaped warp slot 2 and the L-shaped weft slot 3. Specific embodiment four:

[0034] Reference Figure 1-5 ,The surface of the PCB body 8 is provided with a plated hole 12. After the plated hole 12 is opened, the problem of residual rings on the hole edge can be effectively solved by optimizing the outer layer pattern compensation, such as Figure 5 As shown, by optimizing the outer layer pattern compensation, the problem of residual rings on the hole edges can be 100% eliminated.

[0035] In summary:

[0036] 1. The L-shaped warp groove 2 and the L-shaped weft groove 3 provided on the surface of the processing substrate 1 are used to cooperate with the warp clamp 4 and the weft clamp 5 to clamp the PCB board body 8, so as to facilitate the adjustment and adaptation of different widths and lengths of the PCB board bodies 8 of different sizes, maintain the limited clamping of the PCB board body 8, facilitate the stacking and limiting of the PCB board body 8 in the vertical direction, increase the adaptability during production, and have a simple structure and strong size adaptability;

[0037] 2. A linear heat dissipation arc groove 9 is set on the surface of the PCB board body 8 for surface heat dissipation, and an isolation layer 10 is added between adjacent PCB board bodies 8 for heat dissipation and isolation, so that the entire PCB board body 8 adopts a stacked multi-layer design to achieve a more compact circuit layout and higher signal conduction efficiency, while taking into account stable heat dissipation. The isolation layer 10 effectively reduces the interference of electromagnetic radiation and maintains stable heat dissipation and signal transmission.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A PCB manufacturing plate with a ring-free design, comprising a processing substrate (1) and a PCB board body (8), characterized in that: L-shaped warp grooves (2) are provided on both sides of the surface of the processing substrate (1); L-shaped weft grooves (3) are provided on both sides of the surface of the processing substrate (1) perpendicular to the L-shaped warp grooves (2); limit springs (6) are provided inside the L-shaped warp grooves (2) and the L-shaped weft grooves (3); the ends of the limit springs (6) are respectively connected to the warp clamps (4) and the weft clamps (5); a material discharge slot (7) is provided at the center of the surface of the processing substrate (1); and a PCB board body (8) is provided on the surface of the processing substrate (1).

2. The PCB manufacturing plate with a ring-free design according to claim 1, characterized in that: The bottom surface of the PCB board body (8) is provided with linear heat dissipation arc grooves (9) distributed in a linear array, the bottom surface of the PCB board body (8) is provided with an isolation layer plate (10), and the surface of the isolation layer plate (10) is provided with meridian arc grooves (11) distributed in a uniform linear array.

3. The PCB manufacturing plate with a ring-free design according to claim 2, characterized in that: The linear heat dissipation arc grooves (9) and the meridian arc grooves (11) have the same groove width, and the spacing between adjacent linear heat dissipation arc grooves (9) and the spacing between adjacent meridian arc grooves (11) are the same.

4. The PCB manufacturing plate with a ring-free design according to claim 1, characterized in that: The two ends of the adjacent warp clamps (4) are located on the inner wall of the weft clamp (5), and the inner walls of the warp clamps (4) and the weft clamps (5) are both against the side of the PCB board body (8).

5. The PCB manufacturing plate with a ring-free design according to claim 1, characterized in that: The warp clamps (4) and the weft clamps (5) have the same height and width, and the surfaces of the warp clamps (4) and the weft clamps (5) are both coated with an insulating coating.

6. The PCB manufacturing plate with a ring-free design according to claim 2, characterized in that: The isolation layer plate (10) is the same size as the PCB board body (8), and the isolation layer plate (10) is connected between adjacent PCB board bodies (8).

7. The PCB manufacturing plate with a ring-free design according to claim 1, characterized in that: The size of the slot opening of the material discharge slot (7) is smaller than the size of the surface cross-section of the PCB board body (8), and the bottom ends of the warp clamp (4) and the weft clamp (5) respectively cooperate with the inner wall gaps of the L-shaped warp slide groove (2) and the L-shaped weft slide groove (3).

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