Multi-mode local wide-pass audio power amplifier

Abstract

The utility model discloses a multimode local wide-pass audio power amplifier which comprises a device body, a front plate is arranged in the device body, a cover plate is arranged above the front plate, an L-shaped bottom plate is arranged below the front plate, a left cooling fin and a right cooling fin are arranged on the left side and the right side of the front plate, and a buckle is arranged on the inner side wall of the front plate. Buckle holes are formed in the front ends of the left heat dissipation fins and the right heat dissipation fins, second screw holes are formed in the rear ends of the left heat dissipation fins and the right heat dissipation fins, the buckles are movably clamped in the buckle holes, an electronic element is arranged above the L-shaped bottom plate, sliding grooves and first screw holes are formed in the cover plate, an L-shaped sliding plate is inserted in the sliding grooves, and the L-shaped sliding plate is movably clamped in the first screw holes. The upper end of the L-shaped sliding plate is connected with a lower brush, a movable groove is formed in the L-shaped sliding plate, a connecting column is rotationally installed in the movable groove, and a connecting plate is installed at one end of the connecting column, so that the device can be disassembled and assembled according to a user, the user can conveniently overhaul and maintain the device in the later period, and the trouble that the device is inconvenient to disassemble is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of audio equipment, and in particular relates to a multi-mode local wide-band audio power amplifier. Background Art

[0002] A multi-mode audio power amplifier, also known as an audio power amplifier, is the most basic device in the audio system. Its task is to amplify the weak electrical signal from the signal source to drive the speaker to make sound.

[0003] The existing multi-mode audio power amplifier has a simple shell, an incompact and unstable structure, is easily damaged, and is not easy to disassemble and repair. When the multi-mode audio power amplifier is in use, the operation of the internal equipment will generate high heat, which is generally dissipated by installing heat dissipation fins and opening heat dissipation holes inside the body. However, the heat dissipation holes of the current audio power amplifier are exposed to the air for a long time without any obstructions. After long-term use, dust will accumulate in the heat dissipation holes and block the heat dissipation channels. Subsequent cleaning requires disassembly of the entire machine, which is more troublesome. Therefore, we need to upgrade and transform on the basis of existing technologies. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-mode local wide-band audio power amplifier to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above problems, the following technical solutions are provided:

[0006] The heat dissipation device is designed to dissipate heat, and the heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat. The heat dissipation device is designed to dissipate heat.

[0007] Furthermore, the cover plate is provided with heat dissipation holes, and there are multiple groups of heat dissipation holes, and the heat dissipation holes are in the shape of long rectangular strips.

[0008] Furthermore, a screw hole is provided in the cover plate, the left heat dissipation fin and the right heat dissipation fin, and a bolt is screwed in the screw hole.

[0009] Furthermore, a second screw hole is provided in the L-bottom plate, the left heat dissipation fin and the right heat dissipation fin, and a second bolt is screwed in the second screw hole.

[0010] Furthermore, support legs are installed under the L-bottom plate, and the support legs are provided in multiple groups, and the support legs are fixedly connected to the L-bottom plate.

[0011] Furthermore, the clamping plate is movably clamped with the clamping slot, and three screw holes are provided in the clamping plate and the clamping slot, and three bolts are screwed in the three screw holes.

[0012] Furthermore, a knob is installed at the front end of the card slot, and the knob is fixedly connected to the front end of the card slot.

[0013] Furthermore, collection boxes are fixedly mounted on the outer side walls at both ends of the L-shaped slide.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model can disassemble and assemble the device according to the user by arranging a front plate, an L-bottom plate, a cover plate, a left heat dissipating fin, a right heat dissipating fin, a buckle hole, a buckle, a screw hole one, a bolt one, a screw hole two and a bolt two, so as to facilitate the user to inspect and maintain the device at a later time and avoid the trouble of inconvenient disassembly of the device.

[0016] The utility model can clean the heat dissipation holes in the cover plate of the device by arranging a slide groove, an L-shaped slide plate, a movable groove, a connecting column, a connecting plate, an upper brush, a lower brush, a collecting box, a card slot, a card plate, three screw holes, three bolts and a knob, thereby ensuring the safety of the heat dissipation holes, providing convenience for users, and facilitating the users to disassemble and assemble the device at a later time, thereby avoiding the heat dissipation holes being clogged with dust and affecting the subsequent heat dissipation effect.

[0017] With reference to the following description and drawings, specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications and equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a stereoscopic diagram of the overall structure of a multi-mode local wide-band audio power amplifier according to the utility model;

[0020] Figure 2It is a rear view of the overall structure of a multi-mode local wide-band audio power amplifier according to the utility model;

[0021] Figure 3 It is a disassembly structure exploded view of a multi-mode local wide-band audio power amplifier according to the utility model;

[0022] Figure 4 A three-dimensional diagram of the cleaning structure of a multi-mode local wide-band audio power amplifier according to the utility model;

[0023] Figure 5 The present invention is a schematic diagram of the cleaning structure of a multi-mode local wide-band audio power amplifier.

[0024] In the figure: 1. device body; 2. front plate; 3. L bottom plate; 4. cover plate; 5. left cooling fin; 6. right cooling fin; 7. snap hole; 8. snap; 9. screw hole one; 10. bolt one; 11. electronic component; 12. screw hole two; 13. bolt two; 14. adjustment switch; 15. terminal block; 16. support leg; 17. cooling hole; 18. slide groove; 19. L slide plate; 20. movable groove; 21. connecting column; 22. connecting plate; 23. upper brush; 24. lower brush; 25. collection box; 26. slot; 27. card plate; 28. screw hole three; 29. ​​bolt three; 30. knob. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0026] like Figure 1 - Figure 5 As shown, a multi-mode local wide-band audio power amplifier provided in this embodiment includes a device body 1, which includes a front plate 2, a cover plate 4 is provided on the top of the front plate 2 and an L bottom plate 3 is provided below the front plate 2, a left heat dissipation fin 5 and a right heat dissipation fin 6 are provided on the left and right sides of the front plate 2, a buckle 8 is provided on the inner side wall of the front plate 2, a buckle hole 7 is provided at the front end of the left heat dissipation fin 5 and the right heat dissipation fin 6, and a screw hole 12 is provided at the rear end of the left heat dissipation fin 5 and the right heat dissipation fin 6, the buckle 8 is movably connected in the buckle hole 7, and a cover plate 4 is provided on the top of the L bottom plate 3. An electronic component 11 is placed, a slide groove 18 and a screw hole 9 are opened in the cover plate 4, an L slide plate 19 is inserted in the slide groove 18, the upper end of the L slide plate 19 is connected to a lower brush 24 and a movable groove 20 is opened in the L slide plate 19, a connecting column 21 is rotatably installed in the movable groove 20, a connecting plate 22 is installed at one end of the connecting column 21, an upper brush 23 is installed below the connecting plate 22 and a card slot 26 is installed at the front end of the connecting plate 22, a card plate 27 is provided at the front end of the L slide plate 19, an adjustment switch 14 is installed at the front end of the front plate 2, and a wiring terminal 15 is provided at the rear end of the L bottom plate 3.

[0027] Preferably, the cover plate 4 is provided with heat dissipation holes 17, and the heat dissipation holes 17 are provided with multiple groups and are long rectangular. By providing the heat dissipation holes 17, the heat generated by the operation of the electronic components 11 inside the device can be evacuated to avoid heat accumulation and affect the subsequent use of the device. The cover plate 4, the left heat dissipation fin 5 and the right heat dissipation fin 6 are provided with a screw hole 9, and a bolt 10 is screwed into the screw hole 9. By setting the bolt 10, the cover plate 4, the left heat dissipation fin 5 and the right heat dissipation fin 6 can be connected and fixed, thereby ensuring the safety of the device when in use. The L base plate 3, the left heat dissipation fin 5 and the right heat dissipation fin 6 are provided with a screw hole 2 12, and a bolt 2 13 is screwed into the screw hole 2 12. By setting the bolt 2 13, the L base plate 3 and the left heat dissipation fin 5 and the right heat dissipation fin 6 can be fixed and limited, thereby increasing the intimacy and connectivity between the devices.

[0028] Preferably, a support leg 16 is installed under the L bottom plate 3, and the support leg 16 is provided with multiple groups. The support leg 16 is fixedly connected to the L bottom plate 3. By providing the support leg 16, the L bottom plate 3 can be supported and fixed, thereby ensuring the safety of the device when in use. The clamping plate 27 is movably clamped with the clamping slot 26. Screw holes 28 are provided in the clamping plate 27 and the clamping slot 26. Bolts 29 are screwed in the screw holes 28. By providing the bolts 29, the clamping plate 27 and the clamping slot 26 can be fixed and limited, which is convenient for the user to disassemble the device later, thereby ensuring the safety of the device when in use. A knob 30 is installed at the front end of the clamping slot 26, and the knob 30 is fixedly connected to the front end of the clamping slot 26. By providing the knob 30, the user can pull the clamping slot 26, thereby providing convenience for the user. Collection boxes 25 are fixedly installed on the outer side walls at the left and right ends of the L slide plate 19. By providing the collection boxes 25, the dust cleaned in the heat dissipation holes 17 can be collected, thereby avoiding the situation where dust is scattered on the electronic components 11 in a large scale.

[0029] The use principle and use process of the utility model are as follows: when in use, the left heat dissipation fin 5 and the right heat dissipation fin 6 are placed on the left and right sides of the front plate 2 in sequence. After they are properly placed, the buckle hole 7 is hung on the buckle 8 and fixed properly. Then, the L bottom plate 3 is placed on the rear end of the front plate 2. After they are properly placed, the bolt 13 is screwed into the screw hole 12 of the L bottom plate 3, the left heat dissipation fin 5 and the right heat dissipation fin 6 in sequence. At this time, the L bottom plate 3, the left heat dissipation fin 5, the right heat dissipation fin 6 and the front plate 2 are fixed, and then the cover is fixed. The plate 4 is installed on the L bottom plate 3, the left heat dissipation fin 5, the right heat dissipation fin 6 and the front plate 2. After being properly placed, the device can be completely fixed by screwing the bolts 10 into the screw holes 9 in sequence. Conversely, the outer shell of the device can be disassembled. The device can be disassembled and assembled according to the user, which is convenient for the user to inspect and maintain the device later, avoiding the trouble of inconvenient disassembly of the device. When the heat dissipation hole 17 of the device needs to be cleaned, the collection box 25 is installed with tearable adhesive, and the user pushes the knob 30 to remove the adhesive. The connecting plate 22 and the L slide plate 19 move in the slide groove 18. During the movement of the connecting plate 22 and the L slide plate 19, the upper brush 23 and the lower brush 24 are driven to clean the heat dissipation holes 17 of the cover plate 4. The dust swept down during the cleaning process will enter the collection box 25 for collection. When it is necessary to clean the brush and the collection box 25, the user uses a tool to remove the bolt 2 13 from the screw hole 2 12 in turn, and then removes the bolt 3 29 from the screw hole 3 28. The user rotates the connecting plate 22 and the upper brush upwards by using the knob 30. 23, when the connecting plate 22 rotates, the connecting column 21 is driven to rotate and adjust in the movable groove 20 until the connecting plate 22 and the upper brush 23 rotate to 180°. At this time, the user pulls the L slide plate 19 out of the slide groove 18, and can clean it after pulling it out. Otherwise, it can be installed again, and the heat dissipation holes 17 in the device cover plate 4 can be cleaned, ensuring the safety of the heat dissipation holes 17, providing convenience for users, and facilitating the users to disassemble and assemble the device later, avoiding the heat dissipation holes 17 from being clogged with dust and affecting the subsequent heat dissipation effect.

[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] The present invention is described above in conjunction with specific implementation methods, but it should be clear to those skilled in the art that these descriptions are exemplary and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make various modifications and variations to the present invention based on the spirit and principles of the present invention, and these modifications and variations are also within the scope of the present invention.

Claims

1. A multi-mode local wide-band audio power amplifier, characterized in that: The device body (1) comprises a front plate (2) inside the device body (1), a cover plate (4) is provided above the front plate (2) and an L-shaped bottom plate (3) is provided below the front plate (2), a left heat dissipation fin (5) and a right heat dissipation fin (6) are provided on the left and right sides of the front plate (2), a buckle (8) is provided on the inner side wall of the front plate (2), a buckle hole (7) is provided at the front end of the left heat dissipation fin (5) and the right heat dissipation fin (6), and a screw hole (12) is provided at the rear end of the left heat dissipation fin (5) and the right heat dissipation fin (6), the buckle (8) is movably buckled in the buckle hole (7), an electronic component (11) is provided above the L-shaped bottom plate (3), the cover plate (4) is provided with a plurality of screw holes (12) at the rear end of the left heat dissipation fin (5) and the right heat dissipation fin (6), and the buckle (8) is movably buckled in the buckle hole (7), an electronic component (11) is provided above the L-shaped bottom plate (3), and the cover plate (4) is provided with a plurality of screw holes (12) at the rear end of the left heat dissipation fin (5) and the right heat dissipation fin (6). A slide groove (18) and a screw hole (9) are provided inside the slide groove (18), an L slide plate (19) is inserted into the slide groove (18), the upper end of the L slide plate (19) is connected to a lower brush (24) and a movable groove (20) is provided inside the L slide plate (19), a connecting column (21) is rotatably installed in the movable groove (20), a connecting plate (22) is installed at one end of the connecting column (21), an upper brush (23) is installed below the connecting plate (22) and a card slot (26) is installed at the front end of the connecting plate (22), a card plate (27) is provided at the front end of the L slide plate (19), an adjusting switch (14) is installed at the front end of the front plate (2), and a wiring terminal (15) is provided at the rear end of the L bottom plate (3).

2. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: The cover plate (4) is provided with heat dissipation holes (17), the heat dissipation holes (17) are provided in a plurality of groups and the heat dissipation holes (17) are in the shape of long rectangular strips.

3. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: The cover plate (4), the left heat dissipation fin (5) and the right heat dissipation fin (6) are all provided with a screw hole (9), and a bolt (10) is screwed into the screw hole (9).

4. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: The L-shaped bottom plate (3), the left heat dissipation fin (5) and the right heat dissipation fin (6) are provided with two screw holes (12), and two bolts (13) are screwed into the two screw holes (12).

5. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: Support legs (16) are installed below the L-bottom plate (3), and a plurality of groups of the support legs (16) are provided. The support legs (16) are fixedly connected to the L-bottom plate (3).

6. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: The clamping plate (27) is movably clamped with the clamping slot (26); a third screw hole (28) is provided in the clamping plate (27) and the clamping slot (26); a third bolt (29) is screwed into the third screw hole (28).

7. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: A knob (30) is installed at the front end of the card slot (26), and the knob (30) is fixedly connected to the front end of the card slot (26).

8. The multi-mode local wide-band audio power amplifier according to claim 1, characterized in that: Collection boxes (25) are fixedly mounted on the outer side walls at both ends of the L slide plate (19).

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