Lead frame of photoelectric coupler

Abstract

The utility model belongs to the technical field of optocoupler production and processing, and particularly relates to a lead frame of a photoelectric coupler. Comprising a plurality of lead frame units arranged in a matrix, connecting ribs connecting the adjacent lead frame units, and glue blocking steps extending outwards from the connecting ribs in the horizontal direction of the lead frame units and limiting glue from flowing out. According to the lead frame of the photoelectric coupler, through connecting the connecting ribs of the adjacent lead frame units, compared with a traditional double-connecting-rib structure, the bearable stress of the connecting ribs in the punching process is increased, colloid cracking is effectively prevented, and through the arrangement of the colloid blocking steps, under the condition that an original rib cutting mold and an original injection mold are not changed, the production efficiency of the photoelectric coupler is improved. And the glue cannot flow to the position of the glue blocking step in the punching process, so that the connecting rib can be conveniently cut, and waste can be conveniently removed. The risk of colloid cracking is reduced, and the yield is improved.

Description

[Technical field]

[0001] The present application belongs to the technical field of optical coupler production and processing, and specifically relates to a lead frame of an optical coupler. [Background technology]

[0002] A photocoupler is a semiconductor optoelectronic device that seals a light-emitting component and a photosensitive component in the same housing. It is a device that uses light as a medium to transmit electrical signals. Its function is to maintain good isolation between the input and output of electrical signals at ordinary times, and to transmit electrical signals through the isolation layer when necessary. Currently, photocouplers have been used in various circuits.

[0003] Usually, a lead frame is required in the preparation process of the optocoupler. The lead frame includes a light-emitting chip holder and a photosensitive chip holder. The light-emitting chip holder and the photosensitive chip holder are stacked and assembled to form lead frame units arranged in multiple arrays. Adjacent lead frame units are connected in the form of double ribs, wherein the outer ribs are provided to limit the outflow of the colloid. The width of each rib is about 25mm. After completing the operations of patch, wire bonding, and plastic sealing, it needs to be punched. However, due to excessive stress during punching, the colloid is easily cracked, affecting the yield rate. [Contents of the utility model]

[0004] In order to solve the problem in the prior art that when punching a lead frame in the form of double ribs, the colloid is easily cracked due to excessive stress, the present application provides a lead frame for an optocoupler.

[0005] This application is implemented through the following technical solutions:

[0006] A lead frame of an optocoupler comprises a plurality of lead frame units arranged in a matrix, connecting ribs connecting adjacent lead frame units, and glue blocking steps extending outward from the connecting ribs in the horizontal direction of the lead frame units and limiting the outflow of colloid.

[0007] In the lead frame of the optocoupler as described above, the width S of the glue blocking step is less than or equal to the width L of the rib cutting punch.

[0008] In the lead frame of the optocoupler as described above, the connecting rib is located at the left side between adjacent lead frame units.

[0009] In the lead frame of the optocoupler as described above, the width of the connecting rib is D, wherein 0.28 mm≤D≤0.32 mm.

[0010] In the lead frame of the optocoupler as described above, a concave hole is further provided at the connection between the glue blocking step and the connecting rib.

[0011] In the lead frame of the optocoupler as described above, the recessed holes are respectively located on both sides of the glue blocking step.

[0012] In the lead frame of the optocoupler as described above, the connecting ribs include longitudinal ribs connecting adjacent lead frame units and transverse ribs connecting the longitudinal ribs and the lead frame.

[0013] In the lead frame of the optocoupler as described above, the transverse ribs are perpendicular to the longitudinal ribs.

[0014] Compared with the prior art, this application has the following advantages:

[0015] The lead frame of a photoelectric coupler of the present application increases the stress that the connecting ribs can withstand during punching and cutting compared to the traditional double connecting rib structure, effectively preventing the colloid from cracking, and the setting of the glue blocking step ensures that the colloid will not flow to the position of the glue blocking step during the punching process without changing the original cutting rib mold and injection mold, thereby facilitating the cutting of the connecting ribs to remove waste. The risk of colloid cracking is reduced and the yield rate is improved.

Brief Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the structure after superposition of the embodiments of the present application;

[0018] Figure 2 This is a schematic diagram of an embodiment of the present application before rib cutting;

[0019] Figure 3 yes Figure 1 Side view of

[0020] Figure 4 yes Figure 2 Schematic diagram after tendon cutting;

[0021] Figure 5 This is a schematic diagram of the structure of traditional double reinforcement;

[0022] Figure 6 This is a schematic diagram of the traditional double-linked reinforcement before cutting;

[0023] Figure 7 yes Figure 6 Schematic diagram after tendon cutting. [Specific implementation method]

[0024] In order to make the technical problems, technical solutions and beneficial effects solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] See also Figures 1 to 7 A lead frame of an optocoupler comprises a plurality of lead frame units 1 arranged in a matrix, connecting ribs 2 connecting adjacent lead frame units 1, and a glue blocking step 3 extending outward from the connecting ribs 2 in a horizontal direction of the lead frame units 1 and limiting the outflow of a colloid 5, wherein the two sides of the glue blocking step 3 are spaced apart from two adjacent lead frame units 1.

[0026] The lead frame of a photoelectric coupler of the present application increases the stress that the connecting ribs can withstand during punching and cutting compared to the traditional double connecting rib structure, effectively preventing the colloid from cracking, and the setting of the glue blocking step ensures that the colloid will not flow to the position of the glue blocking step during the punching process without changing the original cutting rib mold and injection mold, thereby facilitating the cutting of the connecting ribs to remove waste. The risk of colloid cracking is reduced and the yield rate is improved.

[0027] Further, as a preferred implementation manner of the present solution but not a limitation, the two sides of the glue blocking step 3 are spaced apart from two adjacent lead frame units 1 respectively.

[0028] Further, as a preferred implementation manner of the present solution but not a limitation, the width S of the glue blocking step 3 is less than or equal to the width L of the rib cutting punch 4 .

[0029] In this embodiment, it is ensured that the glue blocking step is completely within the range of the rib cutting punch, effectively avoiding the inaccurate punching caused by the excessive size of the glue blocking step during the punching process. This precise size matching ensures the stability and consistency of the manufacturing process, thereby improving the quality and reliability of the product. Secondly, this design feature also simplifies the manufacturing process and reduces the need for additional adjustments or modifications due to size mismatches. Manufacturers can directly produce based on existing equipment and processes without investing additional costs and time for modifications, thereby reducing production costs and improving production efficiency.

[0030] Further, as a preferred implementation manner of the present solution but not a limitation, the connecting rib 2 is located at the left side between the adjacent lead frame units 1 .

[0031] In this embodiment, the position of the connecting rib corresponds to the position of the left connecting rib of the traditional double connecting rib structure, and an extension position of the glue blocking step can be provided on the right side of the connecting rib, and it is made to correspond to the right connecting rib of the traditional double connecting rib structure, so that the injection mold does not need to be modified. And the amount of modification of the stamping mold is also small. The mold cost is low.

[0032] Further, as a preferred implementation manner of the present solution but not limiting, the width of the connecting rib 2 is D, wherein 0.28 mm ≤ D ≤ 0.32 mm.

[0033] In this embodiment, when the width of the connecting rib is adjusted to 0.28mm, compared with the 0.25mm of the traditional double connecting rib, the dimensional stability of the connecting rib is ensured, so that it can maintain consistency during the manufacturing process without excessive dimensional deviation. This can ensure that the connecting rib can accurately match other components, such as the glue blocking step and the wire frame unit, to ensure the stability and reliability of the overall structure; in this embodiment, the width of the connecting rib is adjusted to 0.3mm, which is 0.05mm more than the 0.25mm of the traditional double connecting rib. This width is moderate, which can reduce the impact on the colloid and avoid colloid cracking, thereby improving the reliability and stability of the product.

[0034] Furthermore, as a preferred implementation mode of the present solution but not a limitation, a recessed hole 31 is further provided at the connection between the glue blocking step 3 and the connecting rib 2 .

[0035] In this embodiment, it can play a role in buffering and dispersing stress during punching, so that the stress is more evenly distributed on the wire frame, avoiding the problem of colloid cracking caused by excessive stress concentration, and also help to optimize the colloid filling process, so that the colloid can be more evenly distributed at the connection, thereby improving the sealing and stability of the connection, and further improving the quality level of the product.

[0036] Further, as a preferred implementation of the present solution but not a limitation, the recessed holes 31 are respectively located on both sides of the glue blocking step 3 .

[0037] Further, as a preferred implementation manner of the present solution but not limiting, the connecting ribs 2 include longitudinal ribs 21 connecting adjacent wire frame units 1 and transverse ribs 22 connecting the longitudinal ribs 21 and the wire frame.

[0038] In this embodiment, the longitudinal ribs can enhance the connection stability and vertical support force between the wire frame units, effectively preventing the structure from loosening or deforming during use. The transverse ribs enhance the transverse support force and stability of the overall structure, allowing the wire frame unit to maintain its shape more firmly under the action of external forces, thereby improving the reliability and durability of the product. Secondly, this design also simplifies the manufacturing process.

[0039] Furthermore, as a preferred implementation manner of the present solution but not a limitation thereof, the transverse ribs 22 are perpendicular to the longitudinal ribs 21 .

[0040] In this embodiment, by arranging the transverse ribs perpendicular to the longitudinal ribs, the supporting force and compressive resistance of the connecting ribs in multiple directions are effectively increased, so that the wire frame unit can better withstand the effects of external forces, thereby improving the structural stability and durability of the product. Secondly, this design also helps to optimize the space utilization efficiency of the wire frame unit. The arrangement of the transverse ribs perpendicular to the longitudinal ribs can maximize the use of space, making the connection between the wire frame units closer without taking up too much space, thereby improving the overall performance and use efficiency of the product.

[0041] The working principle of this embodiment is as follows:

[0042] The lead frame of a photoelectric coupler of the present application increases the stress that the connecting ribs can withstand during punching and cutting compared to the traditional double connecting rib structure, effectively preventing the colloid from cracking, and the setting of the glue blocking step ensures that the colloid will not flow to the position of the glue blocking step during the punching process without changing the original cutting rib mold and injection mold, thereby facilitating the cutting of the connecting ribs to remove waste. The risk of colloid cracking is reduced and the yield rate is improved.

[0043] The above are implementation methods provided in combination with specific contents, and it is not intended that the specific implementation of this application is limited to these descriptions. Any method structure similar to the present application, or a number of technical deductions or replacements based on the concept of the present application, should be considered as the protection scope of this application.

Claims

1. A lead frame of an optocoupler, characterized in that: The invention comprises a plurality of wire frame units (1) arranged in a matrix, connecting ribs (2) connecting adjacent wire frame units (1), and a glue blocking step (3) extending outward from the connecting ribs (2) in a horizontal direction of the wire frame units (1) and limiting the outflow of a glue (5).

2. The lead frame of a photoelectric coupler according to claim 1, characterized in that: The width S of the glue blocking step (3) is less than or equal to the width L of the rib cutting punch (4).

3. The lead frame of a photocoupler according to claim 1, characterized in that: The connecting rib (2) is located at the left side between adjacent wire frame units (1).

4. The lead frame of a photocoupler according to claim 1, characterized in that: The width of the connecting rib (2) is D, wherein 0.28 mm ≤ D ≤ 0.32 mm.

5. The lead frame of a photoelectric coupler according to claim 1, characterized in that: A concave hole (31) is also provided at the connection between the rubber blocking step (3) and the connecting rib (2).

6. The lead frame of a photoelectric coupler according to claim 5, characterized in that: The concave holes (31) are respectively located on both sides of the glue blocking step (3).

7. The lead frame of a photoelectric coupler according to claim 1, characterized in that: The connecting ribs (2) include longitudinal ribs (21) connecting adjacent wire frame units (1) and transverse ribs (22) connecting the longitudinal ribs (21) and the wire frame.

8. The lead frame of a photoelectric coupler according to claim 7, characterized in that: The transverse ribs (22) are perpendicular to the longitudinal ribs (21).

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